CN114025503A - A kind of preparation method of gold finger printed board and gold finger printed board - Google Patents
A kind of preparation method of gold finger printed board and gold finger printed board Download PDFInfo
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- CN114025503A CN114025503A CN202111526562.6A CN202111526562A CN114025503A CN 114025503 A CN114025503 A CN 114025503A CN 202111526562 A CN202111526562 A CN 202111526562A CN 114025503 A CN114025503 A CN 114025503A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The embodiment of the invention provides a preparation method of a golden finger printed board and the golden finger printed board, wherein the method comprises the following steps: manufacturing a first core board and a second core board, wherein the first core board comprises a first substrate, a first semi-cured sheet and a golden finger, the first semi-cured sheet covers the first substrate, the first semi-cured sheet is provided with a groove exposing the first substrate, the golden finger is plated on the first substrate exposed by the groove, the second core board comprises a second substrate and a second semi-cured sheet covering the second substrate, a protective adhesive tape is adhered to the top of the golden finger, the second core board and the first core board are laminated so that the first semi-cured sheet and the protective adhesive tape are combined with the second semi-cured sheet, the area corresponding to the golden finger in the second core board is milled to expose the golden finger, the protective adhesive tape on the top of the golden finger is combined with the second semi-cured sheet, when the second semi-cured sheet on the top of the golden finger is milled away, the protective adhesive tape is taken away from the golden finger, and the surface of the golden finger is prevented from being damaged, the efficiency is high.
Description
Technical Field
The embodiment of the invention relates to the technical field of printed boards, in particular to a preparation method of a golden finger printed board and the golden finger printed board.
Background
The golden finger is a pad which is used for being inserted into the clamping groove and is in contact conduction with a metal spring piece in the clamping groove and arranged like a finger, and due to the fact that the design has higher requirements on the surface wear resistance and conductivity of the pad, a layer of nickel and a layer of gold can be plated on the surface of the pad, the golden finger is commonly called as a golden finger.
At present, mainly bring protection golden finger through at golden finger surface bonding protection glue and avoid polluting and damage, but after golden finger printing board processing is accomplished, still need adopt the manual work to tear the protection sticky tape, the manual work tears the protection sticky tape and relies on the manual operation proficiency, makes golden finger surface impaired easily to work efficiency is low, is unfavorable for the printing board volume production to be promoted.
Disclosure of Invention
The embodiment of the invention provides a preparation method of a golden finger printed board and the golden finger printed board, and aims to solve the problems that manual tearing of a protective tape depends on the skill level of manual operation, the surface of a golden finger is easily damaged, the working efficiency is low, and mass production and popularization of the printed board are not facilitated.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a gold finger printed board, including:
manufacturing a first core board, wherein the first core board comprises a first substrate, a first semi-curing sheet and a golden finger, the first semi-curing sheet covers the first substrate, the first semi-curing sheet is provided with a groove exposing the first substrate, and the golden finger is plated and connected on the first substrate exposed by the groove;
manufacturing a second core board, wherein the second core board comprises a second substrate and a second prepreg covering the second substrate;
bonding a protective adhesive tape on the top of the golden finger;
stacking and pressing the second core board and the first core board so as to combine the first prepreg and the protective adhesive tape with the second prepreg;
and milling the area of the second core board corresponding to the golden finger to expose the golden finger.
Optionally, the fabricating the first core plate includes:
providing a first substrate;
etching an inner layer circuit on the first substrate;
covering a first semi-cured sheet on the first substrate;
forming a window on the first semi-cured sheet to form a groove exposing the first substrate;
and plating a gold connecting finger on the first substrate exposed by the groove.
Optionally, said windowing on said first semi-cured sheet comprises:
taking an area on the first substrate, wherein the difference value between the length of the single side of the area and the length of a preset golden finger area is a preset value, as a windowing area of a first semi-curing sheet, wherein the preset golden finger area is a square area;
windowing the windowed area in the first semi-cured sheet.
Optionally, the sum of the thickness of the protective tape and the thickness of the gold finger is greater than the thickness of the first semi-cured sheet.
Optionally, the adhering a protective tape on the top of the gold finger includes:
attaching a protective adhesive tape to the top of the golden finger;
and pressing the protective tape and the golden finger under a preset first pressing condition, wherein the pressing temperature is 170-180 ℃ and the pressing time is 180-240 seconds under the preset first pressing condition.
