ITMI920063A0 - Materiale composito fluoropolimerico caricato con ceramica - Google Patents

Materiale composito fluoropolimerico caricato con ceramica

Info

Publication number: ITMI920063A0
Authority: IT; Italy
Prior art keywords: ceramic; composite material; material loaded; fluoropolymer composite; fluoropolymer
Prior art date: 1991-01-17

Application number

IT92MI63A

Other languages

English (en)

Inventor

David Arthur

Allen Horn

Gwo S Swei

Gwo Swei

Brett Kilhenny

Original Assignee

Rogers Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-01-17

Filing date

1992-01-16

Publication date

1992-01-16

1992-01-16 Application filed by Rogers Corp filed Critical Rogers Corp

1992-01-16 Publication of ITMI920063A0 publication Critical patent/ITMI920063A0/it

1993-07-16 Publication of ITMI920063A1 publication Critical patent/ITMI920063A1/it

1996-07-22 Application granted granted Critical

1996-07-22 Publication of IT1262930B publication Critical patent/IT1262930B/it

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

Chemical & Material Sciences (AREA)
Polymers & Plastics (AREA)
Health & Medical Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Laminated Bodies (AREA)
Adhesives Or Adhesive Processes (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Wiring (AREA)
Organic Insulating Materials (AREA)

ITMI920063A 1991-01-17 1992-01-16 Materiale composito fluoropolimerico caricato con ceramica IT1262930B (it)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US64142791A	1991-01-17	1991-01-17

Publications (3)

Publication Number	Publication Date
ITMI920063A0 true ITMI920063A0 (it)	1992-01-16
ITMI920063A1 ITMI920063A1 (it)	1993-07-16
IT1262930B IT1262930B (it)	1996-07-22

Family

ID=24572333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ITMI920063A IT1262930B (it)	1991-01-17	1992-01-16	Materiale composito fluoropolimerico caricato con ceramica

Country Status (5)

Country	Link
JP (1)	JP3409066B2 (it)
DE (1)	DE4200583A1 (it)
FR (1)	FR2671932A1 (it)
GB (1)	GB2251860A (it)
IT (1)	IT1262930B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5287619A (en) *	1992-03-09	1994-02-22	Rogers Corporation	Method of manufacture multichip module substrate
GB2422608B (en)	2004-12-30	2008-10-01	Ind Tech Res Inst	Self-cleaning coating comprising hydrophobically-modified particles
CN112574521B (zh) *	2020-12-09	2022-04-26	广东生益科技股份有限公司	一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4849284A (en) *	1987-02-17	1989-07-18	Rogers Corporation	Electrical substrate material
JPH02210710A (ja) *	1989-02-10	1990-08-22	Junkosha Co Ltd	耐湿性誘電体材料
US4987274A (en) *	1989-06-09	1991-01-22	Rogers Corporation	Coaxial cable insulation and coaxial cable made therewith
JPH06119810A (ja) *	1990-02-21	1994-04-28	Rogers Corp	誘電複合体
US5077115A (en) *	1990-05-08	1991-12-31	Rogers Corporation	Thermoplastic composite material

1991
- 1991-12-20 GB GB9127158A patent/GB2251860A/en not_active Withdrawn
1992
- 1992-01-11 DE DE4200583A patent/DE4200583A1/de not_active Withdrawn
- 1992-01-14 FR FR9200287A patent/FR2671932A1/fr not_active Withdrawn
- 1992-01-16 IT ITMI920063A patent/IT1262930B/it active IP Right Grant
- 1992-01-17 JP JP04435492A patent/JP3409066B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
GB9127158D0 (en)	1992-02-19
IT1262930B (it)	1996-07-22
JP3409066B2 (ja)	2003-05-19
ITMI920063A1 (it)	1993-07-16
JPH05202259A (ja)	1993-08-10
DE4200583A1 (de)	1992-07-23
GB2251860A (en)	1992-07-22
FR2671932A1 (fr)	1992-07-24

Publication	Publication Date	Title
FI892765L (fi)	1989-12-08	Kompositmaterial.
DE3869897D1 (de)	1992-05-14	Gesintertes material.
DE69115149D1 (de)	1996-01-18	Oxidationsbeständige Verbundwerkstoffe mit keramischer Matrix.
BR8807683A (pt)	1990-06-26	Um material composito de ceramica/metal
DE68928274D1 (de)	1997-10-02	Mehrschichtiges Material
DE3877566D1 (de)	1993-02-25	Keramisches verbundmaterial und daraus hergestellte gegenstaende.
DE69014887D1 (de)	1995-01-19	Gesintertes polymeres verbundmaterial.
NO911468D0 (no)	1991-04-15	Kompositt ioneledende elektrolyttelement.
IT1214472B (it)	1990-01-18	Materiale cementizio composito con inerte metallico.
DE3887437D1 (de)	1994-03-10	Mikrowellenabsorbierendes zusammengesetztes Material.
MX9203352A (es)	1993-02-01	Material compuesto rigido.
DE69209613D1 (de)	1996-05-09	Dielektrisches-keramisches Verbundmaterial
DE68909324D1 (de)	1993-10-28	Keramisches Material.
DE69125302D1 (de)	1997-04-30	Mit keramischem Material gefüllte Fluorpolymer Verbundstoffe
MX9206552A (es)	1993-05-01	Material de ceramica.
FI912332L (fi)	1991-11-16	Skaft foer solvram av kompositmaterial.
DE69023376D1 (de)	1995-12-14	Verbundstruktursupraleiter.
DE69011142D1 (de)	1994-09-08	Kompositmaterial.
IT8820505A0 (it)	1988-05-09	Trasportatore composito ad elementi a piastra inclinabili lateralmente.
ITMI920063A0 (it)	1992-01-16	Materiale composito fluoropolimerico caricato con ceramica
IT1241466B (it)	1994-01-17	Laterizio di rivestimento in materiale ceramico refrattario.
FR2657946B1 (fr)	1992-06-19	Profile en materiau composite.
IT1232918B (it)	1992-03-05	Materiale composito con matrice di zirconia
IT8622766A0 (it)	1986-12-19	Materiale composito multistrato.
DE69120415D1 (de)	1996-07-25	Gegossenes verbundmaterial

Legal Events

Date	Code	Title	Description
1996-07-22	0001	Granted
1999-10-27	TA	Fee payment date (situation as of event date), data collected since 19931001	Effective date: 19961129