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DE4200583A1 - Fluorpolymer-verbundmaterial mit keramischem fuellstoff - Google Patents

Fluorpolymer-verbundmaterial mit keramischem fuellstoff

Info

Publication number
DE4200583A1
DE4200583A1 DE4200583A DE4200583A DE4200583A1 DE 4200583 A1 DE4200583 A1 DE 4200583A1 DE 4200583 A DE4200583 A DE 4200583A DE 4200583 A DE4200583 A DE 4200583A DE 4200583 A1 DE4200583 A1 DE 4200583A1
Authority
DE
Germany
Prior art keywords
filler
material according
silane
ceramic filler
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4200583A
Other languages
German (de)
English (en)
Inventor
David J Arthur
Gwo S Swei
Iii Allen F Horn
Brett Kilhenny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
World Properties Inc
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of DE4200583A1 publication Critical patent/DE4200583A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Insulating Materials (AREA)
DE4200583A 1991-01-17 1992-01-11 Fluorpolymer-verbundmaterial mit keramischem fuellstoff Withdrawn DE4200583A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64142791A 1991-01-17 1991-01-17

Publications (1)

Publication Number Publication Date
DE4200583A1 true DE4200583A1 (de) 1992-07-23

Family

ID=24572333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4200583A Withdrawn DE4200583A1 (de) 1991-01-17 1992-01-11 Fluorpolymer-verbundmaterial mit keramischem fuellstoff

Country Status (5)

Country Link
JP (1) JP3409066B2 (it)
DE (1) DE4200583A1 (it)
FR (1) FR2671932A1 (it)
GB (1) GB2251860A (it)
IT (1) IT1262930B (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560077A2 (en) * 1992-03-09 1993-09-15 Rogers Corporation Multichip module substrate and method of manufacture thereof
CN112574521A (zh) * 2020-12-09 2021-03-30 广东生益科技股份有限公司 一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2422608B (en) 2004-12-30 2008-10-01 Ind Tech Res Inst Self-cleaning coating comprising hydrophobically-modified particles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
JPH02210710A (ja) * 1989-02-10 1990-08-22 Junkosha Co Ltd 耐湿性誘電体材料
US4987274A (en) * 1989-06-09 1991-01-22 Rogers Corporation Coaxial cable insulation and coaxial cable made therewith
JPH06119810A (ja) * 1990-02-21 1994-04-28 Rogers Corp 誘電複合体
US5077115A (en) * 1990-05-08 1991-12-31 Rogers Corporation Thermoplastic composite material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0560077A2 (en) * 1992-03-09 1993-09-15 Rogers Corporation Multichip module substrate and method of manufacture thereof
EP0560077A3 (en) * 1992-03-09 1993-11-10 Rogers Corp Multichip module substrate and method of manufacture thereof
CN112574521A (zh) * 2020-12-09 2021-03-30 广东生益科技股份有限公司 一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板
WO2022120921A1 (zh) * 2020-12-09 2022-06-16 广东生益科技股份有限公司 一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板
US11945924B2 (en) 2020-12-09 2024-04-02 Shengyi Technology Co., Ltd. Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the same

Also Published As

Publication number Publication date
ITMI920063A1 (it) 1993-07-16
JP3409066B2 (ja) 2003-05-19
JPH05202259A (ja) 1993-08-10
IT1262930B (it) 1996-07-22
GB9127158D0 (en) 1992-02-19
ITMI920063A0 (it) 1992-01-16
GB2251860A (en) 1992-07-22
FR2671932A1 (fr) 1992-07-24

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: WORLD PROPERTIES, INC., LINCOLNWOOD, ILL., US

8128 New person/name/address of the agent

Representative=s name: KUHNEN & WACKER PATENTANWALTSGESELLSCHAFT MBH, 853

8130 Withdrawal