JP2009182216A - Method of manufacturing wiring circuit board for mounting electronic component, the wiring circuit board for mounting electronic component, and wiring circuit board with the electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To develop a technique capable of securing such a non-through-hole (cavity) in a wiring circuit board for mounting of a small electronic component as to have a flat surface as the bottom of the hole on which such a small electronic component as a semiconductor element can be mounted and also capable of preventing or suppressing flowing of an adhesive from an adhesive layer for adhesion between wiring circuit boards into the non-through hole. <P>SOLUTION: In a method of manufacturing a wiring circuit board for mounting of an electronic component, a trapezoidal projection 14a is formed on a metallic pad 14 on a substrate 11 by pattern etching, the obtained substrate 11 with the projection and a wiring circuit board 12 having a through-hole 12c formed therein are joined to each other with an adhesive layer 13 disposed therebetween, the trapezoidal projection 14a is accommodated within a communication hole including the through-hole 12c of the wiring circuit board 12 and an opening 13a passed through the adhesive layer 13, and a non-through-hole 15 for mounting of a small electronic component, which hole has the trapezoidal projection 14a as its bottom, is secured in the communication hole. The wiring circuit board for mounting the electronic component and the wiring circuit board with the electronic component are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring board for mounting an electronic component having a cavity (non-through hole for mounting a small electronic component) for mounting a small electronic component such as a semiconductor element such as a light emitting device, and wiring for mounting the electronic component The present invention relates to a substrate and a wiring substrate with electronic components.

FIG. 14 shows a known example disclosed in Patent Document 1.
This method relates to the formation of a non-through hole for interlayer connection of a multilayer printed wiring board, and particularly a small-diameter non-through hole having a diameter of 0.4 mm or less. In Examples 1 and 2 of Patent Document 1, a 250 μm non-through hole is formed.
As shown in FIG. 14A, the adhesive layer 120 is bonded to the wiring substrate 110, and the wiring substrate 100 with the adhesive layer in which the through hole 130 penetrating the wiring substrate 110 and the adhesive layer 120 is formed. . The through hole 130 penetrating the wiring board 100 with the adhesive layer is formed to obtain an interlayer connection through hole, and the through hole 111 formed in the wiring board 110 and the adhesive layer 120 are wired. An opening 121 (through hole) that is substantially the same size as the through hole 111 of the substrate 110 and is formed at a position corresponding to the through hole 111 of the wiring substrate 110 is communicated with each other. For example, after temporarily bonding the adhesive layer 120 to the wiring board 110, a hole penetrating the wiring board 110 and the adhesive layer 120 is formed by drilling. In this case, the position and the size of the through hole 111 of the wiring board 110 and the through hole (opening 121) of the adhesive layer 120 coincide with each other.

As shown in FIG. 14D, the wiring board 110 in which such a through hole 130 is processed and another wiring board 140 (hereinafter, also referred to as a base-side wiring board) are laminated under pressure and heating. The base-side wiring board 140 is previously provided with a metal pad 141 and an external dome-shaped (hemispherical) protrusion 142 made of a conductive material at a position corresponding to the through hole 130.
The metal pad 141 is designed to have a size larger than the cross section of the through hole 130 (FIGS. 14B and 14D). As shown in FIG. 14C, a dome-like protrusion 142 having an appearance smaller than the cross section of the through hole 130 is formed at the center of the metal pad 141 by conductive paste printing. Then, as shown in FIG. 14D, the base-side wiring board 140 on which the metal pads 141 and the protrusions 142 are formed and the wiring board 100 with an adhesive layer in which the through holes 130 are processed are overlapped. By pressurizing and heating and laminating and bonding, the base-side wiring substrate 140 makes the through hole 130 non-penetrating, and an interlayer connection non-through hole 150 (hereinafter also simply referred to as non-through hole) is formed.
In the technique described in Patent Document 1, the protrusion 142 functions to prevent the adhesive from flowing into the non-through hole 150, and as a result, the connection area between the inner layer wiring and the outer layer wiring in the non-through hole 150. Can be secured sufficiently.
Japanese Patent Application Laid-Open No. 07-015140

The technique described in Patent Document 1 is intended for interlayer connection of multilayer printed wiring boards, and cannot support mounting of small electronic components such as semiconductor elements.
Since the technique described in Patent Document 1 is not intended to mount a small electronic component in the non-through hole 150, the non-through hole 150 is intended to have a small diameter so as to meet the purpose of interlayer connection. . Further, in order to mount a surface mount type small electronic component such as a light emitting element (semiconductor element) on a wiring board, it is necessary to secure a flat surface for mounting on the wiring board. In the described technique, the presence of the dome-shaped protrusion 142 becomes an obstacle to mounting a small electronic component in the non-through hole 150.
It is impossible to mount a small electronic component in the non-through hole 150 due to the size of the non-through hole 150 and the shape of the protrusion 142.

In addition, the non-through hole for interlayer connection is a round hole with a diameter of about 0.4 mm at the maximum, but the size of the non-through hole 150 required for mounting small electronic components is more than twice the size of the non-through hole for interlayer connection. It is. In this way, when the size of the non-through hole is greatly increased compared to the case of the interlayer connection, it has been found that the problem of the outflow of the adhesive into the non-through hole shown in the above known example is likely to occur. It was.
When the size of the non-through hole 150 is increased, to prevent the adhesive 142 from flowing out by the protrusion 142, the size of the dome-shaped protrusion 142 is also increased. However, the dome-shaped protrusion formed by conductive paste printing is used. 142 becomes difficult to form in a desired shape as the size increases. For this reason, the gap between the opening edge portion of the through hole 111 in the wiring substrate 110 and the outer peripheral portion of the dome-shaped protrusion 142 may partially increase, and the adhesive flows into the non-through hole. This is likely to occur.

As described above, the technique according to Patent Document 1 cannot cope with mounting of small electronic components such as semiconductor elements.
In addition, until now, it is possible to support mounting of surface mount type small electronic components such as semiconductor elements, and the adhesive layer adhesive for bonding a pair of substrates (wiring substrates 110 and 140 in Patent Document 1). Appropriate technology that can prevent the outflow of non-through holes for storing small electronic components and prevent the outflow of adhesive into non-through holes from affecting the mounting of small electronic components at a low cost There was no need to develop it.

  In view of the above problems, the present invention secures a sufficient area for mounting a surface mount type small electronic component such as a semiconductor element on the bottom (hole bottom) of a non-through hole (cavity portion) for mounting a small electronic component. Manufacturing method of wiring board for mounting electronic component, wiring board for mounting electronic component, which can obtain flat end surface (bottom surface of cavity portion) and hardly cause adhesive to flow into non-through hole for mounting small electronic component The purpose is to provide a wiring board with electronic components.

