JP2018101660A - Lid body, electronic component housing package and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a decrease in reliability of hermetic sealing due to a reduction in a bonding area between an upper surface of a frame portion and a lid by chamfering the lid at four corners of an electronic component storage package. A lid includes a mounting portion for mounting an electronic component, a lower insulating layer having an upper surface, and a plurality of electrode pads to which the electronic component provided on the mounting portion is connected. 108 and a frame-like upper insulating layer 103 laminated so as to surround the mounting portion 102 on the lower insulating layer 104, and bonded to an insulating substrate provided with notches 106 from the lower end to the upper end of the four corners The chamfered portion 112 is provided from the lower end to the upper end of the four corners, and the convex portions 113 are provided at both ends of the chamfered portion 112 in plan view. [Selection] Figure 2

Description

  The present invention relates to a lid for an electronic component storage package having a mounting portion in which an electronic component is stored, an electronic component storage package, and an electronic device.

  2. Description of the Related Art Conventionally, as an electronic component storage package for airtightly storing an electronic component such as a piezoelectric vibration element, an insulating substrate having a concave mounting portion that stores the electronic component is often used. The lid is bonded to the insulating substrate so as to close the mounting portion, and the electronic component is hermetically sealed in the mounting portion. An electronic device such as a piezoelectric vibration element is hermetically sealed in a container composed of a mounting portion of an insulating substrate and a lid to form an electronic device.

  In such an electronic device, what is said to have high hermetic sealing reliability is that a metal lid and a frame-like metallized layer (or metal frame) formed on the upper surface of the insulating substrate are They are joined by means such as brazing or welding.

  However, in the above-described case, it is necessary to braze or weld the insulating substrate and the lid individually, so that it is difficult to improve productivity as an electronic device. Furthermore, a brazing material used as a bonding material for sealing or equipment necessary for welding is required, which may increase the manufacturing cost. Therefore, a bonding structure using glass or the like that can seal the mounting portion of the insulating substrate with the lid with a relatively inexpensive facility has been proposed as a method for bonding the lid and the insulating substrate. For example, when an insulating substrate and a lid are bonded with glass, it is not necessary to bond the insulating substrate and the lid individually, and a plurality of insulating substrates and a plurality of lids can be bonded simultaneously by batch processing. is there. Except for the joining method using the brazing material as described above, it is excellent in temperature and environmental resistance, and is excellent in terms of airtightness and fixing strength as compared with the joining using resin or solder.

  In addition, there is a lid body that has four corners that are curved and chamfered as a shape of the lid body. In order to be divided into four equal parts, it is manufactured by forming a dividing groove in a lattice shape with a mold or the like and dividing it.

JP 2007-43732 A

  However, in the above-described electronic device, there is a possibility that the following problems occur due to the downsizing. That is, in such an electronic device that is remarkably miniaturized, the width of the frame portion constituting the mounting portion of the electronic component storage package in which the electronic component is stored has become narrow, and the upper surface of the frame portion and the lid The joint area with the body is becoming smaller. Therefore, for example, when using a lid that is curved and chamfered at four corners, the upper surface of the frame portion of the wiring board (electronic component storage package) and the lid are joined using glass as a bonding material as an example. The joint area between the upper surface of the frame portion and the lid body is reduced by curving the four corners of the lid body in a concave shape at the four corners of the insulating substrate, and the reliability of hermetic sealing may be reduced. there were.

In addition, since the bonding material is provided in a frame shape on the lower surface of the lid body (the surface to be joined to the frame portion of the insulating substrate), in the lid body in which the four corners are concavely curved and chamfered in this way. There is a problem that the joint area between the upper surface of the frame portion and the lid is reduced, and the volume of the joining material at the four corners of the lid cannot be increased.

  That is, in an electronic device that has been miniaturized, when the insulating substrate and the lid are sealed with the bonding material, the volume of the bonding material at the four corners after bonding is insufficient, and the reliability of hermetic sealing is reduced. There was a possibility.

  According to the lid of one aspect of the present invention, a lower insulating layer having a mounting portion for mounting an electronic component and having an upper surface, and a plurality of electrode pads to which the electronic component provided in the mounting portion is connected And a frame-like upper insulating layer laminated on the lower insulating layer so as to surround the mounting portion, and bonded to an insulating substrate provided with cutouts from the lower end to the upper end of the four corners. Chamfered portions are provided from the lower end to the upper end of the four corners, and convex portions are provided at both ends of the chamfered portion in plan view.

  According to the electronic component storage package of one aspect of the present invention, the plurality of components each have a mounting portion for mounting the electronic component, the lower insulating layer having an upper surface, and the electronic component provided in the mounting portion are connected. An insulating substrate provided with a notch from the lower end to the upper end of four corners, and the frame-shaped upper insulating layer laminated on the lower insulating layer so as to surround the mounting portion; And a chamfered portion is provided from the lower end to the upper end of the four corners of the lid body, and protrudes at both ends of the chamfered portion in plan view. A shaped part is provided.

  According to the electronic device of one aspect of the present invention, the electronic component storage package described above, the electronic component mounted on the mounting portion, and the frame-shaped upper insulating layer and the lid body are provided. The bonding material is provided, and the bonding material is bonded so as to cover a part of the chamfered portion and the convex portion.

  A lid according to one aspect of the present invention includes a mounting portion for mounting an electronic component, a lower insulating layer having an upper surface, a plurality of electrode pads to which the electronic component provided in the mounting portion is connected, and a lower portion A frame-like upper insulating layer stacked on the insulating layer so as to surround the mounting portion, and bonded to an insulating substrate provided with a notch from the lower end to the upper end of the four corners. Since chamfered portions are provided from the top to the top, and convex portions are provided at both ends of the chamfered portion in a plan view, when joining the insulating substrate and the lid body, the bonding material extends from the chamfered portion to both ends of the chamfered portion. It is difficult to spread on the outer side of the cover, for example, on each side of the lid, and a fillet of a bonding material having a large volume is easily formed on the convex portions at both ends of the chamfered portion. Therefore, even in the chamfered lid, the bonding area of the bonding material at the four corners of the electronic component storage package (insulating substrate) can be increased, and the bonding strength between the insulating substrate and the lid can be improved.

