JP6556004B2 - Electronic component storage package, electronic device and electronic module - Google Patents

Description

  The present invention relates to an electronic component storage package, an electronic device, and an electronic module for hermetically storing an electronic component such as a piezoelectric vibrator or a semiconductor element.

  2. Description of the Related Art Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibrator or a semiconductor element, generally, an electronic component storage portion provided on an insulating substrate made of a ceramic sintered body or the like is closed with a lid. The one that is hermetically sealed is used. A wiring board to be such an electronic component storage package has a flat lower insulating layer having an electronic component mounting portion on the upper surface, and a frame-shaped upper portion laminated around the mounting portion on the upper insulating layer. An insulating substrate having an insulating layer, a frame-like metallized layer that is a bonding surface of the lid, formed on the upper surface of the insulating substrate (upper insulating layer), and wiring formed from the mounting portion to the lower surface of the lower insulating layer, etc. It is basically composed of a conductor.

  Using this electronic component storage package, after the electronic component is mounted on the mounting portion and each electrode of the electronic component is electrically connected to the wiring conductor, a metal lid or the like is formed on the upper surface of the frame-like metallized layer. The electronic device is manufactured by sealing the electronic components in a container composed of a wiring board and a lid body and airtightly sealed through a brazing material or the like.

  In order to prevent oxidative corrosion on the wiring conductor and to improve the electrical connection between the wiring conductor and each electrode of the electronic component, the exposed surface is plated with nickel or gold. The film is deposited by electroplating.

  The electronic component storage package is manufactured from a multi-piece mother board in which a plurality of wiring board regions are arranged. Further, in order to improve the adherence of the plating film, for example, the mother substrate has an upper insulating layer and a lower insulating layer. Then, a continuous through hole is formed from the upper insulating layer to the lower insulating layer across the outer periphery of the wiring board region, and an inner conductor is formed inside the through hole so that each wiring board is electrically connected continuously. There is a case where a so-called castellation structure formed so as to be connected to the head is used (for example, see Patent Document 1).

  With such a structure, the wiring conductors formed on the respective wiring boards are integrally connected via the inner conductors in the through holes, and the plating film is applied to the wiring conductors of the insulating board of the entire mother board. It becomes possible to deposit efficiently. Such a mother board is divided into individual pieces, and an electronic component storage package (wiring board) is manufactured. At this time, the inner surface conductor in the through hole is also divided to form a notch that becomes castellation on the side surface or corner portion of the wiring board and the side conductor (the inner surface conductor is divided and exposed on the side surface of the wiring board). Is done.

  In recent years, electronic component storage packages have been increasingly miniaturized. As a result, the following problems have arisen. That is, when the electronic device is mounted on the external circuit board, the distance between the wiring conductor on the external circuit board and the side conductor formed on the inner side surface of the notch is small. For example, a bonding material such as brazing material or solder May crawl up into the notch, or sealing material such as brazing filler metal for sealing the electronic component storage package with the lid may flow into the notch, causing short circuit between wiring conductors with different potentials was there. In order to suppress such a short circuit, for example, an insulating film made of ceramics or the like has been formed on a part of the wiring conductor in order to prevent the bonding material from spreading.

JP 2003-198310 A

  However, the size of the notch is very small due to the downsizing of the electronic component storage package. For example, when a large number of electronic component storage packages are obtained from a mother board made of a ceramic material or the like, the notch It is difficult to provide an insulating film such as a ceramic so that the small through-holes that are to be formed are not blocked or the openings are not narrowed.

  Also, if the through hole is blocked or the opening becomes narrow, for example, when plating is performed, it is difficult to circulate the plating solution to the through hole, and the adherence of the plating film to the exposed side conductor is deteriorated. As a result, the solder wettability and corrosion resistance of the side conductors may be reduced.

The electronic component storage package according to one aspect of the present invention includes an upper insulating layer and a lower insulating layer, and includes a first main surface on the upper insulating layer side including a mounting portion for mounting the electronic component. And an insulating substrate having a second main surface on the lower insulating layer side, wherein a first notch is provided at an outer edge of the insulating substrate, and the first notch is buried away from the second main surface. The embedded conductor is provided,
At least a part of the embedded conductor is covered with an insulating film, and the embedded conductor is provided so that the thickness gradually increases from the second main surface side to the first main surface side, The insulating film extends to at least a part of the buried conductor on the second main surface side .

  An electronic device according to one aspect of the present invention includes the electronic component storage package described above and an electronic component mounted on the electronic component storage package.