The present invention provides the following means in order to solve the above problems.
A first invention is a method for manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring board having a through hole to the substrate through an adhesive layer, A step of providing a metal pad larger than a cross section perpendicular to the central axis of the through hole of the wiring board on the inside of the portion to be etched by half-etching and thinning a portion excluding the central portion of the metal pad A step of forming a plate-like protrusion having a flat surface that is substantially the same as the cross-section of the through-hole of the wiring board and can be accommodated in the through-hole, and having an end surface on the protruding tip side; And the wiring board through the adhesive layer, the through hole of the wiring board and the opening formed in the adhesive layer are in communication holes formed in communication with each other. Storing the trapezoidal protrusion With, as a non-penetrating the communicating holes, to provide a method of manufacturing an electronic parts mounting wiring board, characterized by comprising a step of obtaining the non-through hole for small electronic parts mounting.
A second invention is a method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring board having a through hole to the substrate through an adhesive layer, A step of providing a metal pad larger than a cross section perpendicular to the central axis of the through hole of the wiring board, and thickening a central portion of the metal pad by a pattern plating method to form the cross section of the through hole of the wiring board. And a step of forming a trapezoidal protrusion having a flat surface of a size that can be accommodated in the through hole as an end surface on the protruding tip side, and then the substrate and the wiring substrate through the adhesive layer The through-holes of the wiring board and the openings formed in the adhesive layer are accommodated in the communication holes formed by communicating with each other, and the base-like protrusions of the substrate are accommodated in the communication holes. Non-penetrating, the small size To provide a manufacturing method of the electronic component mounting wiring board, characterized by comprising a step of obtaining a non-through hole for the child component mounting.
A third invention is a method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring board having a through hole to the substrate through an adhesive layer, the metal layer Can be accommodated in the through-hole at a portion other than the portion to be etched of the metal layer, approximately equal to a cross section perpendicular to the central axis of the through-hole of the wiring board, at a portion other than the portion to be etched. A step of obtaining the substrate having a trapezoidal protrusion having a flat surface of a large size as an end surface on the protruding tip side, and then bonding the substrate and the wiring substrate via the adhesive layer, The board-shaped protrusion of the substrate is accommodated in a communication hole in which the through hole of the wiring board and the opening formed in the adhesive layer are in communication with each other, and the communication hole is made non-penetrating to reduce the size. Non-through holes for mounting electronic components To provide a manufacturing method of the electronic component mounting wiring board, characterized by comprising the that step.
A fourth invention is a method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring board having a through hole to the substrate through an adhesive layer, Is a metal layer, and a portion of the substrate is thickened by pattern plating, and is flat and has a size that is substantially the same as a cross section perpendicular to the central axis of the through hole of the wiring board and that can be accommodated in the through hole. Forming a table-like protrusion having an end surface on the protruding tip side to obtain the substrate having the table-like protrusion, and then bonding the substrate and the wiring board through the adhesive layer Thus, the base-like protrusion of the substrate is accommodated in a communication hole in which the through-hole of the wiring board and the opening formed in the adhesive layer communicate with each other, and the through-hole is not penetrated. As a non-through hole for mounting the small electronic component To provide a manufacturing method of the electronic component mounting wiring board, characterized by comprising a degree.
5th invention is a manufacturing method of the wiring board for electronic component mounting of any one of 1st-4th invention, The thickness of the said adhesive bond layer is formed in the said base-like protrusion by the said half etching or the said pattern plating method. The present invention provides a method for manufacturing an electronic component mounting wiring board characterized by securing a protruding dimension of 10% or more of the height.
A sixth invention is characterized in that the through hole of the wiring board is a round hole having a diameter of 0.8 mm or more, or a square hole having a side length of 0.8 mm or more. A method for manufacturing an electronic component mounting wiring board according to any one of the inventions is provided.
The seventh invention further comprises a step of forming a plating layer on the inner surface of the non-through hole for mounting the small electronic component, wherein the wiring board for mounting electronic component according to any one of the first to sixth inventions A manufacturing method is provided.
According to an eighth aspect of the present invention, a wiring board having a through hole for storing a small electronic component is bonded to a substrate via an adhesive layer, and the substrate has a metal larger than a cross section perpendicular to the central axis of the through hole. A pad is provided, and a flat surface having a size that is substantially the same as the cross-section of the through-hole and that can be accommodated in the through-hole is projected at a position corresponding to the through-hole of the wiring board at the center of the metal pad. A trapezoidal protrusion is provided as an end surface on the front end side, and the trapezoidal protrusion is in a communication hole in which the through hole of the wiring board and the opening formed in the adhesive layer communicate with each other. Is provided, and a non-through hole for mounting a small electronic component having the base-shaped protrusion as a hole bottom is secured in the communication hole.
According to a ninth aspect of the present invention, a wiring board having a through hole for accommodating a small electronic component is bonded to a board via an adhesive layer, the board is a metal layer, and the board includes the through hole of the wiring board. A base-like projecting portion having a flat surface that is substantially the same as a cross section perpendicular to the central axis of the through hole and that can be accommodated in the through hole is provided at a position corresponding to the end surface on the protruding tip side. And the base-like protrusion is housed in a communication hole in which the through hole of the wiring board and the opening formed in the adhesive layer are in communication with each other, and the base-like protrusion is in the communication hole. Provided is a wiring board for mounting an electronic component, characterized in that a non-through hole for mounting a small electronic component having a hole bottom is secured.
According to a tenth aspect of the invention, the trapezoidal protrusion has a tapered shape in which an outer peripheral surface extends outward as it goes from the end surface to the protruding proximal end side of the trapezoidal protrusion on the substrate. An electronic component mounting wiring board according to the eighth or ninth invention is provided.
In an eleventh aspect of the invention, the through hole of the wiring board is a round hole having a diameter of 0.8 mm or more, or a square hole having a side length of 0.8 mm or more. An electronic component mounting wiring board according to any one of the inventions is provided.
A twelfth aspect of the present invention provides the electronic component mounting wiring board according to any one of the eighth to eleventh aspects, wherein a plating layer is formed on an inner surface of the non-through hole for mounting the small electronic component.
A thirteenth aspect of the invention is formed directly on the end surface of the base-like protrusion of the electronic component mounting wiring board of any of the eighth to eleventh aspects or on the inner surface of the non-through hole for mounting the small electronic component. A small electronic component is mounted on a portion of the plated layer formed on the end surface of the plate-like protrusion, and the small electronic component is electrically connected to the wiring of the wiring board by wire bonding. A wiring board with electronic components is provided.

  In the present invention (first to thirteenth inventions), the wiring substrate and the substrate are bonded via an adhesive layer, and the through hole formed in the wiring substrate and the opening formed in the adhesive layer are mutually connected. In the communication hole formed in communication, the base-like protrusion protruding from the substrate (projecting from the metal pad provided on the substrate or directly protruding from the substrate) is stored, and one end of the communication hole is placed on the substrate or the base. It is blocked by a protruding part and made non-penetrating. As a result, the portion of the communication hole located on the side opposite to the substrate from the end surface on the protruding tip side of the trapezoidal projection is a non-through hole for mounting a small electronic component for storing (mounting) the small electronic component. It becomes. An electronic component mounting wiring board having a non-through hole for mounting a small electronic component having a base-like protrusion (specifically, an end surface on the protruding tip side) as a hole bottom is obtained.

The end surface on the projecting tip side of the trapezoidal protrusion is a flat surface extending along the substrate, and is a flat surface perpendicular to the central axis of the non-through hole for mounting a small electronic component. An electronic component mounting wiring board according to the present invention has a flat bottom surface (hereinafter referred to as electronic component mounting) for mounting a small electronic component on the bottom of a non-through hole for mounting a small electronic component by an end surface of a trapezoidal protrusion. (Also referred to as a surface) can be obtained with certainty, and is suitable for mounting a surface mount type small electronic component such as a semiconductor element.
The electronic component mounting surface may be the surface of the plating (plating layer) formed on the end surface of the trapezoidal protrusion in addition to the end surface itself of the trapezoidal protrusion.

In the adhesive layer that bonds and integrates the substrate and the wiring substrate, an opening (through hole) having a cross-sectional size (size) substantially equal to the through hole of the wiring substrate is formed. The cross-sectional size of the opening (the size of the cross section perpendicular to the central axis of the opening) coincides with or slightly increases the end surface of the trapezoidal protrusion.
In the present invention, the trapezoidal protrusion is housed in a communication hole that is a continuous hole that connects the through hole formed in the wiring board and the opening formed in the adhesive layer to each other. To do.

  In the electronic component mounting wiring board obtained by the manufacturing method of the electronic component mounting wiring board according to the present invention, and the electronic component mounting wiring board according to the eighth and ninth inventions, the opening is formed in the adhesive layer. A configuration in which the whole of the trapezoidal protrusion is stored and the end surface of the trapezoidal protrusion is located in the opening, a configuration in which the end surface of the protruding tip of the trapezoidal protrusion is located at the boundary between the adhesive layer and the wiring board, the trapezoid A configuration is adopted in which the protruding tip of the protrusion protrudes from the opening of the adhesive layer into the through hole of the wiring board, and the end surface of the trapezoidal protrusion is positioned in the through hole. The non-through hole for mounting a small electronic component may be constituted by only a through hole of the wiring board or may be constituted by a through hole of the wiring board and an opening of the adhesive layer. In the present invention, depending on the dimensional relationship between the trapezoidal protrusion and the through hole of the wiring board, the wiring board contacts the entire outer periphery of the trapezoidal protrusion, or the outer periphery of the trapezoidal protrusion and the wiring board Are arranged close to each other with a slight separation distance (distance smaller than the thickness of the adhesive layer). Thereby, the outflow (seepage) of the adhesive of the adhesive layer to the non-through hole for mounting the small electronic component is prevented or suppressed.

In the method for manufacturing an electronic component mounting wiring board according to the present invention, the trapezoidal protrusion is formed by half-etching a metal pad or a metal layer formed on the substrate or pattern plating on the metal pad or the metal layer. Since it forms, the base-shaped protrusion which has a flat end surface can be formed easily. As a result, it is possible to easily realize mounting of a surface mount type small electronic component such as a semiconductor element.
If it is a configuration that forms a trapezoidal protrusion by half-etching or pattern plating, for example, by using a mask such as a perforated film, a resist resin, etc., the trapezoidal protrusion having an end surface of a desired shape and size can be reliably obtained. Obtainable. The size of the end face of the trapezoidal protrusion can be easily controlled. In view of the cross-sectional size (cross-sectional dimension) of the through hole in the wiring board, by setting the size of the end surface of the trapezoidal protrusion, it is possible to prevent the adhesive from flowing out to the non-through hole for mounting a small electronic component or Suppression can be realized. In view of mounting small electronic components such as semiconductor elements, the cross-sectional dimensions of the non-through holes for mounting small electronic components are much larger than the non-through holes for interlayer connection (for example, round holes with a diameter of 0.8 mm or more) Alternatively, even when formed with a square hole having a side length of 0.8 mm or more, it is possible to prevent or suppress the outflow of the adhesive to the non-through hole for mounting a small electronic component.

