EP0770710B1 - Verfahren zur galvanischen Abscheidung von blendfreien Nickelniederschlägen - Google Patents
Verfahren zur galvanischen Abscheidung von blendfreien Nickelniederschlägen Download PDFInfo
- Publication number
- EP0770710B1 EP0770710B1 EP96116639A EP96116639A EP0770710B1 EP 0770710 B1 EP0770710 B1 EP 0770710B1 EP 96116639 A EP96116639 A EP 96116639A EP 96116639 A EP96116639 A EP 96116639A EP 0770710 B1 EP0770710 B1 EP 0770710B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrolyte
- process according
- adducts
- operated
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- the invention relates to a method for galvanic Separation of glare-free nickel deposits on one metallic surface.
- nickel precipitation also includes nickel alloy precipitation.
- metallic surface also includes metallized surfaces of non-metallic objects.
- the deposition is operated so that the electrolyte has a temperature in the Has a range of 40 to 75 ° C.
- the adducts are like this selected that the adducts in the working electrolyte form a finely dispersed emulsion that turns out to be turbidity expresses.
- the droplets of the emulsion are the reason for this viewed that a glare-free surface forms.
- the Glare-free is in need of improvement.
- nonionic surfactant can be used can, because the cloud point, that is, the electrolyte temperature, at which the surfactant precipitates, from which chemical structure and concentration of substances in the Electrolyte depends.
- the drop of emulsion increases the risk of agglomeration unsuitably large conglomerates of emulsion drops that satin-like deposition disturb, so large that special Measures are mandatory to complete the procedure to be able to use it permanently in practice.
- the invention is based on the technical problem that Procedure of the structure described at the beginning and of the beginning described purpose so that reproducibly a much improved defined Glare-free is achieved.
- the usual basic gloss agents used are "sulfonic acids such as benzenesulfonic acid, naphthalenetrisulfonic acid, alkanesulfonic acids or also sulfonamides or sulfonimides or the corresponding alkali salts" or mixtures thereof, in an amount of 0.5 to 10 g / l.
- a substance from the group "the unsaturated aliphatic sulfonic acids or their alkali metal salts" or mixtures thereof are used for the purpose of producing the glare-free nickel deposits.
- the concentration of the adducts added is expediently chosen in the range from 0.5 to 10 g / l.
- the electrolyte is preferably operated in a temperature range of 50 to 65 ° C during the electrolytic deposition. Wetting agents and organic sulfinic acids or their alkali salts can also be added to the electrolyte.
- the invention is based on the knowledge that even without Formation of a visible, cloudy emulsion and corresponding organic foreign matter in the electrolyte high quality glare control is achieved when after the teaching of the invention is proceeded.
- the invention applied nickel layer has a completely different structure than the known method described above generated. That is related below Exemplary embodiments explained. It can be left open remain whether according to the invention are still teardrop-shaped at all Precipitations occur. Drop-shaped precipitates are in the Precipitation mainly related to the surface tension is stabilized as drops. In any case, the effects occur for the qualitative high-quality, reproducible glare control is required - and surprisingly, disruptive conglomerates that disturb the glare-free and have to be filtered, not observed.
- the current densities can largely be adapted to the operating conditions. It has proven useful to operate the electrolyte with a current density of 0.1 to 10 A / dm 2 .
- the electrolyte is preferably operated with a current density of approximately 4 A / dm 2 .
- the treatment time for the nickel deposition is largely arbitrary and can be adapted to the operating conditions, in particular also the layer thickness. Within the scope of the invention, the treatment time for the nickel deposition is preferably 1 to 120 min., Preferably about 10 min. is.
- the electrolyte can always be operated without secondary circulation. Secondary circuit free means that a secondary circuit with filter devices or cooling devices is not required.