And carrying out laser cutting on the protective adhesive tape outside the area corresponding to the golden finger.
Optionally, the stacking and laminating the second core board and the first core board includes:
laminating and stacking the surface of the second solidified sheet of the second core plate and the surface of the first semi-solidified sheet of the first core plate;
and laminating the second core plate and the first core plate under a preset second lamination condition, wherein the lamination temperature is 190-210 ℃ and the lamination time is 2-3 hours in the second lamination condition.
Optionally, the milling the area, corresponding to the gold finger, in the second core board includes:
taking the area of the second core board corresponding to the golden finger as a milling area;
taking the thickness of the second core plate as the milling depth of the milling cutter;
milling with the milling cutter along the boundary of the milled region at the milling depth;
uncovering the milled area in the second core plate.
Optionally, milling with the milling cutter at the milling depth along the boundary of the milled region comprises:
drilling a positioning hole at the boundary of the milling area of the second core plate to mark the feed position of the milling cutter;
moving the milling cutter to the feed position;
and milling with the milling cutter at the milling depth.
Optionally, before the milling the region of the second core board corresponding to the gold finger, the method further includes:
and arranging outer layer circuits on the outer sides of the first substrate and the second substrate.
In a second aspect, an embodiment of the present invention further provides a gold finger printed board, including:
the printed circuit board comprises a first substrate, a second substrate and a semi-curing layer, wherein the first substrate and the second substrate are arranged oppositely, the semi-curing layer is arranged between the first substrate and the second substrate, the semi-curing layer penetrates through the second substrate and the curing layer, and a golden finger arranged on the first substrate is exposed out of the groove.
The preparation method of the golden finger printed board of the embodiment of the invention comprises the steps of firstly preparing a first core board, wherein the first core board comprises a first substrate, a first semi-cured sheet and golden fingers, the first semi-cured sheet covers the first substrate, the first semi-cured sheet is provided with a groove exposing the first substrate, the golden fingers are plated and connected on the first substrate exposed by the groove, then preparing a second core board, the second core board comprises a second substrate and a second semi-cured sheet covering the second substrate, then bonding a protective adhesive tape on the top of the golden fingers, then stacking and pressing the second core board and the first core board so that the first semi-cured sheet and the protective adhesive tape are combined with the second semi-cured sheet, finally milling the area corresponding to the golden fingers in the second core board to expose the golden fingers, and because the golden fingers are composed of a plurality of conductive contact sheets arranged at intervals, gaps exist among the conductive contact sheets, the contact area between golden finger and the protection sticky tape is less than the contact area between second core and the protection sticky tape promptly, then combine the back when protection sticky tape and second prepreg, the adhesive force between second core and the protection sticky tape is bigger, when the region that corresponds with the golden finger in the second core is milled away, can take away the protection sticky tape from the golden finger, avoid the artifical golden finger surface damage that tears the protection sticky tape and cause, and work efficiency is high, be favorable to printing board volume production to promote.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a gold finger printed board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first core board according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second core board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a gold finger printed board motherboard according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a cover removal of a golden finger printed mother board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a gold finger printed board according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
Fig. 1 is a flowchart of a method for manufacturing a golden finger printed board according to an embodiment of the present invention, where the embodiment is applicable to a case where a golden finger is protected when the golden finger printed board is manufactured, and the method may be executed by a device for manufacturing a golden finger printed board, where the device for manufacturing a golden finger printed board may be implemented by software and/or hardware, and may be configured in computer equipment, for example, in a module for manufacturing a golden finger printed board, and the like, and specifically includes the following steps:
s101, manufacturing a first core board, wherein the first core board comprises a first substrate, a first semi-curing sheet and a golden finger, the first semi-curing sheet covers the first substrate, the first semi-curing sheet is provided with a groove exposing the first substrate, and the golden finger is plated and connected on the first substrate exposed by the groove.
The substrate is a basic material of a printed board, has the functions of conduction, insulation and support, and can be used for processing holes, electroless copper plating, electrolytic copper plating, etching and the like on the surface of the substrate to obtain a required circuit pattern layer, and the circuit pattern layer is alternately bonded with a prepreg so as to interconnect different circuit pattern layers. When the substrate is connected with the golden finger, the circuit pattern layer transmits signals through the golden finger.
