CN114126189B - Circuit board with embedded element and manufacturing method thereof - Google Patents
Circuit board with embedded element and manufacturing method thereof Download PDFInfo
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- CN114126189B CN114126189B CN202010890050.7A CN202010890050A CN114126189B CN 114126189 B CN114126189 B CN 114126189B CN 202010890050 A CN202010890050 A CN 202010890050A CN 114126189 B CN114126189 B CN 114126189B
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- layer
- heat transfer
- transfer channel
- conductive circuit
- side conductive
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000003466 welding Methods 0.000 claims abstract description 26
- 238000012546 transfer Methods 0.000 claims description 98
- 238000000016 photochemical curing Methods 0.000 claims description 21
- 239000012782 phase change material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 230000010354 integration Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 230
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 64
- 239000011889 copper foil Substances 0.000 description 36
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- 238000007747 plating Methods 0.000 description 24
- 239000012790 adhesive layer Substances 0.000 description 20
- 239000011241 protective layer Substances 0.000 description 14
- -1 polypropylene Polymers 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229920006380 polyphenylene oxide Polymers 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a manufacturing method of a circuit board with an embedded element, which comprises the following steps: providing a circuit substrate, wherein the circuit substrate comprises a first inner conductive circuit layer and a second outer conductive circuit layer; a cavity is formed in the circuit substrate, and the side surfaces of the first inner side conductive circuit layer and the second outer side conductive circuit layer are exposed to the cavity to form a first welding pad and a second welding pad respectively; providing an electronic element, wherein the electronic element comprises an element body and at least two pins electrically connected with the element body; and placing the electronic element in the cavity so that the two pins are respectively and electrically connected with the first welding pad and the second welding pad, thereby obtaining the circuit board with the embedded element. The circuit board manufactured by the manufacturing method provided by the invention has high element integration level. The invention also provides a circuit board with the embedded element manufactured by the manufacturing method.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board with embedded elements and a manufacturing method thereof.
Background
With the progress of technology, electronic products such as mobile phones and notebook computers are being developed in the direction of light weight, high density and high performance. For this reason, the technology of embedding devices is becoming more and more popular in the industry. However, the application of the conventional embedding technology easily results in a smaller integration level of the embedded component, and the problem of heat dissipation of the component is difficult to solve.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a circuit board with high element integration.
In addition, it is also necessary to provide a circuit board with embedded components manufactured by the manufacturing method.
The invention provides a manufacturing method of a circuit board with an embedded element, which comprises the following steps:
providing a circuit substrate, wherein the circuit substrate comprises a base layer, a first inner side conductive circuit layer, a first outer side conductive circuit layer and a second outer side conductive circuit layer, wherein the first inner side conductive circuit layer and the first outer side conductive circuit layer are sequentially overlapped on one side of the base layer, and the second outer side conductive circuit layer is overlapped on the other side of the base layer;
a cavity is formed in the circuit substrate, the cavity penetrates through the second outer side conductive circuit layer, the base layer and the first inner side conductive circuit layer in sequence, and the side surfaces of the first inner side conductive circuit layer and the second outer side conductive circuit layer are exposed to the cavity to form a first welding pad and a second welding pad respectively;
providing an electronic element, wherein the electronic element comprises an element body and at least two pins electrically connected with the element body; and
and placing the electronic element in the cavity so that the two pins are respectively and electrically connected with the first welding pad and the second welding pad, thereby obtaining the circuit board with the embedded element.
The invention also provides a circuit board with embedded components, comprising:
the circuit substrate comprises a base layer, a first inner side conductive circuit layer, a first outer side conductive circuit layer and a second outer side conductive circuit layer, wherein the first inner side conductive circuit layer and the first outer side conductive circuit layer are sequentially overlapped on one side of the base layer, the second outer side conductive circuit layer is overlapped on the other side of the base layer, a cavity is formed in the circuit substrate, the cavity sequentially penetrates through the second outer side conductive circuit layer, the base layer and the first inner side conductive circuit layer, and the side surfaces of the first inner side conductive circuit layer and the second outer side conductive circuit layer are exposed to the cavity to form a first welding pad and a second welding pad respectively; and
the electronic element is arranged in the cavity and comprises an element body and at least two pins electrically connected with the element body, and the two pins are respectively electrically connected with the first welding pad and the second welding pad.
