JP5725898B2 - Electronic component storage package - Google Patents

Description

  The present invention relates to an electronic component storage package for hermetically storing electronic components such as piezoelectric vibrators and semiconductor elements.

  2. Description of the Related Art Conventionally, as an electronic component storage package for mounting electronic components such as piezoelectric vibrators and semiconductor elements, generally, an electronic component storage portion provided on an insulating base made of a ceramic sintered body or the like is closed with a lid. The one that is hermetically sealed is used. Such an electronic component storage package surrounds the mounting portion laminated on the flat lower insulating layer having a flat lower insulating layer having a mounting portion for an electronic component such as a crystal resonator on the upper surface. An insulating base having a frame-like upper insulating layer, a frame-like metallization layer formed on the upper surface of the insulating base and serving as a bonding surface of the lid, and a wiring conductor formed from the mounting portion to the lower surface of the lower insulating layer, etc. It is basically configured by.

  Then, the electronic component is mounted on the mounting portion of the lower insulating layer, and each electrode of the electronic component is electrically connected to the wiring conductor via, for example, a conductive adhesive or a bump made of gold, and then the metallized layer A metal lid is joined to the upper surface via a brazing material based on a silver-copper eutectic composition, and an electronic component is hermetically sealed inside a container composed of an insulating base and a lid. It becomes a device. In addition, a cutout portion extending in the vertical direction is formed on the outer peripheral side surface of the lower insulating layer of the insulating base, and a part of the wiring conductor passes through the surface of the cutout portion to the lower surface of the lower insulating layer. Electrically derived.

  Furthermore, in the frame-like upper insulating layer, a through conductor that penetrates the upper insulating layer in the vertical direction is formed in order to electrically connect the metallized layer to which the lid is joined and a part of the wiring conductor. Has been. This is because the ground potential of the wiring conductor is stabilized by electrically connecting a part of the wiring conductor and the metallized layer (further, a metal lid).

  Moreover, since the width | variety in the planar view of an upper insulating layer is becoming narrow according to recent miniaturization, the package for electronic component accommodation has become difficult to form a penetration conductor in an upper insulating layer. When the through conductor is formed in the narrow upper insulating layer, for example, when the through conductor is formed by punching a mold or the like, a crack or the like is likely to be generated in the upper insulating layer due to stress accompanying the processing.

  For such a problem, a notch is formed on the inner surface of the upper insulating layer from the upper end to the lower end, and a conductor that electrically connects the metallized layer and the wiring conductor is filled in the notch. It has been proposed.

JP 2003-218265 A JP 2004-055985 A

  However, recent electronic component storage packages have been increasingly miniaturized. As a result, the following problems have arisen.

  That is, when the notch is formed on the inner side surface of the upper insulating layer and filled with the metallized conductor, the end of the metallized conductor protrudes above the metallized layer due to a difference in shrinkage during firing, etc. There is a possibility of hindering the bonding of the metallized layer. In response to this, for example, the depth of the notch that is arcuate in plan view (the length of the notch in the width direction of the upper insulating layer) is reduced to reduce the amount of the metallized conductor, and the notch A means of suppressing the protrusion of the metallized conductor to be filled can be considered. However, when the depth of the cutout is reduced in this way, that is, when the central angle of the arcuate cutout is reduced, the extension line on the inner surface of the upper insulating layer and the cutout The angle between is sharp. Along with this, there is a problem that the metallized conductor has an acute angle at the end of the notch part in plan view, and the thickness of the metallized conductor tends to be thin at this part, and the mechanical strength tends to decrease.

  When the mechanical strength of the metallized conductor is reduced at the end of the notch, when the lid is joined to the metallized layer on the upper surface of the upper insulating layer or when the electronic device is soldered to the external circuit board, etc. There is a possibility that the metallized conductor is easily peeled off from the inner surface of the notch due to the generated stress such as thermal stress.

  In addition, for the metallized conductor, a non-sintered flat ceramic sheet serving as an upper insulating layer is provided with a through-hole serving as a notch, and a punching process is performed after filling the through-hole with a conductive paste for the metallized conductor. In the case of forming the frame-like upper insulating layer (unfired) having a cut-out portion filled with the conductive paste on the inner surface, the end of the cut-out portion (the conductive paste There is a possibility that partial erosion (dropout) may occur in the conductor paste that becomes the metallized conductor at the thinned portion.

  If such metallized conductor peeling or erosion occurs, a gap is formed between the notch and the metallized conductor, making it difficult to ensure sufficient reliability of the hermetic seal, or stabilizing the ground potential. It can be difficult.

  The present invention has been devised in view of such problems, and its purpose is to connect the metallized conductor to the inner surface of the notch portion, particularly the notch portion, even if the electronic component storage package is downsized. An object of the present invention is to provide an electronic component storage package that can be strong and reliable at the end.