The prepreg is a thin sheet material composed of resin and a reinforcing material, can be softened under heating and pressurizing, can be reacted and solidified after cooling, has viscosity, can be adjusted according to actual requirements, and can be bonded between the substrates and between the substrates under specified pressing conditions, so that the prepreg can play a role in connection in the multilayer printed board.
In this embodiment, the first core board is one of the daughter boards of the gold finger printed board, fig. 2 is a schematic structural diagram of the first core board, as shown in fig. 2, the first core board 1 may include a first substrate 11, a first inner layer circuit 12, a groove-shaped first semi-cured sheet 13 covering the first substrate 11, and a gold finger 14 plated on the first substrate 11, and generally, the manufacturing process may include: the manufacturing method comprises the steps of firstly cutting materials on a substrate material according to the size of a preset substrate to obtain a first substrate 11, then etching a first inner layer circuit 12 on the first substrate 11, namely obtaining a circuit pattern layer through etching, hole processing and the like, then covering a first semi-cured sheet 13 on the first substrate 11, then carrying out brown oxidation on the first core plate 1, then windowing the first semi-cured sheet 13 to form a groove exposing the first substrate 11, plating a gold-connected finger 14 on the first substrate 11 exposed by the groove, and then finishing manufacturing the first core plate 1.
The browning step is mainly used for increasing the bonding force between the first substrate 11 and the first semi-cured sheet 13 and removing impurities, grease and the like on the surface of the first core plate 1.
In an alternative embodiment of the present invention, a window is opened in the first semi-cured sheet 13, comprising: taking a region on the first substrate 11, where a difference value between a single-side length of the first substrate and a preset golden finger region is a preset value, as a windowing region of the first semi-curing sheet 13, where the preset golden finger region is a square region, windowing the windowing region in the first semi-curing sheet 13, and plating a golden finger 14 in the preset golden finger region, for example, the size of the preset golden finger region is 5mm × 8mm, and the size of the windowing region may be set to be 5.2mm × 8.2mm, it should be noted that a center position of the windowing region should coincide with a center position of the preset golden finger region.
The area, on the first substrate 11, where the difference between the lengths of the single edges of the area with the preset golden finger is the preset value is used as the windowing area of the first semi-curing sheet 13, so that an operation space can be reserved for plating and connecting the golden finger 14, the plating and connecting operation of a machine is easy, and the golden finger 14 can be prevented from being damaged due to collision between the golden finger 14 and the surrounding first semi-curing sheet 13.
And S102, manufacturing a second core board, wherein the second core board comprises a second substrate and a second prepreg covering the second substrate.
The second core board is also one of the daughter boards of the gold finger printed board, and the manufacturing steps mainly include cutting, etching the inner layer circuit, covering the second prepreg, and browning, the specific content of each step is the same as that of the manufacturing step in the first core board 1, fig. 3 is a schematic structural diagram of the second core board, and as shown in fig. 3, the second core board 2 includes a second substrate 21, a second inner layer circuit 22 etched on the second substrate 21, and a second prepreg 23 covering the second substrate 21.
S103, adhering the protective tape to the top of the golden finger.
In the processing process of the golden finger printing plate, the processed equipment or human hand easily directly touches the contact piece of the golden finger 14, so that the surface of the contact piece of the golden finger 14 is damaged, and the performance of information transmission of the golden finger 14 is further influenced, therefore, in the processing process, as shown in fig. 2, the protective tape 15 can be adhered to the top of the golden finger 14 to protect the golden finger 14, because the pressing process of the golden finger printing plate is generally under a high-temperature condition, in order to prevent the protective tape 15 from dissolving or releasing substances influencing the performance of the golden finger 14 at a high temperature, the protective tape 15 used in the embodiment is a high-temperature protective tape.
In an alternative embodiment of the present invention, the sum of the thickness of the protective tape 15 and the thickness of the gold finger 14 may be set to be greater than the thickness of the first semi-cured sheet 13, that is, the upper surface of the protective tape 15 may be higher than the upper surface of the first semi-cured sheet 13, and the higher portion may be referred to as an extra-thick space, because if milling does not have enough extra-thick space, the gold finger 14 may be damaged by the milling cutter, but if the extra-thick space of the protective tape 15 is set to be larger, the height difference may be too large, a problem of press-sealing may easily occur when the second core board 2 and the first core board 1 are pressed, and if the extra-thick space of the protective tape 15 is set to be smaller, the influence of controlled-depth precision may easily damage the effective pattern such as the gold finger 14, and therefore, the extra-thick space may be set according to the depth-control precision of the milling equipment, generally, after the protective tape 15 is adhered on top of the gold finger 14, the upper surface of the protective tape 15 may be made 10-30um higher than the upper surface of the first semi-cured sheet 13.