  An electronic module according to one aspect of the present invention includes the electronic device described above and a module substrate to which the electronic device is connected.

According to the electronic component storage package of one aspect of the present invention, the first main component on the upper insulating layer side, which includes the upper insulating layer and the lower insulating layer, and includes the mounting portion for mounting the electronic component. And an insulating substrate having a second main surface on the lower insulating layer side, the first notch is provided at the outer edge of the insulating substrate, and the embedded conductor is spaced apart from the second main surface in the first notch. Provided, at least a part of the embedded conductor is covered with an insulating film, and the embedded conductor is provided so that the thickness gradually increases from the second main surface side to the first main surface side. Since the insulating film extends to at least a part of the second main surface side of the embedded conductor, even if the electronic component storage package is downsized, for example, the electronic component storage package is made of a ceramic material or the like. If a large number is obtained from the mother board An insulating film can be provided so as not to block the through hole, and when mounting an electronic device including an electronic component storage package on a module substrate, a bonding material such as a brazing material or solder crawls up into the notch, It is possible to suppress a short circuit between wiring conductors having different potentials due to a sealing material such as a brazing material for sealing the electronic component storage package with a lid flowing in the notch. .

  Moreover, according to the electronic device of one aspect of the present invention, by using the electronic component storage package, a highly reliable electronic device in which a short circuit between a mounted electronic component and a bonding material such as solder is suppressed. Equipment can be provided.

  In addition, according to the electronic module of one aspect of the present invention, by using the above-described electronic device, the connection reliability to the electronic component accommodated in the mounting portion or the stability of the ground is improved, thereby improving the operation reliability. An excellent electronic module can be realized.

(A) is a top view which shows the electronic component storage package etc. of embodiment of this invention, (b) is sectional drawing in the X-X 'line | wire of (a). It is an expansion perspective view which shows the corner part of the package for electronic component accommodation in FIG. It is an expansion perspective view in the corner part which shows the other example of the electronic component storage package of embodiment of this invention.

An electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a top view showing an example of an embodiment of an electronic component storage package 1 of the present invention, and FIG. 1B is a cross-sectional view taken along line XX ′ of FIG. . 101 is an insulating substrate, 102 is a first main surface, 103 is a second main surface, 104 is a mounting portion, 105 is an upper insulating layer, 106 is a lower insulating layer, 107 is an external connection conductor, 108 is a first notch, 109 Is an embedded conductor, 110 is an electronic component, 111 is a wiring conductor, 112 is a frame-like metallized layer, 113 is a bonding material such as a conductive resin, 114 is an insulating film, and 115 is a second notch.

The insulating substrate 101 included in the electronic component storage package (wiring substrate) 1 has a rectangular shape, and includes a lower insulating layer 106 serving as a base and an upper insulating layer 105 serving as a frame. A mounting portion 104 is provided on the first main surface 102 (upper surface) of the upper insulating layer 105, and a concave mounting portion 104 is provided on the insulating substrate 101 by the lower insulating layer 106 and the frame portion of the upper insulating layer 105. ing. The central portion of the upper insulating layer 105 serving as a frame portion is opened, and a frame-like metallized layer 112 is formed on the first main surface 102. A first notch 108 is formed at each corner of the upper insulating layer 105.

In addition, the lower insulating layer 106 serving as a base is provided with a mounting portion 104 on which an electronic component 110 is placed. A second notch 115 is formed in each corner portion of the lower insulating layer 106.

The insulating substrate 101 is provided with a wiring conductor 111, an external connection conductor 107, and the like as conductive paths between the electronic component 110 mounted on the mounting portion 104 and an external electric circuit (not shown). In this example, a conductor layer (not shown) and a through conductor (not shown) are provided in the inner layer of the insulating substrate 101, and function as a conductive path like other wiring conductors. The insulating substrate 101 is made of a large number of mother boards (not shown), and the mother board divided into individual pieces becomes individual wiring boards and the electronic component housing package 1. Become.

The electronic component storage package 1 is configured such that a frame-like upper insulating layer 105 surrounds the mounting portion 104 on a flat lower insulating layer 106 having a mounting portion 104 for mounting the electronic component 110 at the center of the upper surface. Insulating substrate 101 is laminated. A concave mounting portion 104 for hermetically sealing the electronic component 110 is formed on the upper surface of the insulating substrate 101 by the upper surface of the lower insulating layer 106 and the inner surface of the upper insulating layer 105.