An electronic component storage package according to one aspect of the present invention includes a mounting portion for mounting an electronic component, a lower insulating layer having an upper surface, and a plurality of electrodes to which the electronic component provided in the mounting portion is connected An insulating substrate including a pad and a frame-like upper insulating layer laminated on the lower insulating layer so as to surround the mounting portion; and an insulating substrate provided with notches from the lower end to the upper end of the four corners; and the frame-like upper insulating layer A lid joined to the layer via a joining material, chamfered portions are provided from the lower end to the upper end of the four corners of the lid, and convex portions are provided at both ends of the chamfered portion in plan view. Therefore, even if the bonding area between the upper surface of the frame portion and the lid body is reduced at the four corners of the insulating substrate, the bonding material is moved from the chamfered portion to the outside of both ends of the chamfered portion, for example, each side of the lid body. It becomes difficult to spread, and a large volume of bonding material is Iretto is easily formed. Therefore, the sealing thickness of the bonding material can be secured between the convex portions at both ends of the chamfered portion, and an electronic component storage package excellent in the hermetic sealing performance of the electronic components accommodated in the mounting portion can be provided.

  An electronic device according to an aspect of the present invention includes the above electronic component storage package, an electronic component mounted on the mounting portion, and a bonding material provided between the frame-shaped upper insulating layer and the lid. Since the bonding material covers and joins part of the chamfered portion and the convex portion, the notch is provided at the four corners of the insulating substrate, so that the upper surface of the frame portion and the lid body Even if the bonding area decreases, the sealing thickness of the bonding material tends to increase between the convex portions at both ends of the chamfered portion. Therefore, it is possible to provide an electronic device in which the airtightness of the electronic components housed in the mounting portion is good and the airtight sealing is highly reliable.

(A) is a top view which shows the electronic component storage package to which the cover body of embodiment of this invention was joined, and an electronic device, (b) is sectional drawing in the XX 'line | wire of (a). . It is a perspective view of the electronic component storage package which expands and shows the principal part of FIG. It is a perspective view which shows the principal part of a cover body. (A)-(c) is a top view which shows the principal part of the cover body of embodiment of this invention.

  The lid, electronic component storage package, and electronic device of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view showing an electronic component storage package and an electronic device to which a lid of an embodiment of the present invention is joined, and FIG. 1B is a cross-sectional view thereof. 2 is an enlarged perspective view showing a main part of the electronic component storage package of FIG. FIG. 3 is a perspective view showing the main part of the lid, and FIGS. 4A to 4C are plan views showing the main part of the lid.

  1-4, 101 is an insulating substrate, 102 is a mounting portion, 103 is an upper insulating layer, 104 is a lower insulating layer, 105 is an external connection conductor, 106 is a notch, 107 is an electronic component, and 108 is an electronic component. Electrode pad to be mounted, 109 is a conductive adhesive, 110 is a bonding material, 111 is a lid, 112 is a chamfered portion, 113 is a convex portion, 114 is a cut surface, 114a is a first cut surface, 114b is a second The cut surface, 115 is a fracture surface, 200 is an electronic component storage package, and 300 is an electronic device.

In this embodiment, an external connection conductor 105, a notch 106, an electrode pad 108, a bonding material 110, a lid 111, a chamfered portion 112, a cut surface 114, and a fracture surface 115 are arranged on an insulating substrate 101 to store electronic components. The package 200 for use is basically configured. As shown in FIG. 1B, the insulating base 101 has a mounting portion 102 that is concave in a sectional view in the thickness direction. An electronic device 300 is manufactured by hermetically sealing an electronic component 107 such as a piezoelectric vibration element in the electronic component storage package 200. Note that the lid 111 that seals the mounting portion 102 is indicated by a broken line in FIG.

The insulating substrate 101 is formed by laminating an upper insulating layer 103 serving as a frame on a flat lower insulating layer 104 serving as a base. The upper insulating layer 103 surrounds the mounting portion 102 on the upper surface of the lower insulating layer 104 in plan view. A concave mounting portion 102 for accommodating the electronic component 107 is provided by the inner side surface of the upper insulating layer 103 and the lower insulating layer 104 exposed inside the inner side surface.

The lid 111 is, for example, a square plate and is made of a ceramic material or the like. The lid 111 has a lower surface outer peripheral portion bonded to the upper surface of the upper insulating layer 103 (frame portion) by a glass bonding method or the like. When the lid 111 is made of a ceramic material, it is made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a glass-ceramic sintered body, or the like. The lid 111 may be a glass material or a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy. Depending on the material of the lid 111, a bonding material 110 for bonding the lid 111 to the upper surface of the insulating substrate 101 is appropriately selected.

If the lid 111 is a ceramic material or a glass material, a bonding material 110 made of glass having excellent wettability with those materials may be used. Further, if the lid 111 is a metal material such as an iron-nickel alloy or iron-nickel-cobalt alloy, the bonding material 110 made of a metal brazing material such as silver brazing or soldering having excellent wettability with the metal material can be used. That's fine. In this case, in order to join the lid 111 to the upper surface of the insulating substrate 101, a metal layer (not shown) such as a metallized layer is provided on the back surface of the lid 111, the chamfered portion 112, and the exposed surface of the convex portion 113. It is done.

The lid 111 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The lid 111 has, for example, a rectangular shape with a side length of about 2 to 10 mm and a thickness of about 0.1 to 0.6 mm in plan view, and has a chamfer at each of its four corners. Part 112 is provided.