According to the present invention, a flat surface (electronic component mounting surface) for mounting a small electronic component on the bottom of a non-through hole for mounting a small electronic component can be reliably secured, and a surface mount type small electronic device such as a semiconductor element can be secured. Mounting of parts can be realized.
Also, the trapezoidal protrusion can prevent or suppress the outflow of the adhesive from the adhesive layer into the non-through hole for mounting the small electronic component, so that the small electronic component can be used for mounting the small electronic component on the electronic component mounting surface. It is possible to prevent the adhesive that has flowed into the non-through hole for component mounting from affecting. As a result, in the present invention, the adhesive that flows from the adhesive layer into the non-through hole for mounting the small electronic component has an influence on the operation of mounting the small electronic component on the electronic component mounting surface at a low cost with a simple configuration. The inconvenience of giving can be prevented.
In addition, in order to avoid the disadvantage that the adhesive flowing into the non-through hole for mounting the small electronic component from the adhesive layer affects the work of mounting the small electronic component on the electronic component mounting surface, Measures such as unnecessarily increasing the size and ensuring a large distance between the inner surface of the non-through hole for mounting the small electronic component and the small electronic component are not required, and an increase in the size of the wiring board for mounting the electronic component can be avoided.

  Hereinafter, a method for manufacturing an electronic component mounting wiring board, an electronic component mounting wiring board, and an electronic component-equipped wiring board embodying the present invention will be described with reference to the drawings.

(First embodiment)
First, a first embodiment of the present invention will be described.
FIG. 1 is a view showing a structure of an electronic component mounting wiring board 10 (hereinafter also simply referred to as a mounting wiring board) according to an embodiment of the present invention, and FIGS. FIGS. 3A, 3B, 3C, and 4 are diagrams for explaining an example of a method for manufacturing a wiring board constituting the wiring board. FIGS. FIG. 5 is a diagram for explaining a manufacturing method, and FIG. 5 is a plan view of forming a plating layer 191 on the inner surface of a non-through hole 15 for mounting a small electronic component of the mounting wiring board 10 of FIG. FIG. 6 is a diagram showing an electronic component mounting wiring board 10A (hereinafter also simply referred to as a mounting wiring board) having the above-described configuration.
In this specification, in FIGS. 1 to 5, the upper side is described as the upper side, and the lower side is set as the lower side. This is simply described as “upper” for the sake of simplicity. ”And“ below ”are defined, and do not limit the direction during production or use when the present invention is carried out.

In FIG. 1, reference numeral 11 is a substrate, 12 is a wiring substrate, and 13 is an adhesive layer.
Reference numeral 14 denotes a metal pad provided on the substrate 11.
In the mounting wiring board 10, the board 11 and the wiring board 12 are bonded via an adhesive layer 13, and a through hole 12 c that penetrates the wiring board 12 and an opening 13 a that penetrates the adhesive layer 13 communicate with each other. The base-like protrusion 14a protruding from the metal pad 14 is accommodated in the communication hole 16 (see FIG. 4), and the non-through hole has the base-like protrusion 14a as the bottom of the hole in the communication hole 16. 15 is secured.

Examples of the small electronic component 18 accommodated in the non-through hole 15 include a semiconductor element such as a light emitting element, a transistor, a field effect transistor (FET), and a thyristor (SCR), a resistance element, and the like.
The mounting wiring board 10 is mounted by mounting the small electronic component 18 on a flat end surface 14b (flat surface) formed at the leading end of the base protrusion 14a protruding from the substrate 11.

Here, a configuration in which a light emitting element is employed as the small electronic component 18 is illustrated. Hereinafter, the small electronic component 18 may be referred to as a light emitting element 18 using the reference numeral 18 in some cases.
However, as the small electronic component 18, a component other than the light emitting element can be used. Instead of the light emitting element, for example, a semiconductor element such as the above-described transistor, a field effect transistor (FET), a thyristor (SCR), or a resistive element. It goes without saying that can be used.

  The light emitting element 18 has a light emitting portion on the side facing the opening of one end of the non-through hole 15 (the end opposite to the trapezoidal protrusion 14 a), and the light emitting portion is opposite to the substrate 11. Output light to the side.

The substrate 11 is an electrically insulating insulating resin plate, and for example, a glass cloth epoxy substrate for a printed wiring board can be used.
Moreover, as the board | substrate 11, what has wiring formed in the both surfaces or one side is also employable.

A metal pad 14 is provided on one surface of the substrate 11.
The metal pad 14 is formed in a layer extending along one surface of the substrate 11. A trapezoidal protrusion 14 a is projected from the center of the metal pad 14.
Hereinafter, the board | substrate 11 with the metal pad 14 in which the base-shaped protrusion 14a was protrudingly provided is also called the board | substrate with a protrusion by attaching | subjecting the code | symbol 11A.

The trapezoidal protrusion 14a protrudes from the metal pad 14 on the side opposite to the substrate 11, and has a flat end surface 14b on the protruding tip side. Here, the flat end surface 14 b means a flat shape along both surfaces of the substrate 11. In other words, it is a plane orthogonal to the central axis of the through hole 12 c of the wiring board 12 and the non-through hole 15 of the mounting wiring board 10.
The flat end surface 14b functioning as the electronic component mounting surface is advantageous for setting the posture of the light emitting element 18 mounted on the end surface 14b and the emitting direction of the emitted light, and reliably obtaining a desired emitting direction. be able to.

The trapezoidal protrusion 14 a is a metal protrusion formed on the metal pad 14.
Specifically, the base-like protrusion 14a illustrated in FIG. 1 is thinned by, for example, half etching (described later) or the like around the portion where the base-like protrusion 14a in the center of the metal pad 14 is formed. This is a part in which a part of is formed in a protruding shape.

  As shown in FIG. 2B, the wiring board 12 has wirings 12b formed on both surfaces or one surface (both surfaces in the illustrated example) of an electrically insulating resin layer 12a. Further, the wiring board 12 is formed with a through hole 12 c for securing the non-through hole 15 in the mounting wiring board 10.

  In order to obtain the wiring substrate 12, for example, as shown in FIGS. 2A and 2B, a copper-clad substrate 12e (a double-sided copper-clad substrate) in which a copper foil 12d is deposited on both surfaces of an insulating resin layer 12a. The copper foil 12d is subjected to pattern etching to form wirings 12b on both sides. The through hole 12c is formed by drilling a hole that penetrates the wiring board 12 and the adhesive layer 13 using a drill or the like in a state where the adhesive layer 13 is laminated on the wiring board 12 (see FIG. 4), or The wiring layer 12 is formed with a drill or the like before the adhesive layer 13 is provided.

As the insulating resin layer 12a, for example, a glass cloth epoxy substrate for a printed wiring board, and a white glass cloth epoxy substrate to which a white pigment such as titanium oxide is added as a filler in order to improve the reflectance of the output light of the light emitting element 18 is used. Etc. can be used.
In the drawings other than FIGS. 2A and 2B, the insulating resin layer 12a and the wiring 12b are not shown, and the wiring board 12 is simplified.

  The thickness of the insulating resin layer 12a of the substrate 11 and the wiring substrate 12 is in the range of 50 μm to 1.6 mm, and the depth of the non-through hole 15 and the rigidity of the entire product (the wiring substrate 10 for mounting and the wiring substrate 19 with electronic components). The thickness is appropriately selected from the above points.

  Examples of the material of the adhesive layer 13 include an epoxy adhesive, a polyamideimide adhesive, and an epoxy-modified polyamide adhesive, and the adhesive layer 13 is an adhesive formed by any of these materials. A film (B stage film) or the like can be employed.

  The through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 are considered in view of housing and mounting in a non-through hole 15 of a surface mount type small electronic component 18 such as a semiconductor element such as a light emitting element (for example, a light emitting diode). Thus, a round hole having a diameter of 0.8 mm or more or a square hole having a side length of 0.8 mm or more is preferable.

  The through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 have a cross section (a cross section perpendicular to the central axis of the opening 13a. The same applies to the cross section of the opening 13a). It is formed in a size slightly larger than the end surface 14b of the portion 14a. In other words, the end surface 14b of the trapezoidal protrusion 14a is formed in a size that can be stored in the opening 13a. In the mounting wiring substrate 10 illustrated in FIG. 1, the trapezoidal protrusion 14 a is accommodated in the opening 13 a of the adhesive layer 13, and the end surface 14 b of the trapezoidal protrusion 14 a is the opening of the adhesive layer 13. It is located at the center in the central axis direction of the portion 13a.

  Specifically, the non-through hole 15 of the mounting wiring board 10 illustrated in FIG. 1 has a trapezoidal protrusion 14 a in the central axis direction of the through hole 12 c of the wiring board 12 and the opening 13 a of the adhesive layer 13. It is comprised by the part which does not exist (that is, the part above the end surface 14b of the base-like protrusion 14a in FIG. 1). The end surface 14 b of the trapezoidal protrusion 14 a is a hole bottom surface of the non-through hole 15.