An electronic component storage package according to the present invention includes a lower insulating layer having a mounting portion for mounting an electronic component on an upper surface, and a wiring conductor deposited on the lower surface from the mounting portion to the lower surface. An electronic component storage package comprising a frame-like upper insulating layer laminated so as to surround the mounting portion and having a metallized layer deposited on the upper surface thereof, wherein the corner portion on the inner side surface of the upper insulating layer is In addition, a metallized conductor that electrically connects the wiring conductor and the metallized layer is filled in a notch formed from the upper end to the lower end of the arc-shaped inner side surface in a plan view . Turn metallized conductors in lack of the end, characterized in that the angle between the second side surface exposed to the first side surface joined to the inner surface of the notch in the mounting portion side is 85 to 120 ° And

  In the electronic component storage package of the present invention, in the above configuration, the radius of the inner surface of the notch portion is smaller than the radius of the corner portion formed in the arc shape of the upper insulating layer in plan view. It is characterized by.

According to the electronic component storage package of the present invention, the inner surface of the notch portion of the metallized conductor in a plan view of the metallized conductor filled in the notch and electrically connecting the wiring conductor and the metallized layer. Since the angle between the first side surface bonded to the second side surface and the second side surface exposed to the mounting portion side is 85 to 120 ° , the inner side surface of the upper insulating layer and the inner side surface of the notch portion are viewed in plan view. In the vicinity of the point of contact (the end of the notch), the thickness of the metallized conductor can be increased.

  Therefore, it is possible to secure the bonding strength of the metallized conductor (and the conductor paste that becomes the metallized conductor) to the inner surface of the notch at the end of the notch, and to prevent the metallized conductor from being peeled off or swollen. .

  According to the electronic component storage package of the present invention, in the above configuration, when the radius of the inner surface of the notch portion is smaller than the radius of the corner portion formed in the arc shape of the upper insulating layer in plan view. In this case, even if a slight misalignment occurs when the notch is formed by punching, the notch can be more reliably formed in the arc-shaped portion on the inner surface of the upper insulating layer.

(A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the X-X 'line | wire of (a). (A) is a principal part expansion top view which shows typically the principal part of the electronic component of a prior art, (b) is a principal part expansion which shows typically the principal part in an example of the electronic component storage package of this invention. It is a top view. It is a principal part enlarged top view which shows the principal part of the electronic component storage package shown in FIG. It is a principal part enlarged top view which shows the principal part of the electronic component storage package shown in FIG.

  The electronic component storage package of the present invention will be described with reference to the accompanying drawings. In the example of this embodiment, a case where a crystal resonator is accommodated as an electronic component will be described as an example.

FIG. 1A is a top view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. In FIG. 1, 101 is an insulating substrate, 102 is an electronic component, 103 is an electronic component mounting portion, 104 is a wiring conductor, 105 is a lower insulating layer, 106 is an upper insulating layer, 107 is a lid, and 108 is a lid. 109 is a notch, 110 is a metallized conductor, 111 is a castellation conductor formed on the side surface of the lower insulating layer 105, and 112 is an external connection conductor.

A wiring conductor 104, a metallized layer 108, a notch 109, and a metallized conductor 110 are formed on an insulating base 101 composed of a lower insulating layer 105 and an upper insulating layer 106, so that an electronic component storage package is basically configured. ing. In FIG. 1A, the lid 107 is omitted in order to make the state of the wiring conductor 104 and the metallized conductor 110 easier to see. The electronic component 102 is hermetically sealed in the electronic component storage package to form an electronic device.

The insulating base 101 is laminated on a flat lower insulating layer 105 having a mounting portion 103 for mounting the electronic component 102 at the center of the upper surface so that a frame-like upper insulating layer 106 surrounds the mounting portion 103. Is formed. A concave space for hermetically sealing the electronic component 102 is formed on the upper surface of the insulating base 101 by the upper surface of the lower insulating layer 105 and the inner surface of the upper insulating layer 106.

  The lower insulating layer 105 and the upper insulating layer 106 are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body, for example, a similar ceramic material. The lower insulating layer 105 and the upper insulating layer 106 are simultaneously fired to produce the insulating base 101.

The insulating base 101 has, for example, a rectangular shape with a side length of about 2.0 to 10 mm in a plan view and a thickness of about 0.3 to 2 mm, and has a concave space as described above on the upper surface. have. Note that the lower insulating layer 105 and the upper insulating layer 106 constituting the insulating base 101 may be configured by laminating a plurality of insulating layers each made of a ceramic material.

Here, the electronic device is a plurality of electronic components such as TCXO (Temperature Compensated Crystal Oscillator) (other electronic components such as a semiconductor element for temperature compensation in addition to the crystal resonator 102) (not shown) In order to secure a space for accommodating a plurality of electronic components 102 (in order to ensure the depth of the concave space), the upper insulation is used. The layer 106 may be composed of two or more insulating layers.

