JP2019084012A - Installation method of ic tag and ic tag built-in metal body - Google Patents

Abstract

To provide an installation method of an IC tag in which the bonding strength with the IC tag and the mounted object is dramatically increased by using adhesives at low cost, and thereby the IC tag is made difficult to be separated from the mounted object even if the mounted object is used repeatedly under a high temperature and a corrosive environment, and provide an IC tag built-in metal body in which a reading machine/writing machine can properly read/write the information stored in the IC tag.SOLUTION: A recess 4 for storing an IC tag 2 is formed to forceps 1 being an individual identification management target, and then a laser beam is applied to an inner circumferential surface including at least a bottom of the recess to form a rough surface. Then, adhesives are applied to the rough surface to form a substrate of the adhesives, the IC tag is placed on the substrate and the whole IC tag is covered and sealed by the adhesives. The rough recess diameter is 10-100 μm and the depth is formed to become 50-200 μm.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of attaching an IC tag and an IC tag built-in metal body, and more specifically, the bonding strength between an IC tag and its object to be attached is significantly enhanced at low cost. A method of attaching an IC tag that makes it difficult to separate the IC tag from the load even when used repeatedly under high temperature and corrosive environments, and a reader / writer records the information stored in the IC tag The present invention relates to an IC tag built-in metal body that can be suitably read / written.

  In recent years, individual identification technology using radio communication technology such as electromagnetic waves, an abbreviation of so-called RFID tag ("Radio-Frequency Identification tag", which is also called RF tag, wireless tag or IC tag) Is used in various industrial fields. This IC tag has a structure in which a microminiature integrated circuit (IC chip) is embedded in a nonmetallic thin plate (tag) such as plastic, and is connected to a host computer (server) through an electromagnetic wave (carrier wave). It is configured to exchange data between them. Therefore, in the IC chip embedded inside, an information storage medium (RAM) capable of reading / rewriting information (data), a modulator (encoder) for modulating data (digital format) to a carrier wave, and vice versa A demodulator (decoder) for converting the received carrier wave into data (digital format), an antenna for transmitting and receiving the carrier wave, and a storage battery for temporarily storing power are integrated. Also, the necessary power uses the induced electromotive force generated when receiving a carrier wave, and a battery is not particularly built in.

  In addition to being used alone as a credit card, a commuter pass, or electronic money, the IC tag is also used in a form that can be attached to a product or a product to be individually identified. For example, an IC tag is attached to a female medical instrument to be reused, a forceps, etc., and is used as a means for managing information (usage information) relating to usage mode, age, and usage history of those medical instruments. ing. As an example, IC tag is attached to a surgical instrument, an ultrasonic diagnostic device, etc. of an endoscope such as a scalpel, forceps, scissors, gauze, etc., and management technology using the IC tag to manage usage information of these surgical instruments etc. (See, for example, Patent Document 1).

  In addition, the IC tag is also used in a medical device that is used only once, for example, a system that prohibits reuse of disposable medical devices. As an example, an IC tag in which a predetermined code indicating that re-use is prohibited is described in advance is attached to the medical device, and the code reader is stored in the chamber of the sterilizer, and the non-reuseable medical device is sterilized There has been disclosed a management system of non-reusable medical device which is designed to prevent the re-use and re-use (see, for example, Patent Document 2). In this management system, the IC tag is attached to or embedded in the flange portion of the device.

  Furthermore, as a single medical device provided with an IC tag, for example, a technique of providing an IC tag in a syringe (syringe cylinder) is disclosed (see, for example, Patent Document 3). In this syringe, the IC tag is used in the form of being embedded in or affixed to an outer cylinder made of a heat-resistant polypropylene, a resin of cyclic polyolefin. Other examples of use of IC tags are known, such as those used in manipulator systems and those used in systems that facilitate medical procedures.

