JP4511335B2 - Multi-circuit board and electronic device - Google Patents

Description

  The present invention is a multi-piece wiring in which a large number of wiring board regions, each of which is a small-sized wiring board for mounting electronic components such as semiconductor elements and crystal resonators, are integrally arranged in a vertical and horizontal arrangement on the board. The present invention relates to a substrate and an electronic device.

  2. Description of the Related Art Conventionally, a small wiring board for mounting and housing electronic components such as semiconductor elements such as IC and LSI, and piezoelectric elements such as crystal resonators and surface acoustic wave elements accommodates electronic components in the central portion of the upper surface. An insulating substrate having a recess, and a wiring conductor led out from the inside of the recess to the side surface and the lower surface of the insulating substrate are provided. Normally, a stepped portion is formed on the bottom surface of the recess, and the wiring conductor is led out from the upper surface of the stepped portion to the side surface and the lower surface of the insulating substrate through the inside of the insulating substrate.

  This small-sized wiring board is generally formed in the form of a multi-piece wiring board in which rectangular wiring board areas to be such wiring boards are arranged vertically and horizontally on the board. It is manufactured by dividing along the boundary.

  As shown in FIGS. 2A and 2B, respectively, a plan view and a cross-sectional view taken along the line YY ′, the multi-cavity wiring board has three layers made of ceramic material such as an aluminum oxide sintered body. In this structure, a plurality of wiring board regions 203 each having a recess 204 for mounting an electronic component (not shown) are arranged in the center of the upper surface of the substrate 201 formed by stacking the insulating layers. . The concave portion 204 has a quadrangular shape suitable for accommodating a quadrangular electronic component, and a step portion 205 is formed in the concave portion 204. A connection pad 206 for electrically connecting the electrodes of the electronic component is formed on the upper surface of the step portion 205.

  When the electronic component housed in the concave portion 204 is such that an electrode is unevenly distributed on a part of the outer periphery of the electronic component main body such as a crystal resonator, the electrode is connected to the electrode (the electrode and the connection pad 206). The step portion 205 is formed so as to be unevenly distributed on one side of the rectangular frame-shaped recess portion 204 (so that the distance between the two portions is as short as possible or so that both face each other directly).

  In addition, each wiring board area | region 203 arranged on the board | substrate 201 is normally arranged in the same direction. Therefore, the stepped portions 205 that are unevenly distributed on one side of the recess 204 are arranged in the same direction in each wiring board region 203 of the substrate 201.

  A dividing groove 210 is formed in advance at the boundary of each wiring board region 203 of the substrate 201. By dividing the substrate 201 along the dividing grooves 210 and dividing the substrate 201 into the wiring substrate regions 203, individual electronic component storage packages are manufactured. The substrate 201 may be divided by a cutting process such as dicing without providing the dividing groove 210.

  In such an electronic component storage package, the electronic component is stored in the recess 204, and the electrode of the electronic component is electrically connected to the connection pad 206 provided on the upper surface of the step portion 205 via a bonding wire or a conductive adhesive. Then, a lid (not shown) is joined to the upper surface of the insulating substrate to close the concave portion 204, and the electronic component is housed in the concave portion 204 in an airtight manner, so that an electronic device as a product is obtained. Then, the connection pad 206 is led out to the outside of the recess 204 through a wiring conductor (not shown), and the lead-out portion of the wiring conductor is connected to a connection pad (not shown) of an external electric circuit board with a connecting material such as solder. Thus, the electronic device is mounted on the external electric circuit board, and the electrodes of the electronic components to be accommodated are electrically connected to the external electric circuit.

  The substrate 201 is usually prepared by preparing a plurality of ceramic green sheets (hereinafter also simply referred to as green sheets) obtained by forming a raw material powder such as aluminum oxide into a sheet shape, and punching a part of the green sheets. An opening for forming the recess 204 is provided, and then a metal powder paste such as tungsten is printed on the surface of the green sheet on a predetermined connection pad 206 or a pattern of a wiring conductor, and then these green sheets are sequentially laminated and fired. It is manufactured by doing.