  However, in the present invention, the non-through hole 15 of the mounting wiring board 10 is limited to a configuration in which the end surface 14b of the trapezoidal protrusion 14a is located in the opening 13a of the adhesive layer 13 as described above. Not. For example, the end surface 14b of the trapezoidal protrusion 14a is located at the boundary between the wiring substrate 12 and the adhesive layer 13, or the protruding tip of the trapezoidal protrusion 14a from the substrate 11 is the through hole 12c of the wiring substrate 12. A configuration in which the non-through hole 15 is formed only by the through hole 12 c of the wiring board 12 may be employed.

The electronic component-attached wiring board 19 can be assembled by surface-mounting the small electronic component 18 by fixing it to the end face 14 of the mount-like protrusion 14a of the mounting wiring board 10 by bonding using an adhesive or the like.
A small electronic component 18 mounted on the trapezoidal protrusion 14a is connected to the wiring 12b of the wiring board 12 (however, the wiring 12b formed on the surface opposite to the adhesive layer 13 of the wiring board 12) by wire bonding. Connect electrically. In the figure, reference numeral 193 denotes a bonding wire.

Next, a method for manufacturing the electronic component mounting wiring board 10 according to the embodiment of the present invention will be described.
In this manufacturing method, a metal pad 14 is provided on the substrate 11 (hereinafter also referred to as a metal pad forming process; see FIGS. 3A and 3B), and the outer periphery of the metal pad 14 is half-etched. A step of forming a trapezoidal protrusion 14a on the inner side of the etched portion (see FIGS. 3B and 3C, a trapezoidal protrusion forming step, hereinafter also referred to as a half-etching step), and a trapezoidal protrusion 14a. A step of bonding the formed substrate 11 (substrate 11A with protrusions) and the wiring substrate 12 having the through holes 12c through the adhesive layer 13 (hereinafter also referred to as an adhesion step; see FIG. 4). .
In the bonding step, the base protrusion 14a is accommodated in a communication hole 16 in which the through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 communicate with each other, and the communication hole 16 is The non-penetrating hole 15 is obtained by making the non-penetrating by the substrate with projection 11A. Thereby, the mounting wiring board 10 having the non-through holes 15 is obtained.

  In the metal pad forming process shown in FIGS. 3A and 3B, for example, a copper-clad substrate 111 in which a copper foil 11b (electrolytic copper foil) is deposited on both surfaces of a substrate 11 that is an insulating resin layer. The copper foil 11b of the copper-clad substrate 111 is patterned by a pattern etching method to form a metal pad 14 on one side (one main surface) of the substrate 11. Thereby, the substrate 11 on which the metal pad 14 is formed (hereinafter, also referred to as a padded substrate 112) is obtained.

The metal pad 14 has a size slightly larger than the cross section of the through hole 12c of the wiring board 12 on the main surface of the substrate 11, that is, an area larger than the cross section of the through hole 12c of the wiring board 12 on the main surface of the substrate 11. A layer is formed in the region. In addition, the metal pad 14 is formed on the main surface of the substrate 11 in the formation position and the formation range is that the substrate 11 (substrate 11A with protrusions) on which the base protrusion 14a is formed and the wiring substrate 12 are bonded via the adhesive layer 13. Then, when the mounting wiring board 10 is assembled, the entire area located on the extension of the through hole 12a of the wiring board 12 on the main surface of the board 11 is included, and moreover, from the area over the entire outer periphery of the area Also have a part protruding outward.
The shape of the metal pad 14 (planar shape seen from above in FIGS. 1, 3A and 3B) is not particularly limited, but is, for example, circular or rectangular. Further, the size of the metal pad 14 (formation range on the main surface of the substrate 11) is preferably 120 to 1000% of the cross-sectional area of the through hole 12a of the wiring substrate 12, and is preferably about 120 to 400%. More preferred.

In the patterning of the copper foil 11b, wiring (wiring pattern) may be formed on one side or both sides of the substrate 11 together with the metal pad 14.
In addition, a single-sided copper-clad substrate can be used in that only the metal pad 14 on one side of the substrate 11 is formed.

As shown in FIG. 3C, in the trapezoidal protrusion forming step (half-etching step), a portion of the metal pad 14 excluding the formation portion of the central protrusion 14a is formed by pattern etching. Thin (half etching). Thereby, a step is formed in the metal pad 14. As a result, a trapezoidal protrusion 14a is formed inside the etched portion.
By forming the table-like protrusion 14a, the substrate with protrusion 11A is obtained.

The trapezoidal protrusion 14 a is formed in a protruding shape having a flat end surface 14 b having a size substantially equal to the cross section of the through hole 12 c of the wiring board 12.
However, the end surface 14b has a size that can be accommodated in the through hole 12c.
The trapezoidal protrusion 14 a has a shape and size (size) of the end face 14 b that matches the cross section of the through hole 12 c of the wiring board 12, or the size of the end face 14 b is larger than the cross section of the through hole 12 c of the wiring board 12. Make it slightly smaller.

When the end surface 14b of the trapezoidal protrusion 14a is slightly smaller than the cross section of the through hole 12c of the wiring substrate 12, the shape of the end surface 14b is the same as the cross section of the through hole 12c of the wiring substrate 12. It is preferable. In this case, compared to the case where the shape of the end surface 14b of the trapezoidal protrusion 14a is different from the cross-sectional shape of the through hole 12c of the wiring board 12, a locally large gap is formed between the outer periphery of the trapezoidal protrusion 14a and the wiring board 12. This is advantageous in preventing and suppressing the outflow of the adhesive from the adhesive layer 13 into the non-through hole 15.
For example, a circular hole having a diameter of 90% or more of the diameter of the through hole 12c, which is a round hole, or a square having a length of one side of the through hole 12c, which is a square hole, of 90% or more of the through hole 12c. Form. The end surface 14b of the trapezoidal protrusion 14a has a size that is 10% smaller than the cross-sectional dimension of the through hole 12c, or a larger dimension that is larger than that (that is, a similar shape of 90% or more of the cross section of the through hole 12c). Form.

The protrusion dimension of the base protrusion 14a on the metal pad 14 (here, the protrusion dimension from the outer peripheral land part 14d) is the thickness of the adhesive layer 13 (however, pressure applied to bond the substrate 11 and the wiring substrate 12) , Thickness before heating) is preferably 10% or more, more preferably 50% or more.
Note that the thickness of the adhesive layer 13 is selected from 15 μm to 100 μm. Moreover, the thing of the range whose thickness is 30 micrometers-70 micrometers is suitable.

  The protrusion dimension of the trapezoidal protrusion 14a is such that, for example, when the substrate 11 and the wiring board 12 are bonded and bonded together via the adhesive layer 13, the end surface 14b of the trapezoidal protrusion 14a is bonded to the adhesive layer 13. It is set so that the trapezoidal protrusion 14a does not enter the through hole 12c of the wiring board 12 in the opening 13a or at the boundary between the adhesive layer 13 and the wiring board 12. In this case, the entire through hole 12c of the wiring board 12 can be used as the non-through hole 15 for accommodating the small electronic component 18.

  Although the protrusion 14a may have a protruding dimension in which the end surface 14b is located in the through hole 12c of the wiring board 12, the length of the through hole 12c (the central axis) in consideration of the thickness of the adhesive layer 13 The projecting dimension is preferably set so that 80% or more of the dimension in the direction) can be used as the non-through hole 15.

In the bonding step, the substrate 11 (substrate 11A with protrusions) on which the base-like protrusions 14a are formed and the wiring substrate 12 on which the through holes 12c are formed are stacked via the adhesive layer 13 and bonded (bonded) by pressure heating. And integrate.
The adhesive layer 13 is not only the surface of the substrate 11 on which the base-like protrusion 14a is protruded, but also the outer periphery that is a portion that protrudes in the form of a flange on the outside of the base-like protrusion 22 in the metal pad 14. It is also bonded so as to overlap the land portion 14d.

As shown in FIG. 4, the substrate 11 (substrate 11A with protrusions) and the wiring substrate 12 are bonded to each other through the adhesive film after an adhesive film (adhesive layer 13) is bonded to the wiring substrate 12. Or after bonding an adhesive film (adhesive layer 13) to the substrate 11, it is preferable from the viewpoint of workability to adhere to each other via this adhesive film.
Further, the adhesive layer 13 may be formed, for example, by applying a resin material to the wiring substrate 12 or the substrate 11.

In both cases of the adhesive film and the coating film, the adhesive layer 13 is formed with an opening 13a (through hole) having the same cross-sectional shape and size as the cross section of the through hole 12c of the wiring board 12.
In assembling (manufacturing) the mounting wiring substrate 10, when the substrate 11 and the wiring substrate 12 are bonded together via the adhesive layer 13, the opening 13 a of the adhesive layer 13 is formed on the wiring substrate 12. In alignment with the through hole 12c, a single hole in which the opening 13a and the through hole 12c are continuous is formed (see FIG. 4 as an example).