If the lid 111 is made of an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, and the like are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to produce a slurry. In order to obtain a single layer ceramic green sheet by making it into a sheet shape by a sheet forming method such as a doctor blade method or a roll calender method, and then to provide a chamfered portion 112 on the ceramic green sheet In order to form a plurality of holes, a suitable punching process is performed, and the ceramic green sheet is fired at a high temperature.

The ceramic green sheet is manufactured as a so-called multi-piece wiring board (not shown) in which a plurality of lid regions (not shown) to be the lid 111 are arranged vertically and horizontally on the ceramic mother board. Is done. Specifically, it is manufactured by a method in which a dividing groove is formed at the boundary of the lid region and the ceramic green sheet is cut at the boundary of the lid region and divided into pieces.

Further, the upper insulating layer 103 and the lower insulating layer 104 included in the insulating substrate 101 are made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body, like the lid 111. It consists of a ceramic material such as a knot. The insulating substrate 101 has, for example, an overall outer shape of a rectangular shape with a side length of about 2 to 10 mm in plan view, and a thickness of 0.3 to
It has a plate shape of about 2 mm and has the concave mounting portion 102 as described above on the upper surface.

The upper insulating layer 103 and the lower insulating layer 104 constituting the insulating substrate 101 included in the wiring board are formed into a plurality of sheets by forming into a sheet shape by a sheet forming method such as a doctor blade method or a roll calender method, like the cover 111. After obtaining a sheet of ceramic green sheets, some of the ceramic green sheets are punched out into a frame shape, and each frame is formed on the upper surface of a flat ceramic green sheet that is not formed into a frame shape. Can be manufactured by stacking up and down so that the ceramic green sheets are positioned and firing the laminate at a high temperature.

The insulating substrate 101 is manufactured as a so-called multi-piece wiring substrate (not shown) in which a plurality of wiring substrate regions (not shown), each of which becomes such a wiring substrate, are arranged vertically and horizontally on a ceramic mother substrate. This is manufactured by a method of cutting it at the boundary of the wiring board region and dividing it into pieces.

A wiring conductor such as an electrode pad 108 that is electrically connected to the electronic component 107 is provided around the mounting portion 102. An electronic component 107 is electrically connected to the electrode pad 108 by a conductive adhesive 109. After the electronic component 107 is accommodated in the mounting portion 102, the lid body 111 made of ceramic or the like is joined to the upper insulating layer 103 by the joining material 110 such as glass, so that the lid body 111 and the insulating substrate 101 are formed. An electronic component 107 is hermetically sealed in the container to form an electronic device. Here, the electronic component 107 is, for example, a piezoelectric vibration element or a semiconductor element, and other electronic components 107 may be combined and accommodated.

The electronic component 107 electrically connected to the electrode pad 108 is electrically connected to the external connection conductor 105 on the lower surface of the insulating substrate 101 via, for example, another wiring conductor (not shown) formed inside the insulating substrate 101. Connected. Further, the external connection conductor 105 is electrically connected to an external electric circuit (not shown) by soldering or the like.

The wiring conductors such as the electrode pads 108 and the external connection conductors 105 have a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 2 μm sequentially deposited on the exposed surfaces. Good. Thereby, the oxidative corrosion of a wiring conductor can be suppressed more effectively.

The lid 111 of the present invention has a mounting portion 102 for mounting an electronic component 107, and a plurality of electrode pads 108 to which a lower insulating layer 104 having an upper surface and an electronic component 107 provided on the mounting portion 102 are connected. And a frame-like upper insulating layer 103 laminated so as to surround the mounting portion 102 on the lower insulating layer 104, and bonded to the insulating substrate 101 provided with the notches 106 from the lower end to the upper end of the four corners The chamfered portion 112 is provided from the lower end to the upper end of the four corners, and the convex portions 113 are provided at both ends of the chamfered portion 112 in plan view.

Because of such a configuration, the bonding material 110 is difficult to spread from the chamfered portion 112 to the outside of both ends of the chamfered portion 112, for example, each side of the lid 111, and the chamfered portion 112 of the chamfered portion 112 is formed at the four corners of the lid 111. Fillets of the bonding material 110 having a large volume are easily formed on the convex portions 113 at both ends. Therefore, also in the chamfered lid 111, the bonding area of the bonding material 110 at the four corners of the electronic component storage package 200 (wiring board) can be increased, and the bonding strength between the insulating substrate 101 and the lid 111 can be improved.

That is, when the lid 111 is bonded to the upper surface of the upper insulating layer 103 (frame portion) of the insulating substrate 101 by a glass bonding method or the like, conventionally, a bonding material made of glass on the outer peripheral portion of the lower surface of the lid 111 is used. 110 is provided in a frame shape, and since the chamfered portions 112 are provided at the four corners of the lid 111, the bonding area between the upper surface of the frame and the lid 111 is reduced, and the bonding material 110 at the four corners is provided. The volume of will be reduced. Then, a part of the bonding material 110 provided between the insulating substrate 101 and the lid 111 at the time of bonding protrudes to the outer edge of the insulating substrate 101, and a fillet of the bonding material 110 is formed partway along the outer peripheral side surface of the lid 111. Is done. However, as shown in FIG. 2, the convex portions 113 provided at both ends of the chamfered portion 112 allow the bonding material 110 to be moved from the chamfered portion 112 to the outside of both ends of the chamfered portion 112, for example, on each side of the lid 111. Therefore, the bonding material 110 wets and spreads at the four corners of the insulating substrate 101, so that the volume of the bonding material 110 is easily secured. Accordingly, the sealing thickness of the bonding material 110 can be ensured between the convex portions 113 at both ends of the chamfered portion 112, and the lid 111 excellent in the reliability of hermetic sealing of the electronic component 107 accommodated in the mounting portion 102 is provided. it can.

Here, in the chamfered portion 112 at the four corners of the lid body 111, the convex portions 113 are provided at both ends thereof.
For example, in a ceramic green sheet in which a plurality of lid regions (not shown) to be the lid 111 are arranged vertically and horizontally, a through hole (not shown) to be a chamfered portion 112 in an intersecting region at the boundary of each lid region Can be manufactured by forming a dividing groove (not shown) with a cutter blade or the like along the boundary of each lid region.

