JP2017011025A - Electronic component storage package, electronic device and electronic module - Google Patents

Abstract

Even when an insulating substrate is reduced in size, when via conductors between frame-shaped insulating layers are connected to each other via an auxiliary conductor, a decrease in hermetic reliability due to a decrease in adhesion between insulating layers is suppressed. A first notch 107a is formed from the lower end to the upper end on the inner surface of the opening of the first frame-like insulating layer 104, and from the lower end to the upper end of the inner surface of the first notch 107a. A first conductor 107 filled with a conductor is formed. A part of the inner surface of the opening of the second frame-shaped insulating layer 105 has a stepped portion 117 protruding from the inner surface of the opening of the first frame-shaped insulating layer 104 in plan view. A second cutout portion 108a is formed on the inner side surface of the stepped portion 117 from the lower end to the upper end, and a second conductor 108 filled with a conductor is formed from the lower end to the upper end of the inner side surface of the second cutout portion 108a. Has been. The first conductor 107 and the second conductor 108 are connected by auxiliary conductors 109 and 110 formed on the upper surface of the second frame-shaped insulating layer 105. [Selection] Figure 1

Description

  The present invention relates to an electronic component storage package, an electronic device, and an electronic module for hermetically storing electronic components such as semiconductor elements.

  Conventionally, as an electronic component storage package for mounting an electronic component such as a semiconductor element or a piezoelectric vibration element, a concave mounting portion of an electronic component provided on an insulating substrate made of a ceramic sintered body is generally covered with a lid. The one that is hermetically sealed is used. Such an electronic component storage package includes a flat lower insulating layer having an electronic component mounting portion on the upper surface, and a frame-shaped upper insulating layer laminated around the mounting portion on the upper surface of the lower insulating layer. Basically, it has an insulating substrate, a frame-like metallized layer that is formed on the upper surface of the insulating substrate (upper insulating layer) and serves as a bonding surface of the lid, and a wiring conductor formed from the mounting portion to the lower surface of the lower insulating layer It is configured. An electronic component is mounted on the mounting portion, and after each electrode of the electronic component is electrically connected to the wiring conductor, a lid body such as metal is joined to the upper surface of the frame-like metallized layer via a brazing material, An electronic device is manufactured by hermetically sealing an electronic component inside a container composed of an insulating substrate and a lid.

  Via conductors may be formed in the vertical direction inside the upper insulating layer of the insulating substrate. In this case, the frame-like metallized layer is electrically connected to the wiring conductor via the via conductor. Thereby, for example, the stability of the ground and the shielding property with respect to the electronic component are enhanced. In order to accommodate a thick electronic component in the mounting portion, the upper insulating layer may be formed of a plurality of frame-shaped insulating layers. For example, a circular auxiliary conductor is formed on the lower side of the via conductor of the upper insulating layer and the upper side of the via conductor of the lower insulating layer in order to electrically connect the upper and lower via conductors satisfactorily. As a result, the connection region between the via conductors is increased, and the upper and lower via conductors can be electrically connected satisfactorily.

Japanese Patent Laid-Open No. 11-214944

  The electronic component storage package tends to be reduced in size, and accordingly, the width of the frame-like upper insulating layer tends to be narrow. When the width of the frame-shaped upper insulating layer is reduced, when a via conductor is formed inside the upper insulating layer, the distance from the outer peripheral portion of the auxiliary conductor connecting the via conductors to the inner side surface or the outer side surface of the upper insulating layer is increased. It becomes extremely small, and in the laminating process, there is a narrow portion at the close contact portion between the upper insulating layer and the lower insulating layer, the adhesiveness is reduced, delamination occurs in the upper insulating layer, and airtight reliability is improved. There was a possibility of decline.

An electronic component storage package according to one aspect of the present invention includes a lower insulating layer having a mounting portion for mounting an electronic component on an upper surface, and the upper insulating layer is stacked so as to surround the mounting portion. Electronic component storage package having a first frame-like insulating layer having an opening to which a body is joined, and a second frame-like insulating layer formed between the lower insulating layer and the first frame-like insulating layer A first cutout portion is formed on the inner side surface of the opening of the first frame-like insulating layer from the lower end to the upper end, and the conductor extends from the lower end to the upper end of the inner side surface of the first cutout portion. A step in which a part of the inner surface of the opening of the second frame-shaped insulating layer protrudes from the inner surface of the opening of the first frame-shaped insulating layer in a plan view is formed. A second cut from the lower end to the upper end on the inner surface of the stepped portion. A notch is formed, and a second conductor filled with a conductor is formed from the lower end to the upper end of the inner side surface of the second notch, and the first conductor and the second conductor are The two conductors are connected by an auxiliary conductor formed on the upper surface of the frame-like insulating layer.

