JP2004319644A - High heat dissipation type plastic package and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a high heat dissipation type plastic package which has less bleeding of the resin of an adhesive, is inexpensive, has satisfactory bonding precision and has a thin thickness without using a thick adhesive such as a prepreg between a resin substrate and a heat dissipation plate, and to provide a manufacturing method thereof. <P>SOLUTION: In the high heat dissipation type plastic package 10, a resin film 11 with Cu foil which is formed by joining an adhesive resin 13 on the Cu foil 23 and has a notch 15 formed by drilling, for a cavity 14 for placing a semiconductor element on a substantial center in a plan view and a heat dissipating plate 12 for dissipating heat from the semiconductor element are directly joined with the adhesive resin 13. The heat dissipating plate 12 has a blocking portion 20 for preventing the resin from bleeding at the time of joining the film 11 and the adhesive resin 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a high heat dissipation plastic package for mounting a semiconductor element and a method of manufacturing the same, and more particularly, to a high heat dissipation plastic package formed by bonding a resin substrate and a heat sink, and a method of manufacturing the same.
[0002]
[Prior art]
With the recent increase in performance and miniaturization of semiconductor elements, plastic packages for mounting semiconductor elements have increased the amount of heat generated from the semiconductor elements, increased the number of terminals for connection to the outside, and mounted semiconductor elements. From the viewpoints of performance, cost reduction, impedance reduction, and the like, a high heat dissipation type plastic package such as a BGA (Ball Grid Array) type having a high heat dissipation structure is often used. This high heat radiation type plastic package has a single-layer or multi-layer structure made of a BT resin (a resin having bismaileimide triazine as a main component) or a polyimide resin having a conductor layer formed by bonding Cu foil on one or both surfaces. A heat radiating plate made of a metal plate such as Cu having a high thermal conductivity is bonded to a high heat-resistant resin substrate via an adhesive such as a prepreg (for example, see Patent Documents 1 and 2).
[0003]
With reference to FIGS. 7A to 7D, a method of manufacturing a conventional high heat radiation type plastic package 50 will be described. As shown in FIG. 7A, a through-hole 53a for a through-hole 53 is formed in a resin substrate 51 containing a glass cloth to which a Cu foil 52 is bonded so as to conduct the front and back surfaces. An electroless Cu plating film is provided on the front and back surfaces and the wall surfaces of the through-holes 53a. Next, as shown in FIG. 7B, an etching resist pattern is formed by a photolithography method in which a dry film is stuck on the Cu plating film 54, exposed and developed by contacting a pattern mask, and the etching resist is formed. The Cu plating film 54 and the Cu foil 52 exposed from the opening of the pattern are removed by etching, and the dry film is peeled off to form the wiring pattern 55. Next, as shown in FIG. 7C, in order to form a cavity for mounting a semiconductor element on the resin substrate 51 on which the wiring pattern 55 is formed, a router processing machine is used to substantially form the cavity. A rectangular cutout 56 is formed. Next, as shown in FIG. 7 (D), a resin substrate 51 and a heat radiating plate 57 made of a Cu plate or the like are joined by heating and pressure bonding through an adhesive 58 such as a prepreg to form a high heat radiating plastic package 50. are doing. Note that a solder resist film 59 is formed on the upper surface side of the resin substrate 51 so that a necessary portion of the wiring pattern 55 is exposed from the opening.
[0004]
As a BGA type package having good heat dissipation, a package in which a TAB (Tape Automated Bonding) tape is joined to a reinforcing plate having good heat dissipation with a thermosetting adhesive has been proposed (for example, see Patent Document 3). .
[0005]
[Patent Document 1]
JP-A-7-321250 (page 1-14, FIG. 1)
[Patent Document 2]
JP-A-10-308467 (pages 1-5, FIG. 2)
[Patent Document 3]
JP 2001-68512 A (Pages 1-6, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, the conventional high heat radiation type plastic package and the method for manufacturing the same as described above have the following problems.
(1) Since the base material for forming the conductor wiring pattern and the heat sink are joined by using an adhesive to be attached later, the total thickness after joining becomes thicker depending on the thickness of the adhesive portion, It is required to be light and thin, for example, which hinders use in electronic devices such as mobile phones and personal computers.
