JPH0717793U - Electric / electronic component storage container - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] The present invention is suitable for mass production without contaminating stored items, suitable for mass production, and capable of rewriting initial information.
An electronic parts storage container is provided. [Structure] This electrical / electronic component storage container is provided with a non-contact data carrier 1 by integral molding. Particularly, this electrical / electronic component storage container contains an inner box 9 for storing semiconductor wafers. A wafer container 2 comprising an upper lid 4 and an outer box 8 for housing, in which a non-contact data carrier 1 is provided on a part or all of these members.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is suitable for storing, transporting, and storing electric / electronic parts such as semiconductor wafers, magnetic disk aluminum disks, photomask quartz glass, liquid crystal glass panels, hybrid ICs, transistor SIPs, and resistor networks. Related to storage containers.

[0002]

[Prior art]

 Conventionally, for example, a numbered or identification code mark is provided on a storage container for storing and transporting semiconductor wafers, and various processes such as surface treatment, cleaning and inspection are performed on each wafer. In order to display information such as each processing history of the wafer on the carrier (conveying means) that conveys paper, for example, labels such as recording paper or cards are attached, or pockets for storing these are provided (actually, No. 53-48598, No. Hei 2-95245, etc.), holes, notches, slits, irregularities, etc. may be provided in a part of the container or carrier to show them (No. 61-158943, 62-158943). No. 163949, Japanese Utility Model Publication No. 1-73939, No. 2-734), an identification code such as a bar code is directly attached to the body of the container or carrier by a laser, and other punch cards, magnetic cards, IC Such as using a card Proposals have been made.

[0003]

[Problems to be solved by the device]

 However, the method of attaching labels such as recording paper and cards depends on their materials, but dust, particles, organic substances, etc. of paper and adhesives contaminate wafers that require high cleanliness and In addition to causing generation and reduction in yield, many adhesive labels currently on the market use rubber-based or acrylic-based adhesives for surface treatment of the material or silicone for the separator. Since the backing paper and scraps are treated in the same way as plastic waste, the cost of waste treatment is bulky and causes post-treatment problems. Also, when reusing this, old recording paper and cards had to be removed and replaced with new ones, which was extremely complicated and recording was difficult. In addition to the above problems, the method of providing a pocket for storing recording paper, cards, etc. not only limits the design of the container and carrier, but also complicates the structure of the mold, and the stored items can be removed from the pocket during use. May fall off.

A unique number is used for a method of providing a hole, a notch, a slit, an unevenness or the like for representing these on a part of a container or a carrier, or a method for directly providing an identification code such as a bar code on the body of the container or the carrier. Although it is suitable for identification code marks, etc., it is possible to distinguish them by visual inspection and image processing using a camera including the method of applying the above label, so the former may be contaminated by dust brought in by workers or touch. However, the latter has the drawbacks of increasing the size and cost of the device. Furthermore, since it is necessary to deal with all the objects, the processing system becomes complicated, making it unsuitable for mass production, especially in the case of a carrier that stores information such as each processing history for each wafer process. Has a problem that it is difficult to apply because it is difficult to rewrite the initial information. Furthermore, from the viewpoint of resource protection due to recent environmental problems, even when trying to reuse these, the range of use must be naturally limited in terms of rewriting the initial information. . Therefore, an object of the present invention is to provide an electric / electronic component storage container which is easy to mold, suitable for mass production, and capable of rewriting initial information without contaminating the stored items.

[0005]

[Means for Solving the Problems]

 The electric / electronic component storage container of the present invention is characterized by being provided with a non-contact data carrier integrally formed with the container. In particular, the electric / electronic component storage container is a semiconductor wafer. A wafer storage container comprising an inner box for storing the above, an upper lid for storing the same, and an outer box, characterized in that a non-contact data carrier is provided in a part or all of these members. .