  According to the electronic component storage package of one aspect of the present invention, a lower insulating layer having a mounting portion for mounting an electronic component on the upper surface, and the upper insulating layer is stacked on the lower insulating layer so as to surround the mounting portion. A first frame-like insulating layer having an opening to which a lid is bonded, and a second frame-like insulating layer formed between the lower insulating layer and the first frame-like insulating layer. The first cutout portion is formed on the inner side surface of the opening of the first frame-like insulating layer from the lower end to the upper end, and is filled with a conductor from the lower end to the upper end of the inner side surface of the first cutout portion. 1 conductor is formed, and a part of the inner surface of the opening of the second frame-shaped insulating layer has a stepped portion protruding from the inner surface of the opening of the first frame-shaped insulating layer in plan view; A second notch is formed on the inner surface of the step from the lower end to the upper end, and the second A second conductor filled with a conductor is formed from the lower end to the upper end of the inner surface of the notch, and the first conductor and the second conductor are auxiliary conductors formed on the upper surface of the second frame-like insulating layer. It is connected.

  Therefore, even if the width of the first frame-shaped insulating layer is narrow, the auxiliary conductor is extended to the exposed stepped portion side of the second frame-shaped insulating layer (that is, the side away from the outer periphery of the insulating substrate). The ratio of the auxiliary conductor for connecting the conductors to the width of the first frame-like insulating layer can be reduced. That is, the portion where the inner conductor is not interposed on the outer peripheral side of the first conductor of the first frame-like insulating layer can be made large. Therefore, it is possible to provide an electronic component storage package in which a decrease in hermetic reliability due to a decrease in adhesion between insulating layers is suppressed.

  Further, when the lid is joined to the frame-like metallized layer with the brazing material, the stepped portion becomes a brazing material reservoir, and the brazing material is suppressed from flowing into the mounting portion via the first conductor. Therefore, it is possible to provide a highly reliable electronic component storage package in which short circuit between the mounted electronic component and the brazing material is suppressed and there is no malfunction such as malfunction.

(A) is an upper surface perspective view which shows the electronic component storage package in embodiment of this invention, (b) is a cross-sectional perspective view in the X-X 'line | wire of (a). It is an expansion top perspective view which shows the principal part of Fig.1 (a). It is an expansion perspective view which shows the principal part of Fig.1 (a). It is an expansion perspective view which shows the principal part of the other example of the electronic component storage package in embodiment of this invention.

The electronic component storage package of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. The insulating substrate 101 includes a lower insulating layer 103, a first frame-shaped insulating layer 104, and a second frame-shaped insulating layer 105 that are stacked on each other.
The lower insulating layer 103 has a mounting portion 102 on the upper surface. A recessed portion is provided in the insulating substrate 101 by the lower insulating layer 103, the frame-shaped portion including the first frame-shaped insulating layer 104 and the second frame-shaped insulating layer 105.

The first frame-like insulating layer 104 which is the uppermost layer has a frame-like metallized layer 116 on the upper surface. A side conductor is disposed in the groove. The insulating substrate 101 has a connection conductor 114 and an external connection conductor 106 as a conductive path between the electronic component 113 mounted on the mounting portion 102 and an external electric circuit (not shown).
Is provided. In this example, a castellation 111 is provided at a corner portion of the insulating substrate 101.

Such an insulating substrate 101 is formed by arranging a plurality of wiring board regions to be packaged for individual electronic component storage on a mother board (not shown) to form a package assembly. In order to divide into individual pieces, the mother board is produced by being divided into individual pieces by dividing grooves formed at the boundary of each wiring board region. And it becomes an individual electronic component storage package.

In the electronic component storage package, a second frame-shaped insulating layer 105 first surrounds the mounting portion 102 on a flat lower insulating layer 103 having a mounting portion 102 for mounting the electronic component 113 in the center of the upper surface. Are laminated. Further, the first frame-shaped insulating layer 104 having an opening larger than the opening of the second frame-shaped insulating layer 105 is laminated on the second frame-shaped insulating layer 105, whereby the insulating substrate 101 is manufactured. Accordingly, a recess for hermetically sealing the electronic component 113 is formed on the upper surface of the insulating substrate 101 by the upper surface of the lower insulating layer 103 and the inner surface of the second frame-shaped insulating layer 105 and the first frame-shaped insulating layer 104. Is done. Further, the stepped portion 117 is formed so that a part of the inner surface of the opening of the second frame-shaped insulating layer 105 protrudes from the inner surface of the opening of the first frame-shaped insulating layer 104 in plan view.

The lower insulating layer 103, the first frame-shaped insulating layer 104, and the second frame-shaped insulating layer 105 are made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a glass-ceramic sintered body, or the like. Made of ceramic material. For example, the lower insulating layer 103 made of the same ceramic material, the first frame-shaped insulating layer 104, and the second frame-shaped insulating layer 105 are simultaneously fired to produce the mother board of the package assembly.