(2) When a post-adhesive material is used for joining the conductive wiring pattern forming base material and the heat sink, the adhesive material is applied to the resin substrate or the heat sink with high accuracy, or the adhesive sheet is applied with high accuracy. It takes time, man-hours, and material costs to attach, and the cost of the high heat radiation type plastic package is increased. In addition, when bonding is performed using an adhesive or an adhesive sheet, the bonding resin oozes into the cavity at the time of bonding, resulting in reduced reliability when mounting the semiconductor element in the cavity. I have.
The present invention has been made in view of such circumstances, without using a thick adhesive such as a prepreg between the resin substrate and the heat sink, less resin exudation of the adhesive, inexpensive, An object of the present invention is to provide a high heat radiation type plastic package having good joining accuracy and a small thickness, and a method of manufacturing the same.
[0007]
[Means for Solving the Problems]
The high heat radiation type plastic package according to the present invention, which meets the above object, is formed by bonding an adhesive resin to a Cu foil, and is provided with a cutout for a cavity portion for mounting a semiconductor element at a substantially central portion in plan view. A high heat radiation type plastic package in which a resin film with a Cu foil having a notch formed therein and a heat radiation plate for dissipating heat generated from the semiconductor element are directly bonded with an adhesive resin, and the heat radiation plate has Cu It has a stopping portion for preventing resin seepage during bonding of the resin for adhesion of the resin film with foil. As a result, since a post-adhesive material such as a prepreg is not used for joining the resin film with a Cu foil, which is a base material for forming a conductor wiring pattern, and a heat sink, the package is thin, inexpensive, and has a Cu foil. It is possible to provide a high heat radiation type plastic package with good joining accuracy between the resin film and the heat radiation plate. In addition, since the resin exuding into the cavity at the time of joining the adhesive resin can be prevented, a high heat radiation type plastic package which can improve the mounting reliability of the semiconductor element can be provided.
[0008]
Here, the high heat radiation type plastic package is preferably made of a step which can be mounted with a slight clearance in the notch in the notch. As a result, the resin can be prevented from exuding into the cavity at the stepped portion where the cavity can be formed so as to protrude in a convex shape, so that the high heat radiation type plastic can improve the mounting reliability of the semiconductor element. Package can be provided.
[0009]
Further, in the high heat radiation type plastic package, it is preferable that the stopping portion is formed of a groove formed along the periphery of the notch. Thus, the resin can be prevented from seeping into the cavity at the groove portion, so that a high heat radiation type plastic package which can improve the mounting reliability of the semiconductor element can be provided.
[0010]
A method of manufacturing a high heat radiation type plastic package according to the present invention, which meets the above-mentioned object, comprises bonding a bonding resin to a Cu foil, and cutting a cavity portion for mounting a semiconductor element at a substantially central portion in plan view. A method for manufacturing a high heat radiation type plastic package, wherein a resin film with a Cu foil formed by forming a notch and a heat radiating plate for radiating heat generated from a semiconductor element are directly bonded with an adhesive resin. A step of forming a step or groove along the periphery of the notch of the resin film with Cu foil on the heat sink, and bonding the resin film with Cu foil to the heat sink by heating the adhesive resin, A step of stopping resin exudation of the resin by steps or grooves. This makes it possible to provide a method of manufacturing a low-cost, high-heat-dissipation plastic package that can be easily and accurately bonded to the heat radiating plate at a time with the resin for bonding the resin film with the Cu foil, and that is thin and inexpensive. In addition, since the occurrence of resin exudation of the adhesive resin on the heat sink in the cavity can be prevented by the steps or grooves, the semiconductor element can be mounted with high bonding reliability, and heat generated from the semiconductor element can be efficiently radiated. It is possible to provide a method for manufacturing a high heat radiation type plastic package.