Specifically, the convex portion 113 of the lid 111 is formed when the notch for the dividing groove is formed in the central portion of the through hole that becomes the chamfered portion 112 of the ceramic green sheet that becomes the ceramic mother substrate. Can be provided by extruding and projecting a part thereof to the center side of the through hole by the pressure of the blade such as a cutter blade. A ceramic mother board is manufactured by firing the ceramic green sheet in which the through holes and the dividing grooves are formed at a high temperature, and the ceramic mother board is formed into a V-shaped dividing groove provided at the boundary of each lid region. The lid 111 by dividing it along
Is produced. As shown in the perspective view of FIG. 2, the lid 111 manufactured in this way is provided with convex portions 113 at both ends of the chamfered portion 112 at the four corners. In the case of the lid body 111 shown in FIG. 2, the dividing grooves are manufactured from a ceramic mother board provided on the upper surface and the lower surface, and the dividing grooves are formed on the upper surface side and / or the lower surface side of the lid body 111. The four convex portions 113 are provided at the four corners in contact with the region to be formed.

Further, the dividing groove may be provided only on one side of the ceramic mother board, and the surface of the lid 111 on which the dividing groove is provided is in contact with the region where the dividing groove is formed, and is protruded at two corners at each of the four corners. 113
Is provided. In this case, if the lid 111 is bonded to the insulating substrate 101 via the bonding material 110 so that the convex portion 113 faces the insulating substrate 101 side, the bonding material is formed between the convex portions 113 at both ends of the chamfered portion 112. A sealing thickness of 110 can be secured.

The formation of the convex portion 113 of the lid 111 is not limited to a method of manufacturing by the pressure of a blade such as a cutter blade, but a punching method can be used to form an outer edge shape including the convex portion 113, or the lid A paste containing a material for forming the convex portion 113 may be applied to the four corners of the body 111 by dipping or the like. The material of the lid 111 is not limited to a ceramic material, and may be a glass material or a resin material.

Further, a chamfered portion 112 is provided at a portion where stress is most concentrated in the joined state of the lid 111, that is, at four corners. The chamfered portion 112 of the lid 111 is shown in FIG. As described above, the insulating substrate 101 is joined to the insulating substrate 101 so as to be located inside the notches 106 at the four corners.
Therefore, when the lid 111 is bonded, the bonding material 110 such as glass wets and spreads between the notches 106 at the four corners of the insulating substrate 101 and the chamfered portion 112 of the lid 111, and a part thereof is a chamfered portion. Since it is easy to enter 112, the chamfered portion 112 is wetted and a portion covered with more bonding material 110 is provided. As a result, the fillet of the bonding material 110 is formed by the convex portion 113 described above, and the volume of the bonding material 110 is increased by the chamfered portion 112, and the portion where the stress of the package in the mounted state tends to concentrate is reinforced. The joint structure of the lid 111 to the insulating substrate 101 is strengthened by the synergistic effect.

Therefore, according to the present invention, it is possible to realize the lid body 111 in which the lid body 111 is prevented from being peeled off from the insulating substrate 101 due to an external impact or the like, or the occurrence of airtight defects is suppressed.

In the lid body 111 of the present invention, a frame-shaped bonding material 110 is provided on the surface to be bonded to the upper insulating layer 103, and a part of the bonding material 110 is provided on the chamfered portion 112. Because of such a configuration, it is easy to ensure the volume of the bonding material 110 at the chamfered portions 112 at the four corners of the lid 111 where the volume of the bonding material 110 is small.

That is, when the lid 111 is bonded to the upper surface of the upper insulating layer 103 of the insulating substrate 101 by a glass bonding method or the like, conventionally, the bonding material 110 made of glass is formed in a frame shape on the outer periphery of the lower surface of the lid 111. The chamfered portions 112 are provided at the four corners of the lid body 111, and the upper surface of the frame portion and the lid body 111 are provided.
And the volume of the bonding material 110 at the four corners decreases. However, the convex portions 113 provided at both ends of the chamfered portion 112 tend to make it difficult for the bonding material 110 to spread from the chamfered portion 112 to the outside of both ends of the chamfered portion 112, for example, the sides of the lid 111. Further, as shown in FIG. 3, the bonding material 110 provided on the chamfered portion 112 of the lid 111 moves the bonding material 110 to the four corners of the insulating substrate 101 and spreads to form a fillet of the bonding material 110. This makes it easy to secure the volume of the bonding material 110 at the four corners. Therefore, the bonding strength of the lid 111 is excellent, the sealing thickness of the bonding material 110 can be secured between the convex portions 113 at both ends of the chamfered portion 112, and the airtight sealing performance of the electronic component 107 accommodated in the mounting portion 102 is ensured. An excellent lid 111 can be provided.

Here, if the bonding material 110 used for sealing the mounting portion 102 is glass, for example, lead oxide 50 to 65% by weight, boron oxide 2 to 10% by weight, lead fluoride 10 to 30% by weight, oxidation It consists of a lead-based glass in which a lead titanate compound is added as a filler to a glass component containing 1 to 6% by weight of zinc and 10 to 20% by weight of bismuth oxide as a filler. A glass in which bubbles contained in glass are removed is used. By using such a bonding material 110 made of glass, the lid body 111 and the insulating substrate 101 are firmly bonded to each other by the bonding material 110, and the hermetic sealing of the container becomes better and accommodated in the mounting portion 102. It becomes possible to operate the electronic component 107 normally and stably for a longer period of time.