According to the invention, the electronic element is placed in the cavity, and the two pins are respectively and electrically connected with the first welding pad and the second welding pad, so that the electronic element is electrically connected with the first inner side conductive circuit layer and the second inner side conductive circuit layer, and the integration level of the circuit board with the embedded element is improved.
Drawings
Fig. 1 is a schematic structural diagram of a first copper-clad substrate according to a preferred embodiment of the present invention.
Fig. 2 is a schematic structural diagram of the first copper-clad substrate shown in fig. 1 after a first through hole and a second through hole are formed therein.
Fig. 3 is a schematic structural view of the first copper foil layer and the second copper foil layer shown in fig. 2 after forming a first copper plating layer and a second copper plating layer, respectively.
Fig. 4 is a schematic diagram of the structure of the first copper-plated layer and the first copper foil layer, and the second copper-plated layer and the second copper foil layer shown in fig. 3 after etching.
Fig. 5 is a schematic structural diagram of the first inner conductive trace layer and the second inner conductive trace layer shown in fig. 4 after forming a second copper-clad substrate and a third copper-clad substrate thereon.
Fig. 6 is a schematic structural diagram of the second copper-clad substrate shown in fig. 5 after the first, second and third slots are formed therein, and the third copper-clad substrate is formed with the fourth slot therein.
Fig. 7 is a schematic structural view of the third copper foil layer and the fourth copper foil layer shown in fig. 6 after forming a third copper plating layer and a fourth copper plating layer, respectively.
Fig. 8 is a schematic view of the structure of the third copper-plated layer and the third copper foil layer, and the fourth copper-plated layer and the fourth copper foil layer shown in fig. 7 after etching.
Fig. 9 is a schematic structural view of the first and second outer conductive trace layers shown in fig. 8 after forming first and second peelable films, respectively.
Fig. 10 is a schematic diagram of a structure of the second peelable film, the second outer conductive trace layer, the second insulating layer, the second adhesive layer, the second inner conductive trace layer, the base layer, the first inner conductive trace layer, and the first adhesive layer shown in fig. 9 after cutting.
Fig. 11 is a schematic structural diagram of the first, second and third bonding pads shown in fig. 10 after photo-curing paste is formed on the bonding pads.
Fig. 12 is a schematic view of the structure of fig. 11 after the first and second peelable films are removed, respectively.
Fig. 13 is a schematic structural diagram of an electronic component according to a preferred embodiment of the present invention.
Fig. 14 is a schematic view of the structure of the electronic component shown in fig. 13 after being placed in the cavity shown in fig. 12.
Fig. 15 is a schematic view of the structure after filling the gap shown in fig. 14 with a thermally conductive phase change material.
Fig. 16 is a schematic structural diagram of a circuit board with embedded components obtained by forming a first protective layer and a second protective layer on the first outer conductive circuit layer and the second outer conductive circuit layer shown in fig. 15, respectively.