  In order to facilitate handling as a multi-piece wiring board on the outer peripheral portion of the substrate 201 and to form a lead wiring layer 208 for electric conduction of electroplating, a discarding allowance having the same thickness as the wiring board region 203 is formed. Region 202 is formed. In this case, the dividing groove 210 is also formed at a site along the boundary between the discard margin region 202 and the wiring board region 203.

The dividing groove 210 cuts the cutter blade to a predetermined depth along, for example, the boundary between the wiring substrate regions 203 or the boundary between the wiring substrate region 203 (outermost peripheral one) and the disposal margin region 202. Is formed.
JP 2002-158306 A

  However, in such a conventional multi-cavity wiring substrate, the strength of one side frame portion 212 where the step portion 205 is formed in the frame portion surrounding the concave portion 204 of each wiring substrate region 203 is formed by the step portion 205. It is higher than the strength of the frame portion 213 that is not.

  Further, when the substrate 201 is divided along the high-strength side where the stepped portion 205 is formed, the wiring substrate region 203 in contact with the dividing position is along the other side where the stepped portion 205 is not formed. As a result, a larger mechanical impact occurs than when the substrate 201 is divided.

  Therefore, when the substrate 201 is broken and divided along the dividing groove 210 at the boundary between the frame portion 212 where the step portion is formed and the frame portion 213 where the step portion is not formed, a large mechanical impact occurs. Due to the impact, mechanical damage such as chipping or cracking occurs in the low-strength frame portion 213 in which the step portion 205 is not formed, and it is applied to the outer peripheral portion of the wiring board region 203 (a piece of electronic component storage package). There was a problem that defects such as cracks and cracks may occur.

  When defects such as flashing or cracking occur, in the individual electronic component storage package, problems such as reduced outer diameter accuracy (out of specification, etc.), reduced reliability of hermetic sealing, poor appearance, etc. become.

  In particular, with the recent demand for miniaturization of electronic components, the size of each wiring board region 203 has become as small as several mm square. Further, as each wiring board region 203 is downsized, the width of the portion (frame portion) surrounding the recess 204 of the wiring board region 203 is becoming narrower. Therefore, in the multi-cavity wiring board having a structure in which such a stepped portion 205 is formed so as to be unevenly distributed on one side of the rectangular frame-shaped concave portion 204, the above-described defects are present in the frame portion of the wiring board region 203. The possibility of occurrence is increasing.

  Further, in the case of a multi-piece wiring board in which the division grooves 210 are formed on the substrate 201, there are the following problems even in the formation process of the division grooves 210. That is, when a cut for forming the dividing groove 210 is pushed into the green sheet to be the substrate 201 with a cutter blade or the like, a step portion is formed at the boundary between the adjacent wiring board regions 203. It is high at the frame portion 212 and low at the frame portion 213 where the step portion is not formed.

  Therefore, the notch that becomes the dividing groove 210 is difficult to open on the side of the frame part 212 where the step part is formed, and on the side of the frame part 213 where the step part is not formed (the low strength side), the cutter blade or the like that pushes the notch is the step part. There is a problem that the cutter blade tends to be biased inside the concave portion 204 where the thickness is not formed (the side having low strength), and it is difficult to put a dividing line that forms the straight dividing groove 210.

  As a result, the shape of the frame portion deteriorates, and it becomes difficult to join the upper surface lid of the frame portion so as to firmly close the concave portion 204 without a gap, and a hermetic sealing failure may occur. There was a problem that there was.

  The present invention has been devised in view of such conventional problems. The object of the present invention is to provide the substrate 201 in each wiring board region 203 even if the stepped portion 205 is unevenly distributed on one side of the rectangular recess 204. In addition, it is possible to reduce the possibility of occurrence of burrs, cracks, etc., and to provide a multi-piece wiring board excellent in airtight sealing without deformation around the recess 204 and a highly reliable electronic device. It is to provide.