[0011]
According to another aspect of the present invention, there is provided a method of manufacturing a high heat radiation type plastic package according to the present invention, comprising bonding an adhesive resin to a Cu foil, and placing a semiconductor element at a substantially central portion in plan view. Manufacture of a high heat radiation type plastic package formed by directly bonding a resin film with a Cu foil formed by forming a cutout for a part and a heat radiating plate for radiating heat generated from a semiconductor element with an adhesive resin. And pressing the release film through the low melting point resin film on the cavity and the resin film with Cu foil using a holding jig having a convex portion that can be fitted into the notch of the resin film with Cu foil. The resin for bonding is heated to join the resin film with Cu foil and the heat sink, and the resin exuding of the resin for bonding is controlled by the release film via the low melting point resin film. A step of, to remove the pressing jig, comprising the step of removing the release film through a low-melting point resin film. This makes it possible to provide a method of manufacturing a low-cost, high-heat-dissipation plastic package that can be easily and accurately bonded to the heat radiating plate at a time with the resin for bonding the resin film with the Cu foil, and that is thin and inexpensive. In addition, since the occurrence of resin exudation of the adhesive resin on the heat sink in the cavity portion can be prevented by the release film via the low melting point resin film pressed by the holding jig, the bonding reliability of the semiconductor element is improved. It is possible to provide a method of manufacturing a high heat radiation type plastic package which can be mounted and efficiently radiates heat generated from a semiconductor element.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are a perspective view and a longitudinal sectional view, respectively, of a high heat radiation type plastic package according to an embodiment of the present invention, and FIGS. 3A and 3B are respectively a top perspective view, a bottom perspective view, and a vertical cross-sectional view of the high heat radiation plastic package of FIG. 4 (A) to 4 (E) are explanatory diagrams of a method of manufacturing the high heat radiation type plastic package, and FIGS. 5 (A) to 5 (E) are high heat radiation type plastics of the same modification. FIGS. 6A to 6D are explanatory views of a method of manufacturing a package, and FIGS. 6A to 6D are explanatory views of another method of manufacturing the high-heat-dissipation plastic package and the modified high-heat-dissipation plastic package, respectively.
[0013]
As shown in FIGS. 1A and 1B, a high heat radiation type plastic package 10 according to an embodiment of the present invention includes a resin film 11 with a Cu foil and a heat radiation plate 12. The resin film 11 with a Cu foil is formed in a film shape by applying an adhesive resin 13 not containing a glass cloth base material to a Cu foil. In the resin film 11 with Cu foil, a notch 15 for a cavity portion 14 for mounting a semiconductor element in a substantially central portion of the package in a plan view is provided by punching with a punching press or the like. On the other hand, the heat radiating plate 12 is made of a Cu plate or the like having a high thermal conductivity so that heat generated from the semiconductor element can be efficiently radiated, and has a rough surface to improve the bonding strength with the bonding resin 13. Has been applied. Further, the heat radiating plate 12 is provided with a stopping portion for preventing resin seepage generated in the cavity portion 14 at the time of bonding with the bonding resin 13 formed by bonding to the resin film 11 with Cu foil. ing. Then, the resin film 11 with the Cu foil and the heat radiating plate 12 are brought into contact with the thermosetting adhesive resin 13 and the heat radiating plate 12 constituting the resin film 11 with the Cu foil, and pressurized while being heated. Are bonded while curing.
[0014]
The high heat radiation type plastic package 10 is provided with a conductor wiring pattern 16 formed by applying a Cu plating on a Cu foil of the resin film 11 with a Cu foil and then performing photolithography and etching. Further, the high heat radiation type plastic package 10 is provided with a solder resist film 17 on the surface on which the conductor wiring pattern 16 is formed in order to expose a necessary portion of the conductor wiring pattern 16 from the opening.
[0015]
As shown in FIGS. 2A to 2C, a modified example of the high heat dissipation plastic package 10a according to the embodiment of the present invention includes a semiconductor in addition to the structure of the high heat dissipation plastic package 10 described above. A conductor wiring pattern 16a is also provided on the lower surface side of the heat radiating plate 12a for radiating heat generated from the elements. In this case, the heat radiating plate 12a is provided with a through hole 18 for a through hole 19 for establishing electrical continuity between the upper and lower conductor wiring patterns 16, 16a using a drill or the like in advance. In the through hole 18, electrical conduction between the upper and lower conductor wiring patterns 16 and 16 a is formed by conductor wiring formed so as not to cause a short circuit on the wall surface of the through hole 18. Further, as in the case of the high heat radiation type plastic package 10, the heat radiation plate 12a is generated in the cavity portion 14 when the heat radiation plate 12a is joined to the bonding resin 13 formed by joining the resin film 11 with the Cu foil. A stop is provided to prevent resin seepage.