When bonding the wiring substrate 12 and the substrate 11 using the adhesive layer 13 provided on the wiring substrate 12, for example, when drilling the through hole 12c of the wiring substrate 12, the drill is used as the adhesive layer. By forming the opening 13a of the adhesive layer 13 together with the through hole 12c through the through hole 13, the opening 13a having the same shape and size as the through hole 12c can be easily formed in the adhesive layer 13.
However, an adhesive film in which the opening 13a is formed in advance can be bonded to the wiring board 12.

  In the case of a procedure for bonding the wiring substrate 12 and the substrate 11 using the adhesive layer 13 provided on the substrate 11, an adhesive film having an opening 13 a formed thereon is bonded to the substrate 11. Thus, after the base-like protrusion 14a is disposed inside the opening 13a of the adhesive layer 13 laminated on the substrate 11, the substrate 11 and the wiring substrate 12 are bonded together via the adhesive layer 13. .

  When the bonding between the substrate 11 (substrate 11A with protrusions) and the wiring substrate 12 is completed in the bonding step, the through hole 12c of the wiring substrate 12 and the opening 13a of the adhesive layer 13 communicate with each other. One end of the communication hole 16 is blocked by the protruding substrate 11A and becomes non-penetrating. Thereby, the non-through hole 15 for mounting a small electronic component is obtained.

In the bonding step, when the substrate with protrusions 11A and the wiring substrate 12 are bonded via the adhesive layer 13, the through hole 12c of the wiring substrate 12 and the opening 13a of the adhesive layer 13 communicate with each other. The trapezoidal protrusion 14a is accommodated in the communication hole 16 formed as described above.
At this time, the opening edge of the through hole 12c on the surface of the wiring board 12 on the adhesive layer 13 side and the trapezoidal protrusion 14a (specifically, the outer peripheral surface (the outer peripheral side surface) of the trapezoidal protrusion 14a, or Ridgeline at the boundary between the outer peripheral surface and the end surface 14b) or abut each other. For this reason, it is possible to prevent or suppress the outflow (exudation) of the adhesive from the adhesive layer 13 into the non-through hole 15 due to the pressure heating in the adhesion process. As a result, it is possible to prevent the adhesive from affecting the mounting operation of the small electronic component 18 on the end surface 14b of the base protrusion 14a, and the mounting operation of the small electronic component 18 can be performed efficiently.

In addition, according to this manufacturing method, the outer peripheral surface 14c of the trapezoidal protrusion 14a extends from the end surface 14b toward the protruding base end side (substrate 11 side) of the trapezoidal protrusion 14a in the substrate 11. It is possible to easily obtain a taper that extends outward.
The outer peripheral surface 14c of the trapezoidal protrusion 14a is an inclined surface that rises obliquely from the outer peripheral land portion 14d of the metal pad 14.

  With the trapezoidal protrusion 14a having this structure (shape), the edge of the opening 13a of the adhesive layer 13 is brought into contact with the outer peripheral surface 14c of the trapezoidal protrusion 14a in the bonding step, so that the trapezoidal protrusion Positioning of the adhesive layer 13 with respect to the portion 14a can be realized. As a result, the edge of the through hole 12c and the base-like protrusion 14a in the wiring board 12 (specifically, the outer peripheral surface (outer peripheral side surface) of the base-like protrusion 14a, or the ridgeline at the boundary between the outer peripheral surface and the end face 14b) ) Are in contact with each other, or in a state where the distance between the two is close to each other with a very small distance.

  In the present invention, the inclination angle of the outer peripheral surface 14c of the trapezoidal protrusion 14a with respect to the outer peripheral land portion 14d is large, and the protruding base end side (substrate 11 side) and the protruding distal end side (end surface 14b side) of the trapezoidal protrusion 14a. When the difference in size is very small, the edge of the opening 13a of the adhesive layer 13 does not overlap the outer peripheral surface 14c of the base-like protrusion 14a, and is bonded only to the outer peripheral land 14d of the metal pad 14. It is also possible to adopt a configuration.

  After the mounting wiring board 10 is manufactured, as shown in FIG. 5, a plating layer 191 which is a metal film covering the entire surface is formed on the inner surface of the non-through hole 15 of the mounting wiring board 10 (plating is formed). Process). Reference numeral 10A in FIG. 5 is attached to the mounting wiring board on which the plating layer 191 is formed.

  In the mounting wiring board 10A, the inner space (inner non-through hole 192) of the plating layer 191 serves as a non-through hole 192 for mounting small electronic components (non-through hole for mounting small electronic components, cavity portion). Function. A portion of the plating layer 191 formed on the end surface 14 b of the trapezoidal protrusion 14 a forms a flat bottom surface of the non-through hole 192. The bottom surface of the hole functions as an electronic component mounting surface 194. A wiring board 19A with an electronic component is obtained by fixing and mounting the small electronic component 18 on the electronic component mounting surface 194.

The plating layer 191 functions as a reflective film that reflects output light from the light emitting element 18 mounted in the non-through hole 192.
Further, the non-through hole 192 (inner non-through hole) inside the plating layer 191 is preferably a round hole having a diameter of 0.8 mm or more, or a square hole having a side length of 0.8 mm or more.
As the plating layer 191, for example, a metal film such as silver (Ag) is suitable. For example, a structure in which an Ag plating with a film thickness of 3 to 12 μm (targeting 5 μm) is formed so as to overlap with a Ni plating with a film thickness of 5 to 15 μm (targeting 10 μm) formed on the inner surface of the non-through hole 15. Can be adopted. Moreover, as this plating layer 191, the thing which raised the reflectance by addition of a brightener can also be employ | adopted.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 6 (a), 6 (b), and 7. FIG.
This embodiment is different from the manufacturing method of the mounting wiring board 10 of the first embodiment described above in that the trapezoidal protrusion 22 is formed by the pattern plating method, and other configurations (metal pad formation) Steps and bonding steps) are the same as the method for manufacturing the mounting wiring board 10 described above.
In the figure, the same components as those in FIGS. 1 to 5 are denoted by the same reference numerals, and the description will be simplified.

In the manufacturing method of the mounting wiring board of this embodiment, as in the manufacturing method of the mounting wiring board 10 described above, first, as shown in FIG. Next, as shown in FIG. 6B, the central portion of the metal pad 21 is thickened by pattern plating to have a flat end surface 23 (flat surface) on the protruding tip side. A step of forming the trapezoidal protrusion 22 (a trapezoidal protrusion forming step, hereinafter also referred to as a pattern plating step) is performed.
Hereinafter, the substrate 11 on which the table-like protrusions 22 are formed in this pattern plating step is also referred to as a substrate with protrusions by attaching a reference numeral 11B.

  Next, a step (bonding step) of bonding and integrating the substrate 11 (substrate 11B with protrusions) obtained in the pattern plating step with the wiring substrate 12 through the adhesive layer 13 is performed (see FIG. 7). . In this step, the trapezoidal protrusion 22 is accommodated in the communication hole 16. By completing this bonding step, a mounting wiring board 20 having non-through holes 15 is obtained as shown in FIG. The end surface 23 of the trapezoidal protrusion 22 functions as the bottom surface of the non-through hole 15. As a technique for bonding the substrate 11 to the wiring board 12 via the adhesive layer 13, a technique that can be employed in the first embodiment can be similarly applied.

  As shown in FIGS. 6B and 7, in the pattern plating process, the table-like protrusions 22 are formed in the through holes 12 c of the wiring board 12 in the same manner as the table-like protrusions 14 a described in the first embodiment. It is formed in a protruding shape having a flat end surface 23 having a size substantially equal to the cross-sectional dimension. Further, in the pattern plating step, the outer peripheral surface 24 (outer peripheral side surface) of the base-like protrusion 22 is an outer peripheral land part 14 d where the metal pad 21 protrudes outside the base-like protrusion 22 in a flange shape. That is perpendicular to.

The base protrusion 14a has a protruding dimension from the metal pad 14 that is 10% of the thickness of the adhesive layer 13 (however, the pressure before bonding the substrate 11 and the wiring substrate 12 and the thickness before heating). Above, more preferably 50% or more. However, this projecting dimension is preferably set so that 80% or more of the length of the through hole 12 c (the dimension in the central axis direction) can be used as the non-through hole 15.
Except for the projecting dimensions and the shape of the outer peripheral surface 24, the through holes 12c of the wiring board 12 and the openings of the adhesive layer 13 have the same size and shape (including the size and shape of the end surface 23) of the trapezoidal protrusion 22. The relationship with 13a is the same as the trapezoidal protrusion 14a of the first embodiment.