Hereinafter, the present invention will be described in detail. Containers for electrical and electronic parts are generally polypropylene, polyethylene, polystyrene, acrylonitrile-butadiene-styrene copolymer, polyacetal, polyamide, polybutylene terephthalate, polycarbonate, polysulfone, fluorine resin, polyphenylene sulfide, polyether ether ketone, etc. Although it is made of resin material, the non-contact data carrier is integrally formed with the container at a part of the molded product to form the product of the present invention. Here, a contactless data carrier is a small transponder that responds to radio waves and sends back the information required for recording by radio waves in a system that allows individual recognition and reading / writing of attribute information from a distance. Is. This is generally composed of a coil (antenna) part required for transmission and reception, and an electronic circuit part consisting of an IC for recording data and a capacitor, and receives an electric wave emitted from an antenna connected to a reader in the system. Using this as an electromotive force, the information recorded in the IC is sent back as another radio wave. Furthermore, this information can be aggregated and managed by a personal computer connected to a reader.

The non-contact data carrier is classified according to its stored information amount, transmission method, access method, communication distance, functionality, physical shape, protective structure, etc., which is in accordance with the gist of the present invention. Anything is acceptable as long as it is. That is, the amount of stored information is roughly classified into presence detection type (1 bit), information identification type (8 to 128 bit), database type (8 kbit to 1 Mbit), etc. Items such as the container unique number, the lot number, and the amount of information such as the recognition of the processing process can be selected according to the amount of information to be stored. Generally, 4 to 128 bits are sufficient for the purpose of individual identification, and a large amount of stored information is required for dynamic storage of technical information such as processing, inspection, management, manufacturing line, and maintenance information. Transmission methods include electromagnetic coupling method, electromagnetic induction method, microwave method, optical communication method, etc., and communication distances are different. The communicable distances are approximately several mm to several tens of mm, ~ 1 m, ~ 3 m, and several tens mm ~ 200 mm, respectively, such as shipping / acceptance of storage containers for electric / electronic parts, processing process of electric / electronic parts, etc. It may be used properly depending on the place where the container or carrier is used, space, radio waves, noise, traffic of people, environmental conditions such as dust, presence of surrounding metal, etc., requirements of combination with system such as other machines and readers. .

Access methods include a read-only type, a write-once type, and a readable / writable type. Again, similar to the amount of stored information, the management items of the target electrical / electronic component storage container, such as a container It should be considered according to the unique number, lot number, recognition of processing process, etc. The physical shape includes a rod type, a card type, a coin type, a module, a chip, etc., and may be selected depending on the shape and dimensions of the container or carrier to be installed. That is, a rod-type, card-type, coin-type, etc. data carrier that is sealed in a glass or resin case for the purpose of protection from external loads such as drip-proof, waterproof, and heat-resistant is installed as it is. Alternatively, bare chips or modules that have not been treated in this way may be installed directly. Further, if necessary, the bare chip or module may be once provided with a protective coat with a material such as epoxy or silicone, and then installed.

Regarding the installation of these non-contact data carriers in the container, the number, position, method, state, etc. of the non-contact data carrier are the same as those of the data carrier transmission system described above, as long as they are provided as a unit when molding the container. Anything is acceptable as long as it satisfies the conditions such as the communication distance generated from the relationship with the layout of the reader and other devices. For example, regarding the number, like a container for semiconductor wafers, if it is composed of multiple parts such as a lid, an outer box and an inner box, it may be installed individually for each part to be managed, If the assembly is to be managed as a whole, it may be installed on any of these parts. Also, regarding the position, if there is a thick part enough to embed and integrate the non-contact data carrier in terms of dimensions, install it at this position, or design flat parts, concave parts, convex parts, corner parts. , Etc., and by newly installing a site to install it at an appropriate position as necessary, the function of individual parts and compatibility with other parts, etc. are significantly impaired, and the operation of automatic machines etc. Any position may be used as long as it does not interfere with. Further, depending on the configuration of the non-contact data carrier, for example, the IC of the data recording section, the electronic circuit section such as a capacitor and the antenna section, which may be of a type such as a core coil antenna or a loop coil antenna, for example. However, they may be installed in different positions.