[0016]
The high heat radiation type plastic package 10a can be configured as a cavity-up type package in which a semiconductor element is mounted on the upper surface side and an external connection terminal such as a solder ball is connected on the lower surface side, and heat generated from the semiconductor element is efficiently radiated. At the same time, the dimensions of the package can be made extremely small by effectively utilizing both sides of the package. The high heat radiation type plastic package 10a of this modification may be formed from a Cu foil to which the lower-side conductor wiring pattern 16a is joined via a prepreg. The wiring pattern 16a may be formed based on the resin film 11 with Cu foil.
[0017]
Here, with reference to FIGS. 3A and 3B, the high heat radiation type plastic package 10 according to the embodiment of the present invention and the restraining portions of the heat radiation plates 12 and 12a of the high heat radiation type plastic package 10a of the modified example. Twenty embodiments will be described. 3A and 3B, the high heat radiation type plastic package 10 will be described as a representative. As shown in FIG. 3 (A), the heat dissipation plate 12 used in the high heat dissipation type plastic package 10 has a resin film 11 with a Cu foil slightly around the notch 15 provided in the resin film 11 with the Cu foil. It is good to have the stopping part 20 which consists of the level | step difference 21 which can be attached with clearance of. Due to the step 21, the cavity portion 14 of the heat sink 12 where the semiconductor element is mounted is formed in a convex shape higher than the portion where the resin film 11 with the Cu foil is joined. The resin seepage of the adhesive resin 13 when the resin film 11 with the Cu foil is heat-pressed to the heat radiating plate 12 is blocked by the stopping portion 20 composed of the step 21, so that the resin seepage onto the cavity portion 14 is reduced. be able to.
[0018]
As shown in FIG. 3 (B), the heat dissipation plate 12 used in the high heat dissipation type plastic package 10 has a resin film 11 with a Cu foil provided around the notch 15 provided in the resin film 11 with the Cu foil. It is good to have the stopping part 20 which consists of the groove | channel 22 formed along. The groove 22 forms an isolated portion between the cavity portion 14 of the heat sink 12 where the semiconductor element is mounted and the portion where the resin film 11 with Cu foil is joined. The resin seepage of the adhesive resin 13 when the resin film 11 with the Cu foil is heat-pressed to the heat radiating plate 12 can be poured into the stopping portion 20 formed by the groove 22, so that the resin seeping onto the cavity portion 14. Dashi can be reduced. In addition, the form of the restraining portion 20 formed on the heat sink 12 has a groove 22 and the cavity portion 14 is formed in a convex shape higher than a portion where the resin film 11 with the Cu foil is joined. Good.
[0019]
Next, a method of manufacturing the high heat radiation type plastic package 10 according to one embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 4 (A), a resin film 11 with a Cu foil for manufacturing a high heat radiation type plastic package 10 by bonding to a heat radiation plate 12 is formed by forming a glass cloth on a Cu foil 23 having a thickness of about 10 to 20 μm. A thermosetting B-stage adhesive resin 13 containing no base material is applied to a thickness of about 50 to 100 μm by a doctor blade method, a roll coater method, or the like to form a film. If a Cu foil that has been previously heat-treated in a reducing atmosphere is used, a stable peeling strength with high bonding strength can be obtained after bonding the bonding resin 13.
[0020]
Next, as shown in FIG. 4B, a notch 15 for a cavity portion 14 (see FIG. 4E) for mounting a semiconductor element is punched out in the resin film 11 with a Cu foil. And the like. Since the resin film 11 with the Cu foil is a bonded body of the Cu foil 23 and the bonding resin 13, the resin itself does not include glass cloth or the like, and the bonded body itself is thin. The notch 15 can be formed efficiently, accurately and inexpensively by punching of a processing machine.