  On the other hand, in order to further improve the bonding strength between the metal alloy and the carbon fiber reinforced plastic (CFRP), carbon nanotubes are formed on the surface of the metal alloy by adding carbon nanotubes to the epoxy adhesive, thereby forming irregularities of micron order. The invention relating to a method of bonding a metal member and a resin member excellent in corrosion resistance, weather resistance, and heat resistance is disclosed that a member in which a metal alloy and CFRP are firmly bonded can be obtained by penetration. (See, for example, Patent Document 4).

  In addition, the surface has a micron-order roughness by chemical etching and the surface is covered with an irregular periodic fine pitch of 5 to 500 nm, and the surface is metal oxide or metal phosphate oxide. Of a metal shape which is a thin layer of an object, and a molding made of an epoxy resin thermosetting resin composition obtained by injection molding are integrated by sandwiching a cured product layer of an epoxy adhesive. An invention relating to an adhesive complex of a metal alloy and a thermosetting resin characterized in that is disclosed (see, for example, Patent Document 5).

JP, 2008-86756, A JP 2003-126251 A JP, 2006-271461, A JP, 2011-42030, A JP 2012-66383 A

  As described above, a system for managing medical instruments and the like using an IC tag is constructed in various forms. In addition, as a method of attaching the IC tag to the above-mentioned medical instrument etc., many of them attach the IC tag to the outer surface of the medical instrument etc by an adhesive or form a recess on the outer surface and store it in the recess. It is an attachment method embedded with an agent. In particular, for medical devices such as re-used scalpels, forceps, and tweezers, predetermined chemical disinfection and boiling disinfection or high-temperature steam disinfection are repeated, so the IC tag attached to the medical device can be easily removed from the medical device. It is required not to separate.

  However, in the above-mentioned conventional IC tag attachment method, the bonding strength between the IC tag and the medical device by the adhesive gradually deteriorates due to repeated chemical sterilization and boiling sterilization, and the IC tag is separated from the medical device at the end. There is a risk of

  By the way, in order to increase the bonding strength between the IC tag and the medical device, it is considered to add carbon nanotubes to the adhesive, or to make the inner peripheral surface of the recess for accommodating the IC tag into the above-mentioned fine asperity shape by chemical etching. Be

  However, the addition of carbon nanotubes to the adhesive, or the formation of the above-mentioned fine asperity shape by chemical etching on the inner peripheral surface of the recess for containing the IC tag has a problem that the manufacturing cost increases.

  In addition, when the IC tag is embedded in the recess with an adhesive, the quality of wireless communication via radio waves (data carrier waves) between the IC tag and the reader / writer is poor, and in the reader / writer There has been a problem that read errors or write errors occur frequently.

  Therefore, the present invention has been made in view of the above-mentioned problems of the prior art, and the object thereof is to dramatically increase the bonding strength between the IC tag and the object to be mounted by the adhesive at low cost. A method of attaching an IC tag and a reader / writer are stored in the IC tag, which makes it difficult to separate the IC tag from the object even if the object is repeatedly used in a high temperature and corrosive environment. It is an object of the present invention to provide an IC tag built-in metal body capable of suitably reading / writing information.

  In the IC tag built-in metal body according to the present invention for achieving the above object, a recess (4, 4A) is formed on the outer surface, and a rectangular plate IC tag (2) is embedded in the recess (4, 4A). A rough surface, which is a laser irradiation mark, is formed on the bottom portion (4a) of the metal body (1) and the concave portion (4, 4A), and the IC tag (2) is entirely covered by the adhesive (3). It is characterized in that it is covered and sealed in the recess (4).

  A second feature of the IC tag incorporated metal body according to the present invention is that the rough surface has a plurality of depressions, the diameter of the depressions being 10 to 100 μm and the depth being 50 to 200 μm.

