JP2019185494A - Ic tag attachment method and ic tag built-in metal body - Google Patents

Abstract

To provide a method for attaching an IC tag in which a communication between the IC tag and a reader is improved, and an IC tag built-in metal body, capable of preferably reading/writing information stored in the IC tag by the reader.SOLUTION: A concave part 4 for housing an IC tag 2 to a clamp 1 as an individual identification management is formed, and a rough surface is formed by radiating a laser beam onto a bottom part of the concave part 4 and an inner peripheral surface of a side part. A base of an adhesion agent is formed by coating the adhesion agent onto the rough surface, the IC tag 2 is mounted on the base, and thereby the entire IC tag 2 is coated and sealed with the adhesion agent. In the concave part 4, an upper part and one to three side parts open. The open side part is filled with the adhesion agent when coating and sealing the IC tag 2 with the adhesion agent.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of attaching an IC tag and a metal body with a built-in IC tag, and more specifically, a reader is stored in the IC tag in a state where the IC tag is embedded or sealed in a recess placed on the metal body. The present invention relates to a metal body with a built-in IC tag that improves reading / writing of information.

  The short-range wireless communication technology is generally a technology for performing wireless communication at a short distance of about several centimeters to 1 meter, and is widely used such as authentication from a magnetic card to an IC tag, and transmission / reception of information. For example, RFID (Radio-Frequency Identification) can be exemplified, which is a technology in which identification information is embedded in a small thin plate (tag) and the identification information is transmitted and received at a short distance. An RFID tag using the RFID technology is called a wireless tag, an IC (Integrated Circuit) tag, or the like (hereinafter referred to as “IC tag”).

  An IC tag is a passive element having a structure in which an ultra-small integrated circuit (IC chip) is embedded in a non-metallic thin plate such as plastic together with a radio communication antenna or coil. A passive IC tag is an element that does not normally have a built-in power supply and is not connected to the power supply, supplies power to the IC chip via an antenna, and performs data transmission / reception with a reader via an induction electromotive system via the antenna. ing. Power supply includes an electromagnetic induction method in which a coil of an IC tag and a reader antenna are magnetically coupled, and a radio wave method in which radio waves are generated between the IC tag antenna and the reader antenna. The electromagnetic induction method has an advantage that the energy transfer efficiency is larger than the radio wave method. In the case of the radio wave system, there is an advantage that the communication distance can be increased.

  Since the passive IC tag is small and uses weak power, the communication distance is limited to a short distance. The above-described reader has an electronic data reading function for communicating with an IC tag and reading electronic data of the IC tag, or an electronic data writing function for transmitting electronic data to be written to the IC tag to the IC tag, or both functions. Equipment. The reader is exactly an electronic data reading and / or electronic data writing device (hereinafter simply referred to as a reader).

  The reader is configured to exchange data with an electronic computer such as a host computer (server). The IC chip includes an information storage medium (RAM) that can read / write information (data), a modulator (encoder) that modulates data (digital format) into a carrier wave, and vice versa. A demodulator (decoder) for converting the signal into a format), an antenna for transmitting and receiving a carrier wave, a capacitor for temporarily storing power, and the like are integrated. Further, the necessary power uses an induced electromotive force generated when a carrier wave is received, and a battery (battery) is not particularly built in.

  The IC tag is used not only as a credit card, a commuter pass, and electronic money, but also in a form attached to a product or a product to be individually identified. For example, IC tags are attached to scalpels, forceps, etc., which are reusable medical instruments, and are used as a means for managing information (usage information) related to usage forms, years of use, usage histories, etc. of these medical instruments. in use. As an example, there is a management technique using an IC tag that attaches an IC tag to a surgical instrument or an ultrasonic diagnostic apparatus of an endoscope, such as a scalpel, forceps, scissors, gauze, etc., and manages usage information of these surgical instruments. It is disclosed (see, for example, Patent Document 1).

  IC tags are also used in systems that prohibit the reuse of medical devices that are used only once, such as disposable medical devices. As an example, an IC tag on which a predetermined code indicating that reuse is prohibited is attached in advance to a medical instrument, and the code reader is stored in the chamber of the sterilizer so that the medical instrument that is prohibited to reuse is sterilized. A reusable medical device management system that prevents the device from being reused is disclosed (for example, see Patent Document 2). In this management system, the IC tag is attached to the flange portion of the instrument or is embedded.