The insulating substrate 101 has, for example, a rectangular shape with a side length of about 1.6 to 10 mm and a thickness of about 0.3 to 2 mm in a plan view, and has a concave portion as described above on the upper surface. doing. Note that the lower insulating layer 103 constituting the insulating substrate 101 may be configured by stacking a plurality of insulating layers. Further, the frame-shaped portion including the first frame-shaped insulating layer 104 and the second frame-shaped insulating layer 105 may be configured by laminating three or more insulating layers.

Here, when the electronic device is such that a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) are accommodated in the recess, the plurality of electronic components are In order to form a stepped mounting portion 102 to be mounted, two frame-shaped portions are provided.
For example, as shown in FIG. 1, an insulating substrate 101 having a stepped portion 117 formed on one side on the short side is manufactured.

A mother substrate for manufacturing the insulating substrate 101 is produced, for example, as follows if each insulating layer is made of an aluminum oxide sintered body. First, a suitable organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to form a slurry, and this is, for example, a doctor blade method or a roll calender method. A plurality of ceramic green sheets are obtained by forming into a sheet by a sheet forming method. Next, some of the ceramic green sheets are appropriately punched into a frame shape, and the frame-shaped ceramic green sheet is positioned on a flat ceramic green sheet that is not formed into a frame shape. Laminate up and down. Thereafter, the mother board is manufactured by firing the laminate at a high temperature.

The mounting portion 102 has a quadrangular shape, for example, like the square plate-shaped electronic component 113. In the example of FIG. 1, four connection conductors 114 are formed at each corner. The connection conductor 114 functions as a conduction path for connecting an electrode (not shown) of an electronic component 113 such as a semiconductor element mounted on the mounting portion 102. The external shape of the electronic component 113 is generally quadrangular when viewed from above, and a plurality of electrodes (not shown) for connection are formed on portions of the main surface along the corner portion and the outer peripheral portion. The connection conductor 114 is formed at the corner portion of the mounting portion 102 so that the electrodes can be connected easily and reliably.

Each electrode of the electronic component 113 and the connection conductor 114 are connected through a bonding material 115 such as a conductive adhesive. That is, the bonding material that has been attached to the connection conductor 114 in advance by positioning the electronic component 113 on the mounting portion 102 so that the electrode formed at the corner of the main surface of the electronic component 113 faces the connection conductor 114. If 115 is heated and cured, the electrode of the electronic component 113 and the connection conductor 114 are connected.

  The connection conductor 114 is formed at the position as described above because an example in which a semiconductor element is used as the electronic component 113 is described in the example of this embodiment, but other electronic components (not shown) are used. ) Or a plurality of other electronic components, the position and shape may be changed according to the arrangement of the electrodes of the electronic component. Examples of such electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, capacitive elements, resistors, and the like.

For example, the connection conductor 114 is electrically derived from the mounting portion 102 or its periphery to the outer surface of the insulating substrate 101. The connection conductor 114 functions as a part of a conductive path for electrically connecting each electrode of the electronic component 113 mounted on the mounting unit 102 to an external electric circuit (not shown). In the example shown in FIG. 1, the connecting conductor 114 is electrically led out to the lower surface of the insulating substrate 101 from the mounting portion 102 via a via conductor (not shown) formed in the lower insulating layer 103, The external connection conductor 106 thus formed is electrically connected. The electrical connection between the connection conductor 114 and the external connection conductor 106 may be performed, for example, by a connection conductor including another conductor (not shown) in addition to the via conductor.

Further, a frame-shaped metallized layer 116 is formed on the upper surface of the first frame-shaped insulating layer 104 of the insulating substrate 101 so as to surround the mounting portion 102. The frame-shaped metallization layer 116 surrounds the mounting part 102,
A lid (not shown) or a metal frame (not shown) is joined to the frame-like metallized layer 116. Then, the electronic component 113 is mounted on the mounting portion 102, the electrodes of the electronic component 113 are connected to the connection conductor 114 with a bonding material 115 such as a conductive adhesive, and then the lid is bonded to the upper surface of the frame-like metallized layer 116. As a result, the electronic component 113 is hermetically sealed in the container composed of the lid and the insulating substrate 101 to form an electronic device. Alternatively, a structure in which a metal frame is brazed to the frame-like metallized layer 116 in advance and then a lid is joined to the metal frame is also possible.

The frame-like metallized layer 116 functions as a metal member for joining the lid to the insulating substrate 101 by a method such as seam welding or electron beam welding. The lid is, for example, a square plate and is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy or a ceramic material, and is connected by a brazing method or a welding method (for example, seam welding or electron beam welding). The outer peripheral portion of the lower surface is bonded to the frame-like metallized layer 116 by law. In addition, when the lid is made of a ceramic material, in order to be able to be joined to the frame-like metallized layer 116 by a brazing method or a welding method, a metallizing method, a plating method, etc. A metal layer (not shown) for bonding may be formed by a method.