  In the above configuration, a large number of depressions / hollows (rough surfaces) are formed on the inner peripheral surface of the bottom portion (4a) of the recess (4). Therefore, the adhesive (3) for bonding the IC tag (2) and the metal body (1) penetrates into these recesses and cavities, and exerts a so-called anchor effect. As a result, the adhesive (3) is less likely to peel off the inner peripheral surface of the bottom portion (4a) of the recess (4). Further, since the IC tag (2) is entirely covered with the adhesive (3), the bonding strength between the IC tag (2) and the metal body (1) by the adhesive (3) is dramatically improved, and the IC The tag (2) is firmly housed in the recess (4) of the metal body (1), making it difficult to separate.

  The third feature of the IC tag built-in metal body according to the present invention is that at least one of the four side surfaces (2b, 2c, 2d, 2e) of the IC tag (2) is the recess (4B, 4C) The other side and the side (4b) of the recess (4B, 4C) and the other side not in contact with the side (4b) directly or indirectly through the layer of the backing (3) A gap (SP1, SP2, SP3) is formed between the two.

  In the above configuration, the gap (SP1, SP2, SP3) is formed, whereby radio waves (data carrier waves) carrying data are diffracted to the bottom of the recess through the gap, and conversely, from the IC tag It becomes possible for the data carrier propagated to the bottom of the recess to propagate through the gap into space. This further improves the transmission and reception characteristics of the data carrier in the IC tag.

  A method of attaching an IC tag according to the present invention for achieving the above object comprises forming a recess (4) for housing the IC tag (2) with respect to the metal body (1) to be subjected to individual identification management. And a second step of forming a rough surface by irradiating the inner peripheral surface including the bottom (4a) of the recess (4) with laser light (6a), and the bottom (4a) of the recess (4) The third step of applying an adhesive (3) to form a base of the adhesive (3) and placing the IC tag (2) on the base of the adhesive (3) to form the IC tag (2) And a fourth step of covering and sealing the whole with an adhesive (3).

  A second feature of the method for attaching an IC tag according to the present invention is that the rough surface has a plurality of depressions, the diameter of the depressions being 10 to 100 μm and the depth being 50 to 200 μm.

  A third feature of the method for attaching an IC tag according to the present invention is that the laser beam (6a) is irradiated continuously or intermittently.

  In the above configuration, the rough surface can be formed on the inner peripheral surface of the recess (4) of the metal body (1) of various dimensions and materials.

According to the mounting method of the IC tag of the present invention, the bonding strength between the IC tag and the mounting object by the adhesive is dramatically enhanced at low cost, whereby the mounting object is repeatedly used under high temperature and corrosive environment. Even if the IC tag is difficult to separate from the object to be mounted.
In addition, according to the IC tag built-in metal body of the present invention, it can be repeatedly used under high temperature and corrosive environment, and the reader / writer can preferably read / write the information stored in the IC tag. become able to do.

It is a perspective view which shows the forceps to which IC tag was attached by the attachment method of IC tag which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows the principal part cross section of the recessed part which accommodates an IC tag. It is an explanatory view showing the important section cross section of the IC tag concerning a 1st embodiment of the present invention. It is explanatory drawing which shows the attachment method of the IC tag which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows the principal part cross section of the recessed part which accommodates the IC tag which concerns on the modification of 1st Embodiment. It is an explanatory view showing the important section cross section of the crevice which stores the IC tag concerning a 2nd embodiment of the present invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 3rd Embodiment of this invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 4th Embodiment of this invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 5th Embodiment of this invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 6th Embodiment of this invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 7th Embodiment of this invention. It is explanatory drawing which shows the recessed part which accommodates the IC tag which concerns on 8th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment
FIG. 1 is a perspective view showing a forceps 1 to which an IC tag 2 is attached by the method of attaching an IC tag according to a first embodiment of the present invention. FIG. 2 is an explanatory view showing the cross-section of the main part of the recess 4 of the insulator 1 for housing the IC tag 2. FIG. 3 is an explanatory view showing the cross section of the main part of the IC tag 2 according to the first embodiment of the present invention.