- Example 1 The anti-glare of the coating according to Example 1 is compared to the embodiment of Example 2 clearly improved.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Physical Vapour Deposition (AREA)
- Electrolytic Production Of Metals (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Description
Claims (10)
- Verfahren zur galvanischen Abscheidung von blendfreien Nickelniederschlägen auf einer metallischen Oberfläche mit den Merkmalen:1.1) es wird mit einem Elektrolyten der Gruppe "Watts'scher Elektrolyt, Elektrolyte auf Basis von Sulfamat, Sulfonat, Fluoroborat" oder Mischungen davon gearbeitet, dem ein übliches Grundglanzmittel beigegeben worden ist,1.2) es werden zum Zwecke der Erzeugung der blendfreien Nickelniederschläge substituierte und/oder unsubstituierte Äthylenoxid-Addukte oder Propylenoxid-Addukte oder Äthylenoxid-Propylenoxid-Addukte verwendet und dem Elektrolyten beigegeben,1.3) die Konzentration der gemäß 1.2) beigegebenen Addukte wird in einen Bereich von größer Null bis 5 mg/l gewählt,1.4) bei der galvanischen Abscheidung wird der Elektrolyt in einem Temperaturbereich von 40 bis 75° C betrieben,
- Verfahren nach Anspruch 1, wobei mit einem Watts'schen Elektrolyten gearbeitet wird, der eine Richtanalyse mit70 bis 140 g/l Nickel,1 bis 20 g/l Chlorid,30 bis 50 g/l H3BO3
- Verfahren nach einem der Ansprüche 1 oder 2, wobei als Grundglanzmittel eine Substanz der Gruppe "2-Sulfobenzoesäureimid, 1,3-Benzoldisulfonsäure und Naphthalintrisulfonsäure bzw. deren Alkalisalze" oder Mischungen davon bzw. "Arylsulfonsäuren, Alkylsulfonsäuren, Sulfonamide und Sulfonimide bzw. deren Alkalisalze" oder Mischungen davon verwendet werden, und zwar in einer Menge von 0,5 bis 10 g/l.
- Verfahren nach einem der Ansprüche 1 bis 3, wobei als Grundglanzmittel eine Substanz der Gruppe "ungesättigte aliphatische Sulfonsäuren bzw. deren Alkalisalze" oder Mischungen davon verwendet werden.
- Verfahren nach Anspruch 4, wobei die Konzentration des Grundglanzmittels in einem Bereich von 0,5 bis 10 g/l gewählt wird.
- Verfahren nach einem der Ansprüche 1 bis 5, wobei bei der galvanischen Abscheidung der Elektrolyt in einem Temperaturbereich von 50 bis 65° C betrieben wird.
- Verfahren nach einem der Ansprüche 1 bis 6, wobei der Elektrolyt mit einer Stromdichte von 0,1 bis 10 A/dm2 betrieben wird.
- Verfahren nach einem der Ansprüche 1 bis 7, wobei der Elektrolyt mit einer Stromdichte von etwa 4 A/dm2 betrieben wird.
- Verfahren nach einem der Ansprüche 1 bis 8, wobei mit einer Behandlungszeit für die Nickelabscheidung gearbeitet wird, die 1 bis 120 min., vorzugsweise etwa 10 min., beträgt.
- Verfahren nach einem der Ansprüche 1 bis 9, wobei der Elektrolyt nebenkreislauffrei betrieben wird.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19540011A DE19540011C2 (de) | 1995-10-27 | 1995-10-27 | Verfahren zur galvanischen Abscheidung von blendfreien Nickel- oder Nickellegierungsniederschlägen |
DE19540011 | 1995-10-27 | ||
DE9540011U | 1995-10-27 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0770710A1 EP0770710A1 (de) | 1997-05-02 |
EP0770710B1 true EP0770710B1 (de) | 1999-01-07 |
EP0770710B2 EP0770710B2 (de) | 2002-08-14 |
Family
ID=7775920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96116639A Expired - Lifetime EP0770710B2 (de) | 1995-10-27 | 1996-10-17 | Verfahren zur galvanischen Abscheidung von blendfreien Nickelniederschlägen |
Country Status (6)
Country | Link |
---|---|
US (1) | US5897763A (de) |
EP (1) | EP0770710B2 (de) |
JP (1) | JPH09202987A (de) |
AT (1) | ATE175453T1 (de) |
DE (2) | DE19540011C2 (de) |
ES (1) | ES2128135T5 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU773971B2 (en) * | 1999-03-19 | 2004-06-10 | Specialty Chemical Systems, Inc. | Electroplating baths |