Each of the multi-cavity circuit board, a plurality of wiring board regions arranged formed in a matrix on the substrate, the dividing grooves formed on a boundary between the plurality of wiring substrate areas, a plurality of the wiring substrate region of the present invention formed, Rutotomoni comprises a recess rectangular shape on which an electronic component is to be accommodated, the said recess of rectangular shape and formed stepped portion so as to unevenly distributed on one side of the long side, a plurality of said wiring A step margin is formed on the outer periphery of the substrate region, and the step portion is the same on the long side so as to be adjacent to the step margin region in the wiring substrate region adjacent to the step margin region. are arranged in one side, the inner side of the wiring substrate area, across the boundary of the wiring board territory Ikido mechanics adjacent that are arranged in the same side of each long side to face each other It is characterized by.

  The electronic device according to the present invention includes an electronic component storage package separated by dividing the multi-cavity wiring substrate of the present invention into each wiring substrate region, and the concave portion of the electronic component storage package. And an electronic component housed in the housing.

Multiple patterning wiring board of the present invention is provided with a step portion formed so as to unevenly distributed on one side of the long sides of the recesses of rectangular shape, the stepped portion is in the inside of the wiring substrate region, the wiring board adjacent territory across the boundary Ikido workers by being arranged in the same side of each long side to face each other, it is possible to reduce the intensity difference of the wiring substrate region adjacent the peripheral recess (frame It is possible to reduce the possibility of occurrence of defects such as flashing and cracking.

  In addition, when forming a cut for forming a dividing groove in a green sheet to be a substrate by pushing a cutter blade or the like, the strength of the green sheet is set so that a stepped portion is formed at the boundary between adjacent wiring board regions. Since the portions can be made the same degree between the frames or between the frame portions where the step portions are not formed, the cutter blade can be prevented from escaping to the concave portion having a low strength, and the deformation of the frame portion can be reduced.

  As a result, when the recess is sealed with a lid, for example, the lid can be firmly joined to the upper surface of the frame, and the reliability of the hermetic sealing can be improved. .

  At this time, the frame portions on both sides of the boundary are similarly opened to both sides by the elasticity of the green sheet itself, and then the two sides of the boundary are similarly restored to the original state by the elasticity of the green sheet itself after forming the dividing groove. become.

Further, the multi-cavity wiring board of the present invention has a margin area formed on the outer periphery of a plurality of wiring board areas, and in the wiring board area adjacent to the margin area , the stepped portion is a discard margin area. Because they are arranged side by side on the same side on the long side , the mechanical strength is higher than the wiring board area for convenience and practicality of handling multi-piece wiring boards. Even if the margin area is formed, and when the board is divided along the boundary between the wiring board area and the discard margin area, a large mechanical impact is generated on the wiring board area (one side where the step portion is formed). Even if it acts on the wiring board, it is possible to reduce the possibility of problems such as flashing and cracking in the wiring board region. As a result, excellent in reliability, it can be a multi-piece wiring substrate handling and excellent easy practicability.

  Further, the multi-cavity wiring board of the present invention includes a dividing groove formed at the boundary between a plurality of wiring board regions, and thereby, for example, a pressing force can be applied to the substrate in the thickness direction along the dividing groove. By applying a pressing force with the apparatus having such a structure, the substrate is easily divided into the respective wiring substrate regions.

In addition, since it has a disposal margin area, using the dividing device as described above, pressure is applied to the substrate in the same way from the disposal margin area to the wiring board area, so that a division groove having a low mechanical strength is formed. The substrate can be broken along the formed site. Therefore, it is possible to increase the workability of dividing the substrate into each wiring substrate area, the division into multiple patterning wiring board pieces can be done easily.

  The strength of the wiring board area can be approximated by a step portion of the wiring board area adjacent to the disposal margin area so that the strength of the wiring board area is close to that of the disposal margin area. Even when dividing along a dividing groove between adjacent outermost wiring substrate regions, it is effectively prevented that a large impact is applied to the wiring substrate region side. As a result, it is possible to reduce the possibility of occurrence of flash or cracks in the wiring board region (divided individual wiring boards).