  The forceps 1 is composed of a handle portion 1a for the user to operate, and a grip portion 1c which rotates about the support shaft 1b by the operation of the handle portion 1a to perform a gripping operation. The forceps 1 is a mosquito-type medical forceps having a length of about 12 cm, and after use, is repeatedly used while being subjected to a predetermined sterilization treatment (chemical disinfection and boiling or high temperature steam disinfection). Accordingly, the insulator 1 is made of stainless steel (for example, No. 300 series of SUS standard) from the viewpoint of corrosion resistance and heat resistance. In addition, although the type of the forceps 1 of this embodiment is a mosquito type, it is not limited to this, For example, other types, for example, a Kelly type, a Kochel type, or a Paan type, may be sufficient.

  A recess 4 for housing the IC tag 2 is formed in the handle portion 1 a of the insulator 1. As shown in FIG. 2, the IC tag 2 is housed inside the recess 4 in a form entirely covered by the adhesive 3 (a form in which a layer of the adhesive 3 is interposed between the side 4 b and the IC tag 2). ing. In particular, a large number of depressions and cavities (rough surfaces) are formed on the inner peripheral surface of the bottom portion 4 a of the recess 4. The adhesive 3 penetrates and hardens in these recesses and cavities, and is firmly locked to the inner peripheral surface of the bottom portion 4 a, so that the adhesive 3 is less likely to peel off from the recess 4. That is, the peeling strength between the adhesive 3 and the inner peripheral surface of the recess 4 is significantly improved. Since the IC tag 2 is entirely covered with the adhesive 3, the IC tag 2 is difficult to separate from the recess 4. As a result, even if the forceps 1 are repeatedly subjected to the sterilization process, the IC tag 2 is firmly housed inside the forceps 1.

  The IC tag 2 includes devices such as a rewritable information recording medium (RAM), an encoder for modulating a digital signal to a high frequency signal, a decoder for restoring a high frequency signal to a digital signal, and an antenna for transmitting and receiving high frequency signals. Has an ultra-compact, high-density integrated electronic substrate, and utilizes the induced electromotive force generated when the coil of the antenna receives a high frequency signal as the operating power of each device. The external reader receives the high frequency signal transmitted from the IC tag 2, reads the information stored in the RAM, and transmits the read information to the control unit of the information system. The control unit of the information system accurately grasps the usage status of the forceps 1 based on the information transmitted from the reader, and manages whether the usage status is normal or not.

  Further, as shown in FIG. 3, the IC tag 2 includes the electronic substrate 20, the lower case 21 which is injection-molded in advance so as to be fitted to the device mounting surface (concave and convex surface) of the electronic substrate 20, and the electronic substrate 20. And a top case 22 injection-molded to cover the solder surface of the electronic substrate 20. As shown in FIG. The lower case 21 and the upper case 22 are made of the same material and integrated by heat fusion. The material of the lower case 21 and the upper case 22 is preferably an engineering plastic having heat resistance and mechanical strength such as polyamide resin, polycarbonate, polyethylene terephthalate, polyimide, polyphenylene sulfide and the like.

  The heat-resistant sheet 23 is a thin sheet and is a relatively heat-resistant synthetic resin film. This material may be the same as or different from the lower case 21 and the upper case 22. The heat-resistant sheet 23 is for protecting the electronic substrate 20 from the heat of the molten resin related to the upper case 22 to be injected.

  The adhesive 3 may be an epoxy adhesive or a hot melt adhesive such as a polyester resin.

FIG. 4 is an explanatory view showing a method of attaching the IC tag according to the present embodiment.
The method for attaching an IC tag according to the present embodiment includes a first step (FIG. 4A) of forming a recess 4 for housing the IC tag 2 inside the insulator 1 which is an individual identification management target, and The second step (FIG. 4B) of forming a rough surface (laser irradiation mark) by irradiating the inner peripheral surface including the bottom 4a of 4 with the laser beam 6a and applying the adhesive 3 to the bottom 4a of the recess 4 Third step (injecting) to form the base of the adhesive 3 (FIG. 4C) and placing the IC tag 2 on the base of the adhesive 3 and covering and sealing the whole with the adhesive 3 It consists of the 4th process (FIG.4 (d), FIG.4 (e)). Each step will be described below.