Further, a first notch 107a is formed on the inner side surface of the first frame-like insulating layer 104, and a first conductor 107 filling the first notch 107a is formed. Further, the second frame-shaped insulating layer 105
A second cutout portion 108a is formed on the inner surface of the second conductor 108, and a second conductor 108 filling the second cutout portion 108a is formed. The first conductor 107 and the second conductor 108 are connected via the first auxiliary conductor 109 and the second auxiliary conductor 110. The second conductor 108 is connected to the external connection conductor 106 formed on the lower surface of the lower insulating layer 103 via the via conductor 112 formed in the lower insulating layer 103. That is, the frame-like metallized layer 116 is electrically connected to the external connection conductor 106 through these conductors. As a result, for example, the grounding (grounding) stability and shielding performance for the electronic component 113 are improved.

Then, the external connection conductor 106 of the individual electronic component storage package on which the electronic component 113 is mounted is connected to an external electric circuit via solder or the like, whereby the electrode of the electronic component 113 is connected to the connection conductor 114, It is electrically connected to an external electric circuit via a wiring conductor (not shown) formed in the lower insulating layer 103 and an external connection conductor 106.

The conductor portions such as the first conductor 107, the second conductor 108, the connection conductor 114, the frame-like metallized layer 116, and the external connection conductor 106 are made of metallization such as tungsten, molybdenum, manganese, copper, silver, or the like. Such a metal material paste (metal paste) to be metallized is printed in a predetermined pattern on a ceramic green sheet to be a mother substrate, and is formed by simultaneous firing with each ceramic green sheet.

The exposed parts of these conductor parts suppress oxidative corrosion and make connection between the connection conductor 114 and the electrode of the electronic component 113 and connection between the external connection conductor 106 and the external electric circuit easier and stronger. Therefore, a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm are preferably sequentially deposited on the exposed surfaces.

The electronic component storage package has a lower insulating layer 103 having a mounting portion 102 for mounting an electronic component 113 on the upper surface, and is laminated on the lower insulating layer 103 so as to surround the mounting portion 102, and a lid is bonded to the upper surface. And a second frame-shaped insulating layer 105 formed between the lower insulating layer 103 and the first frame-shaped insulating layer 104. First
A first notch 107a is formed on the inner surface of the opening of the frame-like insulating layer 104 from the lower end to the upper end, and is filled with a conductor from the lower end to the upper end of the inner surface of the first notch 107a. One conductor 107 is formed, and a part of the inner surface of the opening of the second frame-shaped insulating layer 105 has a stepped portion 117 protruding from the inner surface of the opening of the first frame-shaped insulating layer 104 in plan view. Step part 117
A second cutout 108a is formed on the inner surface of the second cutout from the lower end to the upper end, and a second conductor 108 filled with a conductor is formed from the lower end of the inner side of the second cutout 108a to the upper end. The first conductor 107 and the second conductor 108 are connected by auxiliary conductors 109 and 110 formed on the upper surface of the second frame-shaped insulating layer 105.

Because of such a structure, even if the electronic component storage package (insulating substrate 101) is downsized and the width of the first frame-shaped insulating layer 104 is narrow, the second frame-shaped insulating layer 105 is exposed. The auxiliary conductors 109 and 110 can be formed to extend to the stepped portion 117 side (that is, the side away from the outer periphery of the insulating substrate 101), and the conductors for the width of the first frame-like insulating layer 104 are connected to each other. The proportion of the auxiliary conductors 109 and 110 can be reduced. That is, the portion of the first frame-like insulating layer 104 where the inner conductor is not present on the outer peripheral side of the first conductor 107 can be made large. Therefore, it is possible to provide an electronic component storage package in which a decrease in hermetic reliability due to a decrease in adhesion between insulating layers is suppressed.

A first cutout portion 107a is provided on the inner side surface of the first frame-shaped insulating layer 104, and the first conductor 107 described above is provided in the first cutout portion 107a. A second notch 108a is provided on the inner surface of the second frame-shaped insulating layer 105, and the second conductor 108 described above is provided in the second notch 108a.
Is provided. The first conductor 107 and the second conductor 108 are made of, for example, the same metal material as that of the connection conductor 114 and are formed by the same method.

Further, the first cutout portion 107a and the second cutout portion 108a are formed, for example, before punching a ceramic green sheet to be the first frame-like insulating layer 104 and the second frame-like insulating layer 105 into a frame shape. It can be formed by providing a through hole so as to straddle the outer periphery of the part to be punched. When this ceramic green sheet is punched at the portion to be punched, the through hole is divided in the vertical direction, and the first cutout portion 107a and the second cutout portion 108a are formed on the inner surface of the frame-shaped ceramic green sheet. Is done. During the punching process, if the metallized paste that becomes the first conductor 107 and the second conductor 108 is filled in the through hole in advance, the metallized paste that becomes the first conductor 107 and the second conductor 108 is filled. First notch 107a
It is possible to form the second notch 108a.