Description of the main reference signs
Circuit board 100 with embedded components
First copper-clad substrate 10
Base layer 101
First copper foil layer 102
Second copper foil layer 103
First copper plating layer 104
Second copper plating layer 105
First through hole 11
Second through hole 12
First heat conduction part 13
Second heat conduction part 14
First inner conductive trace layer 20
First bonding pad 201
Second inner conductive line layer 21
Third bonding pad 211
Second copper-clad substrate 30
First insulating layer 301
Third copper foil layer 302
Third copper plating layer 303
Third copper-clad substrate 31
Second insulating layer 311
Fourth copper foil layer 312
Fourth copper plating layer 313
First slot 32
Second slot 33
Third slot 34
Fourth slot 35
First heat transfer portion 36
Second heat transfer portion 37
Third heat transfer portion 38
Fourth heat transfer portion 39
First adhesive layer 40
Second adhesive layer 41
First outer conductive trace layer 50
First heat collection area 501
Third heat collection area 502
Second heat collecting region 503
Second outside conductive trace layer 51
Second bonding pad 511
Circuit board 52
First peelable film 60
Second peelable film 61
Cavity 70
Side wall 701
Photo-curing paste 71
Electronic component 80
Element body 801
Pin 802
Thermally conductive phase change material 81
First protective layer 90
Second protective layer 91
Third adhesive layer 92
Fourth adhesive layer 93
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention will be described in detail below with reference to the drawings and preferred embodiments thereof, in order to further explain the technical means and effects of the invention to achieve the intended purpose.
The preferred embodiment of the invention provides a manufacturing method of a circuit board with an embedded element, which comprises the following steps:
in step S11, referring to fig. 1, a first copper-clad substrate 10 is provided.
In this embodiment, the first copper-clad substrate 10 includes a base layer 101, a first copper foil layer 102 and a second copper foil layer 103 formed on opposite sides of the base layer 101.
The material of the base layer 101 may be one selected from epoxy resin (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the base layer 101 is made of polyimide.
In step S12, referring to fig. 2, at least one first through hole 11 and at least one second through hole 12 are formed in the first copper-clad substrate 10.
The first through hole 11 and the second through hole 12 sequentially penetrate the second copper foil layer 103, the base layer 101 and the first copper foil layer 102. The aperture of the first through hole 11 is smaller than the aperture of the second through hole 12.
In step S13, referring to fig. 3, a first copper plating layer 104 and a second copper plating layer 105 are formed on the first copper foil layer 102 and the second copper foil layer 103, respectively.
Specifically, copper is plated on the first copper foil layer 102 and the second copper foil layer 103, respectively, to form the first copper plating layer 104 and the second copper plating layer 105. Wherein copper plating material is also filled in the first and second through holes 11 and 12 to form first and second heat conductive portions 13 and 14, respectively.
In step S14, referring to fig. 4, the first copper plating layer 104 and the first copper foil layer 102 are etched to form a first inner conductive trace layer 20, and the second copper plating layer 105 and the second copper foil layer 103 are etched to form a second inner conductive trace layer 21.
In the present embodiment, the first copper plating layer 104 and the first copper foil layer 102, and the second copper plating layer 105 and the second copper foil layer 103 are etched by an exposure and development process.
In step S15, referring to fig. 5, a second copper-clad substrate 30 and a third copper-clad substrate 31 are respectively formed on the first inner conductive trace layer 20 and the second inner conductive trace layer 21.
In this embodiment, the second copper-clad substrate 30 includes a first insulating layer 301 and a third copper foil layer 302 formed on one surface of the first insulating layer 301, and the third copper-clad substrate 31 includes a second insulating layer 311 and a fourth copper foil layer 312 formed on one surface of the second insulating layer 311. The materials of the first insulating layer 301 and the second insulating layer 311 may be the same as those of the base layer 101, which will not be described in detail herein.
Specifically, the first insulating layer 301 is adhered to the first inner conductive trace layer 20 by the first adhesive layer 40, and the second insulating layer 311 is adhered to the second inner conductive trace layer 21 by the second adhesive layer 41.
In step S16, referring to fig. 6, at least one first slot 32, at least one second slot 33 and at least one third slot 34 are formed in the second copper-clad substrate 30, and at least one fourth slot 35 is formed in the third copper-clad substrate 31.
The first slot 32, the second slot 33, and the third slot 34 penetrate through the third copper foil layer 302 and the first insulating layer 301, and the bottoms of the first slot 32, the second slot 33, and the third slot 34 correspond to the first inner conductive trace layer 20. The aperture of the first slot 32, the aperture of the second slot 33, and the aperture of the third slot 34 are sequentially increased. The aperture of the second slot 33 is substantially equal to the aperture of the first through hole 11, and the aperture of the third slot 34 is substantially equal to the aperture of the second through hole 12.