  As shown in FIG. 4A, the outer surface of the handle portion 1a of the insulator 1 is cut by a cutting tool such as an end mill 5 to form a recess 4 for housing the IC tag 2. The dimensions of the recess 4 are, for example, depth 2 m × width 6 mm × depth 1.5 mm. Other than cutting using the end mill 5, it is possible to apply coing processing in which the outer surface of the handle portion 1a of the insulator 1 is stamped with a mold (not shown) of the convex portion.

  Next, as shown in FIG. 4B, the surface roughness in which a large number of depressions and cavities (rough surfaces) are formed by irradiating the inner peripheral surface including the bottom 4a of the recess 4 with the laser beam 6a. Put in a state. The diameter of the depression is, for example, 10 to 100 μm, and the depth is 50 to 200 μm.

  In addition, although the laser irradiation range which concerns on this embodiment is the bottom part 4a of the recessed part 4, as FIG. 5 shows, it may be both the bottom part 4a and the side part 4b.

  Further, as the laser beam 6a, for example, YVO4 laser, fiber laser (preferably single mode fiber laser), excimer laser, carbon dioxide gas laser, ultraviolet laser, YAG laser, semiconductor laser, glass laser, ruby laser, He-Ne laser It is possible to use nitrogen lasers, chelating lasers, dye lasers. Further, as the irradiation mode of the laser beam 6a, it is possible to use a continuous irradiation mode or a pulse irradiation mode.

  Next, as shown in FIG. 4C, the adhesive 3 is applied (injected) to the bottom 4 a of the recess 4 irradiated with the laser beam 6 a using the nozzle 7 to form the base of the adhesive 3. Form

  Next, as shown in FIG. 4 (d), the IC tag 2 is placed on the base of the adhesive 3.

  Next, as shown in FIG. 4 (e), the adhesive 3 is further injected through the nozzle 7, and the entire IC tag 2 is covered and sealed with the adhesive 3. It can be seen that the adhesive 3 penetrates and hardens in the depressions and cavities formed in the bottom portion 4 a of the recess 4 and is firmly adhered to the inner peripheral surface of the recess 4. Therefore, the IC tag 2 is firmly stored in the recess 4 of the insulator 1 by the adhesive 3.

  As described above, according to the method for attaching an IC tag of the present invention, the bonding strength between the IC tag 2 and the insulator 1 (object to be attached) by the adhesive 3 is dramatically enhanced at low cost, whereby the IC tag 2 is Even when the attached forceps 1 (object to be attached) is repeatedly subjected to sterilization treatment such as chemical disinfection and boiling disinfection, the IC tag 2 is difficult to be separated from the forceps 1 (object to be attached).

Second Embodiment
FIG. 6 is an explanatory view showing the cross-section of the main part of a recess 4A for housing the IC tag 2 according to the second embodiment of the present invention. The recess 4A of the second embodiment is configured such that the side portion 4b forms a tapered surface that is inclined radially outward. By expanding the gap L between the IC tag 2 and the side portion 4b of the recess 4A, the radio wave (data carrier) is diffracted to the bottom surface 2a of the IC tag 2 through the gap L, and conversely, the IC tag 2 It is possible for the data carrier propagated from the side of the concave portion to the side of the bottom 4a to propagate through the gap L to the space. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Third Embodiment
FIG. 7 is an explanatory view showing a recess 4B for housing the IC tag 2 according to the third embodiment of the present invention. 7 (a) is a front view of the recess 4B, and FIG. 7 (b) is a bottom view of the recess 4B. In the recess 4B of the third embodiment, both sides of the side 4b orthogonal to the longitudinal direction are open. In addition, the IC tag 2 is in direct contact with the bottom 4a and the side 4b of the recess 4B directly on the two surfaces, ie, the bottom 2a and the side 2b, or indirectly via the layer of the adhesive 3.