In an alternative embodiment of the present invention, the protective tape 15 is adhered on top of the gold finger 14, and comprises: and adhering the protective tape 15 to the top of the gold finger 14, pressing the protective tape 15 and the gold finger 14 under a preset first pressing condition, wherein the pressing temperature is 170-180 ℃ and the pressing time is 180-250 seconds under the preset first pressing condition, and performing laser cutting on the protective tape 15 outside the area where the gold finger 14 is located.
The protective tape 15 and the gold finger 14 are pressed together to prevent the protective tape 15 from falling off and causing the failure of the protective measures for protecting the gold finger 14, so the first pressing condition is generally a short-time quick pressing condition, and after the protective tape 15 and the gold finger 14 are pressed together, the redundant protective tape 15 around the gold finger 14 can be cut off by adopting a laser cutting mode.
And S104, stacking and pressing the second core board and the first core board so as to combine the first prepreg and the protective tape with the second prepreg.
As shown in fig. 4, after obtaining a first core board 1 and a second core board 2 of two daughter boards of a gold finger printed board, first stacking the second core board 2 and the first core board 1 in a manner that a surface of a first prepreg 13 of the first core board 1 is placed in a manner of being attached to a surface of a second prepreg 23 of the second core board 2, and then pressing the second core board 2 and the first core board 1 by a pressing machine to obtain a mother board of the gold finger printed board, in the mother board after pressing, bonding surfaces of the first prepreg 13 and the second prepreg 23 are combined with each other, a protective tape 15 is also bonded with a bonding surface of the second prepreg 23, and the mother board of the gold finger printed board shown in fig. 4 is obtained after pressing.
In an optional embodiment of the present invention, the surface of the second cured sheet 23 of the second core plate 2 is laminated with the surface of the first semi-cured sheet 13 of the first core plate 1, and then the second core plate 2 and the first core plate 1 are laminated under the preset second lamination condition, wherein the lamination temperature is 190-.
In the high-temperature pressing process, the first prepreg 13 and the second prepreg 23 are softened and integrated, after the high-temperature pressing process is finished, the first prepreg 13 and the second prepreg 23 are cooled and then react and solidify, the first prepreg 13 is fixedly connected with the second prepreg 23, and the protective tape 15 is not softened or dissolved at high temperature, so that the protective tape 15 is only tightly attached to the second prepreg 23 in the high-temperature pressing process.
And S105, milling the area, corresponding to the golden finger, of the second core board to expose the golden finger.
After the first core board 1 and the second core board 2 are pressed to obtain the mother board of the gold finger printed board, the gold finger 14 in the mother board is still in a covered state, and then the cover of the shielding piece on the side where the top end of the gold finger 14 of the mother board is located can be uncovered. Fig. 4 is a schematic structural diagram of a motherboard of the gold finger printed board, and as can be seen from fig. 4, the shielding member on the side where the top end of the gold finger 14 is located is a partial area of the second core board 2, so that an area corresponding to the gold finger 14 in the second core board 2 can be milled.
In an optional embodiment of the present invention, the area of the second core plate 2 corresponding to the gold finger 14 is used as a milling area, the thickness of the second core plate 2 is used as a milling depth of the milling cutter, the milling cutter is used to mill along the boundary of the milling area by the milling depth, and the milling area in the second core plate 2 is uncovered.
And uncovering the second core board 2 corresponding to the golden finger 14 at the side of the golden finger 14 of the golden finger printed board motherboard, namely taking the area corresponding to the golden finger 14 in the second core board 2 as a milling area and taking the thickness of the second core board 2 as the milling depth of the milling cutter.
Wherein milling is performed along the boundary of the milling region with a milling depth by using a milling cutter, comprising: and (3) drilling a positioning hole at the boundary of the milling area of the second core plate 2 to mark the feed position of the milling cutter, moving the milling cutter to the feed position, and milling by using the milling cutter according to the milling depth.