The fourth slot 35 penetrates the fourth copper foil layer 312 and the second insulating layer 311, and the bottom of the fourth slot 35 corresponds to the second inner conductive circuit layer 21. The aperture of the fourth groove 35 is substantially equal to the aperture of the second through hole 12.
In step S17, referring to fig. 7, a third copper plating layer 303 and a fourth copper plating layer 313 are formed on the third copper foil layer 302 and the fourth copper foil layer 312, respectively.
Specifically, copper is plated on the third copper foil layer 302 and the fourth copper foil layer 312, respectively, to form the third copper plated layer 303 and the fourth copper plated layer 313. Wherein copper plating material is further filled in the first, second, third and fourth grooves 32, 33, 34 and 35 to form first, second, third and fourth heat transfer portions 36, 37, 38 and 39, respectively. Wherein the first heat transfer portion 36 forms a first heat transfer channel (not shown), the second heat transfer portion 37 is in thermal communication with the first heat transfer portion 13 and forms a third heat transfer channel (not shown), and the third heat transfer portion 38, the second heat transfer portion 14, and the fourth heat transfer portion 39 are in thermal communication with each other to form a second heat transfer channel (not shown). It will be appreciated that the inner diameters of the first heat transfer passage, the third heat transfer passage and the second heat transfer passage increase in sequence. The distances between the first heat transfer channel, the third heat transfer channel and the second heat transfer channel and the subsequent electronic component are sequentially increased, and the inner diameters of the first heat transfer channel, the third heat transfer channel and the second heat transfer channel are sequentially set to be increased, so that the heat quantity transmitted through the first heat transfer channel, the third heat transfer channel and the second heat transfer channel in the subsequent light curing process is equivalent, and the welding yield is improved.
In step S18, referring to fig. 8, the third copper plating layer 303 and the third copper foil layer 302 are etched to form the first outer conductive trace layer 50, and the fourth copper plating layer 313 and the fourth copper foil layer 312 are etched to form the second outer conductive trace layer 51, thereby obtaining a trace substrate 52.
The first outer conductive circuit layer 50 includes a first heat collecting area 501 perpendicular to the first heat transfer channel, a third heat collecting area 502 perpendicular to the third heat transfer channel, and a second heat collecting area 503 perpendicular to the second heat transfer channel. The first heat collecting region 501, the third heat collecting region 502 and the second heat collecting region 503 are in thermal communication with the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, respectively. The first heat collecting region 501, the third heat collecting region 502 and the second heat collecting region 503 are used to transfer heat absorbed from the outside to the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, respectively.
In the present embodiment, the third copper plating layer 303 and the third copper foil layer 302, and the fourth copper plating layer 313 and the fourth copper foil layer 312 may be etched by an exposure and development process.
The first heat transfer channel is communicated with the first outer conductive line layer 50 and the first inner conductive line layer 20, the third heat transfer channel is communicated with the first outer conductive line layer 50, the first inner conductive line layer 20 and the second inner conductive line layer 21, and the second heat transfer channel is communicated with the first outer conductive line layer 50, the first inner conductive line layer 20, the second inner conductive line layer 21 and the second outer conductive line layer 51.
In step S19, referring to fig. 9, a first peelable film 60 and a second peelable film 61 are formed on the first outer conductive trace layer 50 and the second outer conductive trace layer 51, respectively.
In step S20, referring to fig. 10, the second peelable film 61, the second outer conductive trace layer 51, the second insulating layer 311, the second adhesive layer 41, the second inner conductive trace layer 21, the base layer 101, the first inner conductive trace layer 20 and the first adhesive layer 40 are cut to form a cavity 70.
Wherein the cavity 70 comprises a sidewall 701. In this embodiment, the cavity 70 sequentially penetrates the second peelable film 61, the second outer conductive trace layer 51, the second insulating layer 311, the second adhesive layer 41, the second inner conductive trace layer 21, the base layer 101, the first inner conductive trace layer 20, and the first adhesive layer 40. The bottom of the cavity 70 corresponds to the first insulating layer 301.