Also for the mounting wiring board 20 shown in FIG. 7, by mounting the small electronic component 18 on the end surface 23 of the table-like protrusion 22, the wiring board 20 </ b> A with the electronic component can be assembled. The small electronic component 18 is surface-mounted by being fixed to the end surface 23 of the trapezoidal protrusion 22 by bonding or the like using an adhesive.
The small electronic component 18 mounted on the trapezoidal protrusion 22 is connected to the wiring 12b of the wiring board 12 by wire bonding (however, the wiring board 12) as in the case of the wiring boards 19 and 19A with electronic parts illustrated in FIGS. The wiring 12b formed on the surface opposite to the adhesive layer 13 is electrically connected to the wiring 12b (not shown in FIG. 7).
Also, with respect to the mounting wiring board 20, a plating layer covering the inner surface of the non-through hole 15 is formed, and a small electronic component 18 is mounted in the non-through hole inside the plating layer to obtain a wiring board with an electronic component. Needless to say, this is possible.

(Aspect using a metal layer as a substrate)
Next, with reference to FIGS. 8 to 11A and 11B, configurations (third and fourth embodiments) in which metal layers (metal foil or metal plate) are used as the substrates 31 and 41 will be described. .
In the figure, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description will be simplified.
The mounting wiring boards 30 and 40 shown in FIGS. 8 and 10 are the same as the mounting wiring boards 10 and 20 described above except for the substrates 31 and 41 and the trapezoidal protrusions 32 and 42.
As the substrates 31 and 41, for example, aluminum, copper, nickel, alloys thereof, or a metal layer (metal foil or metal plate) such as SUS is used.

(Third embodiment)
A third embodiment according to the present invention will be described with reference to FIGS. 8, 9A and 9B.
First, the mounting wiring board 30 shown in FIG. 8 will be described.
On the substrate 31 of the mounting wiring board 30, a table-like protrusion 32 is provided so as to protrude. An end surface 33 on the projecting tip side of the trapezoidal protrusion 32 has a size substantially equal to the cross-sectional dimension of the through hole 12 c of the wiring board 12. In the mounting wiring board 30, the board 31 is bonded and integrated with the wiring board 12 through the adhesive layer 13. Further, the base-like protrusion 32 of the substrate 31 is accommodated in the communication hole 16. In the illustrated example, the trapezoidal protrusion 32 is accommodated only in the opening 13 a of the adhesive layer 13.
The adhesive layer 13 is bonded and bonded to a portion of the surface of the substrate 31 where the trapezoidal protrusions 32 are provided so as to avoid the trapezoidal protrusions 32.

  In the manufacturing method for manufacturing the mounting wiring board 30, first, as shown in FIGS. 9A and 9B, a substrate 31 which is a sheet-like metal layer such as a metal foil is partially thinned by etching. (Half etching) A step of forming the trapezoidal protrusion 32 (trapezoidal protrusion forming step, hereinafter also referred to as a half etching step) is performed. In this half etching process, the trapezoidal protrusion 32 is formed at a desired position on the substrate 31 by a pattern etching method. A substrate 31 having a trapezoidal protrusion 32 is obtained. The portion left without being etched becomes a protruding table-like protrusion 32 that protrudes from the portion (plate-like portion 36) thinned by half etching.

The protrusion dimension of the base protrusion 32 on the substrate 31 (protrusion dimension from the plate-like portion 36) is the thickness of the adhesive layer 13 (however, pressure applied to bond the protrusion-provided substrate 31A and the wiring substrate 12). , Thickness before heating) is preferably 10% or more, more preferably 50% or more. However, this projecting dimension is preferably set so that 80% or more of the length of the through hole 12 c (the dimension in the central axis direction) can be used as the non-through hole 15.
Other than this protruding dimension, the relationship between the size and shape of the trapezoidal protrusion 32 (including the size and shape of the end face 33) with the through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 is as follows. This is the same as the trapezoidal protrusion 14a of the mounting wiring board 10 of the embodiment.

Next, the process (adhesion process) of adhering and integrating the substrate with protrusions 31A obtained in the half etching process with the wiring board 12 through the adhesive layer 13 is performed. At this time, the trapezoidal protrusion 32 of the substrate 31 is accommodated in the communication hole 16 in which the through hole 12c of the wiring substrate 12 and the opening 13a of the adhesive layer 13 are communicated. Thereby, a non-through hole 35 (non-through hole for mounting a small electronic component) having the base protrusion 32 of the substrate with protrusion 31A as a hole bottom is formed, and the mounting wiring board 30 is assembled.
The non-through hole 35 is a portion where the trapezoidal protrusion 32 does not exist in the direction along the central axis of the communication hole 16, that is, a portion above the end surface 33 of the trapezoidal protrusion 32 in FIG. The end surface 33 of the portion 32 is the bottom surface of the hole.

  The outer peripheral surface 34 (outer peripheral side surface) of the trapezoidal protrusion 32 shown in FIG. 8 is an inclined surface that rises obliquely from a plate-like portion (plate-like portion 36) thinned by half etching in the substrate 31. The trapezoidal protrusion 32 has a tapered shape in which the outer peripheral surface 34 expands outward as it goes from the end surface 33 toward the protruding proximal end side (the plate-like portion 36 side) of the trapezoidal protrusion 32 on the substrate 31. It has become. For this reason, in the bonding step, the edge of the opening 13a of the adhesive layer 13 abuts on the outer peripheral surface 34 of the trapezoidal protrusion 32, thereby positioning the adhesive layer 13 with respect to the trapezoidal protrusion 32. Can be realized. In the procedure of adhering the wiring board 12 provided with the adhesive layer 13 on one side to the substrate with projections 31A, the positioning of the wiring substrate 12 with respect to the substrate with projections 31A becomes easy. As a result, the edge portion of the through hole 12c in the wiring board 12 and the base-like protrusion 32 (specifically, the outer peripheral surface 34 of the base-like protrusion 32 or the ridgeline at the boundary between the outer peripheral surface 34 and the end surface 33). It is possible to reliably obtain a state in which they are brought into contact with each other or arranged close to each other with a very small distance between them.

  In the present invention, the inclination angle of the outer peripheral surface 34 of the table-like protrusion 32 with respect to the plate-like part 36 is large, and the protruding base end side (plate-like part 36 side) and the protruding tip side (end surface 33) of the table-like protrusion 32 are provided. When the difference in size between the adhesive layer 13 and the side edge is small, the edge of the opening 13a of the adhesive layer 13 does not overlap the outer peripheral surface 34 of the base-like protrusion 32, and only the plate-like part 36 of the substrate 31 is directly provided. The structure which adhere | attaches to can also be taken.

(Fourth embodiment)
Next, a fourth embodiment according to the present invention will be described with reference to FIGS. 10, 11A and 11B.
As shown in FIGS. 11A and 11B, the mounting wiring board 40 shown in FIG. 10 has a projection-like trapezoidal protrusion 42 (metal) by thickening a part of one surface of the substrate 41 by pattern plating. A substrate 41A having a protrusion formed by protruding a layer) is bonded and integrated with the wiring substrate 12 via the adhesive layer 13, and the base protrusion 42 is accommodated in the communication hole 16. In the illustrated example, the trapezoidal protrusion 42 is accommodated only in the opening 13 a of the adhesive layer 13.
The adhesive layer 13 is bonded and bonded to a portion of the substrate 41 where the trapezoidal protrusions 42 are provided so as to avoid the trapezoidal protrusions 42.

  In the manufacturing method for manufacturing the mounting wiring substrate 40, first, as shown in FIGS. 11A and 11B, a part of one surface of the substrate 41 which is a sheet-like metal layer such as a metal foil is subjected to pattern plating. A step of forming the trapezoidal protrusion 42 by a method (a trapezoidal protrusion forming step; hereinafter also referred to as a pattern plating step) is performed to obtain a substrate 41A with a protrusion.

The protruding dimension of the trapezoidal protrusion 42 from the substrate 41 is 10 of the thickness of the adhesive layer 13 (however, the thickness before pressing and heating for bonding the substrate 41A with protrusion and the wiring board 12). % Or more, more preferably 50% or more. However, this projecting dimension is preferably set so that 80% or more of the length of the through hole 12 c (the dimension in the central axis direction) can be used as the non-through hole 15.
Other than the protruding dimensions, the relationship between the size and shape of the trapezoidal protrusion 42 (including the size and shape of the end face 43 on the protruding tip side) with the through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 These are the same as the trapezoidal protrusion 22 of the mounting wiring board 20 of the second embodiment. The end surface 43 of the trapezoidal protrusion 42 is a flat surface orthogonal to the central axis of the through hole 12 c of the wiring substrate 12.

Next, the process (adhesion process) of adhering and integrating the substrate 41A with protrusions obtained by the pattern plating process with the wiring board 12 (substrate 12A with wiring) via the adhesive layer 13 is performed.
At this time, the trapezoidal protrusion 42 of the board 41A with the protrusion is housed in the communication hole 16 in which the through hole 12c of the wiring board 12 and the opening 13a of the adhesive layer 13 are in communication. As a result, as shown in FIG. 10, a non-through hole 45 (non-through hole for mounting a small electronic component) having the base protrusion 42 as a bottom is formed in the communication hole 16, and the mounting wiring board 40 is assembled. It is done. The end surface 43 of the trapezoidal protrusion 42 becomes the hole bottom surface of the non-through hole 45.