  Furthermore, as a single medical instrument provided with an IC tag, for example, a technique of providing an IC tag on a syringe (injection cylinder) is disclosed (for example, see Patent Document 3). In this syringe, the IC tag is used in the form of being embedded or affixed to an outer cylinder made of heat-resistant polypropylene or cyclic polyolefin resin. As for the use of the IC tag, there are other examples of being used in a manipulator system, an example of being used in a system for facilitating medical procedures, and the like.

  On the other hand, in order to further improve the bonding strength between the metal alloy and the carbon fiber reinforced plastic (CFRP), by adding the carbon nanotube to the epoxy adhesive, the carbon nanotube is formed into a micron-order unevenness formed on the surface of the metal alloy. An invention relating to a method for adhering a metal member and a resin member excellent in corrosion resistance, weather resistance and heat resistance, in which a metal alloy and a CFRP are firmly bonded to each other, can be obtained. (For example, see Patent Document 4).

  In addition, the surface has a roughness on the order of microns by chemical etching, and the surface is covered with fine irregularities with an irregular period of 5 to 500 nm, and the surface is metal oxide or metal phosphorylated. A metal shaped product that is a thin layer of a product and a molded product made of an epoxy resin thermosetting resin composition obtained by injection molding are integrated with a cured product layer of an epoxy adhesive in between. An invention relating to an adhesive composite of a metal alloy and a thermosetting resin characterized by this is disclosed (see, for example, Patent Document 5).

JP 2008-86756 A JP 2003-126251 A JP 2006-271461 A Japanese Patent Application Laid-Open No. 2011-4030 JP 2012-66383 A

  As described above, systems for managing medical instruments using IC tags are constructed in various forms. In addition, as a method of attaching an IC tag to the above-described medical device, many of them are attached after the IC tag is attached to the outer surface of the medical device or the like with an adhesive, or a concave portion is formed on the outer surface and stored in the concave portion. It is an attachment method embedded with an agent. In the management of a medical device attached with an IC tag, it is required that a reader securely transmits and receives data with the IC tag.

  As described above, the IC tag embedded in the concave portion of the metal medical device cannot communicate with the reader, which may hinder the management of the medical device. In other words, if only the top surface of the recess is open, the IC tag can communicate with the reader when the opening faces the reader, but if the reader is on the side of the recess, communication between the IC tag and the reader is possible. Error increases or communication is not possible. Many medical instruments are made of metal such as a scalpel, forceps, tweezers, and the like, and metal becomes an obstacle to radio waves for wireless communication.

  In order to improve this, it is conceivable to adhere to the surface of the medical device so that radio waves can reach the IC tag from the surroundings of the medical device. From the viewpoint of the above, it is not preferable. In addition, for medical instruments such as scalpels, forceps and tweezers to be reused, predetermined chemical disinfection and boiling disinfection or high-temperature steam disinfection is repeated, so that an IC tag attached to the medical instrument can be easily removed from the medical instrument. It is required not to separate.

Therefore, the present invention has been made in view of the above-mentioned problems of the prior art, and achieves the following object.
An object of the present invention is to provide an IC tag mounting method in which communication between an IC tag and a reader is improved, and a metal body with a built-in IC tag that allows the reader to preferably read / write information stored in the IC tag. There is.

In order to achieve the above object, the present invention employs the following means.
The metal body with a built-in IC tag of the present invention is
In the metal body with a built-in IC tag in which a concave portion is formed in the metal body that is an individual identification management target, and the IC tag is entirely covered with an adhesive in the concave portion and embedded or sealed in the concave portion,
The recess (4) has a bottom and at least one side made of a metal surface of the metal body,
In order for the IC tag (2) to transmit and receive electromagnetic waves from an opening described later, the recess (4) has a first direction facing the first surface of the recess (4) to which the IC tag (2) is attached, In addition, one to three directions other than the metal surface selected from the second direction, the third direction, the fourth direction, and the fifth direction orthogonal to the first surface are opened.