Such an insulating substrate 101 is suitable for raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide if the lower insulating layer 105 and the upper insulating layer 106 are both made of an aluminum oxide sintered body. A mixture of organic binder, solvent, plasticizer, etc. is added to make a slurry, and this is made into a sheet by a sheet forming method such as a doctor blade method or a roll calender method to obtain a plurality of ceramic green sheets. Next, some of the ceramic green sheets are appropriately punched into a frame shape, and the frame-shaped ceramic green sheet is positioned on a flat ceramic green sheet that is not formed into a frame shape. Thus, it is manufactured by stacking up and down and firing the laminate at a high temperature.

  The insulating base 101 is manufactured as a so-called multi-piece substrate (not shown) in which a plurality of substrate regions (not shown), each of which becomes such an insulating base 101, are arranged vertically and horizontally on a ceramic mother board, You may make it manufacture by the method of cut | disconnecting this in the boundary of a board | substrate area | region, and dividing | segmenting into a piece.

The mounting portion 103 of the lower insulating layer 105 has a quadrangular shape in accordance with the square plate-like electronic component 102. For example, a pair of wiring conductors 104 are formed at two adjacent corner portions. The exposed portion of the wiring conductor 104 is an electrode of a crystal resonator (an electronic component 102 mounted on the mounting portion 103 (
It functions as a connection conductor for connecting (not shown). Quartz resonators are generally rectangular in shape, and a pair of electrodes (not shown) for connection are formed at the corners of the main surface, and such electrodes can be connected easily and reliably. For this purpose, the wiring conductor 104 is formed at the corner of the mounting portion 103.

Each electrode of the electronic component 102 and the wiring conductor 104 are connected through a bonding material (not shown) such as a conductive adhesive. That is, the bonding material that has been attached to the wiring conductor 104 in advance by positioning the electronic component 102 on the mounting portion 103 so that the electrode formed at the corner of the main surface of the electronic component 102 faces the wiring conductor 104. Is heated and cured, the electrode of the electronic component 102 and the wiring conductor 104 are connected.

  The wiring conductor 104 is formed at the position as described above because an example in which a crystal resonator is used as the electronic component 102 is described in the example of this embodiment, but other electronic components (not shown) are also illustrated. 2) or a plurality of other electronic components, the position and shape may be changed according to the arrangement of the electrodes of the electronic component. Examples of such electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, resistors, and the like.

For example, the wiring conductor 104 is formed so as to be electrically led out from the mounting portion 103 or its periphery to the outer surface of the insulating base 101. The wiring conductor 104 functions as a conductive path for electrically connecting each electrode of the electronic component 102 mounted on the mounting portion 103 to an external electric circuit (not shown). In the example shown in FIG. 1, the wiring conductor 104 is composed of a castellation conductor 111 and an insulating base 101 (lower insulating layer 105) deposited in a groove (castellation) formed in the vertical direction on the side surface of the lower insulating layer 105. It is electrically led out to the lower surface of the insulating base 101 via an external connection conductor 112 formed on the lower surface. By connecting the external connection conductor 112 to an external electric circuit via solder or the like, the electrodes of the electronic component 102 are electrically connected to the external electric circuit via the wiring conductor 104, the castellation conductor 111 and the external connection conductor 112. Connected.

The wiring conductor 104, the castellation conductor 111, and the external connection conductor 112 are made of, for example, a metallized layer such as tungsten, molybdenum, manganese, copper, or silver. A paste of a metal material that becomes such a metallized layer is used as the lower insulating layer 105. A predetermined pattern is printed on the ceramic green sheet to be formed, and is formed by a method of simultaneous firing with the lower insulating layer 105.

The wiring conductor 104, the castellation conductor 111, and the external connection conductor 112 prevent oxidation corrosion, connect the wiring conductor 104 to the electrode of the electronic component 102, and connect the external connection conductor 112.
In order to make the connection with the external electric circuit easier and stronger, a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm are formed on the exposed surfaces. It is good that it is sequentially applied.

A metallized layer 108 is deposited on the upper surface of the insulating substrate 101 (upper insulating layer 106). The metallized layer 108 surrounds the mounting portion 103, and this metallized layer 108 becomes a region where the lid 107 is joined. Then, by mounting the electronic component 102 on the mounting portion 103 and connecting the electrode of the electronic component 102 to the wiring conductor 104 with a bonding material such as a conductive adhesive, the lid 107 is bonded to the upper surface of the metallized layer 108. The electronic component 102 is hermetically sealed in a container composed of the lid 107 and the insulating base 101 to form an electronic device (a crystal oscillator or the like).

