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DE69926939D1 - Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte - Google Patents

Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte

Info

Publication number
DE69926939D1
DE69926939D1 DE69926939T DE69926939T DE69926939D1 DE 69926939 D1 DE69926939 D1 DE 69926939D1 DE 69926939 T DE69926939 T DE 69926939T DE 69926939 T DE69926939 T DE 69926939T DE 69926939 D1 DE69926939 D1 DE 69926939D1
Authority
DE
Germany
Prior art keywords
copper foil
producing
layer
thickness
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69926939T
Other languages
English (en)
Other versions
DE69926939T2 (de
Inventor
Tsutomu Asai
Fujio Kuwako
Shinichi Obata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Application granted granted Critical
Publication of DE69926939D1 publication Critical patent/DE69926939D1/de
Publication of DE69926939T2 publication Critical patent/DE69926939T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69926939T 1998-04-01 1999-03-30 Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte Expired - Fee Related DE69926939T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10421698 1998-04-01
JP10421698 1998-04-01

Publications (2)

Publication Number Publication Date
DE69926939D1 true DE69926939D1 (de) 2005-10-06
DE69926939T2 DE69926939T2 (de) 2006-07-13

Family

ID=14374775

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926939T Expired - Fee Related DE69926939T2 (de) 1998-04-01 1999-03-30 Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte

Country Status (9)

Country Link
US (1) US6240636B1 (de)
EP (1) EP0948247B1 (de)
KR (1) KR100610234B1 (de)
CN (1) CN1333623C (de)
AT (1) ATE303712T1 (de)
DE (1) DE69926939T2 (de)
MY (1) MY122378A (de)
SG (1) SG78343A1 (de)
TW (1) TW411745B (de)