  As a result, gaps SP1, SP2 and SP3 are respectively formed between the other side surfaces 2c, 2d and 2e of the IC tag 2 and the recess 4B. By forming the gaps SP1, SP2 and SP3, the radio wave (data carrier wave) is diffracted toward the bottom surface 2a of the IC tag 2 through the gaps SP1, SP2 and SP3 in the same manner as the recess 4A. In addition, the data carrier propagated from the IC tag 2 to the concave bottom 4a side can propagate to the space through the gaps SP1, SP2, and SP3. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Fourth Embodiment
FIG. 8 is an explanatory view showing a recess 4C for housing the IC tag 2 according to the fourth embodiment of the present invention. 8 (a) is a front view of the recess 4C, and FIG. 8 (b) is a bottom view of the recess 4C. In the recess 4C of the fourth embodiment, both sides of the side 4b orthogonal to the longitudinal direction are open. The IC tag 2 is in direct contact with the bottom 4a and the side 4b of the recess 4C directly or indirectly via the layer of the adhesive 3 on three sides, ie, the bottom 2a, the side 2b and the side 2d.

  As a result, gaps SP1 and SP3 are respectively formed between the other side surfaces 2c and 2e of the IC tag 2 and the recess 4C. By forming the gaps SP1 and SP3, the radio wave (data carrier) is diffracted toward the bottom surface 2a of the IC tag 2 through the gaps SP1 and SP3 similarly to the recess 4A, and conversely, the IC tag 2 It is possible for the data carrier propagated from the side to the recess bottom 4a side to propagate to space through the gaps SP1 and SP3. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Fifth Embodiment
FIG. 9 is an explanatory view showing a recess 4D for housing the IC tag 2 according to the fifth embodiment of the present invention. Fig.9 (a) is a front view of recessed part 4D, FIG.9 (b) is a bottom view of recessed part 4D. In the recess 4D of the fifth embodiment, one side of the side 4b orthogonal to the longitudinal direction is open. Further, the IC tag 2 is in direct contact with the bottom 4a and the side 4b of the recess 4D directly or indirectly via the layer of the adhesive 3 on three sides, ie, the bottom 2a, the side 2b and the side 2c.

  As a result, gaps SP2 and SP3 are respectively formed between the other side surfaces 2d and 2e of the IC tag 2 and the recess 4D. By forming the gaps SP2 and SP3, the radio wave (data carrier wave) is diffracted toward the bottom surface 2a of the IC tag 2 through the gaps SP2 and SP3 similarly to the recess 4A, and conversely, the IC tag 2 It is possible for the data carrier propagated from the side to the recess bottom 4a side to propagate to the space through the gaps SP2 and SP3. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Sixth Embodiment
FIG. 10 is an explanatory view showing a recess 4E for housing the IC tag 2 according to the sixth embodiment of the present invention. FIG. 10 (a) is a front view of the recess 4E, and FIG. 10 (b) is a bottom view of the recess 4E. In the recess 4E of the sixth embodiment, one side of the side 4b orthogonal to the longitudinal direction is open. Also, IC tag 2 is in direct contact with bottom 4a and side 4b of recess 4E directly on the four sides, ie, bottom 2a, side 2b, side 2c and side 2d, respectively, or indirectly via a layer of adhesive 3. There is.

