JP2020026527A - 疎水性を有する熱可塑性デンプン複合材料とその製造方法 - Google Patents
疎水性を有する熱可塑性デンプン複合材料とその製造方法 Download PDFInfo
- Publication number
- JP2020026527A JP2020026527A JP2019145026A JP2019145026A JP2020026527A JP 2020026527 A JP2020026527 A JP 2020026527A JP 2019145026 A JP2019145026 A JP 2019145026A JP 2019145026 A JP2019145026 A JP 2019145026A JP 2020026527 A JP2020026527 A JP 2020026527A
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- JP
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- Prior art keywords
- starch
- thermoplastic
- kneading
- biodegradable
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000004898 kneading Methods 0.000 claims description 36
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- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims description 8
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- ZMKVBUOZONDYBW-UHFFFAOYSA-N 1,6-dioxecane-2,5-dione Chemical compound O=C1CCC(=O)OCCCCO1 ZMKVBUOZONDYBW-UHFFFAOYSA-N 0.000 claims description 2
- VMSIYTPWZLSMOH-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1 VMSIYTPWZLSMOH-UHFFFAOYSA-N 0.000 claims description 2
- NVKSMKFBUGBIGE-UHFFFAOYSA-N 2-(tetradecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCCCOCC1CO1 NVKSMKFBUGBIGE-UHFFFAOYSA-N 0.000 claims description 2
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- SFJRUJUEMVAZLM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxymethyl]oxirane Chemical compound CC(C)(C)OCC1CO1 SFJRUJUEMVAZLM-UHFFFAOYSA-N 0.000 claims description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
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- 241000196324 Embryophyta Species 0.000 claims 1
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- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical class [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 3
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- 238000013021 overheating Methods 0.000 description 2
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- ZHROMWXOTYBIMF-UHFFFAOYSA-M sodium;1,3,7,9-tetratert-butyl-11-oxido-5h-benzo[d][1,3,2]benzodioxaphosphocine 11-oxide Chemical compound [Na+].C1C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP([O-])(=O)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C ZHROMWXOTYBIMF-UHFFFAOYSA-M 0.000 description 1
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Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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Abstract
Description
(1)表1に示す各成分の組成比に従い、植物性デンプン(タピオカデンプン:タイ国−泰華社製:三角ブランドタピオカデンプン)をまず含水率が1.0重量%以下になるまで乾燥させたのち、乾燥デンプンを高速ミキサー中に投入して、順に改質剤1(スチレン−マレイン酸無水共重合体:Aldrich社製を購入;XIRAN)、可塑剤1(クエン酸塩誘導体)とバインダー1(ポリブチレンアジペートテレフタレート)を添加して、600〜1000rpmの回転速度下で5〜10分間混合する。(2)予め混合させた乾燥デンプン混合物を混練押出機(遊星式押出機)に投入し、四段階のスクリュー温度をそれぞれ120℃/140℃/150℃/155℃で20〜200rpmの回転速度で混練を行う。(3)得られた熱可塑性デンプン複合材料を押出造粒方式でデンプン含有量が70〜80%の濃縮の顆粒が得られた。