  The electronic device according to the present invention includes an electronic component storage package separated by dividing the multi-piece wiring substrate described above into each wiring substrate region, and an electronic component stored in a recess of the electronic component storage package. By providing the components, it is possible to realize an electronic device having a good external dimension accuracy and excellent electrical connection reliability.

  Next, the multi-piece wiring board of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1A is a plan view showing an example of an embodiment of a multi-piece wiring board according to the present invention, and FIG. 1B is a cross-sectional view taken along line X-X ′ of FIG. In the figure, 101 is a substrate in which a rectangular wiring board region 103 is formed vertically and horizontally at the center, 104 is a recess formed in the wiring substrate region 103, 102 is a margin area, 105 is a stepped portion, and 110 is a dividing groove. It is.

  The substrate 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic. For example, a plurality of insulating layers made of such a ceramic material are laminated. It is formed by.

  If the substrate 101 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide or silicon oxide is formed into a sheet shape together with an organic solvent and a binder to produce a plurality of ceramic green sheets. It is formed by punching a ceramic green sheet into a predetermined shape and size, and stacking up and down to form a laminate, which is fired at a high temperature (about 1500 to 1600 ° C.).

  In this case, each wiring board region 103 is punched out in the center of each wiring board region 103 on the upper side of the ceramic green sheet when laminated, and a plurality of openings are formed vertically and horizontally in the center of the ceramic green sheet. A recess 104 in the substrate region 103 is formed.

  The concave portion 104 of the wiring board region 103 is for accommodating an electronic component (not shown) such as a piezoelectric element such as a crystal resonator, a semiconductor element, a capacitor element, or a resistor. For example, by closing the recess 104 with a lid (not shown), the electronic component is hermetically sealed inside the container constituted by the recess 104 and the lid. The recess 104 is formed in a quadrangular shape in accordance with the shape of an electronic component such as a crystal resonator or a semiconductor element.

  The lid is formed of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a ceramic material, a resin material, or the like. For example, the plate material made of iron-nickel-cobalt alloy is formed by performing metal working such as punching or etching, and forming the plate into a plate shape that closes the recess 104.

  The lid is, for example, a frame-shaped portion (frame portion) that surrounds the concave portion 104 of the substrate 101 by means such as welding such as seam welding or electron beam welding, brazing, or bonding via a bonding material such as resin or glass. The upper surface is joined so as to close the recess 104.

  In this case, a sealing metallization layer (not shown) may be formed on the upper surface of the frame portion in order to make the joining by welding or brazing easy and strong.

The recess 104 is step portion 105 so as to unevenly distributed on one side of the long side of the recess 104 of rectangular shape is formed, and the connection pad 106 is provided on the step portion 105 the upper surface.

  The connection pad 106 functions as a terminal for electrically connecting the electrode of the electronic component housed in the recess 104, and functions as a part of a conductive path that leads the electrode to the outside of the recess 104.

Since the step portion 105 is formed unevenly on one side of the long side of the concave portion 104, it is easy to align and connect the step portion 105 of the electronic component housed in the concave portion 104 and the connection pad 106 on the upper surface thereof. It is done firmly. For example, when an electrode is unevenly distributed on one side of a square plate-shaped electronic component body (such as a crystal piece) like a crystal resonator, when the electronic component is accommodated in the recess 104, The electrodes formed on the outer periphery of the lower surface are easily aligned so as to face the step portion 105 and the connection pad 106, and are firmly connected electrically and mechanically through a conductive adhesive.

  Further, in the case where the electronic component is a vibrator with mechanical vibration such as a crystal vibrator, a space corresponding to the height of the stepped portion 105 is secured between the electronic component main body and the bottom surface of the recess 104, Functions such as vibration and oscillation of electronic components are not hindered.