  The lower insulating layer 106 and the upper insulating layer 105 are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. For example, the lower insulating layer 106 and the upper insulating layer 105 made of the same ceramic material are simultaneously fired to manufacture the insulating substrate 101 of the electronic component storage package 1.

The insulating substrate 101 is, for example, a rectangular shape with a side length of about 1.6 to 10 mm and a thickness of about 0.3 to 2 mm in plan view, and has a concave mounting portion as described above on the upper surface. 104. Note that the lower insulating layer 106 and the upper insulating layer 105 constituting the insulating substrate 101 may each be formed by stacking a plurality of insulating layers.

When the electronic device is such that a plurality of electronic components (not shown) such as TCXO (Temperature Compensated Crystal Oscillator) are accommodated in the mounting unit 104, the plurality of electronic components are mounted. In order to form a stepped mounting portion (not shown), the upper insulating layer 105 may be composed of two or more insulating layers.

For example, when the lower insulating layer 106 and the upper insulating layer 105 are both made of an aluminum oxide sintered body, the mother substrate on which the insulating substrates 101 included in the wiring substrate are arranged is manufactured as follows. First, a suitable organic binder, a solvent, a plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide to form a slurry, which is, for example, a doctor blade method or a roll calender method. A plurality of ceramic green sheets are obtained by forming a sheet by the sheet forming method. Next, some ceramic green sheets are appropriately punched and formed into a frame shape, and a frame-shaped ceramic green sheet (upper part) is formed on a flat ceramic green sheet (which becomes the lower insulating layer 106). The layers are stacked so that the insulating layer 105 is located. after that,
By firing the laminated body at a high temperature, such a mother substrate is manufactured.

The mounting portion 104 has a quadrangular shape in accordance with, for example, a square plate-shaped electronic component 110. In the example shown in FIG. 1, a pair of wiring conductors 111 are formed in the vicinity of two adjacent corner portions in the mounting portion 104. The wiring conductor 111 functions as a connection conductor for connecting an electrode (not shown) of the electronic component 110 such as a crystal resonator element mounted on the mounting portion 104.

For example, the wiring conductor 111 is electrically derived from the mounting portion 104 or its periphery to the outer surface of the insulating substrate 101. The wiring conductor 111 functions as a part of a conductive path for electrically connecting each electrode of the electronic component 110 mounted on the mounting unit 104 to an external electric circuit (not shown). In the example shown in FIG. 1, the wiring conductor 111 is formed on the insulating substrate 101 (lower insulating layer 106) via a buried conductor 109 or a through conductor (not shown) formed on the lower insulating layer 106 from the mounting portion 104. Electrically led to the lower surface and electrically connected to the external connection conductor 107 formed on the lower surface. The electrical connection between the wiring conductor 111 and the external connection conductor 107 may be performed by a connection conductor including other conductors (not shown) in addition to a through conductor or the like, for example.

A frame-like metallized layer 112 is formed on the upper surface of the insulating substrate 101 (upper insulating layer 105). The frame-shaped metallized layer 112 surrounds the mounting portion 104, and a lid 118 or a metal frame (not shown) is joined to the frame-shaped metallized layer 112. Then, after mounting the electronic component 110 on the mounting portion 104 and connecting the electrode of the electronic component 110 to the wiring conductor 111 with a bonding material 113 such as a conductive adhesive,
By bonding the lid 118 to the upper surface of the frame-like metallized layer 112, the electronic component 110 is hermetically sealed in a container composed of the lid 118 and the insulating substrate 101, thereby forming an electronic device (a crystal oscillator or the like). Also,
After the metal frame is brazed to the frame-shaped metallized layer 112 in advance, the lid 118 may be bonded onto the metal frame.

The frame-like metallized layer 112 functions as a metal member for joining the lid 118 to the insulating substrate 101 by a method such as seam welding or electron beam welding. The lid 118 has, for example, a square plate shape and is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy, or a ceramic material. Then, the lower surface of the lid 118 is joined to the frame-like metallized layer 112 by a joining method such as a brazing method or a welding method. In the case where the lid body 118 is made of a ceramic material, the metallization method or the plating method is applied to the region to be the joint surface of the lid body 118 so that the lid body 118 can be joined to the frame-like metallization layer 112 by a brazing method or a welding method. A metal layer (not shown) for bonding is formed by such a method.