Here, although the formation position of the first conductor 107 is not particularly limited, as shown in FIG. 1A, the formation position of the first conductor 107 is the inner surface of the first frame-like insulating layer 104 having a relatively large frame width. By providing at the corner portion, the portion of the first frame-like insulating layer 104 on the outer peripheral side of the first conductor 107 where the internal conductor is not interposed can be made larger. Therefore, a decrease in hermetic reliability due to a decrease in adhesion between insulating layers is further effectively suppressed.

Further, when the lid is joined to the frame-like metallized layer 116 with a brazing material (not shown), the stepped portion 117 becomes a brazing material reservoir, and the brazing material is placed on the mounting portion 102 side via the first conductor 107. Inflow is suppressed. Therefore, it is possible to provide a highly reliable electronic component storage package in which short circuit between the mounted electronic component 113 and the brazing material is suppressed and there is no malfunction such as malfunction.

Since the first conductor 107 is coated with a nickel plating layer or a gold plating layer on the exposed portion, the plating layer easily wets the brazing material, and when the lid is joined to the frame-like metallized layer 116 with the brazing material. Further, the brazing material is mounted on the mounting portion 102 through the portion of the first conductor 107 exposed on the inner surface of the first frame-like insulating layer 104.
Easy to flow to the side. However, since the stepped portion 117 is formed in this way, the stepped portion 117 serves as a brazing material reservoir, and the brazing material is suppressed from flowing into the mounting portion 102 via the first conductor 107.

Here, as shown in FIG. 1A, for example, the first conductor 107 formed on the inner surface of the first frame-shaped insulating layer 104 and the inner surface of the second frame-shaped insulating layer 105 are formed in a plan view. By shifting the position of the second conductor 108, even if the brazing material flows through the first conductor 107, the first conductor 107 and the second conductor 108 are displaced, and the brazing material flows into the mounting portion 102. Since the path becomes long, the auxiliary conductor 110 formed on the stepped portion 117 is likely to stay. Further, the position of the second conductor 108 with respect to the first conductor 107 is preferably provided on the short side of the insulating substrate 101 that does not easily affect the capacity of the electronic component 113 to be mounted on the mounting portion 102 even if the stepped portion 117 is formed. . With such a structure, a short circuit between the electronic component 113 and the brazing material is more effectively suppressed, while ensuring the accommodation of the electronic component 113 in the mounting portion 102, and there is no malfunction such as malfunction. A package for storing high electronic components can be provided.

In addition, the auxiliary conductors 109 and 110 are provided at positions offset from the first conductor 107 so as to be separated from the outer peripheral edge portion of the electronic component storage package in a plan view. With such a structure, even if the electronic component storage package is downsized and the width of the first frame-shaped insulating layer 104 is reduced, the first conductor 107 and the second conductor with respect to the width of the first frame-shaped insulating layer 104 are reduced. The area occupied by the auxiliary conductors 109 and 110 for connecting the conductor 108 can be further reduced. Therefore, the possibility of occurrence of poor adhesion between insulating layers can be further effectively reduced, and an electronic component storage package can be provided in which a decrease in hermetic reliability due to a decrease in adhesion between insulating layers is suppressed.

The configuration of the auxiliary conductors 109 and 110 will be described with reference to FIGS. FIG. 2 is an enlarged top perspective view of the main part showing the corner part of the electronic component storage package of the present invention. A first cutout portion 107a is provided on the inner side surface of the first frame-shaped insulating layer 104, and the first conductor 107 described above is provided in the first cutout portion 107a. A first auxiliary conductor 109 is formed on the lower surface of the first frame-like insulating layer 104 in contact with the lower end of the first conductor 107, and the first auxiliary conductor 109 is an outer peripheral edge portion (see FIG. In the first example, it is provided at a position biased with respect to the first conductor 107 so as to be separated from the outer peripheral corner portion of the insulating substrate 101. Thereby, the area | region in which the 1st auxiliary conductor 109 with respect to the width | variety of the 1st frame-shaped insulating layer 104 is not formed can be enlarged.

The second frame-shaped insulating layer 105 is provided with a second cutout portion 108a on the inner side surface, and the second conductor 108 described above is provided in the second cutout portion 108a. A second auxiliary conductor 110 is formed on the upper surface of the second frame-like insulating layer 105 in contact with the upper end of the second conductor 108, and the second auxiliary conductor 110 is also the outer peripheral edge portion of the electronic component storage package. It is provided at a position biased with respect to the first conductor 107 so as to be separated from the first conductor 107. The first auxiliary conductor 109 and the second auxiliary conductor 110 are the first conductor 107.
As with the second conductor 108, when the opening is formed, it is punched at the portion to be punched.