  The bottom surface of the metal surface and / or the inner peripheral surface of the side portion of the metal body may be formed with a rough surface that is a laser irradiation mark.

The method of attaching the IC tag of the present invention is as follows:
In order to store the IC tag (2) in the metal body that is the object of individual identification management, the embedded or sealed IC tag (2) transmits and receives electromagnetic waves from the opening described later, ) A concave portion (4) having a bottom portion made of a metal surface and at least one side portion of the metal body, and (b) a first surface facing the first surface to which the IC tag (2) is attached. And the concave portion formed by opening one direction to three directions other than the metal surface selected from a direction and a second direction, a third direction, a fourth direction, and a fifth direction orthogonal to the first surface. A first step of forming (4);
A second step of forming a rough surface by a cutting means on at least one inner peripheral surface of the bottom and the inner peripheral surface of the side portion made of the metal surface;
A third step of applying an adhesive to the rough surface to form an adhesive base; and
And a fourth step of placing the IC tag on the base of the adhesive and covering and sealing the entire IC tag with the adhesive.

  The cutting means is preferably irradiated with laser light to form the rough surface.

  According to the mounting method of the IC tag of the present invention, the concave portion formed in the metal body has an upper surface and one to three side portions opened, so that the IC tag in the concave portion communicates with an external device such as a reader reliably. I can do it now.

FIG. 1 is a perspective view showing a forceps to which an IC tag is attached by the IC tag attachment method according to the first embodiment of the present invention. FIG. 2 is an explanatory diagram showing a method of attaching an IC tag according to the first embodiment of the present invention. FIG. 3 is an explanatory view showing a cross section of the main part of the IC tag according to the first embodiment of the present invention. FIG. 4 is an explanatory diagram showing a cross-section of the main part of the recess that houses the IC tag according to the first embodiment of the present invention. FIG. 5 is an explanatory diagram showing a method of attaching an IC tag according to the first embodiment of the present invention. FIG. 6 is an explanatory view showing a recess for accommodating an IC tag according to the second embodiment of the present invention. FIG. 7 is an explanatory view showing a recess for housing an IC tag according to the third embodiment of the present invention. FIG. 8 is an explanatory view showing a recess (two faces are open) for storing an IC tag according to the fourth embodiment of the present invention. FIG. 9 is an explanatory view showing a recess (four faces are open) for accommodating an IC tag according to the fifth embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)
FIG. 1 is a perspective view showing a forceps 1 to which an IC tag 2 is attached by an IC tag attachment method according to the first embodiment of the present invention. FIG. 2 is an explanatory view showing a method of attaching the IC tag 2 according to the first embodiment of the present invention. FIG. 3 is an explanatory view showing a cross section of the main part of the IC tag 2 according to the first embodiment of the present invention. FIG. 4 is an explanatory view showing a cross-section of the main part of the recess 4 of the forceps 1 that houses the IC tag 2.

  The forceps 1 is a subject for individual identification management, and for that purpose, an IC tag 2 is installed or affixed in a recess 4 formed in the forceps 1 (hereinafter referred to as installation). The IC tag 2 is individually identified by wirelessly communicating with a reader (not shown) described later via electromagnetic waves. The forceps 1 includes a handle portion 1a that is operated by a user, and a grip portion 1c that rotates around a support shaft 1b by the operation of the handle portion 1a to perform a clamping operation.

  This forceps 1 is a short mosquito type medical forceps having a length of about 12 cm and is repeatedly used after being subjected to a predetermined sterilization treatment (chemical disinfection and boiling or high temperature steam disinfection). Therefore, the forceps 1 are made of metal from the viewpoint of corrosion resistance and heat resistance, and are particularly made of stainless steel (for example, SUS standard No. 300 series). The type of the forceps 1 is a mosquito type, but is not limited to this, and may be another type, for example, a Kelly type, a Kochel type, or a Pean type.