  When a sealing material such as lead glass having a relatively low melting point is used, the wettability between the ceramic material and the glass is good, and the metal layer on the bonding surface of the lid 118 and the frame on the upper surface of the insulating substrate 101 are used. The metallized layer 112 may not be formed.

The frame-like metallized layer 112 may be electrically connected to a part of the wiring conductor 111 (for example, one to which a ground electrode of the electronic component 110 is connected) via an embedded conductor 109 described later. . In this case, the ground potential of the electronic component 110 can be made more stable by increasing the ground conductor area, for example. The frame-like metallized layer 112 may be further electrically connected to the external connection conductor 107. The electrical connection between the frame-shaped metallized layer 112 and the external connection conductor 107 is, for example, in addition to the embedded conductor 109, a horizontal conductor (not shown) and a through conductor (not shown) formed in the lower insulating layer 106. Is done through.

  Conductive portions such as the embedded conductor 109, the wiring conductor 111, the frame-like metallized layer 112, and the external connection conductor 107 are made of a metallized layer such as tungsten, molybdenum, manganese, copper, or silver. Such a metal material paste (metal paste) serving as a metallized layer is formed by printing in a predetermined pattern on a ceramic green sheet serving as a base substrate and simultaneously firing with each ceramic green sheet.

These exposed conductor parts prevent oxidative corrosion, and make the connection between the wiring conductor 111 and the electrode of the electronic component 110 and the connection between the external connection conductor 107 and the module substrate 130 easier and stronger. For this purpose, a nickel plating layer having a thickness of about 1 to 20 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are preferably sequentially deposited on the exposed surfaces.

A first notch 108 is provided on the inner surface of each corner portion of the upper insulating layer 105. A first notch 108 and a second notch 115 that is notched deeper than the first notch 108 are provided on the inner side surface of each corner portion of the lower insulating layer 106. The aforementioned embedded conductor 109 is provided from the second notch 115 to the inner surface of the first notch 108. The embedded conductor 109 is made of the same metal material as that of the wiring conductor 111, for example, and is formed by the same method.

In addition, the embedded conductor 109 is formed by punching a through-hole serving as the second notch 115 so that, for example, a ceramic green sheet serving as the lower insulating layer 106 extends over each corner portion of the adjacent wiring board region on the mother board. It can be formed by providing. If the laminated body in which the ceramic green sheets are laminated is fired to be a mother board and then divided at a portion to be the outer periphery of the insulating substrate 101 in each wiring board region, the through holes are divided into four in the vertical and horizontal directions. A first notch 108 and a second notch 115 are formed at each corner of the rectangular insulating substrate 101. If the metallized paste that becomes the embedded conductor 109 is previously filled in the through hole that becomes the second notch 115 during the punching process for forming the first notch 108, the metallization that becomes the embedded conductor 109 is obtained. A first notch 108 in which a paste is formed along the second notch 115 is provided in the lower insulating layer 106. Although the first cutout 108, the embedded conductor 109, and the second cutout 115 are provided at each corner of the insulating substrate 101, they may be provided on the side surface of the insulating substrate 101.

  The electronic component storage package 1 includes an upper insulating layer 105 and a lower insulating layer 106, and includes a first main surface 102 on the upper insulating layer 105 side including a mounting portion 104 for mounting the electronic component 110, and An insulating substrate 101 having a second main surface 103 on the lower insulating layer 106 side is included, a first notch 108 is provided on the outer edge of the insulating substrate 101, and the first notch 108 is separated from the second main surface 103. An embedded conductor 109 is provided, and at least a part of the embedded conductor 109, that is, a part or all of it is covered with the insulating film 114.

With such a structure, even if the electronic component storage package 1 is reduced in size, for example, when a large number of electronic component storage packages 1 are obtained from a mother board made of a ceramic material or the like, small penetrations that become notches are formed. An insulating film 114 is provided so as not to block the hole, and when mounting the electronic device including the electronic component storage package 1 on the module substrate 130, a bonding material (not shown) such as a brazing material or solder. Scooping up the first cutout 108, or a sealing material (not shown) such as a brazing material for sealing the electronic component storage package 1 with the lid 118 flows into the first cutout 108, It is possible to suppress short circuit between wiring conductors having different potentials.

That is, when the potentials of the wiring conductors such as the external connection conductor 107 and the embedded conductor 109 formed in the adjacent corner portion are different, the bonding material such as brazing material or solder is placed on the embedded conductor 109 side. Even if it rises, a part or all of the embedded conductor 109 is covered with the insulating film 114, so that the possibility of a short circuit between the embedded conductor 109 and the wiring conductor such as the external connection conductor 107 is reduced.