The metallized layer 108 is made of, for example, a metal material similar to the wiring conductor 104 or the external connection conductor 112 (
Tungsten, molybdenum, manganese, copper, silver, etc.). For example, the metallized layer 108 is formed by printing a paste of a metal material such as tungsten on a ceramic green sheet serving as an insulating layer constituting the upper insulating layer 106 in a predetermined pattern and simultaneously firing the upper insulating layer 106. Formed by the method. As for the metallized layer 108, a plating layer may be sequentially deposited in the same manner as the wiring conductor 104 and the like.

The metallized layer 108 (and various plating layers deposited on the metallized layer 108 as necessary) functions as a metal member for joining the lid 107 to the insulating base 101 by a method such as seam welding or electron beam welding. . The lid 107 has, for example, a square plate shape, and is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy, or a ceramic material, and can be brazed or welded (for example, seam welding or electron beam welding). The outer peripheral portion of the lower surface is bonded to the metallized layer 108 via a brazing material by a bonding method. In addition, when the lid 107 is made of a ceramic material, the lid 107 is joined to the joint surface of the lid 107 by a method such as a metallizing method or a plating method so that the lid 107 can be joined to the metallized layer 108 by a brazing method or a welding method. A metal layer (not shown) is formed.

The metallized layer 108 is electrically connected to a part of the wiring conductor 104 (for example, one to which the grounding electrode of the electronic component 102 is connected). This is because, for example, the conductor area for grounding is widened so that the ground potential of the electronic component 102 is further stabilized. Metallized layer 108 and wiring conductor 104
Are electrically connected to each other via a metallized conductor 110 filled in a notch 109 on the inner side surface of the upper insulating layer 106.

In the electronic component storage package of the present invention, for example, as shown in FIG. 1A, the corner portion of the inner surface of the upper insulating layer 106 is an arcuate inner surface in plan view, and the lower end from the upper end of the inner surface. The metallized conductor 110 is formed in the notch 109 with a side surface (side surface exposed to the mounting portion 103 side) of the metallized conductor 110 in a plan view, and a notch 109.
The inner side surface of the upper insulating layer 106 and the inner side surface of the upper insulating layer 106 are filled in a letter shape.

  According to this configuration, the thickness of the metallized conductor 110 can be increased in the vicinity of the point where the inner surface of the upper insulating layer 106 and the inner surface of the notch 109 are in contact with each other (the end of the notch 109) in plan view. it can.

In this case, the upper surface of the rectangular frame-like upper insulating layer 106 is wider than the side portion (projected toward the mounting portion 103 than the side portion), and the inner side surface is cut into a corner portion formed in an arc shape. Since the notch 109 is formed, the upper surface of the upper insulating layer is compared with, for example, a conventional notch (not shown) formed in the side portion of the upper insulating layer (not shown). This is also advantageous in suppressing the narrowing of the width.

Further, for example, as shown in FIG. 2B, the upper portion as shown in FIG. 2B is compared with the case where the notch 109 ′ of the prior art is formed in the side portion of the upper insulating layer 106 ′ as shown in FIG. By forming the notch 109 in the arc-shaped portion of the insulating layer 106, the hatched A in FIG.
The thickness of the metallized conductor 110 can be increased by the portion. FIG. 2 is a drawing for explaining the effect of the electronic component storage package of the present invention. FIG. 2A is an enlarged top view of a main part schematically showing a main part of a conventional electronic component storage package, and FIG. 2B is a main part of an example of the electronic component storage package of the present invention. It is a principal part enlarged top view shown typically. In FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals (with “′” for the prior art).

Further, the corner portion of the upper insulating layer 106 has an arc shape in plan view, and this arc-shaped portion (that is, the portion in which the inner side surface of the upper insulating layer 106 is curved toward the mounting portion 103 side in plan view) has a notch 109. As a result, the angle between the inner side surface of the notch 109 and the inner side surface of the upper insulating layer 106 can be easily close to a right angle compared to the case where the inner side surface is linear. It is. Since the notch 109 is filled with the metallized conductor 110, the side surface of the notch 109 and the inner surface of the upper insulating layer 106 are formed in a letter shape in plan view at the end of the notch 109. A contact structure can be easily formed.

Therefore, the bonding strength of the metallized conductor 110 to the inner surface of the notch 109 can be made sufficiently strong, particularly at the end portion near the point in contact with the inner surface of the upper insulating layer 106. According to such an electronic component storage package, for example, when the lid 107 is bonded to the metallized layer 108 or when the electronic device is soldered to an external electric circuit (circuit board or the like) (not shown). It is possible to suppress the metallized conductor 110 from being peeled off from the inner surface of the notch 109 due to a stress such as a thermal stress generated in the process.

In order to form the corner portion of the inner side surface of the upper insulating layer 106 in an arc shape, when the ceramic green sheet is punched into a frame shape, the inner side surface of the punched portion becomes an arc shape, What is necessary is just to produce a metal mold | die.