The side surface of the first inner conductive trace layer 20, the side surface of the second inner conductive trace layer 21, and the side surface of the second outer conductive trace layer 51 are exposed to the cavity 70 to form a first bonding pad 201, a third bonding pad 211, and a second bonding pad 511, respectively.
In step S21, referring to fig. 11, a photo-curing paste 71 is formed on the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511, respectively.
Wherein the photo-curable paste 71 is located in the cavity 70. The photo-curable paste 71 may be photo-cured. In this embodiment, the photo-curable paste 71 may be a solder paste. In this embodiment, the photo-curing paste 71 is electrically connected to the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511.
In step S22, referring to fig. 12, the first peelable film 60 and the second peelable film 61 are removed respectively.
In step S23, referring to fig. 13, an electronic component 80 is provided.
In this embodiment, the electronic component 80 includes a component body 801 and at least two pins 802 electrically connected to the component body 801. The pins 802 may be disposed on two sides of the device body 801. Fig. 13 only shows three of the pins 802 on opposite sides of the electronic component 80. In practice, the number of pins 802 may be varied as desired.
In step S24, referring to fig. 14, the electronic component 80 is placed in the cavity 70 so that three pins 802 respectively correspond to the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511, and the photo-curing paste 71 is photo-cured.
After photo-curing, the three pins 802 are electrically connected to the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511 through the photo-curing paste 71, so that the electronic component 80 is electrically connected to the first inner conductive trace layer 20, the second inner conductive trace layer 21 and the second outer conductive trace layer 51. The bottom of the electronic component 80 abuts against the first insulating layer 301, which is beneficial to improving the soldering precision.
Wherein the light source may be disposed on one side of the first outer conductive trace layer 50. The heat generated by the light can be absorbed by the first heat collecting region 501, the third heat collecting region 502 and the second heat collecting region 503 and then transferred to the photo-curing paste 71 through the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, respectively, so that the photo-curing paste 71 is cured. Since the photo-curing is only performed on one side of the first outer conductive trace layer 50, i.e., double-sided photo-curing is not required, the process is simplified and the cost is reduced.
The inner diameters of the first heat transfer channel, the third heat transfer channel and the second heat transfer channel are sequentially set to be increased, so that heat generated by illumination is favorably equivalent to heat transmitted by the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, and the welding yield is improved.
It will be appreciated that a gap (not shown) is formed between the electronic component 80 and the side wall 701.
In step S25, referring to fig. 15, the gap is filled with a thermally conductive phase change material 81.
The thermally conductive phase change material 81 may be used to absorb heat generated by the electronic component 80 and also to secure the electronic component 80 within the cavity 70.
In step S26, referring to fig. 16, a first protection layer 90 and a second protection layer 91 are formed on the first outer conductive trace layer 50 and the second outer conductive trace layer 51, respectively, so as to obtain the circuit board 100 with embedded components.
The first protective layer 90 is adhered to the first outer conductive trace layer 50 by a third adhesive layer 92, and the second protective layer 91 is adhered to the second outer conductive trace layer 51 by a fourth adhesive layer 93. The first protection layer 90 is used for protecting the first outer conductive trace layer 50, and the second protection layer 91 is used for protecting the second outer conductive trace layer 51. The first protective layer 90 and the second protective layer 91 may be solder masks, or may be cover films (CVLs).
Referring to fig. 16, the present invention further provides a circuit board 100 with embedded components, wherein the circuit board 100 with embedded components includes a circuit substrate 52, an electronic component 80, a photo-curing paste 71, a thermally conductive phase-change material 81, a first protection layer 90 and a second protection layer 91.
In this embodiment, the circuit board 52 includes a base layer 101, a first inner conductive circuit layer 20, a first adhesive layer 40, a first insulating layer 301, a first outer conductive circuit layer 50, and a second inner conductive circuit layer 21, a second adhesive layer 41, a second insulating layer 311, and a second outer conductive circuit layer 51, which are stacked on one side of the base layer 101 in this order.