  For example, the electrode of the electronic component is electrically connected to the connection pad 106 via a conductive connection material (not shown) such as a bonding wire or solder. Then, a wiring conductor (not shown) is extended so as to be connected to the connection pad 106 so as to be led out to the lower surface side through the through conductor 107 in advance through the inside of the substrate 101 (each wiring substrate region 103). As a result, in each wiring board region 103, the electrodes of the electronic components are led out to the lower surface side of the board 105 through the wiring conductors such as the connection pads 106 and the through conductors 107.

  The through conductor 107 has a function of electrically connecting the wiring conductors formed in the upper and lower insulating layers to each other, for example, formed so as to straddle the boundary between the wiring board regions 103, and adjacent wiring board regions It has a function of electrically connecting the 103 wiring conductors to each other.

  In the stepped portion 105, the concave portion 104 is formed by laminating a plurality of ceramic green sheets having openings formed therein, and a part of the periphery of the opening portion of the ceramic green sheet on the lower layer side is formed on the upper layer side. It is formed by setting the size and shape of the punching so as to be exposed inside the opening of the ceramic green sheet. This exposed portion becomes the stepped portion 105.

  The connection pad 106 and the wiring conductor are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold. For example, if the connection pad 106 is made of tungsten, a paste of tungsten is printed and applied in a predetermined pattern of the connection pad 106 on the upper surface of the portion to be the stepped portion 105 of the ceramic green sheet, and is integrally fired. Can be formed.

  Further, the wiring conductor can be formed by printing and applying a tungsten paste in a predetermined pattern on the surface of the ceramic green sheet in a continuous pattern from the connection pads 106 printed on the stepped portion 105.

  Then, the substrate 101 is divided into the respective wiring substrate regions 103 and the electronic components are accommodated in the recesses 104. After the electrodes of the electronic components are connected to the connection pads 106, for example, a lid (not shown) is separated into individual pieces. The electronic components are hermetically sealed by attaching to the upper surface of the wiring board region 103 and closing the recess 104.

  When the lid is attached to the insulating base by a welding method such as joining via a brazing material or seam welding, a metallization layer for sealing is formed on the upper surface of each wiring board region 103 so as to surround the recess 104. (Not shown) may be formed. The metallization layer for sealing can be formed by the same means using the same material as the connection pad 106 and the wiring conductor described above.

In this multi-cavity circuit board, the step portion 105, the inside of the wiring substrate region 103, across the boundary of the wiring substrate area 10 3 same mechanics adjacent side by side in the same side of each long side to face each other arranged Has been.

  With this configuration, it is possible to make the rigidity of the frame portion (the portion surrounding the recess 104 in each wiring substrate region 103 of the substrate 101) substantially the same between the adjacent wiring substrate regions 103.

  Therefore, on the side where the stepped portion 105 is formed, where a large impact is likely to occur when the substrate 101 is divided, both the wiring substrate regions 103 on both sides sandwiching the boundary are high in strength (that is, defects such as burrs and cracks). The sides where the stepped portions 105 are formed are located adjacent to each other, and even if a large impact is applied, defects such as flashing and cracking occur around the concave portion 104 (frame portion, etc.). Can be prevented.

In addition, in each wiring board region 103 where the stepped portion 105 is not formed and the side having a relatively low strength, the adjacent wiring board region 103 is also formed in the side having a relatively low strength where the stepped portion 105 is not formed. order but located not that a large mechanical shock occurs when dividing the substrate 101 along between the relatively low sides to each other in intensity, the burrs or cracks occurs in the wiring substrate area 10 3 effectively Is prevented.

  As a result, the substrate 101 can be a multi-piece wiring substrate that can be divided without causing defects such as flashing and cracking.

Further, for example, when forming a dividing groove for division as described later on the green sheet to be the substrate 101, when forming the cut to be the dividing groove 110 by pushing a cutter blade or the like, the strength at the boundary of the wiring substrate region 103 adjacent frame portions stepped portion 104 is formed or, since it is possible to the same extent by the frame portions of the step portion 105 is not formed, the cutter blade strength It is possible to prevent the frame portion from being deformed by preventing escape to the weak concave portion 104 side.