  The handle portion 1 a of the forceps 1 is formed with a recess 4 for accommodating the IC tag 2. In particular, the recess 4 is formed in a portion that does not directly affect the use of the forceps 1. In this example, the recessed part 4 is formed in the ring part 1d of the handle | steering-wheel part 1a for a user putting in a finger | toe. The portion where the concave portion 4 is formed in this way is preferably a portion that is not directly related to the work when the user carries out the work with the forceps 1 and hardly comes into contact with other instruments during the work.

  FIG. 2A is a front view showing a part of the ring portion 1d in which the recess 4 is formed, and FIG. 2B is a cross-sectional view taken along the long axis (longitudinal direction) of the ring member. 4A is a cross-sectional view taken along the long axis of the ring member constituting the ring portion 1d, and FIG. 4B is a cross-sectional view taken along a plane perpendicular to the long axis of the ring member. The concave portion 4 is formed by cutting the outer peripheral surface of the ring portion 1d. As shown in FIGS. 2 and 4, the bottom portion 4a and the two side portions 4b of the concave portion 4 become the ring portion 1d. ing.

  And the two side parts 4c of the recessed part 4 are what the ring part 1d was cut, and are opened. Of course, the upper surface of the recess 4 is open. The IC tag 2 is housed inside the recess 4 in a form covered entirely with an adhesive 3. In the IC tag 2, a layer of the adhesive 3 is interposed between the bottom portion 4 a and the side portions 4 b and 4 c of the recess 4. Numerous depressions and cavities (rough surfaces) are formed on the inner peripheral surface of the bottom 4 a of the recess 4.

  The adhesive 3 penetrates and cures into these depressions and cavities, and is firmly locked to the inner peripheral surface of the bottom portion 4a, so that the adhesive 3 is difficult to peel from the recess 4. That is, the peel strength between the adhesive 3 and the inner peripheral surface of the recess 4 is remarkably improved. Since the IC tag 2 is entirely covered with the adhesive 3, it is difficult for the IC tag 2 to be separated from the recess 4. As a result, even when the forceps 1 are repeatedly subjected to the sterilization process, the IC tag 2 is firmly housed inside the forceps 1.

  The IC tag 2 transmits and receives a high-frequency signal to a rewritable information recording medium (hereinafter referred to as “memory”), an encoder that modulates a digital signal into a high-frequency signal, and a decoder that restores the high-frequency signal to a digital signal. Each element, such as an antenna, is equipped with an electronic substrate that is ultra-compact and densely integrated, and the induced electromotive force generated when the antenna coil receives a high-frequency signal is used as the operating power of each device. .

  The IC tag 2 communicates with a reader (not shown), transmits electronic data stored in the memory to the reader, receives data from the reader, and writes it in the memory. The reader transmits and receives electronic data using the IC tag 2 and high-frequency signals. Specifically, the reader has an electronic data reading function for reading electronic data in the IC tag 2 by communicating with the IC tag 2, or an electronic data writing function for transmitting electronic data to the IC tag 2, or both functions. Equipment.

  The IC tag 2 transmits electronic data stored in the memory to the reader, processes data received from the reader, and stores the data in the memory. The reader transmits a signal received from the IC tag 2 to a control unit of an information system (not shown) connected by wired or wireless communication. The control unit of the information system accurately grasps the usage status of the forceps 1 based on information transmitted from the reader, and manages whether or not the usage status is normal.

  Hereinafter, in order to make the description easy to understand, the IC tag 2 is considered as an object having a top surface, a bottom surface, and four side surfaces, taking a rectangular card shape having a predetermined thickness, in other words, a box shape as an example. The surface disposed on the bottom 4a of the recess 4 via the contact or the adhesive 3 is the bottom surface of the IC tag 2, and the top surface of the IC tag is generally a surface facing the bottom surface, and is a surface parallel or substantially parallel to the bottom surface. become. The four side surfaces of the IC tag are four surfaces that are perpendicular or nearly perpendicular to the bottom surface and the top surface, and the adjacent side surfaces are perpendicular or nearly perpendicular surfaces.

  Here, since it is considered to be a box shape, four side surfaces are used. However, in the case of three side surfaces, five or more side surfaces, it can be considered that the four side surfaces are replaced. Even if the IC tag 2 has a coin shape, a rod shape, or the like, it can be explained in the same manner as the box shape described above. A direction (azimuth) perpendicular to the upper surface of the IC tag 2 is defined as a first direction. A direction perpendicular to the antenna of the IC tag 2, in other words, a direction perpendicular to the side portions 4 b and 4 c of the IC tag 2 is defined as second to fifth directions.