[0021]
Next, as shown in FIG. 4C, the heat radiation plate 12 made of a metal member having a high thermal conductivity such as Cu or a Cu alloy and having a thickness of about 0.2 mm is provided as an example of the stopping portion 20. For example, a portion to be the cavity portion 14 is made convex by, for example, etching or cutting. As a result, a step 21 is formed around the periphery of the cavity portion 14 having the convex shape so as to have a slight clearance along the periphery of the notch 15 provided in the resin film 11 with Cu foil. A stopper 20 is formed to prevent the resin 13 for adhesion from seeping out of the resin. Although not shown, the stopper 20 may be formed by a groove 22 (see FIG. 3B) formed by, for example, etching or cutting. Further, the heat radiating plate 12 may be configured so that the surface thereof is roughened by honing or black oxide or the like to improve the bonding strength when the heat radiating plate 12 is bonded to the bonding resin 13.
[0022]
Next, as shown in FIG. 4D, the resin film 11 with the Cu foil and the heat radiating plate 12 are brought into direct contact with the adhesive resin 13 side of the resin film 11 with the Cu foil and the heat radiating plate 12, and a vacuum press or the like is performed. And thermocompression bonding. In the case of thermocompression bonding using a vacuum press machine, for example, the degree of vacuum is set to 50 mmHg or less, the temperature is 170 to 190 ° C., the pressure is 2 to 3 MPa, and the heating and pressurization are maintained for 40 minutes or more in a temperature of 175 ° C. or more. The adhesive resin 13 is hardened and bonded. Resin exudation occurs in the bonding resin 13 due to the heat compression bonding. The exudation of the resin is suppressed by the restricting portion 20 to reduce the amount of resin exuding onto the cavity portion 14.
[0023]
Next, as shown in FIG. 4 (E), after Cu plating (not shown) made of electroless Cu plating and electric field Cu plating is performed on the Cu foil 23 of the resin film 11 with Cu foil, The conductor wiring pattern 16 is formed by ordinary semi-additive, subtractive, or the like. Further, a solder resist film 17 is formed on the surface on which the conductor wiring pattern 16 is formed in order to expose a necessary portion of the conductor wiring pattern 16 from the opening, whereby the high heat radiation type plastic package 10 is manufactured. . Since a large number of the high heat radiation type plastic packages 10 are formed on a sheet-like base material, the high heat radiation type plastic packages 10 are finally cut at cut portions 24 after the semiconductor elements and the like are mounted.
[0024]
Next, with reference to FIGS. 5A to 5E, a description will be given of a method of manufacturing a high heat radiation type plastic package 10a according to a modification of the embodiment of the present invention.
As shown in FIG. 5A, the resin film 11 with a Cu foil for producing the high heat radiation type plastic package 10a is formed by applying the adhesive resin 13 to the Cu foil 23 similarly to the case of the high heat radiation type plastic package 10. The notch 15 is formed by a punching press machine.
[0025]
Next, as shown in FIG. 5 (B), the radiating plate 12a made of a metal member having a high thermal conductivity such as Cu or a Cu alloy is provided with a cavity portion as in the case of the high heat radiating plastic package 10. A stopper 20 is formed on the periphery of the cavity 14 so as to prevent the exudation of the adhesive resin 13 formed of the step 21 from the resin. Although not shown, the stopper 20 may be formed of, for example, a groove 22 (see FIG. 3B), as in the case of the high heat radiation type plastic package 10. In the heat sink 12a, a through hole 18 for a through hole 19 for establishing electrical continuity between the conductor wiring patterns 16, 16a (see FIG. 5 (E)) on the upper and lower surfaces of the package is provided with a drill machine or the like. It is formed by using. Further, the surface of the heat sink 12a is roughened by honing, black oxide or the like. The prepreg 25 and the Cu foil 23a for forming the conductor wiring pattern 16a on the lower surface side are prepared on the lower surface side of the heat sink 12a.