Further, in the electronic component storage package 1 in which the frame-shaped metallized layer 112 or a metal frame (not shown) brazed to the frame-shaped metallized layer 112 is provided, a corner portion adjacent to the frame-shaped metallized layer 112 Even if a sealing material such as a brazing material flows into the first notch 108 when the potential of the embedded conductor 109 formed on the first electrode is different from that of the embedded conductor 109, a part or all of the embedded conductor 109 is covered with the insulating film 114. Since it is covered, the possibility of a short circuit between the buried conductor 109 and the frame-like metallized layer 112 is reduced.

For example, four external connection conductors 107 are provided at each corner portion of the second main surface 103 (lower surface) of the insulating substrate 101.
Are formed, and two of the four external connection conductors 107 are signal potentials for the electronic component 110, and the other two are ground potentials, which are arranged on diagonal lines of the insulating substrate 101, respectively. In some cases, one of the wiring conductors 111 to which the electronic component 110 is connected and the external connection conductor 107 in the vicinity thereof have different potentials. Even in such a state, if there is a region where the conductor layer is not formed in the first notch 108 in the lowermost layer of the lower insulating layer 106, a short circuit basically does not occur.

On the other hand, due to the recent downsizing of the electronic component storage package 1, the thickness of the insulating layer constituting the lower insulating layer 106 and the like has become very thin, and the bonding material such as brazing material or solder is the first. There was a case where it crawls into the notch 108. However, if a part of the embedded conductor 109 is covered with the insulating film 114 in this way, the distance between the exposed portion of the embedded conductor 109 and the external connection conductor 107 can be increased on the inner surface of the first notch 108. Furthermore, if the entire embedded conductor 109 is covered with the insulating film 114 on the inner surface of the first notch 108, the exposed portion of the embedded conductor 109 does not exist on the inner surface of the first notch 108. Therefore, it is possible to further effectively reduce the possibility of a short circuit due to a bonding material bridge or the like generated between the embedded conductor 109 and the external connection conductor 107 or between the embedded conductor 109 and the frame-like metallized layer 112.

  In the electronic component storage package 1, the embedded conductor 109 is provided so that its thickness gradually increases from the second main surface 103 side to the first main surface 102 side. A part of the lower insulating layer 106 (in contact with the second principal surface 103 side) extends to a part or the whole of the buried conductor 109 on the second principal surface 103 side.

  With such a structure, even when the electronic component storage package 1 is reduced in size, for example, when a large number of electronic component storage packages 1 are obtained from a mother substrate made of a ceramic material or the like, the first notch 108 and The insulating film 114 can be provided so as not to block the small through hole.

That is, even if the electronic component storage package 1 is reduced in size, it is possible to reliably form a small through-hole that becomes the first notch 108, and at the same time, covers the part of or the entire surface of the embedded conductor 109 and the insulating film 114. Can be formed. Since it is not necessary to newly provide a process for applying the ceramic paste to be the insulating film 114 to the surface of the embedded conductor 109, the manufacturing process can be simplified.

As a method of forming such an insulating film 114, for example, a through hole that becomes the second notch 115 is formed in the first ceramic sheet that becomes the lower insulating layer 106, and the embedded conductor 109 and the through hole 109 are formed in the through hole. Fill with a metallized paste. Then, the lower insulating layer 106 has a two-layer structure, and is laminated with the first ceramic sheet sandwiched between the second ceramic sheet on the second main surface 103 side and the third ceramic sheet that becomes the upper insulating layer 105. Further, an adhesive sheet (not shown) containing a large amount of a binder is disposed between the first ceramic sheet and the second ceramic sheet, and a through hole that becomes the first notch 108 is formed from the second main surface 103 side. By punching with a mold or the like, the first notch 108 and the insulating film 114 can be formed.

In this punching step, the insulating film 114 can be formed by forming a part of the adhesive sheet so as to extend to the embedded conductor 109. Thus, it is not necessary to separately provide a step of applying the insulating film 114 by a suction method or the like, and the electronic component housing package 1 in which short-circuiting is efficiently suppressed can be manufactured.

  Here, the insulating film 114 formed to extend on the insulating film 114 is formed, for example, such that the tip thereof protrudes in a wave shape. For punching the first notch 108 in the laminated body to be the insulating substrate 101, all of the first ceramic sheet, the second ceramic sheet, and the third ceramic sheet may be punched all at once. As a result, the vertical displacement between the upper insulating layer 105 and the lower insulating layer 106 does not occur. Therefore, it is possible to realize the electronic component storage package 1 having excellent external dimension accuracy.