Note that the bonding material 110 is not limited to the glass described above, and may be glass, resin, solder, or the like made of another composition. If the bonding material 110 is a resin, for example, an epoxy resin can be used, and the bonding material 110 can be directly bonded to the base of the lid 111 made of ceramic. If the bonding material 110 is solder, the bonding material 110 made of high-temperature solder having a melting point higher than that of solder used when the electronic device 300 is secondarily mounted on an external circuit board (not shown) by reflow processing is used. Can be used. As the high temperature solder, for example, a Pb / Sn series, Pb / Sn / Ag series or the like having a melting point of around 300 ° C. In this case, a metallized layer is provided on the upper surface of the upper insulating layer 103, and further, a frame-like portion on the back surface of the lid body 111 on which solder to be the bonding material 110 is provided, and a chamfered portion 112 and a convex portion at the four corners. A metallized layer (not shown) may be provided on 113 so that wettability with solder is ensured by this metallized layer. In order to further improve the wettability with the solder, a plating layer such as nickel and gold may be provided on the exposed surfaces of the upper insulating layer 103 and the metallization layer of the lid 111.

In addition, the lid body 111 of the present invention has a cut surface 114 and a fracture surface 115 on each side, and the fracture surface 115 includes a first cut surface 114a provided in contact with the upper surface of the lid body 111, and a lid. The fracture surface 115 is provided between the first cut surface 114a and the second cut surface 114b, and is formed at the four corners of the insulating substrate 101 at the four corners. 113 is provided between the first cut surface 114 a and the chamfered portion 112, and between the second cut surface 114 b and the chamfered portion 112.

With such a configuration, when the bonding material 110 for bonding the lid 111 to the upper surface of the insulating substrate 101 is provided on the lid 111, it is not necessary to specify either the front or back of the lid 111. In other words, whether the bonding material 110 is provided on the upper surface of the lid 111 or the bonding material 110 is provided on the lower surface, the bonding material 110 is convex when the lid 111 is bonded to the upper surface of the insulating substrate 101. The configuration is in contact with 113. Due to the four convex portions 113 provided at both ends of the chamfered portion 112, the bonding material 110 is located at least two locations in the vicinity of the upper surface of the insulating substrate 101 among the four convex portions 113 due to surface tension. Due to the convex portion 113, the bonding material 110 tends to hardly spread from the chamfered portion 112 to the outside of both ends of the chamfered portion 112, for example, each side of the lid 111. Therefore, the bonding material 110 provided on the chamfered portions 112 at the four corners of the lid 111 spreads the bonding material 110 at the four corners of the insulating substrate 101 to form fillets of the bonding material 110, thereby forming the lid 111. In the four corner chamfers 112, the bonding material 110
It is easy to secure the volume.

Here, in order to provide the cut surface 114 and the fractured surface 115 in the lid 111, for example, a plurality of holes are formed by punching a ceramic green sheet serving as a multi-piece substrate, and 4 at the center of each hole. What is necessary is just to manufacture by forming a division | segmentation groove | channel in a grid | lattice form, for example with a metal mold | die so that it may be equally divided. At this time, the perforated portion becomes the chamfered portion 112 of the lid 111, and the portion where the divided grooves are formed in a lattice shape becomes the cut surface 114. Then, a ceramic mother board is manufactured by firing the ceramic green sheet in which these through holes and dividing grooves are formed at a high temperature, and along the dividing grooves provided at the boundary of each lid region of the ceramic mother board. The part divided in this way becomes the fracture surface 115. Therefore, when the split grooves are provided on both sides of the lid 111, the cut surfaces 114 are provided on both sides of the lid 111. In addition, in the chamfered portions 112 at the four corners of the lid 111, in order to provide the convex portions 113 on both sides and both ends, as described above, a dividing groove (not shown) is formed by a cutter blade or the like along the boundary of each lid region. Can be manufactured.

Further, in order not to change the bonding state to the insulating substrate 101 depending on the shape of the front and back of the lid 111, the shape of the lid 111 is set to the same shape as much as possible on both the front and back as shown in FIG. It is preferable. For that purpose, when forming the divided grooves in a lattice shape with a mold or the like on a ceramic green sheet that is a multi-piece substrate, insert the same shape mold at the same depth on the front and back to form the divided grooves Good. Thereby, on the outer peripheral side surface of the lid 111, the first cut surface 114a on the upper surface side and the second cut surface 114b on the lower surface side are formed with substantially the same width, and at the four positions on both ends of each chamfered portion 112. The convex portion 113 having substantially the same shape can be provided. In the thickness direction, the fracture surface 115 is provided at substantially the center of the first cut surface 114a and the second cut surface 114b.
The lid 111 as shown in FIG. 3 can be manufactured. By using such a lid 111, when the bonding material 110 for bonding to the upper surface of the insulating substrate 101 is provided on the lid 111, it is not necessary to specify the front and back of the lid 111, and the lid 111 It is possible to provide the lid 111 in which the state of bonding to the insulating substrate 101 is suppressed depending on the front and back shapes.

The electronic component storage package 200 (wiring board) of the present invention has a mounting portion 102 for mounting the electronic component 107, and the lower insulating layer 104 having the upper surface is connected to the electronic component 107 provided on the mounting portion 102. A plurality of electrode pads 108 and a frame-like upper insulating layer 103 laminated on the lower insulating layer 104 so as to surround the mounting portion 102, and are provided with notches 106 from the lower end to the upper end of the four corners. It has a substrate 101 and a lid body 111 joined to a frame-like upper insulating layer 103 via a joining material 110, and chamfered portions 112 are provided from the lower end to the upper end of the four corners of the lid body 111. Convex portions 113 are provided at both ends of the chamfered portion 112 in plan view.

With this configuration, even if the bonding area between the upper surface of the frame portion (upper insulating layer 103) and the lid 111 is reduced at the four corners of the insulating substrate 101, the fillet of the bonding material 110 is formed on the convex portion 113. Is easily formed. Therefore, it is possible to secure the sealing thickness of the bonding material 110 between the convex portions 113 at both ends of the chamfered portion 112, and to provide an electronic component storage package 200 excellent in airtight sealing of the electronic component 107 accommodated in the mounting portion 102. Can be provided.

