GB9127158D0 - Ceramic filled fluoropolymeric composite material - Google Patents

Ceramic filled fluoropolymeric composite material

Info

Publication number: GB9127158D0
Authority: GB; United Kingdom
Prior art keywords: composite material; ceramic filled; fluoropolymeric composite; filled fluoropolymeric; ceramic
Prior art date: 1991-01-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

GB919127158A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Rogers Corp

Original Assignee

Rogers Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-01-17

Filing date

1991-12-20

Publication date

1992-02-19

1991-12-20 Application filed by Rogers Corp filed Critical Rogers Corp

1992-02-19 Publication of GB9127158D0 publication Critical patent/GB9127158D0/en

1992-07-22 Publication of GB2251860A publication Critical patent/GB2251860A/en

Status Withdrawn legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

Chemical & Material Sciences (AREA)
Polymers & Plastics (AREA)
Health & Medical Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Laminated Bodies (AREA)
Adhesives Or Adhesive Processes (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Wiring (AREA)
Organic Insulating Materials (AREA)

GB9127158A 1991-01-17 1991-12-20 Ceramic tilled fluoropolymeric composite material Withdrawn GB2251860A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US64142791A	1991-01-17	1991-01-17

Publications (2)

Publication Number	Publication Date
GB9127158D0 true GB9127158D0 (en)	1992-02-19
GB2251860A GB2251860A (en)	1992-07-22

Family

ID=24572333

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB9127158A Withdrawn GB2251860A (en)	1991-01-17	1991-12-20	Ceramic tilled fluoropolymeric composite material

Country Status (5)

Country	Link
JP (1)	JP3409066B2 (en)
DE (1)	DE4200583A1 (en)
FR (1)	FR2671932A1 (en)
GB (1)	GB2251860A (en)
IT (1)	IT1262930B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5287619A (en) *	1992-03-09	1994-02-22	Rogers Corporation	Method of manufacture multichip module substrate
GB2422608B (en)	2004-12-30	2008-10-01	Ind Tech Res Inst	Self-cleaning coating comprising hydrophobically-modified particles
CN112574521B (en)	2020-12-09	2022-04-26	广东生益科技股份有限公司	Fluorine-containing resin composition, resin glue solution containing same, fluorine-containing medium sheet, laminated board, copper-clad plate and printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4849284A (en) *	1987-02-17	1989-07-18	Rogers Corporation	Electrical substrate material
JPH02210710A (en) *	1989-02-10	1990-08-22	Junkosha Co Ltd	Moisture resistant dielectric material
US4987274A (en) *	1989-06-09	1991-01-22	Rogers Corporation	Coaxial cable insulation and coaxial cable made therewith
JPH06119810A (en) *	1990-02-21	1994-04-28	Rogers Corp	Dielectric composite
US5077115A (en) *	1990-05-08	1991-12-31	Rogers Corporation	Thermoplastic composite material

1991
- 1991-12-20 GB GB9127158A patent/GB2251860A/en not_active Withdrawn
1992
- 1992-01-11 DE DE4200583A patent/DE4200583A1/en not_active Withdrawn
- 1992-01-14 FR FR9200287A patent/FR2671932A1/en not_active Withdrawn
- 1992-01-16 IT ITMI920063A patent/IT1262930B/en active IP Right Grant
- 1992-01-17 JP JP04435492A patent/JP3409066B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
ITMI920063A1 (en)	1993-07-16
JP3409066B2 (en)	2003-05-19
JPH05202259A (en)	1993-08-10
IT1262930B (en)	1996-07-22
ITMI920063A0 (en)	1992-01-16
GB2251860A (en)	1992-07-22
FR2671932A1 (en)	1992-07-24
DE4200583A1 (en)	1992-07-23

Publication	Publication Date	Title
GB2220669B (en)	1992-06-03	Composite materials
GB2224730B (en)	1993-02-10	Ceramic composite
GB9013629D0 (en)	1990-08-08	Composite materials
US5384181B1 (en)	2000-06-13	Low volume fraction ceramic filled fluoropolymeric composite material
GB2221675B (en)	1993-01-06	Ceramic material
EP0443401A3 (en)	1992-05-06	Ceramic filled fluoropolymer composite material
GB8819297D0 (en)	1988-09-14	Composite materials
GB9124403D0 (en)	1992-01-08	Ceramic material
GB2245899B (en)	1993-12-08	Composite materials
GB2216526B (en)	1992-02-26	Low-permittivity composite material
GB9125124D0 (en)	1992-01-22	Cementitious material
GB9027506D0 (en)	1991-02-06	Composite material
GB9127158D0 (en)	1992-02-19	Ceramic filled fluoropolymeric composite material
EP0514157A3 (en)	1995-04-26	Composite material
GB2235156B (en)	1993-06-02	Composite materials
GB9109315D0 (en)	1991-06-19	Composite material
GB2269394B (en)	1994-08-03	Insulation material
CS8801592A1 (en)	1989-11-14	Composite materials
GB9126178D0 (en)	1992-02-12	Material preparation
GB9103380D0 (en)	1991-04-03	Material preparation
PL291478A1 (en)	1993-02-22	Porous ceramic material
RU1635482C (en)	1993-11-15	Composite material
GB8819896D0 (en)	1988-09-21	Composite material
GB8817006D0 (en)	1988-08-17	Composite material
GB8819134D0 (en)	1988-09-14	Composite material

Legal Events

Date	Code	Title	Description
1993-05-19	WAP	Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)