[0026]
Next, as shown in FIG. 5 (C), the adhesive resin 13 of the resin film 11 with the Cu foil on which the notch 15 is formed is brought into direct contact with the upper surface side of the heat sink 12a, The Cu foil 23a is brought into contact with the surface on the lower surface side of the plate 12a via the prepreg 25, and is pressed while heating using a vacuum press or the like as in the case of the high heat radiation type plastic package 10, and the whole is simultaneously formed. Joined and bonded. By this bonding, the inside of the through hole 18 of the heat sink 12a is filled with the bonding resin 13 and the prepreg 25. Resin exudation occurs in the bonding resin 13 due to the heat compression bonding. The exudation of the resin is suppressed by the restricting portion 20 to reduce the amount of resin exuding onto the cavity portion 14.
[0027]
Next, as shown in FIG. 5D, the wall of the through hole 18 filled with the adhesive resin 13 or the prepreg 22 is covered with the resin so that the through hole 18 has a diameter smaller than the diameter of the through hole 18. A hole 26 for the hole 19 is formed by a drill machine or the like. Then, the Cu foil 23 and the Cu plating film 27 on the upper surface side and the Cu plating film 27 on the lower surface side The foil 23a and the Cu plating film 27 are electrically connected.
[0028]
Next, as shown in FIG. 5E, the Cu foil 23 and the Cu plating film 27 on the upper surface side and the Cu foil 23a and the Cu plating film 27 on the lower surface side are formed similarly to the case of the high heat radiation type plastic package 10. Conductive wiring patterns 16 and 16a are formed on both sides by a normal semi-additive method, a subtractive method, or the like. Further, the solder resist films 17 and 17a are formed on the surfaces on which the conductor wiring patterns 16 and 16a are formed so as to expose necessary portions of the conductor wiring patterns 16 and 16a from the openings. 10a has been fabricated.
[0029]
Since a large number of the high heat dissipation plastic packages 10a are formed on the sheet-like substrate similarly to the case of the high heat dissipation plastic package 10, after the semiconductor element and the like are mounted, the high heat dissipation plastic package 10a is finally cut. It is manufactured by cutting at a location 24. Further, a thermal via (not shown) connected to the heat radiating plate 12a and exposed from the opening of the solder resist film 17a is provided below the cavity portion 14 in which the semiconductor element is mounted, thereby generating heat from the semiconductor element. Can be further improved. On the back side of the radiator plate 12a below the cavity portion 14 in which the semiconductor element is mounted, a convex portion (not shown) similar to the stop portion 20 formed by the step 21 provided on the upper surface side of the radiator plate 12a. ) Can be formed, and a thermal via (not shown) similar to the above can be provided. Thereby, the heat radiation effect of the heat generated from the semiconductor element can be improved, and the occurrence of warpage of the heat radiation plate 12a can be prevented by forming uniform convex portions on both surfaces of the heat radiation plate 12a. Further, in the method of manufacturing the high heat radiation type plastic package 10a described above, the prepreg 25 and the Cu foil 23a are used to form the conductor wiring pattern 16a on the lower surface side of the heat sink 12a, but the conductor wiring pattern on the upper surface side is used. 16 may be formed using the same resin film 11 with Cu foil used as the resin film 11 with Cu foil used.
[0030]
Next, another method of manufacturing the high heat radiation type plastic package 10 according to the embodiment of the present invention and the modified high heat radiation type plastic package 10a will be described with reference to FIGS. 6A to 6D, another manufacturing method using the high heat radiation type plastic package 10 will be described as a representative.
As shown in FIG. 6A, a resin film 11 with a Cu foil for producing a high heat radiation type plastic package 10 is obtained by applying an adhesive resin 13 to a Cu foil 23 in the same manner as in all the above-described packages. The cutout 15 is formed in the resin film 11 with the Cu foil by a punching press machine.
[0031]
Next, as shown in FIG. 6B, a metal member having a high thermal conductivity such as Cu or a Cu alloy is used to radiate heat generated from the semiconductor element. A heat radiating plate 12 capable of improving the bonding strength when the surface is roughened and bonded to the bonding resin 13 is prepared. In addition, a holding jig 29 provided with a convex portion 28 that can be fitted into the notch 15 formed in the resin film 11 with a Cu foil and made of resin or metal is prepared. Further, a low melting point resin film 30 and a release film 31 to be sandwiched between the holding jig 29 and the resin film 11 with Cu foil are prepared.