The insulating substrate 101 constituting the electronic component storage package 200 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The insulating substrate 101 is, for example, a rectangular shape having a side length of about 2 to 10 mm in a plan view and a thickness of about 0.3 to 2 mm, and is cut out at each of the four corners. 106.

If the insulating substrate 101 is made of an aluminum oxide sintered body, a multilayer ceramic green sheet is obtained by using the raw material powder, organic binder, and the like described above to form a sheet by a sheet molding method. Next, the ceramic green sheet can be manufactured by performing an appropriate punching process for forming a hole for providing the mounting portion 102 and the notch 106 and firing the ceramic green sheet at a high temperature.

In addition, the external connection conductor 105 provided on the insulating substrate 101 and the electrode pad 108 on which the electronic component 107 is mounted are formed of a metal material such as tungsten, molybdenum, manganese, copper, or silver. The plurality of conductors and the like are printed in a predetermined pattern on a main surface of a ceramic green sheet that becomes the upper insulating layer 103 and the lower insulating layer 104, for example, by using a paste (metal paste) of such a metal material such as tungsten. It can be provided by co-firing.

An electronic component 107 such as a piezoelectric vibration element is bonded to the electrode pad 108 provided on the mounting portion 102 of the electronic component storage package 200 as shown in FIG. In addition, when the insulating substrate 101 and the lid 111 are bonded together by the bonding material 110 and the electronic component 101 is hermetically accommodated in the insulating container composed of the insulating substrate 101 and the lid 111, At the corner, the fillet of the bonding material 110 is easily formed on the convex portions 113 at both ends of the chamfered portion 112 of the lid 111. Therefore, even when the lid 111 having the chamfered portion 112 at the four corners is bonded to the insulating substrate 101 having the notches 106 at the four corners, the bonding area of the bonding material 110 at the four corners of the insulating substrate 101 is The bonding strength between the insulating substrate 101 and the lid body 111 is improved, and the sealing thickness of the bonding material 110 can be secured between the convex portions 113 at both ends of the chamfered portion 112, and is accommodated in the mounting portion 102. In addition, it is possible to provide the electronic component storage package 200 having excellent airtight sealing of the electronic component 107.

In the electronic component storage package 200 of the present invention, the lid body 111 has a cut surface 114 and a fracture surface 115 on each side, and the fracture surface 115 is provided in contact with the upper surface of the lid body 111. The fracture surface 115 includes a first cut surface 114a and a second cut surface 114b provided in contact with the lower surface of the lid 111.
Provided between the cut surface 114a and the second cut surface 114b, and at the four corners of the insulating substrate 101, the convex portions 113 are located between the first cut surface 114a and the chamfered portion 112, and between the second cut surface 114b and the chamfered portion. It is provided between the unit 112.

With this configuration, when the bonding material 110 for bonding the lid body 111 to the upper surface of the insulating substrate 101 is provided on the lid body 111, it is possible to store electronic components that do not require the orientation of the front and back surfaces of the lid body 111 to be specified. The bonding structure of the package 200 can be realized. In other words, whether the bonding material 110 is provided on the upper surface of the lid 111 or the bonding material 110 is provided on the lower surface, the bonding material 110 is convex when the lid 111 is bonded to the upper surface of the insulating substrate 101. The configuration is in contact with 113. Due to the four convex portions 113 provided at both ends of the chamfered portion 112, the bonding material 110 is located at least two locations in the vicinity of the upper surface of the insulating substrate 101 among the four convex portions 113 due to surface tension. It tends to spread to the convex portion 113 side. Therefore, the bonding material 110 provided at the four chamfered portions 112 of the lid 111 has the bonding material 110 at the four corners of the insulating substrate 101.
Since the fillet of the bonding material 110 is formed by moving and spreading, the volume of the bonding material 110 is easily secured at the chamfered portions 112 at the four corners of the lid 111. Therefore, the sealing thickness of the bonding material 110 can be secured between the convex portions 113 at both ends of the chamfered portion 112, and the electronic component storage package excellent in the hermetic sealing reliability of the electronic component 107 accommodated in the mounting portion 102. Can provide 200.

The lid 111 bonded to the upper insulating layer 103 of the electronic component storage package 200 is shown in FIGS.
It is not limited to the shape in which the four corners are chamfered in a ¼ arc shape in plan view as shown in a), and may be chamfered in other shapes. For example, as shown in the plan view of the main part in FIGS. 4B and 4C, it may be chamfered in the shape of a 1/4 long hole, and the chamfered portion 112 may be C
The shape may be chamfered linearly as the surface.

For example, as shown in FIG. 4B, when the four corners of the lid body 111 are chamfered into a 1/4 long hole shape in a plan view, the width of the chamfered portion 112 can be widened. It is possible to provide as many bonding materials 110 as the chamfered portion 112, and the bonding strength between the insulating substrate 101 and the lid 111 can be improved. Further, for example, as shown in FIG. 4C, when the chamfered portion 112 is chamfered with the four corners of the lid body 111 as a C surface in a plan view, the width of the chamfered portion 112 is obtained. Is reduced, and the volume of the bonding material 110 provided in the chamfered portion 112 is reduced, but the insulating substrate 101
Since the joint width of the four corners of the insulating substrate 101 not including the joint material 110 can be increased, a synergistic effect with the structure in which the fillet of the joint material 110 is formed at the four corners of the insulating substrate 101 enables reliable hermetic sealing. Can be improved. Such a lid 111 can be simultaneously and collectively manufactured as a multi-piece substrate by the method described above.

Each manufactured lid body 111 has a fracture surface 115 provided in contact with the upper surface of the lid body 111.
It consists of a cut surface 114a and a second cut surface 114b provided in contact with the lower surface of the lid 111, and the fracture surface 115 is provided between the first cut surface 114a and the second cut surface 114b and 4 of the insulating substrate 101. At the corner, the convex portion 113 is provided between the first cut surface 114 a and the chamfered portion 112 and between the second cut surface 114 b and the chamfered portion 112.