  The notch 109 is formed by punching a ceramic green sheet that will be the upper insulating layer 106. For example, first, before forming the ceramic green sheet into a frame shape, a through hole such as a circular shape is formed across the virtual outer periphery of the portion of the ceramic green sheet to be punched, and then punched. What is necessary is just to process. By this punching process, the ceramic green sheet is formed into a frame shape, and at the same time, a notch 109 having an arcuate inner surface, which is a trace of a through hole, is formed on the inner surface.

The metallized conductor 110 can be formed in a similar manner (for example, by applying a metal material paste to a ceramic green sheet serving as the insulating base 101 and co-firing) using the same material as the wiring conductor 104 or the like.

The metallized conductor 110 is formed by a method in which a notch 109 is filled with a metal material paste and fired. Further, as described above, when the through hole to be the notch 109 is formed in the ceramic green sheet to be the upper insulating layer 106 before being punched, the metal material paste is filled into the through hole. It can also be formed by a simultaneous firing method. The paste of the metal material such as a columnar shape filled in the through hole is divided into two vertically by the punching process (a part remaining in the notch 109 and a part removed by the punching process), The portion remaining in the notch 109 becomes the metallized conductor 110 after firing. When filling the through hole that becomes the notch 109 with the metal material paste that becomes the metallized conductor 110, it is preferable to use a suction method or a press-fitting method. This is because the inner surface of the through-hole formed by punching is unevenly formed on the surface by scooping, and thus by using the suction method or the press-fitting method to fill it, the gap is unevenly metalized. This is because the metallized conductor 110 can be filled on the inner side surface of the notch 109 with increased bonding strength because the metal material paste that becomes the conductor 110 can be filled.

Also, in this case, since the ceramic green sheet having a through hole filled with a metal material paste that becomes the metallized conductor 110 is subjected to punching processing, the portion that is removed by punching and the inner surface of the through hole are in contact with each other (punching) A large stress is generated in the paste of the metal material in a portion that will later become an end portion of the notch 109). In contrast, since the metallized conductor 110 (metal material paste) is thick at the end of the notch 109 and has a high bonding strength to the inner surface of the notch 109 as described above, the metallized conductor 110 (metal It is possible to effectively suppress the occurrence of burrs in the material paste).

Therefore, the bonding strength of the metallized conductor 110 (and the paste of the metal material that becomes the metallized conductor 110) to the inner surface of the notch 109 can be secured even at the end of the notch 109, and the metallized conductor 110 is peeled off. It is possible to provide an electronic component storage package capable of suppressing stagnation.

  The notch 109 is preferably arcuate in view of workability during formation by the punching process or the like, and for facilitating filling with the metallized conductor 110 (metal material paste or the like). Similarly, the through hole that becomes the notch 109 is preferably circular.

Here, in a plan view, the side surface of the metallized conductor 110, the inner side surface of the notch 109, and the upper insulating layer 106
As shown in FIG. 3, the inner surface of the upper insulating layer 106 has an arcuate shape at the end of the notch 109 (A portion surrounded by a broken line) in a plan view. Corners formed), side surfaces of the metallized conductor 110 in the cutout portion 109 (both the first side surface 110a joined to the inner side surface of the cutout portion 109 and the second side surface 110b exposed to the mounting portion 103 side), It means that the shape formed by is a letter shape. The first side surface 110 a of the metallized conductor 110 corresponds to the inner side surface of the notch 109. FIG. 3 is an enlarged top view of the main part showing the main part of the electronic component storage package shown in FIG. In FIG. 3, the same parts as those in FIG. For ease of viewing, the metallized layer 108 is omitted and the metallized conductor 110 is hatched.

In other words, since the outer periphery of the metallized conductor 110 is in contact with the inner surface of the upper insulating layer 106 at the end of the notch 109, the first of the metallized conductor 110 is at the end of the notch 109.
It means that the angle between the side surface 110a and the second side surface 110b is a right angle or a shape close to a right angle.

In other words, for example, as shown in FIG. 4, when the notch 109 has an arc shape in a plan view, the virtual circle C <b> 2 that extends the inner surface of the arc-shaped upper insulating layer 106, and the metallized conductor 110. That is, tangent lines (without reference numerals) in contact with the virtual circles intersect with each other at the intersections with the virtual circle C1 extending the arc-shaped first side surface 110a. FIG. 4 is an enlarged top view of the main part showing the main part of the electronic component storage package shown in FIG. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. Further, the metallized layer 108 is omitted for easy viewing.