Further, if the above process is used, the step at the boundary between the buried conductor 109 and the insulating film 114 on the surface of the first notch 108 becomes extremely small. Therefore, there is no step even when the size of the through hole that becomes the first notch 108 is reduced, and for example, when plating is performed, the plating solution is circulated well to the through hole. Therefore, the plating film adherence to the exposed embedded conductor 109 is improved, and the electronic component storage package 1 having excellent corrosion resistance can be realized. When the insulating film 114 covers the entire buried conductor 109, the buried conductor 109 is not exposed and the corrosion resistance is improved.

  In the electronic component storage package 1, the insulating substrate 101 has a first side surface 116 and a second side surface 117 connected to the first side surface 116 via the first notch 108. It is provided along a second notch 115 that is notched deeper than the first notch 108 in a plan view, and extends from the first side surface 116 to the second side surface 117 of the insulating substrate 101.

With such a structure, the embedded conductor 109 can be embedded in the back side of the first notch 108 and formed in the lower insulating layer 106. Therefore, the embedded conductor 109 can be firmly formed in the corner portion of the insulating substrate 101. . That is, the insulating film 114 covers a part or all of the embedded conductor 109 serving as a conductive path, so that the bonding strength between the embedded conductor 109 and the lower insulating layer 106 is increased, and the embedded conductor 109 is peeled off. Etc. are suppressed.

As a method of forming such an insulating film 114, for example, a through hole that becomes the second notch 115 is formed in the first ceramic sheet that becomes the lower insulating layer 106, and the embedded conductor 109 and the through hole 109 are formed in the through hole. Fill with a metallized paste. Then, the lower insulating layer 106 has a two-layer structure, and is laminated with the first ceramic sheet sandwiched between the second ceramic sheet on the second main surface 103 side and the third ceramic sheet that becomes the upper insulating layer 105. Furthermore, an adhesive sheet containing a large amount of a binder is disposed between the first ceramic sheet and the second ceramic sheet, and a through hole that becomes the first notch 108 is punched out from the second main surface side by a mold or the like. Thus, the insulating film 114 as shown in FIGS. 2 and 3 may be formed. FIG. 2 shows a state in which the insulating film 114 is provided on a part of the embedded conductor 109, and FIG. 3 shows a state in which the insulating film 114 is provided on the entire embedded conductor 109.

As described above, the buried conductor 109 is formed in the lower insulating layer 106 so as to extend from the first side surface 116 to the second side surface 117 of the insulating substrate 101, and from the first side surface 116 to the first notch. Since it is widely formed through the second side surface 117 via 108, the bonding strength between the buried conductor 109 and the lower insulating layer 106 as a metal layer becomes stronger, and peeling of the buried conductor 109 is more effective. To be suppressed.

In the punching process, the insulating film 114 is formed by providing a part of the adhesive sheet so as to extend to a part of the embedded conductor 109. Thereby, it is not necessary to provide a separate step of applying an insulating film by a suction method or the like, and the electronic component housing package 1 in which short-circuiting is efficiently suppressed can be manufactured.

  Note that the method of forming the insulating film 114 on the buried conductor 109 is not limited to the above. For example, without using an adhesive sheet, the ceramic sheet is laminated after applying a binder or the like that softens the ceramic sheet to the upper surface (adhesion surface side) of the second ceramic sheet, and the laminate that becomes the mother substrate is the second one. A through hole that becomes the first notch 108 may be formed by punching from the main surface 103 side with a mold or the like. Thereby, a part of the softened second ceramic sheet extends so as to extend to a part of the embedded conductor 109 during the punching process or to extend to the entire embedded conductor 109. An insulating film 114 as shown in FIG. 2 can be formed.

  In the electronic component storage package 1, the insulating film 114 is provided so that the thickness gradually increases from the first main surface 102 side to the second main surface 103 side.

With such a structure, the embedded conductor 109 can be embedded in the back side of the first notch 108 and formed in the lower insulating layer 106, and the embedded conductor 109 can be formed more firmly in the corner portion of the insulating substrate 101. . That is, the second main surface 103 side (mounting surface side) of the embedded conductor 109 is covered with a thick insulating layer, and a structure in which a step is hardly formed at the boundary between the embedded conductor 109 and the insulating film 114 can be obtained. Therefore, the strength of the insulating film 114 is ensured, the circulation of the plating solution is further improved, and the adherence of the plating film is improved.