An electronic device 300 according to the present invention includes an electronic component storage package 200 described above, an electronic component 107 mounted on the mounting portion 102, and a joint provided between the frame-shaped upper insulating layer 103 and the lid 111. The bonding material 109 is bonded so as to cover part of the chamfered portion 112 and the convex portion 113. With such a configuration, even if the bonding area between the upper surface of the frame portion (upper insulating layer 103) and the lid 111 is reduced by providing the notches 106 at the four corners of the insulating substrate 101, the chamfering is performed. Part 112
The sealing thickness of the bonding material 110 is likely to increase between the convex portions 113 at both ends of the two. Therefore, it is possible to provide the electronic device 300 in which the airtightness of the electronic component 107 housed in the mounting portion 102 is good and the airtight sealing is highly reliable.

Specifically, the bonding material 110 provided on the back surface of the lid 111 positioned so as to close the upper surface of the electronic component storage package 200 wets and spreads on the upper surface of the upper insulating layer 103 by heat treatment. Then, it is provided between the lower surface of the lid body 111 and the upper surface of the upper insulating layer 103, and a part of the bonding material 110 spreads to the outer peripheral side surface of the lid body 111 due to surface tension. If the convex portions 113 are not provided at both ends of the chamfered portion 112 of the lid 111, the shape of the outer periphery of the frame-shaped bonding material 110 provided at the four corners of the lower surface of the lid 111 is convex. Therefore, even if a part of the bonding material 110 spreads to the side surfaces of the four corners of the lid 111, the volume that spreads is reduced. Further, in order to increase the volume of the bonding material 110 at the four corners of the lower surface of the lid 111, the bonding can be performed even if the width of the frame-shaped bonding material 110 provided at the four corners of the lower surface of the lid 111 is increased. Since the material 110 does not contribute to the sealing structure and remains on the lower surface of the lid 111, the volume of the bonding material 110 for covering the four corners of the chamfered portion 112 and the convex portion 113 of the lid 111 cannot be increased.

However, since the convex portion 113 is provided on the chamfered portion 112 of the lid 111, the bonding material 110 comes into contact with the convex portion 113 when the lid 111 is joined to the upper surface of the insulating substrate 101. Due to the convex portions 113 provided at both ends of the chamfered portion 112, the bonding material 110 easily spreads to the convex portions 113 due to surface tension. Therefore, the movement of the bonding material 110 is promoted to the four corners of the chamfered portion 112 of the lid 111, and fillets of the bonding material 110 are formed at the four corners of the insulating substrate 101, whereby the four corners of the chamfered portion of the lid 111 are formed. In 112, it is easy to secure the volume of the bonding material 110. Therefore, the sealing thickness of the bonding material 110 can be secured between the convex portions 113 at both ends of the chamfered portion 112, and the reliability of the hermetic sealing of the electronic component 107 accommodated in the mounting portion 102 of the electronic component storage package 200 is ensured. It is possible to provide the electronic device 300 excellent in the above.

In the case where the bonding material 110 provided on the lower surface of the lid 111 is made of a glass layer, for example, a screen printing method or a glass paste containing a glass component composed of the above-described components at a predetermined position on the lower surface of the lid 111 is used. It can be provided by coating in a frame shape by a dipping method. Then, in order to remove bubbles in the glass paste by degassing in advance, by heating for about 10 minutes at a temperature higher by 10-50 ° C. than the softening point of glass at 300-350 ° C. in a vacuum of a heat treatment furnace, A transparent glass layer can be formed. At this time, it is possible to reduce the porosity in the glass layer by performing in a vacuum range higher than the vacuum level at the time of vacuum sealing.

The shape of the lid 111 bonded to the upper insulating layer 103 of the electronic component storage package 200 is:
The shape is not limited to a shape in which the four corners are chamfered in a quarter arc shape in a plan view. For example, FIG.
, (C), as shown in plan view of the main part, it may be chamfered in the shape of a 1/4 long hole, and the chamfered part 112 may have a shape that is chamfered linearly as a C surface. . Accordingly, the lid 111 is hardly affected by the shape and position of the notch 106 of the electronic component storage package 200.
Since the region where the upper insulating layer 103 and the upper insulating layer 103 are sealed with the bonding material 110 such as a glass layer is firmly secured on the bonding surface and the outer peripheral side, the electronic component 107 is protected from the external environment.

Further, in the electronic device 300 according to the embodiment of the present invention, in the bonding material 110 for bonding the insulating substrate 101 and the lid 111, the fillet height provided in the chamfered portion 112 and the convex portion 113 of the lid 111 is:
It is larger than the fillet height at the edge of the outer edge of the lid 111. With this configuration, the fillet height at the edge of the outer edge of the lid 111 is increased in a region where the bonding area between the upper surface of the frame (upper insulating layer 103) and the edge of the insulating substrate 101 is relatively large. Therefore, the bonding material 110 is prevented from flowing out to the side surface side of the insulating substrate 101. In the region where the bonding area between the upper surface of the frame portion (upper insulating layer 103) and the lid body 111 is reduced by providing the notches 106 at the four corners of the insulating substrate 101, the chamfered portion 112 of the lid body 111 is formed. And the fillet height provided in the convex part 113 is large, and the sealing thickness of the bonding material 110 is large. Therefore, it is possible to provide the electronic device 300 in which the airtightness of the electronic component 107 accommodated in the mounting portion 102 is further improved and the reliability of the hermetic sealing is more excellent.