  As a result, a gap SP3 is formed between the other side surface 2e of the IC tag 2 and the recess 4E. By forming the gap SP3, the radio wave (data carrier wave) is diffracted on the bottom surface 2a side of the IC tag 2 through the gap SP3 like the recess 4A, and conversely, from the IC tag 2 to the recess bottom 4a. The data carrier propagated to the side can be propagated to space through the gap SP3. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Seventh Embodiment
FIG. 11 is an explanatory view showing a recess 4F for housing the IC tag 2 according to the seventh embodiment of the present invention. 11 (a) is a front view of the recess 4F, and FIG. 11 (b) is a bottom view of the recess 4F. The recess 4F of the seventh embodiment has a configuration in which the side portion 4b is closed. Also, IC tag 2 is in direct contact with bottom 4a and side 4b of recess 4F directly on the four sides, ie, bottom 2a, side 2b, side 2c and side 2e, respectively or indirectly via the layer of adhesive 3. There is.

  As a result, a gap SP2 is formed between the other side surface 2d of the IC tag 2 and the recess 4F. By forming the gap SP2, the radio wave (data carrier wave) is diffracted on the bottom surface 2a side of the IC tag 2 through the gap SP2 similarly to the recess 4A, and conversely, from the IC tag 2 to the recess bottom 4a. It becomes possible for the data carrier propagated to the side to propagate to space through the gap SP2. This improves the transmission and reception characteristics of the data carrier in the IC tag 2. As a result, a reader / writer (not shown) can accurately read the information stored in the IC tag 2 and write desired data in the IC tag 2.

Eighth Embodiment
Further, as shown in FIG. 12, in the first embodiment, in the IC tag 2, the bottom surface 2 a and at least one of the four side surfaces 2 b, 2 c, 2 d and 2 e directly contact the side portion 4 b of the recess 4. Or indirectly via a layer of adhesive 3.

  In the third to sixth embodiments, the side portion 4b of the recess may be formed to form a tapered surface that is inclined radially outward as in the second embodiment.

REFERENCE SIGNS LIST 1 forceps 1 a finger portion 1 b support shaft 1 c grip portion 2 IC tag 20 electronic substrate 21 lower case 22 upper case 23 heat resistant sheet 3 adhesive 4 recess 4 a bottom 4 b side 5 end mill 6 laser oscillator 6 a laser light 7 nozzle

Claims (6)

A metal body (1) in which a recess (4, 4A) is formed on the outer surface and an IC tag (2) of a rectangular plate is embedded in the recess (4, 4A),
A rough surface, which is a laser irradiation mark, is formed on the bottom (4a) of the recess (4, 4A), and the IC tag (2) is entirely covered with an adhesive (3) to cover the recess (4). A metal body with built-in IC tag characterized in that it is sealed.   The IC tag built-in metal body according to claim 1, wherein the rough surface has a plurality of depressions, the diameter of the depressions is 10 to 100 μm, and the depth is 50 to 200 μm. Built-in metal body.   The IC tag built-in metal body according to claim 1 or 2, wherein at least one of the four side surfaces (2b, 2c, 2d, 2e) of the IC tag (2) is the side of the recess (4B, 4C) Of the other side and the side (4b) of the recess (4B, 4C) while in direct contact with the part (4b) or indirectly through the layer of the backing (3) A gap (SP1, SP2, SP3) is formed between the IC tag built-in metal body. A first step of forming a recess (4, 4A) or a groove for housing the IC tag (2) with respect to the metal body (1) to be subjected to individual identification management;
A second step of forming a rough surface by irradiating a laser beam (6a) to an inner peripheral surface including at least a bottom portion (4a) of the recess (4, 4A);
A third step of applying an adhesive (3) to the rough surface of the bottom portion (4a) to form a base of the adhesive (3);
A fourth step of placing the IC tag (2) on the base of the adhesive (3) and covering and sealing the entire IC tag (2) with the adhesive (3);
A method of attaching an IC tag, comprising:   5. The method for attaching an IC tag according to claim 4, wherein the rough surface has a plurality of depressions, the diameter of the depressions is 10 to 100 μm, and the depth is 50 to 200 μm. Method.   The method for attaching an IC tag according to claim 4 or 5, wherein the laser beam (6a) is irradiated continuously or intermittently.

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