Specifically, in a plan view, angles (end portion angles) θ1 and θ2 between the first side surface 110a and the second side surface 110b of the metallized conductor 110 at the end portion of the notch 109 are 85 to 120 °. is there. In this case, the tolerances of the end angles θ1 and θ2 of the metallized conductor 110 are slightly wider on the obtuse angle side than on the acute angle side with respect to the right angle. From the viewpoint of securing the thickness of the metallized conductor 110 at the end of the notch 109, it is preferable that the end angle of the notch 109 is on the obtuse angle side.

Note that the end angle of the metallized conductor 110 is 120 ° or less as described above in consideration of securing the mechanical strength of the upper insulating layer 106 in the portion adjacent to the end portion of the notch 109 ( 85 ° or more) and you.

For example, as described above, the notch 109 has a circular through-hole formed in the ceramic green sheet serving as the upper insulating layer 106 in a plan view, and a portion corresponding to the mounting portion 103 is punched out of the ceramic green sheet. Since it is formed by being divided into two parts when it is removed at, it is easy to form the inner side surface in an arc shape in plan view.

When forming a through hole in the ceramic green sheet by punching using a mold, the diameter of the through hole is about 80 to 150 μm. The metallized conductor 110 filled with the notch 109 can be easily formed by filling the through hole with a metal material paste.

As a method of forming the metallized conductor 110, the above method is suitable. For example, as a method of forming the metallized conductor 110, before filling the paste of the metal material that becomes the metallized conductor 110, by punching the ceramic green sheet that becomes the upper insulating layer 106 so that the through hole is divided. A method is also conceivable in which the notch 109 is formed in advance, and then a metal material paste to be the metallized conductor 110 is filled in the opening of the notch 109. However, in the case of this method, a part of the paste of the metal material flows out from the opening of the notch 109 (for example, along the inner surface of the frame-shaped ceramic green sheet serving as the upper insulating layer), Since it is difficult to ensure the thickness of the metallized conductor 110, there is a possibility that the chipping is likely to occur at the end portion of the notch 109 (particularly the portion close to the metallized layer 108).

  Similarly to the wiring conductor 104 and the external connection conductor 112, the metallized conductor 110 filled in the notch 109 can be more effectively suppressed if it is covered with a plating layer such as nickel or gold. .

In the example shown in FIG. 4, the intersection of two imaginary extension lines (not labeled) in which two adjacent sides of the inner surface of the upper insulating layer 106 in plan view are extended to arcuate portions of the corners. The center of the virtual circle C1 (that is, the center of the arc-shaped cutout 109) is located at a position that is more biased toward the mounting portion 103 side. The position of the center of the virtual circle C1 is the virtual straight line L intersecting at an angle of 45 ° with any of these extension lines from the intersection of the virtual extension lines of the two inner side surfaces of the upper insulating layer 106. It can also be considered that the center of the virtual circle C1 (the center of the metallized conductor 110 filled in the arc-shaped notch 109) is moved to the mounting portion 103 side along.

Further, when the center of the arc-shaped notch 109 is moved to the mounting portion 103 side along the virtual straight line L in this way, the center of the notch 109 is obtained when the upper insulating layer 106 has a square frame shape. Can be regarded as being moved toward the center of the square mounting portion 103. When the upper insulating layer 106 has a rectangular frame shape, if the center of the notch 109 is moved toward the center of the rectangular mounting portion 103, the moving direction is biased toward the long side of the upper insulating layer 106, On the long side, the size of the notch 109 increases in the width direction of the upper surface of the upper insulating layer 106. For this reason, the width of the upper insulating layer 106 becomes narrow, and the sealing width near the corner portion on the long side becomes narrow. On the other hand, if the center of the notch 109 is moved along the imaginary straight line L intersecting at an angle of 45 ° as described above, the sealing width can be ensured regardless of the shape of the upper insulating layer 106. it can.

For example, by moving the center of the notch 109 as described above, the virtual circle C
1 at the end of the notch 109, where the intersection of 1 and the virtual circle C2 is located.
The angle at which the tangent lines of 1 and the virtual circle C2 intersect can be adjusted to about 90 °. In other words, by moving the center of the virtual circle C1, it is possible to realize a form in which the side surface of the metallized conductor 110 filled in the notch 109 and the inner surface of the upper insulating layer 106 are in a letter shape in plan view. .

  In the electronic component storage package of the present invention, in the above configuration, the radius of the inner surface of the notch 109 (the radius R1 of the virtual circle C1 in FIG. 4) is an arc shape of the upper insulating layer 106 in plan view. When the radius is smaller than the radius of the formed corner portion (radius R2 of the virtual circle C2 in FIG. 4), the following effects can be obtained.

That is, in this case, even if a positional shift occurs when the metallized conductor 110 is formed by punching, the notch 109 is more reliably formed in the arc-shaped portion on the inner surface of the upper insulating layer 106. be able to.