In order to form the insulating film 114 so that the thickness gradually increases from the first main surface 102 side to the second main surface 103 side, for example, in the punching process as described above, a part of the adhesive sheet extends. When forming so as to extend to a part of the embedded conductor 109, an adhesive sheet to be the insulating film 114 is formed so that the second main surface 103 side of the metallized paste to be the embedded conductor 109 is spread to the outer periphery. It can be formed by deforming. At this time, the second main surface 103 side of the metallized paste that becomes the embedded conductor 109 spreads outside the second notch 115. Therefore, since the buried conductor 109 is formed deeper inside the insulating substrate 101, the bonding strength between the buried conductor 109 and the lower insulating layer 106 as a metal layer becomes stronger, and the buried conductor 109 is peeled off. Etc. are more effectively suppressed.

The buried conductor 109 exposed on the first side surface 116 and the second side surface 117 is not exposed at the time of manufacturing the mother substrate, for example, and is exposed after the mother substrate is divided. Not. Therefore, even if a bonding material such as a brazing material or solder crawls up to the embedded conductor 109 side exposed on the first side surface 116 and the second side surface 117, the bonding material is difficult to wet, so that the wiring conductors having different potentials are short-circuited. Can be suppressed.

  Since the electronic device includes the electronic component storage package 1 and the electronic component 110 mounted on the electronic component storage package 1, the electronic device 110 and the bonding material such as solder are mounted on the electronic device. A highly reliable one in which short-circuiting is suppressed can be provided.

That is, when the potentials of the wiring conductors such as the external connection conductor 107 and the embedded conductor 109 formed in the adjacent corner portion are different, the bonding material such as brazing material or solder is placed on the embedded conductor 109 side. Even if it crawls up, since part or all of the embedded conductor 109 is covered with the insulating film 114, the possibility of short circuit between the embedded conductor 109 and the wiring conductor such as the external connection conductor 107 is reduced. A highly electronic device 120 can be provided.

The electronic component 110 mounted on the mounting unit 104 is a crystal vibrating element or the like, and these electronic components 110
These electrodes (not shown) are connected to the wiring conductor 111. The electronic component 110 has a generally rectangular outer shape, and a pair of electrodes (not shown) for connection are formed at the corners of the main surface. The wiring conductor 111 is formed at the corner portion of the mounting portion 104 so that the electrodes can be connected easily and reliably.

Each electrode of the electronic component 110 and the wiring conductor 111 are connected to each other through a bonding material 113 such as a conductive adhesive. That is, the electronic component 110 is positioned on the mounting portion 104 so that the electrode formed at the corner portion of the main surface of the electronic component 110 faces the wiring conductor 111, and the bonding material 113 previously applied to the wiring conductor 111 is heated. Then, the electrode of the electronic component 110 and the wiring conductor 111 are connected.

Note that the wiring conductor 111 is formed at the position as described above because the example of this embodiment describes an example in which a crystal resonator element is used as the electronic component 110, but other electronic components are mounted. In the case of mounting a plurality of other electronic components, the position and shape of the wiring conductor 111 may be changed according to the arrangement of the electrodes of the electronic component. Examples of such electronic components include a piezoelectric element such as a ceramic piezoelectric element or a surface acoustic wave element, a semiconductor element, a capacitive element, a resistor, and the like.

By using the electronic device 120 described above, the electronic module can realize a connection reliability with respect to the electronic component 110 accommodated in the mounting unit 104 or an operation reliability with improved ground stability.

That is, when the potentials of the wiring conductors such as the external connection conductor 107 and the embedded conductor 109 formed in the adjacent corner portion are different, the bonding material such as brazing material or solder is placed on the embedded conductor 109 side. Even if it crawls up, since part or all of the embedded conductor 109 is covered with the insulating film 114, the possibility of short circuit between the embedded conductor 109 and the wiring conductor such as the external connection conductor 107 is reduced. By using the highly functional electronic device 120, it is possible to realize an electronic module excellent in operation reliability in which connection reliability to the electronic component 110 accommodated in the mounting portion 104 and ground stability are improved.