(4)熱可塑性デンプンの顆粒と異なる割合の生分解性樹脂[例えばポリブチルアジペートテレフタレート共重合体:ドイツBASF製;Ecoflex、(poly(butylene adipate−co−terephthalate))]、酸化防止剤(例:杭州海瑞化工社製:(Sodium 2,2’−methylene−bis−(4,6−di−tert−butylphenyl)phosphate)、潤滑剤(例:ステアリン酸)と無機添加物を混合して、80℃で6時間乾燥させた。(5)混合物を混練押出機中(例:遊星式押出機)に投入して、5段階スクリュー温度をそれぞれ120℃/150℃/160℃/150℃/140℃で回転速度100〜400rpmで混練とひっぱり造粒してデンプンベース生分解性複合材が得られた。(6)得られた顆粒を80℃で6時間乾燥させ、更に後続する射出、押出、フィルムブロー、真空成型と発泡等のプロセスを行った。以上、熱可塑性デンプンの顆粒、生分解性プラスチック剤、酸化防止剤、潤滑剤及び無機添加物の添加割合は、製造したい製品により異なるが、例えば熱可塑性デンプンの顆粒:生分解性樹脂:酸化防止剤:潤滑剤:無機添加物(重量比)の添加割合は、20〜50%:20〜40%:0.1〜1.0%:0.3〜3.0%:5〜20%である。
Claims (14)
- 疎水性生分解性の顆粒であり、160℃の溶融指数(MI)は0.2〜6g/10MIn の範囲であり、デンプン含有量が60〜80重量%、含水率は4.1%以下であり、前記疎水性生分解性の顆粒が成膜する時の水に対する接触角は65°以上であり、
前記生分解性の顆粒は、反応押出法により、植物性デンプン及び改質剤を含むデンプン組成物を用いて、反応温度を、指定温度−2℃乃至指定温度+2℃の範囲内に制御して、混練及び変性反応を行って得られた疎水性変性デンプンの顆粒であり、前記指定温度は120〜170℃の範囲にあり、混練及び変性反応を行う時間は10分以下であることを特徴とする、熱可塑性デンプン複合材料。 - 前記デンプン組成物が、更に可塑剤及びバインダーからなる群から選ばれる1種又は2種以上を含むことを特徴とする、請求項1記載の熱可塑性デンプン複合材料。
- 前記デンプン組成物中の植物性デンプンには、タピオカデンプン、馬鈴薯デンプン、小麦デンプン、タロイモデンプン、コーンスターチ及びレンコンデンプンからなる群から選ばれる1種又は2種以上を含み、
前記デンプン組成物における改質剤としては、酸無水物、エポキシ樹脂及びイソシアネート系化合物からなる群から選ばれる1種又は2種以上が含まれる、ことを特徴とする請求項1の熱可塑性デンプン複合材料。 - 前記改質剤は、マレイン酸無水物、スチレン−マレイン酸無水共重合体、t−ブチルグリシジルエーテル、ドデシルグリシジルエーテル、トリデシルグリシジルエーテル、テトラデシルグリシジルエーテル、ビスフェノールA及びエピクロロヒドリンとの重合体、エポキシ樹脂、及びジフェニルメタンジイソシアネートからなる群から選ばれる1種又は2種以上を含む、ことを特徴とする請求項3記載の熱可塑性デンプン複合材料。
- 前記可塑剤は、エポキシ化大豆油、植物油、クエン酸塩誘導体からなる群から選ばれる1種又は2種以上を含む、ことを特徴とする請求項2記載の熱可塑性デンプン複合材料。
- 前記バインダーが、ポリブチレンサクシネート、ポリ(ブチレンアジペートテレフタレート)共重合体(PBAT)、ポリカプロラクトンからなる群からなる群から選ばれる1種又は2種以上を含む、ことを特徴とする請求項2記載の熱可塑性デンプン複合材料。
- 前記デンプン組成物が、60〜80重量%の植物性デンプン、5〜20重量%の改質剤、4〜20重量%の可塑剤及び2〜20重量%のバインダーを含む、ことを特徴とする請求項2記載の熱可塑性デンプン複合材料。
- 熱可塑性デンプン複合材料と、生分解性樹脂とを含む複合材料から形成される顆粒であり、
前記生分解性樹脂は、ポリブチレンサクシネート[Poly(butylene succinate)]、ポリブチレンアジペートテレフタレート[PBAT]、ポリカプロラクトンからなる群から選ばれる1種又は2種以上であり、
前記熱可塑性デンプン複合材料の含有量は20〜50重量%であり、
前記熱可塑性デンプン複合材料は疎水性生分解性の顆粒で、160℃の溶融指数(MI)は0.2〜6g/10MIn の範囲であり、デンプン含有量が60〜80重量%、含水率は4.1%以下、前記疎水性生分解性の顆粒が成膜する時の水に対する接触角は65度以上であり、
前記生分解性の顆粒は、反応押出法により、植物性デンプンと、改質剤と、を含むデンプン組成物を用い、反応温度を、指定温度−2℃乃至指定温度+2℃の範囲内に制御して、混練及び変性反応を行って得られた疎水性変性デンプンの顆粒であり、前記指定温度は120〜170℃の範囲にあり、混練及び変性反応を行う時間は10分以下である、ことを特徴とする生分解性熱可塑性複合材料。 - 前記デンプン組成物中の植物性デンプンには、タピオカデンプン、馬鈴薯デンプン、小麦デンプン、タロイモデンプン、コーンスターチ及びレンコンデンプンからなる群から選ばれる1種又は2種以上を含む、ことを特徴とする請求項8記載の生分解性熱可塑性複合材料。
- 前記デンプン組成物が、60〜80重量%の植物性デンプン、5〜20重量%の改質剤、4〜20重量%の可塑剤及び2〜20重量%のバインダーを含む、ことを特徴とする請求項8記載の生分解性熱可塑性複合材料。
- 反応押出法により、植物性デンプンと、改質剤を含むデンプン組成物を用い、反応温度を、指定温度−2℃乃至指定温度+2℃の範囲内に制御して、混練及び変性反応を行って得られた疎水性変性デンプンの顆粒であり、前記指定温度は120〜170℃の範囲にあり、混練及び変性反応を行う時間は10分以下であることを特徴とする熱可塑性デンプン複合材料の製造方法。
- デンプン組成物を乾燥して、含水率を1%以下にする工程と、
前記デンプン組成物中の成分が均一に混合されるよう撹拌を行ってデンプン組成物の均質混合物を得る工程と、
前記デンプン組成物の均質混合物を混練及び変性反応させて変性混練物を得る工程と、及び、
前記変性混練物を押出造粒して疎水性生分解性の顆粒を得る工程と、を含むことを特徴とする請求項11に記載の製造方法。 - 前記混練及び変性反応を行う方法としては、ニーダー、単軸押出機、二軸押出機及び遊星式押出機からなる群から選ばれる1種又は2種以上の機器で行い、撹拌方法は、高速ミキサーを用い、回転速度600〜1000rpmの条件下で行うことを特徴とする請求項12記載の製造方法。
- 前記混練と変性反応を行う方法は、1組の主ねじスクリューと複数組の遊星式スクリューを有する遊星式押出機を用い、回転速度20〜200rpmの条件で行い、
前記遊星式押出機は投入口から吐出口との間に複数の温度制御ブロックを有し、それぞれ独立して複数個の指定温度に制御され、各前記指定温度と遊星式押出機において混練及び変性反応を行う材料との温度差の絶対値は1〜2℃の範囲であることを特徴とする請求項13に記載の製造方法。
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JP2015511648A (ja) * | 2012-03-13 | 2015-04-20 | テックスチェム ポリマーズ エスディーエヌ ビーエイチディー | 農業廃棄物から得られる熱可塑性デンプン組成物 |
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