The non-contact data carrier is installed by simultaneously installing the non-contact data carrier and molding the container or the carrier, and integrally molding and integrating the non-contact data carrier. Examples of molding methods for containers and carriers include injection molding, blow molding, casting, drawing from sheet, and vacuum forming, depending on the material and shape used and the application. Then, the integration method by insert molding using injection molding is effective because it is suitable for mass production. FIG. 1 is a schematic diagram showing an example of the installation state of the non-contact data carrier in the electric / electronic component storage container of the present invention on the container or carrier. FIG. 1 (a) shows a state in which the entire non-contact data carrier 1 is completely buried in contact with the container or carrier body 2, and the case where the non-contact data carrier 1 is installed by injection molding will be explained. Hold the non-contact data carrier from one side or both sides at a predetermined position in the mold corresponding to the thick part with the operating pin of the injection molding machine, and fix it in the mold. It is molded and integrated by injection-timing the resin and returning the holding pin so that the non-contact data carrier is embedded in the resin. Also, in the case of casting using a liquid acrylic resin or the like, molding can be performed by the same method.

FIG. 1B shows a state in which a part of the non-contact data carrier 1 is embedded in the space 3 in the container or the carrier body 2 while being in contact therewith. In this case, a nozzle for injecting compressed gas that works with the operation circuit of the injection molding machine is installed, and the non-contact data carrier is embedded in the resin by timing the injection of resin into the mold. At the same time, a compressed gas is injected from the nozzle, and the nozzle is returned after the space 3 is formed, which is molded and integrated by a method generally called a gas assist method. At this time, the holding pin and the nozzle for injecting the compressed gas may be used together to simplify the parts and structure of the mold. Also, in the case of casting using a liquid acrylic resin or the like, molding can be performed by the same method. In this state, it is expected that the stress applied to the chip or module can be avoided, especially when installing a pair of chips or modules that are not sealed by a case. FIG. 1 (c) shows a state in which a part of the non-contact data carrier 1 is embedded in a container or a carrier body 2. For example, when the non-contact data carrier 1 is installed by injection molding or blow molding. The shape of the non-contact data carrier exposed on the surface of the container or the carrier body is previously provided in a concave shape at a predetermined position in the mold, and the non-contact data carrier is inserted into this shape and then filled with resin. It can be molded. Further, a non-contact data carrier can also be molded by a method such as drawing from a sheet or vacuum molding using a mold having the same structure so that the non-contact data carrier is held in the recess after molding.

FIG. 1D shows a state in which the non-contact data carrier 1 is installed on the surface of the container or the carrier body 2, and the case where the non-contact data carrier 1 is installed by injection molding or blow molding will be described. After molding, the shape of the non-contact data carrier excluding the part that comes into contact with the container or carrier body is provided in advance in a concave shape at a predetermined position in the mold, and after inserting the non-contact data carrier here, the resin is It can be molded by filling. At this time, the non-contact data carrier and the container or the carrier body are joined by heat fusion of the respective materials on the contact surface, but in order to increase the joining strength, materials of the same or similar composition are used. It is desirable to select. Further, in the case of casting in which a liquid acrylic resin or the like having a bonding function is used in a mold having the same structure as this, it is possible to mold while forming the bonding surface at the contact surface. 1 (e) is similar to FIG. 1 (c) in that a part of the non-contact data carrier 1 is embedded in a container or a carrier body 2, and the whole or a part of the embedded portion has an acute angle shape. When a protrusion is provided, the non-contact data carrier is prevented from falling off after molding due to the so-called anchor effect. Although the non-contact data carrier sealed in the case is shown in each of the above figures, this is a bare chip or module, and if necessary, the bare chip or module is temporarily cut, for example, with epoxy, silicone, or the like. The material may be a protective coat.

[0013]

[Action]

 The electric / electronic component storage container of the present invention includes, for example, an inner box for storing and transporting semiconductor wafers, a storage container including an upper lid for storing the semiconductor wafer, an outer box, and a cushioning member, or various types of wafers. It is used as a carrier (conveying means) that conveys each process for surface treatment, cleaning, inspection, etc. Writing or rewriting information such as unique number, identification code mark, etc. Since a non-contact data carrier that can be used is integrally provided on part or all of these members at the same time when the container or carrier body is molded, it has excellent mass productivity and can be retrofitted by using adhesive or fitting. There is no risk of falling off compared to the case of No. 1, there is no contamination by adhesives, complicated shape design, mold change, and non-contact process for managing information. You that there is no of pollution.

[0014]

【Example】

 Hereinafter, specific embodiments of the electric / electronic component storage container of the present invention will be described with reference to examples. Example 1 An example in which a non-contact data carrier 5 is installed on an upper lid 4 of a storage container for storing and transporting semiconductor wafers shown in FIGS. 2 to 4 will be described. The non-contact data carrier used was composed of a planar loop coil antenna part 6 as a receiving antenna and an electronic circuit part 7 equipped with an IC connected to the antenna part by a lead wire and having a protective coating of silicone resin. , Separate structure, electromagnetic induction method, communication distance: approx. 1m, frequency used: 134kHz, access method is readable and writable, memory capacity: 64 bits, unique number of molded product as initial information, and storage container The lot number and the number of times of use 0 were recorded. In order to enable continuous supply during injection molding, which will be described later, these are connected in advance on both sides of the planar loop coil antenna portion 6 with polypropylene resin sheets in accordance with the molding pitch to form a tape-shaped roll, The automatic unwinding device installed in the vertical direction of the mold attached to the molding machine was attached to the winding device.

The attachment to the upper lid 4 does not significantly change the design and size of the molded product, does not hinder the operation of the automatic machine, and minimizes the amount of resin used in the molded product, and is shown in FIG. As described above, one side surface of the planar antenna portion 6 is exposed to the inner surface of the upper lid, and the electronic circuit portion 7 is exposed to the inner surface of the upper lid adjacent thereto, so that the tape-shaped component is placed in a predetermined mold in the mold. positioning unwound to come to a position, using a polypropylene resin, a mold clamping force: a 350 t injection molding machine at a cylinder temperature: 200 ° C., mold temperature: 40 ° C., injection pressure: at 400 kg / cm ² The upper lid 4 was molded at the same time as insert molding. On the other hand, the same shape as the outer box 8 and the inner box 9 shown in FIGS. 3 and 4 is injection-molded using polypropylene resin under the same conditions as the upper lid 4 on which the data carrier 5 is installed, A container for transporting wafers was assembled together with the upper lid 4.

The required wafers were stored in this storage container and shipping control was performed. In other words, the container that contains the wafers that have been moved and placed on the conveyor transmits the radio waves from the transmitting antenna when it passes in front of the transmitting antenna that is connected to the reader installed immediately before the shipping packaging line. The antenna of the non-contact data carrier installed on the top lid of the container receives and captures it, and stores the unique number of the molded product, the lot number as the storage container and the information of the number of times of use 0 recorded in advance as initial information, It was sent back as a radio wave. This was received by the antenna on the reader side, converted into a digital signal, and decoded. These series of operations do not directly touch the storage container, and there is no risk of dust generation or falling off from the data carrier, so it can be performed quickly without contaminating the container or stopping the line. The container can be managed. It is also possible to centrally manage various data for each storage container by connecting a control device such as a personal computer to the reader. When reusing a storage container, the history of the container can be grasped and managed without contacting the container by rewriting the record of the number of times of use each time. The information to be recorded on the data carrier includes, for example, the number of wafers to be stored, material, size, etc., and these can be added or rewritten as necessary. Further, the recording of the initial information may be performed after it is installed in the molded product.