The material of the base layer 101 may be one selected from epoxy resin (PP), BT resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polypropylene (PP), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the base layer 101 is made of polyimide. The material of the first insulating layer 301 and the second insulating layer 311 may be the same as that of the base layer 101, which will not be described in detail herein.
The circuit substrate 52 has a cavity 70 formed therein. Wherein the cavity 70 comprises a sidewall 701. In this embodiment, the cavity 70 sequentially penetrates the second outer conductive trace layer 51, the second insulating layer 311, the second adhesive layer 41, the second inner conductive trace layer 21, the base layer 101, the first inner conductive trace layer 20, and the first adhesive layer 40. The bottom of the cavity 70 corresponds to the first insulating layer 301.
The side surface of the first inner conductive trace layer 20, the side surface of the second inner conductive trace layer 21, and the side surface of the second outer conductive trace layer 51 are exposed to the cavity 70 to form a first bonding pad 201, a third bonding pad 211, and a second bonding pad 511, respectively.
In the present embodiment, the circuit substrate 52 is provided with a first heat transfer channel, a third heat transfer channel, and a second heat transfer channel. The distances between the first heat transfer channel, the third heat transfer channel, and the second heat transfer channel and the electronic component 80 are sequentially increased, and the inner diameters of the first heat transfer channel, the third heat transfer channel, and the second heat transfer channel are sequentially increased. This is advantageous in that the amount of heat generated by illumination transferred through the first heat transfer channel, the third heat transfer channel, and the second heat transfer channel is comparable, thereby improving the welding yield.
The first outer conductive circuit layer 50 includes a first heat collecting area 501 perpendicular to the first heat transfer channel, a third heat collecting area 502 perpendicular to the third heat transfer channel, and a second heat collecting area 503 perpendicular to the second heat transfer channel. The first heat collecting region 501, the third heat collecting region 502 and the second heat collecting region 503 are in thermal communication with the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, respectively. The first heat collecting region 501, the third heat collecting region 502 and the second heat collecting region 503 are used to transfer heat absorbed from the outside to the first heat transfer channel, the third heat transfer channel and the second heat transfer channel, respectively.
The first heat transfer channel is communicated with the first outer conductive line layer 50 and the first inner conductive line layer 20, the third heat transfer channel is communicated with the first outer conductive line layer 50, the first inner conductive line layer 20 and the second inner conductive line layer 21, and the second heat transfer channel is communicated with the first outer conductive line layer 50, the first inner conductive line layer 20, the second inner conductive line layer 21 and the second outer conductive line layer 51.
The electronic component 80 is mounted in the cavity 70, and the bottom of the electronic component 80 abuts against the first insulating layer 301. In this embodiment, the electronic component 80 includes a component body 801 and at least two pins 802 electrically connected to the component body 801. The pins 802 may be disposed on two sides of the device body 801. Fig. 16 only shows three of the pins 802 on opposite sides of the electronic component 80. In practice, the number of pins 802 may be varied as desired. It will be appreciated that a gap (not shown) is formed between the electronic component 80 and the side wall 701.
The photo-curing paste 71 is disposed on the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511 and is located in the cavity 70. The photo-curing paste 71 is used for electrically connecting the first bonding pad 201, the third bonding pad 211, the second bonding pad 511 and the three pins 802, so that the electronic component 80 is electrically connected with the first inner conductive trace layer 20, the second inner conductive trace layer 21 and the second outer conductive trace layer 51. The photo-curing paste 71 may be disposed only at one side of the electronic component 80 without being disposed at both sides of the electronic component 80, thereby reducing costs.
The thermally conductive phase change material 81 fills in the gaps. The thermally conductive phase change material 81 may be used to absorb heat generated by the electronic component 80 and also to secure the electronic component 80 within the cavity 70.