Then, a part of the first auxiliary conductor 109 and the second auxiliary conductor 110 are laminated in the vertical direction in plan view, so that the first conductor 107 and the second conductor 108 become the first auxiliary conductor 109 and the second auxiliary conductor 110. It is connected in the vertical direction via. In addition, a region where the first auxiliary conductor 109 is not formed with respect to the width of the first frame-like insulating layer 104 can be enlarged. A part of the second auxiliary conductor 110 not stacked with the first auxiliary conductor 109 in plan view is exposed on the stepped portion 117 and acts as a conduction path connecting the first conductor 107 and the second conductor 108.

Note that the shapes of the first auxiliary conductor 109 and the second auxiliary conductor 110 can be appropriately changed according to the size and shape of the first conductor 107 and the second conductor 108 and the formation position. For example, the first conductor 107
When the distance between the first auxiliary conductor 109 and the second conductor 108 is short, the area of the first auxiliary conductor 109 and the second auxiliary conductor 110 may be small. Further, as shown in FIGS. 1 to 3, the first conductor 107 and the second conductor 108 overlap so that the second conductor 108 overlaps the outer peripheral edge of the electronic component storage package as shown in FIGS. In the case where the second auxiliary conductor 110 is formed on the stepped portion 117, the distance between the first conductor 107 and the second conductor 108 becomes even shorter when the second auxiliary conductor 110 is formed on the stepped portion 117. The area of the auxiliary conductor 109 and the second auxiliary conductor 110 can be further reduced. Further, when the formation positions of the first conductor 107 and the second conductor 108 are formed on the straight portions of the long side and the short side of the insulating substrate 101, the shape of the first conductor 107 and the second conductor 108 is set so as to be offset from the first conductor 107 May be formed in a half-moon shape when viewed from above.

  Further, the first conductor 107 and the second conductor 108 are provided at positions that do not overlap with each other in a plan view. Due to such a structure, the first conductor 107 and the second conductor 108 do not easily protrude to the upper surface after firing, and the pushing-up stress is difficult to be applied in the upper surface direction. In other words, when the ceramic green sheet laminate that is to be the insulating substrate 101 is fired, the first frame-like insulating layer 104 has the One conductor 107 may protrude in the upper surface direction. In the second frame-shaped insulating layer 105, the second conductor 108 may protrude in the upper surface direction.

However, even in such a state, if the first conductor 107 and the second conductor 108 are provided at a position where they do not overlap with each other in a plan view, the upward stress in the first frame-shaped insulating layer 104 is increased. It only stays within the thickness range. Further, the stress to be pushed up in the second frame-shaped insulating layer 105 only acts within the range of the thickness of the second frame-shaped insulating layer 105. That is, the stress that the first conductor 107 and the second conductor 108 push up after firing is less likely to be applied in the upper surface direction, and the first conductor 107 is applied to the frame-like metallized layer 116 formed on the upper surface of the first frame-like insulating layer 104. Protrusion can be suppressed. Therefore, it is possible to provide an electronic component storage package excellent in airtight reliability in which deterioration of flatness of the frame-like metallized layer 116 is suppressed and bonding property with the lid can be satisfactorily performed.

In this way, in order to form the first conductor 107 and the second conductor 108 at a position where they do not overlap with each other in plan perspective, a structure as shown in FIG. 4 may be used, for example. In the first frame-like insulating layer 104, the first conductor 107 is formed at the corner portion of the insulating substrate 101. The first conductor 107 has a semi-via shape, and the first conductor 107 is exposed on the inner surface of the first frame-shaped insulating layer 104. In addition, the second frame-shaped insulating layer 105 is formed so that a stepped portion 117 is formed from the short side of the insulating substrate 101 to a part of the long side. The second conductor 108 is formed from the short side of the stepped portion 117 to a part of the long side. The second conductor 108 also has a semi-via shape, and the second conductor 108 is exposed on the inner surface of the second frame-shaped insulating layer 105.

Then, the first conductor 107 and the second conductor 108 may be formed at a position where they do not overlap with each other in a plan view. At this time, the first conductor 107 and the second conductor 108 include the first auxiliary conductor 109 formed in a region hidden by the first frame-shaped insulating layer 104, the upper surface of the stepped portion 117, and the first frame-shaped insulating layer 104. It is electrically connected via a second auxiliary conductor 110 formed in a hidden area. Note that the first auxiliary conductor 109 and the second auxiliary conductor 110 are provided at positions where a part thereof overlaps in a plan view, and thereby the first conductor 107 and the second conductor 108 are electrically connected to each other well. It becomes possible to do.

