ITMI920063A1 - Materiale composito fluoropolimerico caricato con ceramica - Google Patents

Materiale composito fluoropolimerico caricato con ceramica

Info

Publication number: ITMI920063A1
Authority: IT; Italy
Prior art keywords: ceramic; composite material; material loaded; fluoropolymeric composite; fluoropolymeric
Prior art date: 1991-01-17

Application number

IT000063A

Other languages

English (en)

Inventor

David J Arthur

Allen F Horn Iii

Brett Kilhenny

Gwo S Swei

Original Assignee

Rogers Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-01-17

Filing date

1992-01-16

Publication date

1993-07-16

1992-01-16 Application filed by Rogers Corp filed Critical Rogers Corp

1992-01-16 Publication of ITMI920063A0 publication Critical patent/ITMI920063A0/it

1993-07-16 Publication of ITMI920063A1 publication Critical patent/ITMI920063A1/it

1996-07-22 Application granted granted Critical

1996-07-22 Publication of IT1262930B publication Critical patent/IT1262930B/it

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

Chemical & Material Sciences (AREA)
Polymers & Plastics (AREA)
Health & Medical Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Laminated Bodies (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Wiring (AREA)
Organic Insulating Materials (AREA)
Adhesives Or Adhesive Processes (AREA)

ITMI920063A 1991-01-17 1992-01-16 Materiale composito fluoropolimerico caricato con ceramica IT1262930B (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US64142791A	1991-01-17	1991-01-17

Publications (3)

Publication Number	Publication Date
ITMI920063A0 ITMI920063A0 (it)	1992-01-16
ITMI920063A1 true ITMI920063A1 (it)	1993-07-16
IT1262930B IT1262930B (it)	1996-07-22

Family

ID=24572333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ITMI920063A IT1262930B (it)	1991-01-17	1992-01-16	Materiale composito fluoropolimerico caricato con ceramica

Country Status (5)

Country	Link
JP (1)	JP3409066B2 (it)
DE (1)	DE4200583A1 (it)
FR (1)	FR2671932A1 (it)
GB (1)	GB2251860A (it)
IT (1)	IT1262930B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5287619A (en) *	1992-03-09	1994-02-22	Rogers Corporation	Method of manufacture multichip module substrate
GB2422608B (en)	2004-12-30	2008-10-01	Ind Tech Res Inst	Self-cleaning coating comprising hydrophobically-modified particles
CN112574521B (zh) *	2020-12-09	2022-04-26	广东生益科技股份有限公司	一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4849284A (en) *	1987-02-17	1989-07-18	Rogers Corporation	Electrical substrate material
JPH02210710A (ja) *	1989-02-10	1990-08-22	Junkosha Co Ltd	耐湿性誘電体材料
US4987274A (en) *	1989-06-09	1991-01-22	Rogers Corporation	Coaxial cable insulation and coaxial cable made therewith
JPH06119810A (ja) *	1990-02-21	1994-04-28	Rogers Corp	誘電複合体
US5077115A (en) *	1990-05-08	1991-12-31	Rogers Corporation	Thermoplastic composite material

1991
- 1991-12-20 GB GB9127158A patent/GB2251860A/en not_active Withdrawn
1992
- 1992-01-11 DE DE4200583A patent/DE4200583A1/de not_active Withdrawn
- 1992-01-14 FR FR9200287A patent/FR2671932A1/fr not_active Withdrawn
- 1992-01-16 IT ITMI920063A patent/IT1262930B/it active IP Right Grant
- 1992-01-17 JP JP04435492A patent/JP3409066B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
GB9127158D0 (en)	1992-02-19
GB2251860A (en)	1992-07-22
DE4200583A1 (de)	1992-07-23
JP3409066B2 (ja)	2003-05-19
FR2671932A1 (fr)	1992-07-24
IT1262930B (it)	1996-07-22
ITMI920063A0 (it)	1992-01-16
JPH05202259A (ja)	1993-08-10

Publication	Publication Date	Title
BR8807683A (pt)	1990-06-26	Um material composito de ceramica/metal
FI892765L (fi)	1989-12-08	Kompositmaterial.
NO982793D0 (no)	1998-06-17	Isolasjonsmaterial
FI923737L (fi)	1992-08-20	Rekombinantantikroppar specifika foer tnfa
DE3887437D1 (de)	1994-03-10	Mikrowellenabsorbierendes zusammengesetztes Material.
BR8905676A (pt)	1990-06-05	Estrutura composita
BR9007051A (pt)	1991-10-01	Estrutura transportadora
NO894578L (no)	1990-05-18	Sammensatt platemateriale.
DE68921971D1 (de)	1995-05-04	Komposit-Ferrit-Material.
DE69209613D1 (de)	1996-05-09	Dielektrisches-keramisches Verbundmaterial
DE68909324D1 (de)	1993-10-28	Keramisches Material.
FI931711L (fi)	1993-10-17	Stoedfot foer kran i kompositmaterial
MX9206552A (es)	1993-05-01	Material de ceramica.
DK400289D0 (da)	1989-08-15	Fladt keramisk element
ITMI920063A1 (it)	1993-07-16	Materiale composito fluoropolimerico caricato con ceramica
DE69127900D1 (de)	1997-11-13	Kohlenstoff-kohlenstoff verbundmaterial
DK490388D0 (da)	1988-09-02	Materiale
BR9306524A (pt)	1998-09-15	Material composto
HUT59462A (en)	1992-05-28	Slab-shaped sandwich element
BR8905015A (pt)	1990-05-08	Material termicamente condutivo
FR2620574B1 (fr)	1989-12-01	Materiau supraconducteur
DE3854057D1 (de)	1995-08-03	Supraleitendes Material.
AT389547B (de)	1989-12-27	Waermedaemm-verbundelement
DK160889D0 (da)	1989-04-03	Mikroboelgeovn
DK50490A (da)	1995-10-04	Sammensat keramisk materiale

Legal Events

Date	Code	Title	Description
1996-07-22	0001	Granted
1999-10-27	TA	Fee payment date (situation as of event date), data collected since 19931001	Effective date: 19961129