Fig. 5 is a schematic diagram illustrating uncovering of a golden finger printed board template, when a part of the second core board 2 corresponding to a golden finger 14 is milled away, the protective tape 15 is taken away by means of the bonding force between the part of the second core board 2 and the protective tape 15, and the printed board with the bare golden finger 14 is obtained, wherein the milled away part of the second core board 2 is a combination of a part of the second substrate 21 and a part of the second prepreg 23. Since the golden finger 14 is composed of a plurality of conductive contact pieces arranged at intervals, and there is a gap between the conductive contact pieces, that is, the contact area between the golden finger 14 and the protective tape 15 is smaller than the contact area between the second core board 2 and the protective tape 15, the adhesive force between the second core board 2 and the protective tape 15 is larger, so that the protective tape 15 can be taken away by the milled second core board 2, and a printed board with the golden finger 14 exposed is obtained after milling, and the structure diagram is shown in fig. 6.
In the actual milling process, the milled golden finger printed board is subjected to first inspection, that is, whether the currently set milling depth and the milling area meet preset standards is detected, if yes, milling is continuously performed according to current parameters, and if not, the parameter milling depth and/or the milling area of the milling cutter are/is adjusted according to the currently set milling depth, the milling area and the preset standards until the milled golden finger printed board passes the first inspection.
In the processing process of the golden finger printed board, after milling the area corresponding to the golden finger 14 in the second core board 2, outer layer circuits can be arranged on the outer sides of the first substrate 11 and the second substrate 21 of the golden finger printed board.
The preparation method of the golden finger printed board of the embodiment of the invention comprises the steps of firstly preparing a first core board, wherein the first core board comprises a first substrate, a first semi-cured sheet and golden fingers, the first semi-cured sheet covers the first substrate, the first semi-cured sheet is provided with a groove exposing the first substrate, the golden fingers are plated and connected on the first substrate exposed by the groove, then preparing a second core board, the second core board comprises a second substrate and a second semi-cured sheet covering the second substrate, then bonding a protective adhesive tape on the top of the golden fingers, then stacking and pressing the second core board and the first core board so that the first semi-cured sheet and the protective adhesive tape are combined with the second semi-cured sheet, finally milling the area corresponding to the golden fingers in the second core board to expose the golden fingers, and because the golden fingers are composed of a plurality of conductive contact sheets arranged at intervals, gaps exist among the conductive contact sheets, the contact area between golden finger and the protection sticky tape is less than the contact area between second core and the protection sticky tape promptly, then combine the back when protection sticky tape and second prepreg, the adhesive force between second core and the protection sticky tape is bigger, when the region that corresponds with the golden finger in the second core is milled away, can take away the protection sticky tape from the golden finger, avoid the artifical golden finger surface damage that tears the protection sticky tape and cause, and work efficiency is high, be favorable to printing board volume production to promote.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
Example two
Fig. 6 is a schematic structural diagram of a gold finger printed board according to a second embodiment of the present invention, which may specifically include: the semi-cured layer structure comprises a first substrate 1 and a second substrate 2 which are oppositely arranged, and a semi-cured layer positioned between the first substrate and the second substrate, wherein the semi-cured layer is composed of a first semi-cured layer 13 and a second semi-cured layer 23, and the semi-cured layer structure further comprises a groove which penetrates through the second substrate 2 and the semi-cured layer and exposes a golden finger 14 arranged on the first substrate 1.
Optionally, the gold finger printed board further includes:
and an outer layer circuit disposed outside the first substrate and the second substrate.
The golden finger printed board provided by the embodiment of the invention can be obtained by the preparation method of the golden finger printed board provided by any embodiment of the invention, and has the corresponding functional module and beneficial effect.
It should be noted that, for the gold finger printed board embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for relevant points, reference may be made to part of the description of the method embodiment.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
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| CN115103529A (en) * | 2022-07-26 | 2022-09-23 | 广州广合科技股份有限公司 | Manufacturing method of circuit board, circuit board and production device thereof |
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| 姜涛: "绿色制造丛书 印制电路板行业绿色工厂创建与评价", 30 September 2021, 北京：机械工业出版社, pages: 189 - 190 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679852A (en) * | 2022-04-29 | 2022-06-28 | 广州广合科技股份有限公司 | Manufacturing method of stepped golden finger |
| CN115103529A (en) * | 2022-07-26 | 2022-09-23 | 广州广合科技股份有限公司 | Manufacturing method of circuit board, circuit board and production device thereof |
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