Here, as described above, the first conductor 107 and the second conductor 108 are formed in a semi-via shape, and the first conductor 107 and the second conductor 108 are the inner surfaces of the first frame-shaped insulating layer 104 and the second frame-shaped insulating layer 105. By adopting a structure that is exposed to the surface, there are the following effects. That is, even if the first conductor 107 and the second conductor 108 protrude due to the difference in contraction between the ceramic and the metallization of the first conductor 107 and the second conductor 108, the first conductor 107 and the second conductor 108 are not mounted on the mounting portion. The protrusion protrudes toward the 102 side (horizontal direction), and stress due to the protrusion can be released to the mounting portion 102 side (horizontal direction). Therefore, the first
The stress that the conductor 107 and the second conductor 108 push up after firing is in the direction of the upper surface (the frame-like metallized layer 116 side)
An electronic component with excellent hermetic reliability in which deterioration of the flatness of the frame-like metallized layer 116 is further effectively suppressed and the bonding property with the lid can be satisfactorily suppressed. A storage package can be provided.

The second conductor 108 is provided at a position overlapping the virtual outer periphery of the first conductor 107 in plan perspective. Due to such a structure, the first conductor 107 and the second conductor 108 can be arranged very close to each other in a plan view. That is, when the first conductor 107 and the second conductor 108 are connected, an increase in conduction resistance is suppressed. Therefore, the frame-like metallized layer 116 is well electrically connected to the external connection conductor 106 via the first conductor 107 and the second conductor 108. As a result, it is possible to provide an electronic component storage package in which the stability (grounding) of the electronic component 113 and the shielding performance are improved.

As described above, the structure in which the second conductor 108 is provided at a position where it overlaps the virtual outer periphery of the first conductor 107 in a plan view may be a structure as shown in FIG. 2, for example. In the first frame-like insulating layer 104, the first conductor 107 is formed at the corner portion of the insulating substrate 101. The first conductor 107 has a semi-via shape, and the first conductor 107 is exposed on the inner surface of the first frame-shaped insulating layer 104. In addition, the second frame-shaped insulating layer 105 is formed so that a stepped portion 117 is formed from the short side of the insulating substrate 101 to a part of the long side. The second conductor 108 is formed from the short side of the stepped portion 117 to a part of the long side. The second conductor 108 also has a semi-via shape, and the second conductor 108 is exposed on the inner surface of the second frame-shaped insulating layer 105. Then, the second conductor 108 may be formed at a position that overlaps with the virtual outer peripheral portion of the first conductor 107 in plan perspective.

In the case of FIG. 2, the second conductor 108 overlaps a part of the virtual outer periphery of the first conductor 107 in a plan view, and the first frame-shaped insulating layer 104 and the second frame-shaped insulating layer 105 are stacked on the first surface. 1 conductor 107
A part of the second conductor 108 overlaps with a part of the second conductor 108. The overlapping region in the plane perspective is a very small amount of the frame-like metallized layer 116 in the plane perspective, and the first conductor 107 formed in the first frame-like insulating layer 104 is subjected to the stress that pushes up in the second frame-like insulating layer 105. Therefore, the flatness of the frame-like metallized layer 116 is easily ensured.

In addition, since a region is formed in which a part of the first conductor 107 and a part of the second conductor 108 overlap each other in a plan view, the first conductor 107 and the second conductor 108 are combined with the first auxiliary conductor in addition to the effects described above. 109, second
Since there is not only the auxiliary conductor 110 but also the overlapping region in the plane perspective, there is an effect that the conduction resistance is further effectively suppressed from increasing.

The electronic device includes the electronic component storage package (insulating substrate 101) described above and the electronic component 113 mounted on the electronic component storage package. Because of such a structure, even if the electronic component storage package (insulating substrate 101) is downsized and the width of the first frame-shaped insulating layer 104 is narrow, the second frame-shaped insulating layer 105 is exposed. The auxiliary conductors 109 and 110 can be formed to extend to the stepped portion 117 side (that is, the side away from the outer periphery of the insulating substrate 101), and the conductors for the width of the first frame-like insulating layer 104 are connected to each other. The proportion of the auxiliary conductors 109 and 110 can be reduced. Therefore, a portion where the inner conductor is not present on the outer peripheral side of the first conductor 107 of the first frame-like insulating layer 104 can be made large, and a decrease in hermetic reliability due to a decrease in adhesion between the insulating layers is suppressed. Can be realized.

Further, since the stepped portion 117 is formed in the mounting portion 102, the stepped portion 117 becomes a reservoir portion for the brazing material, and the brazing material passes through the first conductor 107 and the second conductor 108 to the mounting portion 102 side. Inflow is suppressed. Therefore, it is possible to realize a highly reliable electronic device in which a short circuit between the electronic component 113 and the brazing material is more effectively suppressed and there is no malfunction such as malfunction.

Further, the stress that the first conductor 107 and the second conductor 108 formed on the insulating substrate 101 push up after firing becomes difficult to be applied in the upper surface direction, and the frame-shaped metallized layer 116 formed on the upper surface of the first frame-shaped insulating layer 104. Protrusion of the first conductor 107 into the can be suppressed. Therefore, it is possible to realize an electronic device with excellent airtight reliability in which deterioration of the flatness of the frame-like metallized layer 116 is suppressed and the bonding property with the lid can be satisfactorily performed.