  As a result, when the concave portion 104 is sealed with, for example, a lid, the lid can be firmly bonded to the upper surface of the frame portion, and the reliability of the hermetic sealing can be improved. it can.

  The connection pad 106, the wiring conductor, the through conductor 107, and the sealing metallization layer are preferably coated with a plating layer (not shown) such as nickel or gold on the exposed surface. As a result, oxidation of the connection pad 106 and the like can be effectively prevented, and the bonding property of the bonding wire to the connection pad 106, the wettability of the solder, the wettability of the brazing material to the sealing metallization layer, and the welding strength. Etc., and the reliability of electrical connection and hermetic sealing of electronic components can be further improved.

  For such a plating layer, an outer peripheral metallized layer 108 is formed on the outer peripheral part of the substrate 101, and the outer peripheral metallized layer 108 part is held by a plating jig, and the outer periphery from the terminal of the jig in the plating solution. The wiring conductor is electrically connected via the metallized layer 108 to supply a plating current.

Also, multiple patterning wiring board of the present invention has a discarded margin regions 102 formed on the outer peripheral portion of the plurality of wiring substrate regions 103, the wiring substrate region 103 adjacent to the discarded margin area 102, the stepped portion 105 so that adjacent discarded margin region 102 that are arranged in the same side of the long side.

Therefore, by discarding margin area 102 is formed, handling of the multiple patterning wiring board is easy. For example, even if a multi-piece wiring board is accidentally bumped into a jig, device, etc. during transportation or when electronic parts are accommodated, mechanical destruction such as cracking or chipping occurs in the disposal margin area 102, and the wiring board area It is effectively prevented that a defect occurs in 103.

In the wired substrate region 103 adjacent to the discarded margin area 102, since they are arranged in the same side of the long sides as the stepped portion 105 adjacent the discard margin area 102, discarded margin area 102 side The strength at is high.

Therefore, even if the high discard margin area 102 mechanical strength is not the recess 104 is formed as compared to the wiring substrate region 103 has been formed, along the boundary between the abandoned margin region 102 and wiring substrate region 103 Even when a large mechanical impact is applied to the wiring substrate region 103 (one side where the stepped portion 105 is formed) when the substrate 101 is divided, it is effective that defects such as flashing and cracking occur in the wiring substrate region 103. Is prevented.

As a result, excellent in reliability, it can be a multi-piece wiring substrate handling and excellent easy practicability.

Further, by using a dividing device having a structure capable of applying pressure in the thickness direction to the substrate 101, pressure is similarly applied to the substrate 101 from the disposal allowance region 102 to the wiring substrate region 103, and the mechanical component of the substrate 101 is The substrate 101 can be broken along the part where the divided grooves having a low strength are formed. Therefore, it is possible to increase the workability of dividing the substrate 101 to each wiring substrate area 103, the division into multiple patterning wiring board pieces can be done easily.

  The disposal allowance area 102 is for facilitating handling of the multi-piece wiring board. In addition, when supplying a current for plating to each wiring board region 103 as described above, it also functions as a space for routing a conductive path (not shown) for conduction.

Also, multiple patterning wiring board of the present invention, that have a split groove 110 formed at the boundary between the plurality of wiring substrate regions 103. Therefore, along the dividing groove 110, for example by pressing force is applied by the apparatus having the structure as may be made a pressing force in the thickness direction of the substrate 101, the substrate 101 is easily divided into the wiring substrate region 103 The

In addition, since it has the disposal margin region 102, the dividing device 110 having the low mechanical strength is formed by applying pressure to the substrate 101 in the same manner from the disposal margin region 102 to the wiring substrate region 103 by using the above dividing device. The substrate 101 can be broken along the formed portion. Therefore, it is possible to increase the workability of dividing the substrate 101 to each wiring substrate area 103, the division into multiple patterning wiring board pieces can be done easily.

  An electronic device (not shown) according to the present invention includes an electronic component storage package (not shown) separated by dividing a multi-piece wiring board having the above-described configuration into wiring board regions 103, and an electronic device. And an electronic component housed in the recess 104 of the component housing package.