The first protective layer 90 and the second protective layer 91 are respectively formed on the first outer conductive trace layer 50 and the second outer conductive trace layer 51. The first protective layer 90 is adhered to the first outer conductive trace layer 50 by a third adhesive layer 92, and the second protective layer 91 is adhered to the second outer conductive trace layer 51 by a fourth adhesive layer 93. The first protection layer 90 is used for protecting the first outer conductive trace layer 50, and the second protection layer 91 is used for protecting the second outer conductive trace layer 51. The first protective layer 90 and the second protective layer 91 may be solder masks, or may be cover films (CVLs).
In the present invention, the electronic component 80 is placed in the cavity 70, and the three pins 802 are electrically connected to the first bonding pad 201, the third bonding pad 211 and the second bonding pad 511 respectively, so that the electronic component 80 is electrically connected to the first inner conductive trace layer 20, the second inner conductive trace layer 21 and the second outer conductive trace layer 51, thereby improving the integration of the circuit board 100 with embedded components, and the prepared circuit board 100 with embedded components has higher flatness.
The invention also fills the gap with the heat-conducting phase-change material 81, and when the heat-conducting phase-change material 81 changes phase, the heat generated by the electronic element 80 can be absorbed, so that the heat dissipation effect of the electronic element 80 is enhanced. The inner diameters of the first heat transfer channel, the third heat transfer channel and the second heat transfer channel are sequentially set to be increased, which is beneficial to the heat quantity transmitted by the first heat transfer channel, the third heat transfer channel and the second heat transfer channel through the heat quantity generated by illumination, and the heat quantity absorbed by the first heat collection area 501, the third heat collection area 502 and the second heat collection area 503 is transmitted to the photo-curing paste 71 through the first heat transfer channel, the third heat transfer channel and the second heat transfer channel respectively, so that the photo-curing paste 71 is cured, and the welding yield is improved.
The invention also places the bottom of the electronic component 80 on the first insulating layer 301, so as to ensure the alignment of the pins 802 and the conductive traces of each layer of the circuit board 100 with embedded components during photo-curing.
The above description is only one preferred embodiment of the present invention, but is not limited to this embodiment during actual application. Other modifications and variations to the present invention will be apparent to those of ordinary skill in the art in light of the present teachings.
Claims (6)
1. The manufacturing method of the circuit board with the embedded element is characterized by comprising the following steps of:
providing a circuit substrate, wherein the circuit substrate comprises a base layer, a first inner side conductive circuit layer, a first outer side conductive circuit layer and a second outer side conductive circuit layer, wherein the first inner side conductive circuit layer and the first outer side conductive circuit layer are sequentially overlapped on one side of the base layer, the second outer side conductive circuit layer is overlapped on the other side of the base layer, and a first heat transfer channel and a second heat transfer channel are arranged in the circuit substrate;
a cavity is formed in the circuit substrate, the cavity penetrates through the second outer side conductive circuit layer, the base layer and the first inner side conductive circuit layer in sequence, the side surfaces of the first inner side conductive circuit layer and the second outer side conductive circuit layer are exposed to the cavity to form a first welding pad and a second welding pad respectively, the first heat transfer channel is communicated with the first outer side conductive circuit layer and the first inner side conductive circuit layer, the second heat transfer channel is communicated with the first outer side conductive circuit layer, the first inner side conductive circuit layer and the second outer side conductive circuit layer, and the inner diameters of the first heat transfer channel and the second heat transfer channel are increased in sequence;
forming photo-curing paste on the first bonding pad and the second bonding pad respectively;
providing an electronic element, wherein the electronic element comprises an element body and at least two pins electrically connected with the element body, and the distances between the first heat transfer channel and the electronic element and the distances between the second heat transfer channel and the electronic element are sequentially increased; and
and placing the electronic element in the cavity so that the two pins are respectively and electrically connected with the first welding pad and the second welding pad through the photo-curing paste, thereby obtaining the circuit board with the embedded element.