US6251253B1 (en) * | 1999-03-19 | 2001-06-26 | Technic, Inc. | Metal alloy sulfate electroplating baths |
US6248228B1 (en) * | 1999-03-19 | 2001-06-19 | Technic, Inc. And Specialty Chemical System, Inc. | Metal alloy halide electroplating baths |
US6797141B1 (en) * | 1999-11-25 | 2004-09-28 | Enthone Inc. | Removal of coagulates from a non-glare electroplating bath |
US6306275B1 (en) * | 2000-03-31 | 2001-10-23 | Lacks Enterprises, Inc. | Method for controlling organic micelle size in nickel-plating solution |
DE10025552C1 (de) * | 2000-05-19 | 2001-08-02 | Atotech Deutschland Gmbh | Saures galvanisches Nickelbad und Verfahren zum Abscheiden eines satinglänzenden Nickel- oder Nickellegierungsüberzuges |
DE10222962A1 (de) * | 2002-05-23 | 2003-12-11 | Atotech Deutschland Gmbh | Saurer galvanischer Badelektrolyt und Verfahren zur elektrolytischen Abscheidung satinglänzender Nickelniederschläge |
PL1969160T3 (pl) * | 2006-01-06 | 2011-09-30 | Enthone Incorporated | Elektrolit i sposób osadzania matowej warstwy metalu |
EP2620529B1 (de) * | 2012-01-25 | 2014-04-30 | Atotech Deutschland GmbH | Verfahren zur Herstellung von matten Kupferablagerungen |
JP6760166B2 (ja) | 2017-03-23 | 2020-09-23 | トヨタ自動車株式会社 | ニッケル皮膜の形成方法及び当該方法に使用するためのニッケル溶液 |
US11505867B1 (en) | 2021-06-14 | 2022-11-22 | Consolidated Nuclear Security, LLC | Methods and systems for electroless plating a first metal onto a second metal in a molten salt bath, and surface pretreatments therefore |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2238861A (en) * | 1938-07-06 | 1941-04-15 | Harshaw Chem Corp | Electrodeposition of metals |
DE1134258B (de) * | 1959-05-06 | 1962-08-02 | Dehydag Gmbh | Saures galvanisches Nickelbad |
DE1621085C3 (de) * | 1967-05-16 | 1980-02-14 | Henkel Kgaa, 4000 Duesseldorf | Saures galvanisches Bad zur Abscheidung satinglanzender Nickelniederschlage |
US3839166A (en) * | 1967-05-16 | 1974-10-01 | Henkel & Cie Gmbh | Method for obtaining nickel deposits with satin finish |
US3839165A (en) * | 1967-08-26 | 1974-10-01 | Henkel & Cie Gmbh | Nickel electroplating method |
BE794695A (fr) * | 1972-01-29 | 1973-05-16 | W Kampschulte & Cie K G Dr | Bain galvanique de nickel pour la separation de revetements de nickel satines mats |
DE2327881B2 (de) * | 1973-06-01 | 1978-06-22 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Verfahren zur galvanischen Abscheidung mattglänzender Nickel- bzw. Nickel/Kobalt-Niederschläge |
JPS56152988A (en) * | 1980-04-30 | 1981-11-26 | Nobuyuki Koura | Nickel satin finish plating bath of heavy ruggedness |
JPS61238993A (ja) * | 1985-04-16 | 1986-10-24 | Dai Ichi Kogyo Seiyaku Co Ltd | 電気メツキ浴用添加剤 |
JPS62205041A (ja) * | 1986-03-05 | 1987-09-09 | Nisso Yuka Kogyo Kk | 1,4−ブチンジオ−ルのヒドロキシアルキルエ−テル化物の製造方法およびこれを用いたニツケルメツキ処理液 |
-
1995
- 1995-10-27 DE DE19540011A patent/DE19540011C2/de not_active Expired - Lifetime
-
1996
- 1996-10-17 DE DE59601103T patent/DE59601103D1/de not_active Expired - Lifetime
- 1996-10-17 ES ES96116639T patent/ES2128135T5/es not_active Expired - Lifetime
- 1996-10-17 AT AT96116639T patent/ATE175453T1/de not_active IP Right Cessation
- 1996-10-17 EP EP96116639A patent/EP0770710B2/de not_active Expired - Lifetime
- 1996-10-25 US US08/736,906 patent/US5897763A/en not_active Expired - Lifetime
- 1996-10-25 JP JP8284052A patent/JPH09202987A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH09202987A (ja) | 1997-08-05 |
ATE175453T1 (de) | 1999-01-15 |
EP0770710B2 (de) | 2002-08-14 |
ES2128135T3 (es) | 1999-05-01 |
DE19540011A1 (de) | 1997-04-30 |
DE59601103D1 (de) | 1999-02-18 |
US5897763A (en) | 1999-04-27 |
ES2128135T5 (es) | 2003-03-01 |
EP0770710A1 (de) | 1997-05-02 |
DE19540011C2 (de) | 1998-09-10 |
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