  The magnetic flux generated by the reader antenna crosses the antenna of the IC tag 2 so that the reader and the IC tag 2 communicate with each other. Therefore, when the forceps 1 is made of metal, it is desirable that the recess 4 is opened as much as possible so that magnetic flux from the outside can pass through. There are restrictions on the size and size of the opening.

  In the case of the electromagnetic induction type IC tag 2, when the antenna of the IC tag 2 and the antenna of the reader are parallel, the communication efficiency between them is the best. This is because the magnetic flux generated by the reader antenna crosses the antenna of the IC tag 2 most often. In addition, the antenna of the IC tag 2 is often arranged on a plane and has a planar shape.

  As shown in FIG. 3, the IC tag 2 includes an electronic substrate 20, a lower case 21 that has been injection-molded in advance so as to be fitted to a device mounting surface (uneven surface) of the electronic substrate 20, and solder for the electronic substrate 20. The heat-resistant sheet 23 attached to the surface and the upper case 22 injection-molded so as to cover the solder surface of the electronic substrate 20 are provided. The lower case 21 and the upper case 22 are made of the same material and are integrated by heat fusion.

  The material of the lower case 21 and the upper case 22 is preferably an engineering plastic having heat resistance and mechanical strength such as polyamide resin, polycarbonate, polyethylene terephthalate, polyimide, polyphenylene sulfide and the like. The heat-resistant sheet 23 is a thin sheet and is a film made of a synthetic resin having a relatively high heat resistance. This material may be the same material as the lower case 21 and the upper case 22 or a different material.

  The heat-resistant sheet 23 is for protecting the electronic substrate 20 from the heat of the molten resin related to the upper case 22 to be injected. As the adhesive 3, an epoxy adhesive or a hot-melt adhesive such as a polyester resin can be used. As illustrated in FIG. 2, the IC tag 2 is formed with a gap between the bottom 4 a, the side 4 b, and the side 4 c of the recess 2.

  Radio waves (data carrier waves) are diffracted through the gap to the bottom surface side of the IC tag 2, and conversely, the data carrier waves propagated from the IC tag 2 to the recess bottom portion 4 a side propagate through the gap to the space. It becomes possible. This improves the transmission / reception characteristics of the data carrier in the IC tag 2.

  FIG. 5 is an explanatory diagram showing a method of attaching the IC tag 2 according to the present embodiment. The IC tag 2 is attached to the inner peripheral surface including the first step (FIG. 5A) for forming the recess 4 for accommodating the IC tag 2 in the forceps 1 and the bottom 4 a of the recess 4. A second step (FIG. 5B) for forming a rough surface (laser irradiation trace) by irradiating the laser beam 6a, and applying (injecting) the adhesive 3 to the bottom 4a of the recess 4 to form a base of the adhesive 3 A third step (FIG. 5C) for forming the IC tag, a fourth step (FIG. 5D) for placing the IC tag 2 on the base of the adhesive 3, and the entire IC tag 2 is covered with the adhesive 3. -It consists of processes, such as the 5th process (FIG.5 (e)) to seal.

  Hereinafter, each step will be described. As shown in FIG. 5A, the outer surface of the handle portion 1 a of the forceps 1 is cut with a cutting tool such as an end mill 5 to form a recess 4 that houses the IC tag 2. The dimensions of the recess 4 are, for example, 2 m depth × 6 mm width × 1.5 mm depth. In addition to the cutting process using the end mill 5, it is also possible to apply a coining process that coins the outer surface of the handle part 1 a of the forceps 1 with a convex mold (not shown).

  As shown in FIG. 1, the recess 4 is formed on the outer peripheral surface of the ring portion 1 d of the forceps 1. When the user puts his / her finger into the ring of the ring portion 1d and operates the handle portion 1a, the place is formed at a portion not related to the function, that is, at the rear portion of the handle portion 1a. Next, as shown in FIG. 5B, the surface roughness in which a large number of depressions / cavities (rough surfaces) are formed by irradiating the inner peripheral surface including the bottom 4 a of the recess 4 with the laser beam 6 a. Put it in a state.

  The diameter of the depression is, for example, 10 to 100 μm, and the depth is 50 to 200 μm. In addition, although the laser irradiation range which concerns on this embodiment is the bottom part 4a of the recessed part 4, both the bottom part 4a and the side part 4b may be sufficient. The recess 4 has two side portions opened, and laser irradiation is performed on the side portions 4b that are not opened (see FIG. 4).

  As the laser beam 6a, for example, YVO4 laser, fiber laser (preferably single mode fiber laser), excimer laser, carbon dioxide gas laser, ultraviolet laser, YAG laser, semiconductor laser, glass laser, ruby laser, He-Ne laser. Nitrogen laser, chelate laser, and dye laser can be used. Further, as the irradiation mode of the laser beam 6a, a continuous irradiation mode or a pulse irradiation mode can be used.

  Next, as shown in FIG. 5C, the adhesive 3 is applied (injected) to the bottom 4 a of the recess 4 irradiated with the laser beam 6 a using the nozzle 7, and the base of the adhesive 3 is then applied. Form. Next, as shown in FIG. 5D, the IC tag 2 is placed on the base of the adhesive 3. At this time, if necessary, the IC tag 2 is pushed to the bottom 4a of the recess 4 by pressure from above. Then, as shown in FIG. 5E, the adhesive 3 is further injected through the nozzle 7 to cover and seal the entire IC tag 2 with the adhesive 3.

  Since the adhesive 3 is a liquid, it can be poured so as to swell slightly from the surface, and its shape can be adjusted later. For example, the shape can be adjusted so that the side part 4c with which the recessed part 4 was opened corresponds with the surface of the ring part 1d. If it does in this way, when cleaning, such as washing | cleaning the forceps 1, it can carry out as usual. The adhesive 3 penetrates and cures into the depressions / cavities formed in the bottom 4 a of the recess 4 and firmly adheres to the inner peripheral surface of the recess 4.

  Therefore, the IC tag 2 is firmly housed inside the recess 4 of the forceps 1 by the adhesive 3. As described above, according to the method for attaching an IC tag of the present invention, the bonding force between the IC tag 2 and the forceps 1 (attachment) by the adhesive 3 is dramatically increased at a low cost. Even when the attached forceps 1 (attachment) is repeatedly subjected to sterilization such as chemical disinfection and boiling disinfection, the IC tag 2 is difficult to separate from the forceps 1 (attachment).

  The opening side portion 4c of the recess 4 is formed on both sides of the recess 4, and radio waves from the reader can easily reach the IC tag 2 through the opening side portion 4c. Of course, when the upper surface of the opening of the recess 4 is included, the radio wave from the reader can reach the IC tag 2 from the three directions of the recess 4. As the IC tag 2 to be used, any IC tag that meets the requirements of the international standard ISO / IEC18000 series and the medical environment to be used can be used.

  The communication between the IC tag 2 and the reader is preferably an electromagnetic induction method using low power, a communication method of 135 kHz or less, or 13.56 MHz or less. In the present embodiment, the forceps 1 has been described as an example. However, when used in other fields, a propagation method, for example, an IC tag having a frequency band of 920 MHz can be used. Since the present invention is not an invention of an IC tag and an invention of its communication system, details are omitted.

  As shown in FIG. 2, as indicated by arrows 5 a, 5 b, and 5 c, the first direction 5 a of the upper surface of the recess 4, the second direction 5 b of the side portion 4 c, and the fourth direction facing 180 degrees (approximately 180 degrees). The direction 5c is opened. An electromagnetic wave (magnetic flux) to the IC tag 2 and an electromagnetic wave transmitted from the IC tag 2 are transmitted and received through the openings of the IC tag 2 in the first, second, and fourth directions.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. The second embodiment of the present invention is basically the same as the above-described first embodiment of the present invention, and different parts will be described. FIG. 6 is an explanatory view showing a recess 4A that houses the IC tag 2 according to the second embodiment of the present invention. FIG. 6A is a front view of the recess 4A, and FIG. 6B is a side view of the recess 4A.

  In the recess 4A of the second embodiment, both sides of the side portion 4b orthogonal to the longitudinal direction are open. Further, the IC tag 2 is in direct contact with the bottom surface 4a and the side portion 4b of the recess 4A on the two surfaces, that is, the bottom surface 2a and the side surface 2b, respectively, or indirectly through the adhesive 3 layer. As a result, gaps SP1, SP2, and SP3 are formed between the other side surfaces 2c, 2d, and 2e of the IC tag 2 and the recess 4A, respectively.

  By forming the gaps SP1, SP2, and SP3, radio waves (data carrier waves) are diffracted to the bottom surface 2a side of the IC tag 2 through the gaps SP1, SP2, and SP3, and vice versa. The data carrier wave propagated to the 4a side can propagate to the space through the gaps SP1, SP2, and SP3. This improves the transmission / reception characteristics of the data carrier in the IC tag 2. As a result, the reader can accurately read the information stored in the IC tag 2 and can write desired data in the IC tag 2.

(Third embodiment)
Next, a third embodiment of the present invention will be described. The third embodiment of the present invention is basically the same as the first embodiment of the present invention described above, and different parts will be described. FIG. 7 is an explanatory view showing a recess 4B that houses the IC tag 2 according to the third embodiment of the present invention. FIG. 7A is a front view of the recess 4B, and FIG. 7B is a side view of the recess 4B. In the recess 4B of the third embodiment, both sides of the side portion 4b orthogonal to the longitudinal direction are open.

  In addition, the IC tag 2 is in direct contact with the bottom 4a and the side 4b of the recess 4B on the three surfaces, that is, the bottom surface 2a, the side surface 2b, and the side surface 2d, respectively, or indirectly through the adhesive 3 layer. As a result, gaps SP1 and SP3 are formed between the other side surfaces 2c and 2e of the IC tag 2 and the recess 4C, respectively.

  By forming the gaps SP1 and SP3, radio waves (data carrier waves) are diffracted through the gaps SP1 and SP3 to the bottom surface 2a side of the IC tag 2 and conversely propagate from the IC tag 2 to the concave bottom surface 4a side. The transmitted data carrier can propagate to the space through the gaps SP1 and SP3.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. The fourth embodiment of the present invention is basically the same as the above-described first embodiment of the present invention, and different parts will be described. FIG. 8 is an explanatory view showing a recess 4C that houses the IC tag 2 according to the fourth embodiment of the present invention. The concave portion 4 </ b> C of the fourth embodiment is formed at the corner of the ring portion 1 e of the handle portion 1 a of the forceps 1. In this example, the forceps 1 is taken as an example, but a recess 4C is formed at an edge (edge) or a round (curved portion) of an object for individual identification management.

  The upper surface of the recess 4C and one side are opened, in other words, the first direction 5a and the second direction 5b are opened. The other three side portions are not opened but are metal side surfaces. Similar to the first to third embodiments described above, electromagnetic waves are transmitted and received through this opening. The IC tag 2 is in direct contact with the bottom of the concave portion 4C and the side that is not opened, either directly or via an adhesive. A rough surface is formed on the bottom surface of the recess 4C and / or the inner peripheral surface of the side portion that is not opened by a cutting means such as laser irradiation.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described. The fifth embodiment of the present invention is basically the same as the first to fourth embodiments of the present invention described above, and different parts will be described. FIG. 9 is an explanatory view showing a recess 4D that houses the IC tag 2 according to the fifth embodiment of the present invention. The recess 5 of the fifth embodiment is formed in the rounded portion 1f.

  The upper surface of the recess 4D and three side portions are opened. In other words, the first direction 5a, the second direction 5b, the third direction 5c, and the fourth direction 5d are opened. Similar to the first to third embodiments described above, electromagnetic waves are transmitted and received through this opening. The IC tag 2 is in direct contact with the bottom portion of the recess 4D and one side portion that is not opened, either directly or indirectly via an adhesive. The adhesive can be filled up to the original rounded portion drawn in phantom lines in FIG. 9, but it may be less than that. A rough surface is formed on the bottom surface of the recess 4D and / or the inner peripheral surface of one side that is not opened by a cutting means such as laser irradiation.

(Other)
In the above example, the recess 4 has a bottom surface parallel to the top surface and the side surface is substantially perpendicular to the bottom surface, but may have a tapered shape that gradually increases from the bottom surface to the top surface. it can. Similarly, the open side surface can be formed into a tapered shape that gradually increases. If it does in this way, even if the forceps 1 will be arrange | positioned diagonally with respect to a leader, the electromagnetic wave from a leader will become easy to reach | attain.

  In other words, the angle at which the radio wave transmitted from the reader reaches the IC tag 2 is widened, and communication between the IC tag and the reader is improved. As described above, the state where the IC tag 2 is attached using the forceps 1 as an example has been described. The present invention is not limited to the forceps 1, and individual identification management can be performed by attaching an IC tag to any metal instrument. The concave portion 4 has been described by taking a box shape as an example. However, the upper surface and the bottom surface can be a circular or elliptical cylinder.

  In the above-described embodiment, the example in which the IC tag 2 is installed in parallel with the bottom of the recess 4 has been described. However, the IC tag 2 can be installed at a predetermined angle on the bottom of the recess 4. Further, the IC tag 2 can be installed parallel to or at an angle to the side of the recess 4 that is not opened, but in this case, the side where the IC tag 2 is installed is the recess 4 described above. Think of it as the bottom of the replacement.

  The bottom part 4a of the concave part 4 was irradiated with the laser beam 6a so as to have a surface roughness state in which a large number of depressions / cavities (rough surfaces) were formed. However, a method of strengthening the adhesive force by forming a dovetail groove for storing an adhesive by a machining machine such as a milling machine, a seal engraving machine, or an engraving machine may be used.

DESCRIPTION OF SYMBOLS 1 ... Forceps 1a ... Finger part 1b ... Supporting shaft 1c ... Grasp part 1d ... Ring part 2 ... IC tag 20 ... Electronic substrate 21 ... Lower case 22 ... Upper case 23 ... Heat-resistant sheet 3 ... Adhesive 4 ... Concave part 4a ... Bottom part 4b ... Side 4c ... Side (open)
5 ... End mill 6 ... Laser oscillator 6a ... Laser light 7 ... Nozzle

Claims (4)

In the metal body with built-in IC tag in which a recess is formed in the metal body that is the object of individual identification management, the IC tag is entirely covered with an adhesive in the recess, and embedded or sealed in the recess,
The recess (4) has a bottom and at least one side made of a metal surface of the metal body,
In order for the IC tag (2) to transmit and receive electromagnetic waves from an opening described later, the recess (4) has a first direction facing the first surface of the recess (4) to which the IC tag (2) is attached, In addition, the IC is characterized in that one to three directions other than the metal surface selected from the second direction, the third direction, the fourth direction, and the fifth direction orthogonal to the first surface are opened. Tag built-in metal body. The metal body with a built-in IC tag according to claim 1,
A metal body with a built-in IC tag, wherein the bottom surface of the metal surface and / or the inner peripheral surface of the side portion of the metal body is formed with a rough surface that is a laser irradiation mark. In order to store the IC tag (2) in the metal body that is the object of individual identification management, the embedded or sealed IC tag (2) transmits and receives electromagnetic waves from the opening described later, ) A concave portion (4) having a bottom portion made of a metal surface and at least one side portion of the metal body, and (b) a first surface facing the first surface to which the IC tag (2) is attached. The concave portion formed by opening one or three directions other than the metal surface selected from the direction and the second direction, the third direction, the fourth direction, and the fifth direction orthogonal to the first surface A first step of forming (4);
A second step of forming a rough surface with a cutting means on at least one inner peripheral surface of the bottom and the inner peripheral surface of the side portion made of the metal surface;
A third step of applying an adhesive to the rough surface to form an adhesive base; and
And a fourth step of placing the IC tag on the base of the adhesive and covering and sealing the entire IC tag with the adhesive. In the IC tag attachment method according to claim 3,
The method of attaching an IC tag, wherein the cutting means irradiates a laser beam to form the rough surface.

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