[0032]
Next, as shown in FIG. 6C, the resin film 11 with the Cu foil is placed on the heat radiating plate 12 such that the bonding resin 13 side of the resin film 11 with the Cu foil is in contact with the heat radiating plate 12. Further, the release film 31 via the low melting point resin film 30 is placed on the cavity portion 14 and the resin film 11 with Cu foil, and is pressed from above the low melting point resin film 30 by the holding jig 29. Since the convex portion 28 of the holding jig 29 is fitted into the notch 15 of the resin film 11 with the Cu foil, the convex portion 28 allows the cavity portion 14 to be formed by the release film 31 via the low melting point resin film 30. Can be sealed. Then, in this state, the adhesive resin 13 is heated to join the resin film 11 with the Cu foil and the heat radiating plate 12, and the resin exuding the cavity 13 of the adhesive resin 13 into the low melting point resin film 30 is performed. The release film 31 intervenes.
[0033]
Next, as shown in FIG. 6D, after the resin film 11 with the Cu foil and the heat sink 12 are joined, the holding jig 29 is removed, and the release film 31 via the low melting point resin film 30 is further removed. are doing. After that, the high heat radiation type plastic package 10 and the modified high heat radiation type plastic package 10a are manufactured in the same manner as the above-described manufacturing method.
[0034]
【The invention's effect】
The high heat radiation type plastic package according to claim 1 or claim 2 or 3 is formed by bonding an adhesive resin to a Cu foil, and has a cutout for a cavity portion with a Cu foil. A high heat dissipation plastic package in which a resin film and a heat radiating plate are directly joined with an adhesive resin. The heat radiating plate is used to prevent resin exudation when the resin film with Cu foil is joined to the adhesive resin. Since the resin film with Cu foil and the heat radiating plate are not bonded using a post-adhesive material such as prepreg, the thickness of the package is thin, inexpensive, and a high heat radiation type plastic with good bonding accuracy. Package can be provided. In addition, it is possible to prevent the resin from leaking into the cavity when the bonding resin is joined, and to improve the mounting reliability of the semiconductor element.
[0035]
In particular, in the high heat radiation type plastic package according to the second aspect, the stopping portion has a step which can be mounted with a slight clearance in the notch. Resin seepage can be prevented, and the mounting reliability of the semiconductor element can be improved.
[0036]
Further, in the high heat radiation type plastic package according to the third aspect, since the stopping portion is formed by the groove formed along the periphery of the notch, it is possible to prevent the resin from leaking into the cavity portion of the bonding resin at the groove portion, The mounting reliability of the semiconductor element can be improved.
[0037]
The method of manufacturing a high heat radiation type plastic package according to claim 4, wherein the resin film with the Cu foil formed by bonding the adhesive resin to the Cu foil and forming a cutout for the cavity is bonded to the heat radiation plate. Forming a step or a groove along the periphery of a notch of a resin film with a Cu foil on a heat radiating plate, the method comprising: A step of heating the resin to join the resin film with the Cu foil and the heat sink and stopping the resin exudation of the adhesive resin with a step or groove, easily and accurately with the heat sink with the adhesive resin, It can be joined at once, and a thin and inexpensive high heat radiation type plastic package can be manufactured. In addition, the occurrence of resin exudation of the adhesive resin on the heat radiating plate in the cavity portion can be prevented by the step or the groove portion, the semiconductor device can be mounted with high bonding reliability of the semiconductor device, and the heat generated from the semiconductor device can be efficiently radiated. High heat radiation type plastic package can be manufactured.
[0038]
The method of manufacturing a high heat radiation type plastic package according to claim 5, wherein a resin film with a Cu foil formed by bonding a bonding resin to a Cu foil and forming a cutout for a cavity is bonded to the heat radiation plate. A method for manufacturing a high heat radiation type plastic package formed by directly joining with a resin for use, comprising: using a holding jig having a convex portion that can be fitted into a notch; Step of pressing on the resin film with Cu foil, heating the adhesive resin to join the resin film with Cu foil and the heat sink, and controlling the resin exudation of the adhesive resin with the release film via the low melting point resin film And a step of removing the holding jig and removing the release film through the low melting point resin film. , Accurately, can joined at a time, it can be produced small thickness inexpensive high heat dissipation plastic package. In addition, the release of the adhesive resin onto the heat sink in the cavity can be prevented by the release film via the low-melting resin film pressed by the holding jig, and the bonding reliability of the semiconductor element is increased. As a result, a high heat dissipation plastic package capable of efficiently dissipating heat generated from the semiconductor element can be manufactured.