Specifically, the bonding material 110 provided on the back surface of the lid 111 wets and spreads on the upper surface of the upper insulating layer 103 by heat treatment. At this time, for example, as shown in FIG. 3, a frame-shaped bonding material 110 is provided on the lower surface corresponding to the surface bonded to the upper insulating layer 103, and a part of the bonding material 110 is formed on the chamfered portion 112. By using the cover body 111 having the provided structure, the fillet height provided at the chamfered portion 112 and the convex portion 113 of the cover body 111 is larger than the fillet height at the side of the outer edge of the cover body 111. The electronic device 300 having the configuration can be realized. That is, the bonding material 110 provided on the side of the lower surface of the lid 111 corresponding to the surface bonded to the upper insulating layer 103 is heat-treated by the upper insulating layer 103.
The upper surface excluding the four corners of the lid 111 wets and spreads, and is joined in a state in which the fillet height at the edge of the outer edge of the lid 111 is relatively small.

On the other hand, the bonding material 110 provided at the corners of the lower surface of the lid 111 spreads on the upper surfaces of the four corners of the upper insulating layer 103 by heat treatment and is further provided at the chamfered portion 112 of the lid 111. Since the bonding material 110 also hangs down by heat treatment and wets and spreads on the upper surfaces of the four corners of the upper insulating layer 103, a larger volume of the bonding material 110 spreads on the upper surfaces of the four corners of the upper insulating layer 103. The chamfered portion 112 is joined with a large fillet height. At this time, the bonding material 110 is also spread by the surface tension on the convex portions 113 provided in the chamfered portions 112 at the four corners of the lid 111.

On the other hand, the convex portion 113 has a larger volume of the bonding material 110 provided in the notch 106 of the lid 111 until the bonding material 110 softened by the heat treatment is cooled and hardened. 2 acts as a dam that suppresses movement from the region of the notch 106 to the region of the outer edge of the lid 111. For this reason, it is suppressed that the fillet height provided in the chamfered portion 112 and the convex portion 113 of the lid 111 after the lid 111 is joined is reduced. Therefore, it is possible to realize the electronic device 300 in which the fillet height provided in the chamfered portion 112 and the convex portion 113 of the lid body 111 is larger than the fillet height at the edge of the outer edge of the lid body 111. At the four corners of the package 200 for use, it is possible to suppress a decrease in the reliability of hermetic sealing due to a reduction in the bonding area between the upper surface of the frame portion and the lid 111 due to chamfering of the lid 111.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, an example in which a piezoelectric vibration element is mounted as an electronic component on the mounting unit 102 is shown. However, other electronic components are mounted or other related electronic components (capacitor, thermistor element, etc.) ) May be the electronic device 300 mounted together with the piezoelectric vibration element. In addition, as an example of a method of dividing the lid 111 into pieces, an example is shown in which a divided groove is formed in a lattice pattern on a mother board in which lid regions are arranged vertically and horizontally with a mold or the like. For example, a method of dividing the mother substrate by forming a dividing groove in a lattice shape with a laser may be employed.

101 ・ ・ ・ Insulating substrate
102 ・ ・ ・ Mounting part
103 ... Upper insulating layer
104 ... Lower insulation layer
105 ・ ・ ・ External connection conductor
106 ... notch
107 ・ ・ ・ Electronic components
108 ... Electrode pad
109 ・ ・ ・ Conductive adhesive
110 ・ ・ ・ Joint material
111 ・ ・ ・ Cover
112 ・ ・ ・ Chamfer
113 ・ ・ ・ Convex
114 ... cut surface
114a ... first cut surface
114b ... 2nd cut surface
115 ・ ・ ・ Fracture surface
200 ・ ・ ・ Package for storing electronic components
300 ・ ・ ・ Electronic device

Claims (7)

A lower insulating layer having an upper surface for mounting an electronic component; a plurality of electrode pads to which the electronic component provided in the mounting portion is connected; and surrounding the mounting portion on the lower insulating layer And a frame-like upper insulating layer laminated with each other and bonded to an insulating substrate provided with a notch from the lower end to the upper end of the four corners, and a chamfered portion is provided from the lower end to the upper end of the four corners. A lid having convex portions at both ends of the chamfered portion in plan view. The lid according to claim 1, wherein a frame-shaped bonding material is provided on a surface bonded to the upper insulating layer, and a part of the bonding material is provided on the chamfered portion. The lid body has a cut surface and a fracture surface at each side, and the fracture surface is provided in contact with a first cut surface provided in contact with the upper surface of the lid body and a lower surface of the lid body. The fracture surface is provided between the first cut surface and the second cut surface, and the convex portions are formed at the four corners of the insulating substrate with the first cut surface. The lid according to claim 1, wherein the lid body is provided between the chamfered portion and between the second cut surface and the chamfered portion. A lower insulating layer having an upper surface for mounting an electronic component; a plurality of electrode pads to which the electronic component provided in the mounting portion is connected; and surrounding the mounting portion on the lower insulating layer A frame-like upper insulating layer laminated with a cutout provided from the lower end to the upper end of the four corners, and a lid bonded to the frame-like upper insulating layer via a bonding material; A chamfered portion is provided from the lower end to the upper end of the four corners of the lid body, and convex portions are provided at both ends of the chamfered portion in a plan view. For package. The lid body has a cut surface and a fracture surface at each side, and the fracture surface is provided in contact with a first cut surface provided in contact with the upper surface of the lid body and a lower surface of the lid body. The fracture surface is provided between the first cut surface and the second cut surface, and the convex portions are formed at the four corners of the insulating substrate with the first cut surface. The electronic component storage package according to claim 4, wherein the electronic component storage package is provided between the chamfered portion and between the second cut surface and the chamfered portion. The electronic component storage package according to claim 4 or 5, an electronic component mounted on the mounting portion, and a bonding material provided between the frame-shaped upper insulating layer and the lid. An electronic device comprising: the bonding material covering and joining a part of the chamfered portion and the convex portion. In the bonding material for bonding the insulating substrate and the lid, the fillet height provided in the chamfered portion and the convex portion of the lid body is higher than the fillet height in the side portion of the outer edge of the lid body. The electronic device according to claim 6, wherein the electronic device is large.

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