When such an electronic module is mounted on an electronic device (not shown), the inside of the mounting portion 104 is shielded from external noise by setting the frame-like metallized layer 112 and the lid body 118 to the same potential as the ground potential. It becomes a structure. That is, the amount of electromagnetic waves from the outside reaching the electronic component 110 accommodated in the mounting portion 104 can be suppressed. In other words, such an electronic module has a structure in which the amount of electromagnetic waves from the electronic device can be suppressed and the influence of the electromagnetic waves from the electronic device can be suppressed.

A first notch 108 is formed in each corner portion of the insulating substrate 101 included in the electronic device 120. Further, the embedded conductor 109 is formed in the first notch 108, and the whole or part of the surface is covered with the insulating film 114, and a fillet such as solder is hardly formed in the first notch 108. That is, since the electronic device 120 is connected only between the external connection conductor 107 formed on the second main surface 103 side of the insulating substrate 101 and the connection conductor on the module substrate 130, the electronic device 120 in a plan view. A joining structure in which there is no protruding portion such as a solder fillet beyond the outer periphery of the solder becomes possible. Therefore, since the interval at the time of mounting with another electronic device adjacent to the electronic device 120 can be reduced, the electronic device 120 can be mounted on the module substrate 130 with high density, and the electronic device can be downsized.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, the frame-like metallized layer 112 is formed on the upper insulating layer 105, and a part of the lower insulating layer 106 serves as the insulating film 114 on the second main surface 103 side of the embedded conductor 109. Although the insulating substrate 101 formed extending partly or entirely is shown, the frame-like metallized layer 112 is not formed on the upper surface of the insulating substrate 101 when a sealing material such as glass or adhesive is used. As an insulating substrate 101 formed by extending a part of the upper insulating layer 105 from one main surface 102 to the first main surface 102 side of the embedded conductor 109 as an insulating film 114 by punching or the like. May be produced.

Further, even if the frame-shaped metallized layer 112 is formed, the frame-shaped metallized layer 112 is formed except for the vicinity of the first notch 108, and punching is performed from a portion where the frame-shaped metallized layer 112 is not formed. By doing so, the insulating film 114 may be formed so as to extend part of the adhesive sheet and extend to the embedded conductor 109. In this case, it is effective against a short circuit caused by a joining material such as silver solder for joining the lid 118 flowing out to the embedded conductor 109 side in the first notch 108.

Further, a pair of wiring conductors 111 formed on the mounting portion 104 using the electronic component 110 as a piezoelectric vibration element.
However, the insulating substrate 101 may be manufactured to accommodate a plurality of other electronic components in a plurality of wiring conductors having different arrangements.

1 ... Electronic component storage package (wiring board)
101 ・ ・ ・ Insulating substrate
102 ... 1st main surface
103 ... 2nd main surface
104 ・ ・ ・ Mounting part
105 ... Upper insulating layer
106 ・ ・ ・ Lower insulation layer
107 ... External connection conductor
108 ... 1st notch
109 ... Built-in conductor
110 ・ ・ ・ Electronic components
111 ・ ・ ・ Wiring conductor
112 ・ ・ ・ Frame metallization layer
113 ・ ・ ・ Bonding material
114 ・ ・ ・ Insulating film
115 ... 2nd notch
116 ... 1st side
117 ・ ・ ・ Second side
118 ・ ・ ・ Lid
120 ・ ・ ・ Electronic device
130 ... Module substrate

Claims (5)

An upper insulating layer and a lower insulating layer are provided, and includes a first main surface on the upper insulating layer side and a second main surface on the lower insulating layer side provided with a mounting portion for mounting an electronic component. A first notch is provided at an outer edge of the insulating substrate, an embedded conductor is provided in the first notch away from the second main surface, and at least the embedded conductor A part of the embedded conductor is covered with an insulating film, and the embedded conductor is provided so as to gradually increase in thickness from the second main surface side to the first main surface side. An electronic component storage package, wherein the package extends to at least a part of the embedded conductor on the second main surface side . The insulating substrate has a first side surface and a second side surface connected to the first side surface through the first notch, and the embedded conductor is cut deeper than the first notch in a plan view. 2. The electronic component storage package according to claim 1, wherein the electronic component storage package is provided along the notched second notch and extends from the first side surface to the second side surface of the insulating substrate. . The insulating film is subjected to the second main surface side from the first main surface side, electronic component housing according to claim 1 or claim 2, characterized in that provided to a thickness of gradually larger package. An electronic device comprising: the electronic component storage package according to any one of claims 1 to 3 ; and an electronic component mounted on the electronic component storage package. An electronic module comprising the electronic device according to claim 4 and a module substrate to which the electronic device is connected.

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