[Brief description of the drawings]
FIGS. 1A and 1B are a perspective view and a longitudinal sectional view, respectively, of a high heat radiation type plastic package according to an embodiment of the present invention.
FIGS. 2A to 2C are a top perspective view, a bottom perspective view, and a longitudinal sectional view, respectively, of a high heat radiation type plastic package of the modification.
FIGS. 3A and 3B are explanatory views of a stop portion of a heat radiating plate of the high heat radiation type plastic package and the modified high heat radiation type plastic package, respectively.
FIGS. 4A to 4E are diagrams illustrating a method of manufacturing the high heat radiation type plastic package.
FIGS. 5A to 5E are diagrams illustrating a method of manufacturing a high heat radiation type plastic package according to the modification.
FIGS. 6A to 6D are diagrams illustrating another method of manufacturing the high heat radiation plastic package and the modified high heat radiation plastic package, respectively.
FIGS. 7A to 7D are explanatory views of a conventional method for manufacturing a high heat radiation plastic package.
[Explanation of symbols]
10, 10a: High heat radiation type plastic package, 11: Resin film with Cu foil, 12, 12a: Heat radiation plate, 13: Adhesive resin, 14: Cavity, 15: Notch, 16, 16a: Conductor wiring pattern, 17 , 17a: solder resist film, 18: through hole, 19: through hole, 20: stop, 21: step, 22: groove, 23, 23a: Cu foil, 24: cut, 25: prepreg, 26: hole, 27: Cu plating film, 28: convex portion, 29: holding jig, 30: low melting point resin film, 31: release film

Claims (5)

A resin film with a Cu foil formed by bonding an adhesive resin to a Cu foil, and a cutout for a cavity portion for mounting a semiconductor element in a substantially central portion in plan view is provided; A heat radiating plate for radiating heat generated from the semiconductor element is a high heat radiating plastic package directly joined with the bonding resin,
A high heat radiation type plastic package, wherein the heat radiation plate has a stopping portion for preventing resin seepage when the resin film with the Cu foil is bonded to the adhesive resin. 2. The high heat radiation type plastic package according to claim 1, wherein said stopping portion comprises a step which can be attached to said notch with a slight clearance. 2. The high heat radiation type plastic package according to claim 1, wherein said stopping portion comprises a groove formed along a peripheral edge of said notch. A resin film with a Cu foil formed by bonding an adhesive resin to a Cu foil and forming a cutout for a cavity portion for mounting a semiconductor element substantially in a central portion in plan view; A method for manufacturing a high heat radiation type plastic package in which a heat radiating plate for radiating heat generated from a direct bonding with the adhesive resin is formed.
A step of forming a step or a groove on the heat sink along the periphery of the notch of the resin film with the Cu foil;
A step of heating the bonding resin to join the resin film with the Cu foil to the heat sink and stopping resin exudation of the bonding resin at the step or groove. Manufacturing method of plastic package. A resin film with a Cu foil formed by bonding an adhesive resin to a Cu foil and forming a cutout for a cavity portion for mounting a semiconductor element substantially in a central portion in plan view; A method for manufacturing a high heat radiation type plastic package in which a heat radiating plate for radiating heat generated from a direct bonding with the adhesive resin is formed.
Pressing a release film through a low melting point resin film onto the cavity and the resin film with Cu foil using a holding jig having a convex portion that can be fitted into the notch of the resin film with Cu foil,
A step of heating the bonding resin to join the resin film with the Cu foil and the heat sink, and stopping resin exudation of the bonding resin with the release film via the low melting point resin film,
A method for manufacturing a high heat radiation type plastic package, comprising a step of removing the holding jig and a step of removing the release film via the low melting point resin film.

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