In the case of the mounting wiring boards 30 and 40 according to the third and fourth embodiments shown in FIGS. 8 and 10, since high heat dissipation is obtained by the metal boards 31 and 41, the end faces of the trapezoidal protrusions 32 and 42. When the small electronic components 18 are mounted on the 33 and 43 and the wiring boards 30A and 40A with electronic components are assembled, heat generated from the small electronic components 18 can be efficiently dissipated.
Needless to say, the trapezoidal protrusions 32 and 42 are also made of metal, which effectively contributes to ensuring high heat dissipation.

FIG. 12 shows a configuration (wiring board 30B for mounting small electronic components) in which a plating layer 195 covering the inner surface is formed in the non-through hole 35 of the mounting wiring board 30 shown in FIG. In the small electronic component mounting wiring board 30 </ b> A, a non-through hole 196 (non-through hole for electronic component mounting, cavity portion), which is a space for mounting a small electronic component, is secured inside the plating layer 195. FIG. 12 illustrates a wiring board 30C with an electronic component having a configuration in which the small electronic component 18 is mounted on a portion of the plating layer 195 formed on the end surface 33 of the trapezoidal protrusion 32.
The small electronic component 18 is electrically connected to the wiring 12b of the substrate with wiring 12A by wire bonding. In the figure, reference numeral 193 denotes a bonding wire.

  Similarly, for the mounting wiring board 40 shown in FIG. 10, a plating layer that covers the inner surface of the non-through hole 45 is formed, and a non-through hole that is a space for mounting a small electronic component is secured inside the plating layer. A small electronic component is mounted in the non-through hole (specifically, the small electronic component 18 is mounted on the plating layer formed on the end face 43 of the base protrusion 42) and the wiring board with the electronic component is assembled. Is possible.

  In addition, as described above, when the plating layer covering the inner surfaces of the non-through holes 35 and 45 is formed, a non-through hole that is a space for mounting a small electronic component (non-through hole for mounting an electronic component) is formed inside the plating layer. It is preferable to secure a round hole with a diameter of 0.8 mm or more, or a square hole with a side length of 0.8 mm or more. As the plating layer, for example, the same layer as the plating layer 191 of the wiring board 19A with an electronic component described with reference to FIG. 5 can be adopted.

  As described above, even when the plating layer covering the inner surface is formed in the non-through holes 35 and 45 of the mounting wiring boards 30 and 40, high heat dissipation is obtained by the metal substrates 31 and 41. Thereby, the heat generated from the small electronic component 18 can be efficiently radiated.

Example 1
Prepare a double-sided board (copper-clad board) with a thickness of 0.06mm, which is made by depositing 35μm-thick copper foil on both sides of CCL-820WDI insulating resin board made by Mitsubishi Gas Chemical Co., Ltd. A guide hole for exposure alignment to be used is processed into the four corners of the double-sided plate, and a dry film for etching is laminated to exposed to etched to form a wiring pattern on both sides, and a substrate with a wiring pattern (substrate with a pad). Hereinafter, it is also referred to as a wiring pattern formation substrate. In the wiring pattern, a metal pad (land portion) wider than a cross-section of a through hole of a wiring board with a through hole (described later, a wiring board) bonded to the wiring pattern forming substrate through an adhesive layer is formed. The formation position of the metal pad is set corresponding to the formation position of a non-through hole (hereinafter also referred to as a cavity portion) of the electronic component mounting wiring board to be manufactured.

  Next, in order to form a trapezoidal protrusion on the metal pad, the surface of the wiring pattern forming substrate is laminated to a dry etching film, exposed to developed, and brought into contact with a chemical etching solution to form a base on the metal pad. The portions other than the formation positions of the protrusions were etched to a thickness of 20 μm. As a result, a trapezoidal protrusion was formed that was 15 μm higher than the portion thinned by etching (the projecting dimension from the thinned portion was 15 μm). A step of 15 μm was obtained on the metal pad. Thereafter, the dry film was peeled off.

Subsequently, the through-holed wiring board (wiring board) attached to the wiring pattern forming substrate was processed.
A dry film for etching is applied to a core material (copper-clad substrate) with a thickness of 0.06 mm, which is obtained by depositing 18 μm thick copper foil on both sides of an insulating resin plate of CCL-820WDI manufactured by Mitsubishi Gas Chemical Co., Ltd. Lamination, exposure, and etching were performed, and a wiring pattern was formed on both surfaces to obtain a wiring board. AS-3000 manufactured by Hitachi Chemical Co., Ltd. having a thickness of 0.025 mm was temporarily bonded to this wiring board as an adhesive film. The temporary bonding was performed using a vacuum laminator at a pressure of 0.75 Mpa / cm ² , a temperature of 120 ° C., and a time of 45 seconds. Next, a through-hole (square hole) having an opening size of 1.05 × 1.05 mm was formed by router processing in a portion to be a cavity portion of the wiring board and the adhesive film.
Next, in order to laminate and bond the wiring pattern forming substrate formed with stepped protrusions on the metal pad and the adhesive film through the adhesive film layer of the wiring substrate in which the opening has been processed Alignment was performed with a multi-stage press using a pin lamination method, and this bonding was performed. In the mounting wiring board obtained, the base-like protrusions are housed in communication holes formed by communication between the through holes of the wiring board with through holes and the openings of the adhesive film. The trapezoidal protrusion penetrates through the opening of the adhesive film and reaches the through hole of the wiring board with the through hole.

As a result of confirming the state after the adhesion, no bleeding of the adhesive film into the opening confirmed in the conventional production method was observed. In addition, although the cross section was observed by performing desmear treatment to plating on the inner surface of the cavity portion, the thickness of the plating layer formed on the inner surface of the cavity portion was almost uniform, and a smooth inner surface without unevenness was obtained on the inner side of the plating layer. .
The cold cycle test was performed at a cycle of −65 ° C. for 30 minutes and at 125 ° C. for 30 minutes. As a result, the resistance value did not change even after 1000 cycles. In the cross-sectional observation, there was no peeling or cracking, and the shape was stable.

(Comparative Example 1)
Without forming the stepped protrusions on the metal pads, the other steps were to bond the wiring pattern forming substrate and the wiring substrate on which the opening was formed under the same conditions as in Example 1. As a result, as shown in FIG. 13, the bleeding of the adhesive film (reference numeral 13 in the figure) was observed in the opening of the wiring board within a range of about 70 μm from the inner surface.
Moreover, the desmear process-plating was performed about the cavity part inner surface. The plating film thickness on the surface of the adhesive film tended to be thin, and as a result of carrying out a cooling / heating cycle test under the same conditions as described above, an increase in resistance value was observed at 200 cycles.