In addition, the first conductor 107 and the second conductor 108 formed on the insulating substrate 101 can be arranged very close to each other in plan view, and when the first conductor 107 and the second conductor 108 are connected, the conduction resistance Is suppressed from increasing. Therefore, since the frame-like metallized layer 116 is well electrically connected to the external connection conductor 106 via the first conductor 107 and the second conductor 108, the stability of the ground for the electronic component 113 and the shielding performance are improved. An electronic device can be realized.

The electronic module includes the electronic device described above and a module substrate 118 to which the electronic device is connected via a bonding material 119. With such a structure, it is possible to realize an electronic module that can contribute to the reduction in size and thickness of an electronic device using a smaller electronic device.

In addition, since the electronic component storage package constituting the electronic device is prevented from being deteriorated in airtight reliability as described above, an electronic module having excellent operational reliability can be realized. Then, the increase in the conduction resistance can be suppressed, and the frame-like metallized layer 116 can be satisfactorily connected to the external connection conductor 106 via the first conductor 107 and the second conductor 108. That is, a lid made of metal or the like that is mechanically and electrically joined to the frame-like metallized layer 116 by a joining material such as a brazing material covers the upper surface of the electronic component storage package.

Therefore, the electronic component 113 housed in the mounting part 102 has a structure that electromagnetically shields it satisfactorily, so that the ground stability and shielding performance against the electronic component 113 are improved, and noise from the external environment is shielded. An electronic module with excellent operational reliability can be realized.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, the shape of the insulating substrate 101 constituting the electronic component storage package is a rectangular shape having different long sides and short sides, but may be a square shape. Further, the insulating substrate 101 is composed of three insulating layers (a total of three layers including one lower insulating layer 103, one first frame-shaped insulating layer 104, and one second frame-shaped insulating layer 105). However, it may be composed of four or more insulating layers in accordance with the accommodation form of the electronic component 113. Also,
The first conductor 107 and the second conductor 108 are formed at one place in the corner portion of the mounting portion 102. However, in order to adjust the mounting position and conduction resistance of the electronic component, other places such as the center portion of the side at two or more locations. You may form in. Further, in order to join the lid to the upper surface of the frame-like metallized layer 116 by seam welding, a metal frame (not shown) such as a square-frame iron-nickel-cobalt alloy may be joined.

101 ・ ・ ・ Insulating substrate
102 ・ ・ ・ Mounting part
103 ... lower insulation layer
104 ... 1st frame-shaped insulating layer
105 ... 2nd frame-shaped insulating layer
106 ・ ・ ・ External connection conductor
107 ... 1st conductor
107a ... 1st notch
108 ... Second conductor
108a ... 2nd notch
109 ... 1st auxiliary conductor
110 ... Second auxiliary conductor
111 ・ ・ ・ Castellation
112 ・ ・ ・ via conductor
113 ・ ・ ・ Electronic components
114 ・ ・ ・ Connection conductor
115,119 ・ ・ ・ Joint material
116 ・ ・ ・ Frame metallization layer
117 ... Step
118 ・ ・ ・ Substrate for module

Claims (6)

A first insulating frame having a lower insulating layer having a mounting portion for mounting an electronic component on the upper surface, and an opening laminated on the lower insulating layer so as to surround the mounting portion and to which a lid is joined. An electronic component storage package comprising: a layer; and a second frame-shaped insulating layer formed between the lower insulating layer and the first frame-shaped insulating layer,
A first cutout is formed from the lower end to the upper end on the inner side surface of the opening of the first frame-like insulating layer, and is filled with a conductor from the lower end to the upper end of the inner side surface of the first cutout portion. A first conductor is formed;
A part of the inner surface of the opening of the second frame-shaped insulating layer has a stepped portion protruding from the inner surface of the opening of the first frame-shaped insulating layer in plan view, and the inner surface of the stepped portion In addition, a second notch is formed from the lower end to the upper end,
A second conductor filled with a conductor is formed from the lower end to the upper end of the inner surface of the second notch,
The electronic component storage package, wherein the first conductor and the second conductor are connected by an auxiliary conductor formed on an upper surface of the second frame-like insulating layer. The said auxiliary conductor is provided in the position biased with respect to the said 1st conductor so that it may space apart from the outer periphery part of the said electronic component storage package in planar view. Electronic component storage package. 3. The electronic component storage package according to claim 1, wherein the first conductor and the second conductor are provided at positions that do not overlap with each other in a plan view. 4. The electronic component storage package according to claim 1, wherein the second conductor is provided at a position overlapping with a virtual outer peripheral portion of the first conductor when seen in a plan view. 5. 5. An electronic apparatus comprising: the electronic component storage package according to claim 1; and an electronic component mounted on the electronic component storage package. 6. An electronic module comprising: the electronic device according to claim 5; and a module substrate to which the electronic device is connected.

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