For example, as described above, a through-hole is first formed in the ceramic green sheet to be the upper insulating layer 106, and then the ceramic green sheet is punched into a frame shape, and at the same time, the through-hole is divided to form a frame-shaped ceramic. Even if the punching position shifts when the notch 109 is formed on the inner side surface of the green sheet, a problem due to the shift can be more effectively suppressed. That is, in this case, a metal material paste that becomes the metallized conductor 110 is filled in the through hole by using a suction method or a press-fitting method, and the through hole is punched into a ceramic green sheet so as to divide into two. To form a frame. At this time, even if a slight misalignment occurs in the punching process, since the radius R2 of the virtual circle C2 is larger than the radius R1 of the virtual circle C1, the arc-shaped portion on the inner surface of the upper insulating layer 106 The notch 109 having a smaller radius than the arcuate portion can be positioned more reliably. Therefore, in plan view, the side surface of the metallized conductor 110 filled in the notch 109 is shaped like a letter with the inner surface of the upper insulating layer 106 at the arc-shaped portion, and at the end of the notch 109. Also, the thickness of the metallized conductor 110 can be secured. Therefore, even if stress at the time of punching is applied, it is possible to more effectively suppress the occurrence of punching at both ends of the metallized conductor 110.

  Further, even when the center of the arc-shaped notch 109 is moved to the mounting portion 103 side as described above, the outer circumference of the metallized conductor 110 is surely secured by the arc-shaped portion on the inner surface of the upper insulating layer 106. It will be in contact with each other, and it has the effect of suppressing stagnation.

There are two intersections between the virtual circle C1 and the virtual circle C2, but the angle between the tangents of the two virtual circles C1 and C2 at the two intersections (similar to the end angles θ1 and θ2 of the metallized conductor 110). ) Are preferably at the same angle as each other.

This is because if the angle (intersection angle) between the tangents at the two intersections is different, at the time of punching, the one with the smaller intersection angle (end angles θ1 and θ2 of the metal material paste that becomes the metallized conductor 110 is small). This is because erosion tends to occur. As described above, the center of the virtual circle C1 on the virtual straight line L intersecting at an angle of 45 ° with any of these extension lines from the intersection of the virtual extension lines of the inner surface of the upper insulating layer 106. Is formed so that the angles θ1 and θ2 between the tangents of the two virtual circles C1 and C2 are the same angle.

In this electronic component storage package, the metallized layer 108 to which the lid 107 is bonded is used as a ground potential, and a part of the wiring conductor 104 is formed of the external connection conductor 112 formed on the lower surface of the wiring substrate 101. It is electrically connected to an external connection as a ground potential. In this case, the metallized conductor 110 can be electrically connected to the external connection conductor 112 for grounding via the wiring conductor 104 and the castellation conductor 111.

  Here, the effect of the electronic component storage package of the present invention will be described with a specific example.

A rectangular plate-like lower insulating layer 105 and a rectangular frame-like upper insulating layer 106 are made of an aluminum oxide sintered body, and an arc-shaped notch 109 having a radius of 100 μm is provided on the inside of the notch 109. The metallized conductor 110 was filled. As described above, the notch 109 has a through hole formed in the ceramic green sheet to be the upper insulating layer 106, and after filling the through hole with a paste of a metal material, the ceramic green sheet is used with a mold. It was formed by punching into a frame shape. Further, by this punching process, the corner portion of the upper insulating layer 106 was formed in an arc shape having a radius of 250 μm. Arc-shaped notch 109 filled with metallized conductor 110
The center of is set at the intersection of a virtual line extending the inner surface of the adjacent upper insulating layer 106 across a corner portion in plan view and a virtual straight line L shown in FIG. Angles θ1, θ2 of metallized conductor 110
Both were about 85 °.

Further, a metallized layer 108 for bonding the lid 107 was formed on the entire upper surface of the upper insulating layer 106. At this time, the metallized conductor 110 filled in the notch 109 has the same height as the upper surface of the upper insulating layer 106 as shown in the sectional view of FIG. Since the metallized layer 108 is applied, a sufficient area of the surface to which the lid 107 is joined can be secured.

  As a comparative example, an electronic component storage package (not shown) according to the prior art was produced. In the electronic component storage package of the comparative example, an arc-shaped notch is formed on the inner peripheral side of the rectangular frame-shaped upper insulating layer 106, and the end angle of the metallized conductor 110 filled in the notch is an acute angle. It was produced in the same manner as the electronic component storage package of the above specific example except that the angle was about 40 °. Hereinafter, the electronic component storage package of the conventional example is not illustrated, but for convenience of explanation, the same reference numerals are used for the same parts as the electronic component storage package of the specific example.

  Regarding the electronic component storage packages of these specific examples and comparative examples, after fabrication, first, the presence or absence of the metallized conductor 110 in the end portion of the notch 109 was confirmed by a stereomicroscope with a magnification of 20 times.