  According to the electronic device of the present invention, since the electronic component is accommodated in the electronic component storage package in which the multi-piece wiring board of the present invention is divided into individual pieces, It is possible to realize an electronic device that has excellent hermetic sealing reliability and excellent long-term reliability and electrical connection reliability.

  As described above, the multi-cavity wiring board can be divided into the wiring board regions 103 by forming the dividing grooves 110 in the board 101 in advance. Further, it can be performed by performing a cutting process such as a dicing process along the boundary between the wiring board regions 103 or the boundary between the wiring board region 103 and the disposal margin region 102.

In the example shown in FIG. 1, the dividing grooves 110 are formed on the upper and lower surfaces of the substrate 101 so as to be at the same position in plan view. In this case, cracks progress from the tip (bottom) of one of the upper and lower divided grooves 110 of the substrate 101 toward the tip of the opposing divided groove 110, and each wiring board region 103 is surely prevented from causing defects such as burrs and chips. Can be divided into Note that the productivity may be improved by forming the dividing grooves 110 only on either the upper surface or the lower surface of the substrate 101 in accordance with the thickness of the substrate 101 or the like. If only the dividing groove 110 is formed on one of the upper or lower surface of the substrate 101, bending stress for dividing the substrate 101 is added in a direction such that the dividing groove 1 10 is opened.

  The dividing grooves 110 are formed on the upper and lower surfaces of the ceramic green sheet laminate to be the substrate 101 by pressing a cutter blade or a metal mold and making a cut. Further, the depth of the dividing groove 110 is set to about 20 to 70% with respect to the thickness of the ceramic green sheet forming the substrate 101 in order to prevent cracks, burrs, and chipping during the division. It is better.

  It should be noted that the present invention is not limited to the examples of the above-described embodiments, and changes and modifications can be made without departing from the scope of the present invention.

In the embodiment of the multi-cavity wiring board according to the present invention shown in FIG. 1, the stepped portion 105 is formed so as to be unevenly distributed on one side of the long side of the concave portion 104 of each wiring board region 103 . That is, a multi-piece wiring substrate shown in FIG. 1, in the wiring substrate region 103 between aligned adjacent in the vertical direction, that have opposite stepped portion 105 for ubiquitous.

  Further, the number of wiring board regions 103 arranged in the vertical and horizontal directions on the substrate 101 is set to 4 rows and 3 columns (12), but the number of substrates 101 suitable for the size of the wiring board region 103 may be used. Good.

(A) is a top view which shows an example of embodiment of the multi-cavity wiring board of this invention, (b) is sectional drawing in the XX 'line of the multi-cavity wiring board shown to (a). is there. (A) is a plan view of a conventional multi-cavity wiring board, and (b) is a cross-sectional view taken along line Y-Y ′ of the multi-cavity wiring board shown in (a).

Explanation of symbols

101... Substrate 102... Discarding area 103 .. wiring board region 104... Recessed portion 105... Stepped portion 110.

Claims (2)

A plurality of wiring substrate regions which are arranged and formed in a matrix on the substrate, the dividing grooves formed on a boundary between the plurality of wiring substrate region, which is formed in each of the plurality of the wiring substrate region, the electronic components are accommodated discard the recess of rectangular shape that has been formed in the outer peripheral portion of the rectangular Rutotomoni a formed stepped portion so as to unevenly distributed on one side of the long sides of the recess of the shape, a plurality of the wiring substrate region The step portion is arranged along the same side on the long side so as to be adjacent to the discard margin region in the wiring board region adjacent to the discard margin region, multiple patterning wiring board wherein the wiring board region, which is characterized in that it is arranged in the same side of each long side to face each other across the boundary of the wiring board territory Ikido mechanic neighboring. An electronic component storing package which is sectioned by multiple patterning wiring board according to claim 1 Symbol placement is divided into the circuit board area, an electronic component accommodated in the concave portion of the electronic component storing package An electronic device comprising:

Images