Example 2 A non-contact data carrier 15 was attached to the inner box 9 of the storage container used in Example 1 in order to carry out various surface treatments, cleanings, inspections, etc. on the wafer by transporting between the steps. An example will be explained. The non-contact data carrier 15 consists of a coil receiving antenna with a core and an electronic circuit part adjacent to it, and is sealed in a glass cylindrical case with an outer diameter of 4 mm and a length of 20 mm. The same specifications as in Example 1 were used. Hold this from both sides by the holding pin that works in conjunction with the operating circuit of the injection molding machine described above, at the position of the mold corresponding to approximately the center of the 5 mm thick H-bar 10 of the inner box 9 shown in FIG. Fixed, using tetrafluoroethylene / perfluoro / alkoxy / ethylene resin with an injection molding machine with a mold clamping force of 350 tons, cylinder temperature: 380 ° C, mold temperature: 200 ° C, injection pressure: It was integrated by insert molding at the same time as the inner box 9 was molded at 400 kg / cm ² .

An unprocessed wafer is stored in a carrier (inner box) 9 to which this non-contact data carrier 15 is attached, and it is placed on a conveyor in a clean room, and etching, cleaning and drying are performed according to a wafer processing process. And other surface treatment processes, and then sequentially transferred to the inspection process. At this time, the readers provided at the check points of each process identify the carriers, determine the passage, and inspect, and connect the measurement data and management data to the non-contact data carrier and the reader or to this. By reading and rewriting between personal computers and other devices, the data for each carrier is collectively managed, and by incorporating this information into the process control device, the control means associated with the conveyor is activated, Process checks for line control, such as transferring the carrier to the next process or excluding it from the line, could be performed without touching the carrier and without reducing the line speed. Furthermore, since the non-contact data carrier is embedded in tetrafluoroethylene / perfluoro / alkoxy / ethylene resin, which has chemical resistance, it is not affected by the treatment liquid used during each process. .

[0019]

[Effect of device]

 Since the electric / electronic component storage container of the present invention is provided with the non-contact data carrier integrally at the time of molding the container or the carrier main body, it does not fall off like the case of the recording paper or the card, or the wafer from itself is dropped. It is possible to prevent contamination of electrical and electronic parts such as, and it is possible to mount contactless data carriers without changing existing designs or dimensions, and at the same time, it is possible to mount complicated gold. It is possible to obtain a container or carrier with excellent mass productivity without the need to change the mold or individually process each container or carrier. Furthermore, when a rewritable non-contact data carrier is used, the recorded information is exchanged in a non-contact manner, so that the electrical and electronic parts such as wafers should be prevented from being contaminated, and the processing should be performed along the processing steps. In addition to being able to record the history, it can be easily reused by rewriting the unique number, identification code mark, etc. again from the viewpoint of effective use of resources due to the current environmental problems.

[Brief description of drawings]

FIG. 1 is a schematic view showing an installation state of a non-contact data carrier in an electric / electronic component storage container of the present invention, and FIGS. 1 (a) to (e) are vertical cross-sectional explanatory views of different embodiments thereof. is there.

FIG. 2 is a perspective view showing an embodiment of the electric / electronic component storage container of the present invention in which a non-contact data carrier is installed on an upper lid.

FIG. 3 is a perspective view showing an embodiment of an outer box of the electric / electronic component storage container of the present invention.

FIG. 4 is a perspective view showing an embodiment of a non-contact data carrier installed in the inner box of the electric / electronic component storage container of the present invention.

[Explanation of symbols]

1, 5, 15 ... Non-contact data carrier, 2 ... Container or carrier body, 3 ... Space, 4 ...
Top cover, 6 ... Antenna part, 7 ... Electronic circuit part, 8 ... Outer box, 9 ... Inner box, 10 ... H
bar.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 21/68 T

Claims (2)

[Scope of utility model registration request] 1. An electric / electronic component storage container comprising a non-contact data carrier integrally molded. 2. A wafer storage container comprising an inner box for storing semiconductor wafers, an upper lid for housing the same, and an outer box, wherein the non-contact data carrier is a part of these members. The electric / electronic component storage container according to claim 1, wherein the electric / electronic component storage container is provided in all of them.