As a result, in the electronic component storage package of the specific example, none of the 100 metallized conductors 110 had sag. On the other hand, as for the electronic component storage package of the comparative example, in two out of 100, the metallized conductor 110 had a chipping.

Next, the lid body 107 was joined by seam welding to the metallized layer 108 of the electronic component storage package (100 pieces each) of the specific example and the comparative example. The exposed surface of the conductor such as the metallized layer 108 is preliminarily subjected to nickel plating with a thickness of about 8 to 20 μm and gold plating with a thickness of about 0.1 to 3.0 μm, and a metal lid 107 is provided on the surface. It joined by the seam welding through the brazing material.

The lid 107 was made of a square plate iron-nickel-cobalt alloy. Further, a brazing material for joining the lid 107 to the metallized layer 108 is a silver brazing based on a silver-copper eutectic composition (for example, 71-73 mass% silver-27-29 mass% copper, JIS name: BAg-8). In the case of BAg-8, the melting point is about 780 ° C. Using such a brazing material, the lid 107 was brazed to the metallized layer 108 by seam welding.

In recent years, there has been a demand for improvement in reliability (temperature cycle), the so-called environmental resistance performance, when temperature environmental stress is repeatedly and continuously applied, so metallization after temperature cycle testing to meet actual use conditions. The peeling state of the conductor 110 was confirmed. The temperature cycle test
The test sample was held in a thermostat controlled at −55 ° C. and 125 ° C. in an air atmosphere for 100 cycles by holding 15 minutes / 15 minutes as one cycle.

Whether or not the metallized conductor 110 was peeled off was confirmed for the electronic component storage packages of specific examples and comparative examples that had been subjected to the temperature cycle test. Presence or absence of peeling, whether or not the metalized conductor 110 is peeled from the inner surface of the notch 109 by polishing each of the electronic component storage package of the specific example and the comparative example after the temperature cycle test from the upper side, Judgment was made by checking with a metallurgical microscope. As a result, in the electronic component storage package of the specific example, none of the 100 metallized conductors 110 peeled off. On the other hand, in the electronic component storage package of the comparative example, peeling of the metallized conductor occurred at the end of the notch 109 in 3 out of 100 packages.

Based on the above results, the metallized conductor 110 in the electronic component storage package of the present invention.
The effect of suppressing erosion and peeling was specifically confirmed.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, the insulating base 101 has a rectangular shape in which the long side and the short side are different, but may be a square shape. Further, although the insulating base 101 is composed of two insulating layers (lower and upper insulating layers 105 and 106), it may be composed of three or more insulating layers in accordance with the accommodation form of the electronic component 102. Further, although the metallized conductor is formed at one place in the corner portion of the upper insulating layer 106, two or more places may be formed according to the number of the wiring conductors 104 for grounding. Further, in order to join the lid 107 to the upper surface of the metallized layer 108 by seam welding, a metal frame made of iron-nickel-cobalt alloy metal having a square frame shape may be joined by a brazing material.

101 ... Insulating substrate
102 ・ ・ ・ Electronic components
103 ・ ・ ・ Mounting part
104 ... Wiring conductor
105 ... Lower insulation layer
106 ・ ・ ・ Upper insulating layer
107 ... lid
108 ・ ・ ・ Metallized layer
109 ... notch
110 ・ ・ ・ Metallized conductor
111 ・ ・ ・ Castellation conductor
112 ・ ・ ・ External connection conductor

Claims (4)

A lower insulating layer having a mounting portion for mounting an electronic component on the upper surface and having a wiring conductor deposited from the mounting portion to the lower surface, and laminated on the lower insulating layer so as to surround the mounting portion; An electronic component storage package comprising a frame-like upper insulating layer having a metallized layer deposited on an upper surface thereof, wherein the corner portion of the inner side surface of the upper insulating layer has an arc shape in plan view The metallized conductor for electrically connecting the wiring conductor and the metallized layer is filled in the notch formed from the upper end to the lower end of the metallized conductor, and the metallized conductor at the end of the notch in plan view. The package for storing electronic components is characterized in that an angle between a first side surface joined to an inner side surface of the cutout portion and a second side surface exposed to the mounting portion side is 85 to 120 ° .   2. The electronic component according to claim 1, wherein, in a plan view, an end portion of the notch portion is located in a circularly curved portion of the corner portion of the inner side surface of the upper insulating layer. Storage package. 3. The electronic component according to claim 1, wherein a radius of the inner surface of the cutout portion is smaller than a radius of the corner portion formed in an arc shape of the upper insulating layer in a plan view. Storage package.   The center of the arc-shaped cutout portion is located at a position that is biased toward the mounting portion with respect to the intersection of two virtual extension lines extending from two adjacent sides of the inner side surface of the upper insulating layer in plan view. The electronic component storage package according to any one of claims 1 to 3, wherein the electronic component storage package is located.

Images