2. The method of manufacturing a circuit board with embedded components of claim 1, wherein the cavity includes a sidewall, a gap is formed between the electronic component and the sidewall, the method further comprising:
and filling the gap with a heat-conducting phase-change material.
3. The method of claim 1, wherein the circuit board further comprises a second inner conductive trace layer between the base layer and the second outer conductive trace layer, wherein a side of the second inner conductive trace layer is exposed to the cavity to form a third bonding pad, and the leads of the electronic component are further electrically connected to the third bonding pad.
4. A circuit board with embedded components, comprising:
the circuit substrate comprises a base layer, a first inner side conductive circuit layer and a first outer side conductive circuit layer which are sequentially overlapped on one side of the base layer, and a second outer side conductive circuit layer which is sequentially overlapped on the other side of the base layer, wherein a cavity, a first heat transfer channel and a second heat transfer channel are formed in the circuit substrate, the cavity sequentially penetrates through the second outer side conductive circuit layer, the base layer and the first inner side conductive circuit layer, the side surfaces of the first inner side conductive circuit layer and the second outer side conductive circuit layer are exposed to the cavity to form a first welding pad and a second welding pad respectively, the first heat transfer channel is communicated with the first outer side conductive circuit layer and the first inner side conductive circuit layer, the second heat transfer channel is communicated with the first outer side conductive circuit layer, the first inner side conductive circuit layer and the second outer side conductive circuit layer, and the inner diameters of the first heat transfer channel and the second heat transfer channel are sequentially increased; and
the electronic component is arranged in the cavity and comprises an element body and at least two pins electrically connected with the element body, the two pins are respectively and electrically connected with the first welding pad and the second welding pad through photo-curing paste, and the distances between the first heat transfer channel and the second heat transfer channel and the electronic component are sequentially increased.
5. The circuit board with embedded component of claim 4, wherein the cavity comprises a sidewall, a gap is formed between the electronic component and the sidewall, and the gap is filled with a thermally conductive phase change material.
6. The circuit board with embedded component of claim 4, wherein the circuit substrate further comprises a second inner conductive trace layer between the base layer and the second outer conductive trace layer, a side of the second inner conductive trace layer being exposed to the cavity to form a third bond pad, the leads of the electronic component further being electrically connected to the third bond pad.
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| CN202010890050.7A CN114126189B (en) | 2020-08-28 | 2020-08-28 | Circuit board with embedded element and manufacturing method thereof |
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| CN202010890050.7A CN114126189B (en) | 2020-08-28 | 2020-08-28 | Circuit board with embedded element and manufacturing method thereof |
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| CN114126189B true CN114126189B (en) | 2023-08-04 |
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| CN117641756A (en) * | 2022-08-16 | 2024-03-01 | 宏启胜精密电子(秦皇岛)有限公司 | Buried flexible circuit board and preparation method thereof |
| CN118201239A (en) * | 2022-12-12 | 2024-06-14 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104254202A (en) * | 2013-06-28 | 2014-12-31 | 富葵精密组件(深圳)有限公司 | Circuit board with embedded electronic component and manufacturing method of circuit board |
| CN106488652A (en) * | 2015-08-25 | 2017-03-08 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible PCB and preparation method thereof |
| CN108767084A (en) * | 2018-04-24 | 2018-11-06 | 湖南省方正达电子科技有限公司 | A kind of printed circuit and preparation method thereof of three-dimensional assembling LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102380304B1 (en) * | 2015-01-23 | 2022-03-30 | 삼성전기주식회사 | A printed circuit board comprising embeded electronic component within and a method for manufacturing |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104254202A (en) * | 2013-06-28 | 2014-12-31 | 富葵精密组件(深圳)有限公司 | Circuit board with embedded electronic component and manufacturing method of circuit board |
| CN106488652A (en) * | 2015-08-25 | 2017-03-08 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible PCB and preparation method thereof |
| CN108767084A (en) * | 2018-04-24 | 2018-11-06 | 湖南省方正达电子科技有限公司 | A kind of printed circuit and preparation method thereof of three-dimensional assembling LED |
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