It is sectional drawing which shows the structure of the wiring board for electronic component mounting of 1st Embodiment which concerns on this invention. It is a figure explaining the method of manufacturing the wiring board of the wiring board for electronic component mounting of FIG. 1, Comprising: (a) is sectional drawing which shows the copper clad board (double-sided copper clad board) used in order to obtain a wiring board, FIG. 3B is a diagram showing details of a wiring board obtained by forming wirings and through holes in the copper-clad board of FIG. It is a figure explaining an example of the manufacturing method of the wiring board for electronic component mounting of FIG. 1, (a) is sectional drawing which shows the copper-clad board | substrate used in order to obtain the board | substrate of the electronic component mounting wiring board of FIG. (B) is a figure which shows the board | substrate with a pad formed by forming a wiring pattern and a metal pad by the pattern etching method of the copper foil of the copper clad board | substrate of Fig.3 (a), (c) is with a pad of FIG.3 (b). It is a figure which shows the board | substrate with a protrusion formed by forming a base-shaped protrusion on the metal pad of a board | substrate by the pattern etching method. It is a figure explaining an example of the manufacturing method of the wiring board for electronic component mounting of FIG. 1, Comprising: A board | substrate with a pad obtained in FIG.3 (b), and the wiring board in which the through-hole was formed are bonded with an adhesive layer. It is a figure which shows the process bonded through. It is sectional drawing which shows the structure which formed the plating layer in the inner surface of the non-through-hole for small electronic component mounting of the wiring board for electronic component mounting of FIG. It is a figure explaining the manufacturing method of the wiring board for electronic component mounting of 2nd Embodiment which concerns on this invention, Comprising: (a) is a figure which shows a board | substrate with a pad, (b) is a board | substrate with a pad of Fig.6 (a). It is a figure which shows the board | substrate with a protrusion formed by forming a base-like protrusion on the metal pad. It is sectional drawing which shows the structure of the wiring board for electronic component mounting of 2nd Embodiment which concerns on this invention. It is sectional drawing which shows the structure of the wiring board for electronic component mounting of 3rd Embodiment which concerns on this invention. It is a figure explaining the manufacturing method of the wiring board for electronic component mounting of 3rd Embodiment which concerns on this invention, Comprising: (a) forms the board | substrate (board | substrate with a protrusion) of the electronic component mounting wiring board of FIG. The figure which shows the metal layer (metal foil) for this, (b) is a figure which shows the board | substrate with a protrusion formed by forming a trapezoid protrusion in the metal layer of Fig.9 (a) by half etching. It is sectional drawing which shows the structure of the wiring board for electronic component mounting of 4th Embodiment concerning this invention. It is a figure explaining the manufacturing method of the wiring board for electronic component mounting of 4th Embodiment which concerns on this invention, Comprising: (a) forms the board | substrate (board | substrate with a protrusion) of the electronic component mounting wiring board of FIG. The figure which shows the metal layer (metal foil) for this, (b) is a figure which shows the board | substrate with a protrusion formed by forming a trapezoid protrusion in the metal layer of Fig.11 (a) by half etching. It is sectional drawing which shows the structure which formed the plating layer in the inner surface of the non-through-hole for small electronic component mounting of the wiring board for electronic component mounting of FIG. It is a figure which shows the oozing-out state of the adhesive film in the opening part of a wiring board in the comparative example 1. (A)-(d) is a figure explaining the manufacturing method of the multilayer printed wiring board which has a non-through-hole for interlayer connection.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wiring board for electronic component mounting, 11 ... Board, 11A, 11B ... Board with protrusion, 11b ... Copper foil, 11c ... Wiring pattern, 111 ... Copper-clad board (double-sided copper-clad board), 112 ... Substrate with pad, DESCRIPTION OF SYMBOLS 12 ... Wiring board, 12a ... Insulating resin layer, 12b ... Wiring, 12c ... Through-hole, 13 ... Adhesive, 13a ... Opening part, 14 ... Metal pad, 14a ... Trapezoidal protrusion, 14b ... End face, 14c ... Outer peripheral surface 14d ... outer peripheral land, 15 ... non-through hole, 16 ... communication hole, 18 ... small electronic component, 19, 19A ... wiring board with electronic component, 191 ... plated layer, 192 ... inner non-through hole, 913 ... bonding wire 194 ... Electronic component mounting surface, 20 ... Electronic component mounting wiring board, 20A ... Electronic component mounting wiring board, 21 ... Metal pad, 22 ... Platform projection, 23 ... End face, 24 ... Outer peripheral surface, 30 ... Electronic component Mounting wiring board, 30A ... wiring board with electronic components, 30B ... wiring board for mounting electronic components, 30C ... wiring board with electronic components, 31 ... substrate, 31A ... substrate with protrusions, 32 ... trapezoidal protrusion, 33 ... End surface, 34 ... outer peripheral surface, 35 ... non-through hole, 36 ... plate-like portion, 40 ... wiring board for mounting electronic components, 40A ... wiring substrate with electronic components, 41 ... substrate, 41A ... substrate with protruding portions, 42 ... stand -Like protrusions, 43 ... end faces, 44 ... outer peripheral surfaces, 45 ... non-through holes.

Claims (13)

A method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring substrate having a through hole to the substrate through an adhesive layer,
Providing the substrate with a metal pad larger than a cross section perpendicular to the central axis of the through hole of the wiring board;
By half-etching and thinning the portion excluding the central portion of the metal pad, inside the portion to be etched, the cross section of the through hole of the wiring board is approximately the same size as the cross section of the through hole. Forming a trapezoidal protrusion having a flat surface as an end surface on the protruding tip side;
Next, by bonding the substrate and the wiring substrate through the adhesive layer, the through hole of the wiring substrate and the opening formed in the adhesive layer are in a communication hole formed to communicate with each other. And manufacturing the wiring board for mounting an electronic component, comprising the step of accommodating the base-like protrusion of the substrate and obtaining the non-through hole for mounting the small electronic component by making the communication hole non-through. Method. A method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring substrate having a through hole to the substrate through an adhesive layer,
Providing the substrate with a metal pad larger than a cross section perpendicular to the central axis of the through hole of the wiring board;
The central portion of the metal pad is thickened by a pattern plating method, and a trapezoidal shape having a flat surface that is substantially the same as the cross section of the through hole of the wiring board and that can be accommodated in the through hole is an end surface on the protruding tip side. Forming a protrusion; and
Next, by bonding the substrate and the wiring substrate through the adhesive layer, the through hole of the wiring substrate and the opening formed in the adhesive layer are in a communication hole formed to communicate with each other. And manufacturing the wiring board for mounting an electronic component, comprising the step of accommodating the base-like protrusion of the substrate and obtaining the non-through hole for mounting the small electronic component by making the communication hole non-through. Method. A method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring substrate having a through hole to the substrate through an adhesive layer,
The metal layer is partially half-etched and thinned, so that a portion of the metal layer except the portion to be etched is substantially equivalent to a cross section perpendicular to the central axis of the through-hole of the wiring board in the through-hole. Forming a table-like protrusion having a flat surface of a size that can be stored as an end surface on the protruding tip side, and obtaining the substrate having the table-like protrusion; and
Next, by bonding the substrate and the wiring substrate through the adhesive layer, the through hole of the wiring substrate and the opening formed in the adhesive layer are in a communication hole formed to communicate with each other. And manufacturing the wiring board for mounting an electronic component, comprising the step of accommodating the base-like protrusion of the substrate and obtaining the non-through hole for mounting the small electronic component by making the communication hole non-through. Method. A method of manufacturing an electronic component mounting wiring board having a non-through hole for mounting a small electronic component by bonding a wiring substrate having a through hole to the substrate through an adhesive layer,
The substrate is a metal layer, and a part of the substrate is thickened by a pattern plating method so that the substrate can be accommodated in the through hole with a cross section perpendicular to the central axis of the through hole of the wiring substrate. Forming a trapezoidal protrusion having the flat surface of the protrusion as the end surface on the protruding tip side;
Next, by bonding the substrate and the wiring substrate through the adhesive layer, the through hole of the wiring substrate and the opening formed in the adhesive layer are in a communication hole formed to communicate with each other. And manufacturing the wiring board for mounting an electronic component, comprising the step of accommodating the base-like protrusion of the substrate and obtaining the non-through hole for mounting the small electronic component by making the communication hole non-through. Method.   In the manufacturing method of the electronic component mounting wiring board according to any one of claims 1 to 4, 10% or more of the thickness of the adhesive layer is formed on the trapezoidal protrusion by the half etching or the pattern plating method. The manufacturing method of the wiring board for electronic component mounting characterized by ensuring the protrusion dimension of this.   The said through hole of the said wiring board is a round hole with a diameter of 0.8 mm or more, or a square hole with the length of one side of 0.8 mm or more. A method of manufacturing a wiring board for mounting electronic components.   Furthermore, the manufacturing method of the wiring board for electronic component mounting in any one of Claims 1-6 which comprises the process of forming a plating layer in the inner surface of the said small through-hole for electronic component mounting. A wiring board having a through hole for storing small electronic components is bonded to the board via an adhesive layer,
The substrate is provided with a metal pad larger than a cross section perpendicular to the central axis of the through hole, and the through hole is formed at a position corresponding to the through hole of the wiring board at the center of the metal pad. A table-like protrusion is provided that has a flat surface that is substantially the same as the cross section and that can be accommodated in the through hole, and has an end surface on the protruding tip side.
The trapezoidal protrusion is accommodated in a communication hole in which the through hole of the wiring board and the opening formed in the adhesive layer communicate with each other, and the trapezoidal protrusion is formed in the communication hole. A wiring board for mounting electronic parts, wherein a non-through hole for mounting a small electronic part is secured as a bottom. A wiring board having a through hole for storing small electronic components is bonded to the board via an adhesive layer,
The substrate is a metal layer, and the substrate has a size corresponding to the through-hole of the wiring substrate and can be accommodated in the through-hole with a cross section perpendicular to the central axis of the through-hole. The base-like protrusion which makes the flat surface of
The trapezoidal protrusion is accommodated in a communication hole in which the through hole of the wiring board and the opening formed in the adhesive layer communicate with each other, and the trapezoidal protrusion is formed in the communication hole. A wiring board for mounting electronic parts, wherein a non-through hole for mounting a small electronic part is secured as a bottom.   9. The taper-like protrusion has a taper shape in which an outer peripheral surface of the base-like protrusion expands outward as it goes from the end face toward the protruding base end side of the base-like protrusion on the substrate. 9. A wiring board for mounting electronic components according to 9.   The said through hole of the said wiring board is a round hole with a diameter of 0.8 mm or more, or a square hole with one side length of 0.8 mm or more. Wiring board for mounting electronic components.   The wiring board for mounting electronic components according to claim 8, wherein a plating layer is formed on an inner surface of the non-through hole for mounting the small electronic components. The inside of the plating layer formed in the said end surface of the said base-like protrusion part of the wiring board for electronic component mounting in any one of Claims 8-11 or the inner surface of the said non-through hole for small electronic component mounting. A small electronic component is mounted on a portion formed on the end face of the trapezoidal protrusion,
The wiring board with electronic parts, wherein the small electronic parts are electrically connected to the wiring of the wiring board by wire bonding.

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