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JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
US6356002B1 (en) * 1999-02-08 2002-03-12 Northrop Grumman Corporation Electrical slip ring having a higher circuit density
EP1172025B2 (de) † 1999-03-23 2006-04-26 Circuit Foil Luxembourg S.a.r.l. Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte und verbundfolie zur verwendung darin
DE60031680T2 (de) * 1999-06-02 2007-09-06 Ibiden Co., Ltd., Ogaki Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte
DE19929179A1 (de) * 1999-06-25 2001-01-11 Siemens Ag Flexible Leiterplatte mit beidseitigem Zugriff
US6492600B1 (en) * 1999-06-28 2002-12-10 International Business Machines Corporation Laminate having plated microvia interconnects and method for forming the same
DE60030743T2 (de) * 1999-07-12 2007-09-06 Ibiden Co., Ltd., Ogaki Verfahren zum Herstellen einer Leiterplatte
JP3676152B2 (ja) * 1999-11-11 2005-07-27 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその製造方法
DE60043337D1 (de) * 1999-12-15 2009-12-31 Panasonic Corp Leiterplatte und herstellungsverfahren der leiterplatte
JP2001267747A (ja) * 2000-03-22 2001-09-28 Nitto Denko Corp 多層回路基板の製造方法
CN1441919A (zh) * 2000-07-10 2003-09-10 株式会社光技术 多心金属箍的制造方法
JP2002033581A (ja) * 2000-07-13 2002-01-31 Mitsui Mining & Smelting Co Ltd 銅張積層板の製造方法
DE10036995A1 (de) * 2000-07-29 2002-02-07 Heidelberger Druckmasch Ag Verfahren zum Gravieren einer Druckform mit Laserstrahl
TWI283555B (en) * 2000-09-22 2007-07-01 Ase Material Inc Method for drilling holes on circuit board
US6815709B2 (en) * 2001-05-23 2004-11-09 International Business Machines Corporation Structure having flush circuitry features and method of making
JP2002353160A (ja) * 2001-05-28 2002-12-06 Murata Mfg Co Ltd 回路基板及びその製造方法
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EP1289354B1 (de) * 2001-09-01 2005-11-30 TRUMPF LASERTECHNIK GmbH Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte
US6984915B2 (en) 2002-01-22 2006-01-10 Electro-Tec Corp. Electrical slip ring platter multilayer printed circuit board and method for making same
JP3941573B2 (ja) * 2002-04-24 2007-07-04 宇部興産株式会社 フレキシブル両面基板の製造方法
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DE102004005300A1 (de) * 2004-01-29 2005-09-08 Atotech Deutschland Gmbh Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens
US7205483B2 (en) * 2004-03-19 2007-04-17 Matsushita Electric Industrial Co., Ltd. Flexible substrate having interlaminar junctions, and process for producing the same
KR100601465B1 (ko) * 2004-10-05 2006-07-18 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US7892412B2 (en) * 2005-08-05 2011-02-22 Mutual-Tek Industries Co., Ltd. Manufacturing process of embedded type flexible or rigid printed circuit board
US7297285B2 (en) * 2005-08-05 2007-11-20 Roger Chang Manufacturing process of emboss type flexible or rigid printed circuit board
US20070210420A1 (en) * 2006-03-11 2007-09-13 Nelson Curt L Laser delamination of thin metal film using sacrificial polymer layer
JP2008166736A (ja) * 2006-12-06 2008-07-17 Hitachi Via Mechanics Ltd プリント基板の製造方法およびプリント基板加工機
TWI337058B (en) * 2007-02-16 2011-02-01 Unimicron Technology Corp Circuit board process
JP5073395B2 (ja) * 2007-07-19 2012-11-14 日本メクトロン株式会社 多層プリント配線板の製造方法
JP5094323B2 (ja) * 2007-10-15 2012-12-12 新光電気工業株式会社 配線基板の製造方法
TWI455671B (zh) * 2007-10-23 2014-10-01 Ube Industries 印刷電路板之製造方法
US20110212257A1 (en) * 2008-02-18 2011-09-01 Princo Corp. Method to decrease warpage of a multi-layer substrate and structure thereof
US20110212307A1 (en) * 2008-02-18 2011-09-01 Princo Corp. Method to decrease warpage of a multi-layer substrate and structure thereof
TWI432121B (zh) * 2008-02-18 2014-03-21 Princo Corp 平衡多層基板應力之方法及多層基板結構
TWI392425B (zh) * 2009-08-25 2013-04-01 Unimicron Technology Corp 內埋式線路板及其製造方法
TWI393508B (zh) * 2009-12-17 2013-04-11 Unimicron Technology Corp 線路板及其製程
JP5355380B2 (ja) * 2009-12-25 2013-11-27 新光電気工業株式会社 多層配線基板
CN101977480B (zh) * 2010-10-14 2013-06-05 惠州中京电子科技股份有限公司 印刷线路板精细线路制作工艺
JP6144003B2 (ja) * 2011-08-29 2017-06-07 富士通株式会社 配線構造及びその製造方法並びに電子装置及びその製造方法
WO2013133269A1 (ja) * 2012-03-09 2013-09-12 三井金属鉱業株式会社 プリント配線板の製造方法及びレーザー加工用銅箔
JP2014053342A (ja) * 2012-09-05 2014-03-20 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板
EP2934074A1 (de) * 2012-12-11 2015-10-21 Ngk Spark Plug Co., Ltd. Verdrahtungssubstrat und herstellungsverfahren dafür
CN104519670B (zh) * 2014-12-18 2019-11-29 深圳市五株科技股份有限公司 曲面电路板制作工艺
KR102412000B1 (ko) * 2015-05-12 2022-06-22 삼성전기주식회사 동박적층판 및 이를 이용한 인쇄회로기판의 제조방법
CN104923918A (zh) * 2015-06-30 2015-09-23 开平太平洋绝缘材料有限公司 一种半固化片的激光裁边装置
KR102576010B1 (ko) * 2015-08-11 2023-09-06 가부시끼가이샤 레조낙 다층 프린트 배선판의 제조 방법, 접착층 부착 금속박, 금속장 적층판, 다층 프린트 배선판
CN105405770A (zh) * 2015-12-14 2016-03-16 深圳崇达多层线路板有限公司 一种超小尺寸的绑定焊盘的制作方法
US10251270B2 (en) * 2016-09-15 2019-04-02 Innovium, Inc. Dual-drill printed circuit board via
JP6777023B2 (ja) * 2017-06-20 2020-10-28 トヨタ自動車株式会社 積層金属箔の溶接方法
US10986730B2 (en) * 2019-03-08 2021-04-20 Microsemi Semiconductor Ulc Techniques for routing electrical signals through electrical components and related methods
KR102777247B1 (ko) * 2019-11-27 2025-03-10 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
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CN113747669A (zh) * 2021-09-02 2021-12-03 大同共聚(西安)科技有限公司 一种布线板间通孔的制造方法

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Also Published As

Publication number Publication date
MY122378A (en) 2006-04-29
SG78343A1 (en) 2001-02-20
KR100610234B1 (ko) 2006-08-09
EP0948247B1 (de) 2005-08-31
CN1333623C (zh) 2007-08-22
US6240636B1 (en) 2001-06-05
KR19990082814A (ko) 1999-11-25
EP0948247A1 (de) 1999-10-06
DE69926939T2 (de) 2006-07-13
ATE303712T1 (de) 2005-09-15
TW411745B (en) 2000-11-11
CN1237873A (zh) 1999-12-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee