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DE69721153D1 - Verpackung eines optoelektronischen Bauelements - Google Patents

Verpackung eines optoelektronischen Bauelements

Info

Publication number
DE69721153D1
DE69721153D1 DE69721153T DE69721153T DE69721153D1 DE 69721153 D1 DE69721153 D1 DE 69721153D1 DE 69721153 T DE69721153 T DE 69721153T DE 69721153 T DE69721153 T DE 69721153T DE 69721153 D1 DE69721153 D1 DE 69721153D1
Authority
DE
Germany
Prior art keywords
packaging
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69721153T
Other languages
English (en)
Other versions
DE69721153T2 (de
Inventor
Yasushi Fujimura
Yoshiki Kuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69721153D1 publication Critical patent/DE69721153D1/de
Publication of DE69721153T2 publication Critical patent/DE69721153T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69721153T 1996-07-31 1997-07-28 Verpackung eines optoelektronischen Bauelements Expired - Fee Related DE69721153T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21921896A JP3436009B2 (ja) 1996-07-31 1996-07-31 光半導体素子
JP21921896 1996-07-31

Publications (2)

Publication Number Publication Date
DE69721153D1 true DE69721153D1 (de) 2003-05-28
DE69721153T2 DE69721153T2 (de) 2004-02-19

Family

ID=16732060

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69721153T Expired - Fee Related DE69721153T2 (de) 1996-07-31 1997-07-28 Verpackung eines optoelektronischen Bauelements

Country Status (5)

Country Link
US (1) US6034424A (de)
EP (1) EP0825653B1 (de)
JP (1) JP3436009B2 (de)
KR (1) KR100265456B1 (de)
DE (1) DE69721153T2 (de)

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US6866923B2 (en) * 2000-11-15 2005-03-15 Atlas Roofing Corporation Thermosetting plastic foams and methods of production thereof using adhesion additives
US7023022B2 (en) 2000-11-16 2006-04-04 Emcore Corporation Microelectronic package having improved light extraction
US6555903B2 (en) * 2000-12-19 2003-04-29 Truelight Corporation Package structure of hybrid device in optical signal transmitter
US6536958B2 (en) 2000-12-20 2003-03-25 Triquint Technology Holding Co. Optical device package with hermetically bonded fibers
WO2002089219A1 (en) * 2001-04-17 2002-11-07 Nichia Corporation Light-emitting apparatus
DE10159544A1 (de) * 2001-12-05 2003-06-26 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelementes und damit hergestelltes Bauelement
US6936495B1 (en) 2002-01-09 2005-08-30 Bridge Semiconductor Corporation Method of making an optoelectronic semiconductor package device
US6891276B1 (en) 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
JP2003258272A (ja) * 2002-02-27 2003-09-12 Sumitomo Electric Ind Ltd 光受信モジュール
US6806547B2 (en) * 2002-03-28 2004-10-19 Sumitomo Electric Industries, Ltd. Light-receiving module
US20030185522A1 (en) * 2002-04-02 2003-10-02 Young Craig A. Bend limiter
TW540816U (en) * 2002-05-30 2003-07-01 Hon Hai Prec Ind Co Ltd Semiconductor package
JP3989350B2 (ja) * 2002-09-30 2007-10-10 新光電気工業株式会社 ガラス端子
US20040076383A1 (en) * 2002-10-17 2004-04-22 Huei Peng Self-aligned metal base/window cap and methods of aligning a laser diode chip to a window cap for high speed semiconductor laser package
DE10255462B4 (de) * 2002-11-25 2005-07-07 Infineon Technologies Ag Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung
US7038900B2 (en) * 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
KR100464342B1 (ko) 2003-04-14 2005-01-03 삼성전자주식회사 티오-캔 구조의 광 모듈
US7406268B2 (en) * 2003-08-27 2008-07-29 Avago Technologies Limited Optical receiver circuit
JP4470583B2 (ja) 2004-05-21 2010-06-02 住友電気工業株式会社 光半導体装置
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
JP2007201213A (ja) * 2006-01-27 2007-08-09 Opnext Japan Inc 光受信モジュール
JP4970924B2 (ja) * 2006-03-28 2012-07-11 三菱電機株式会社 光素子用パッケージとこれを用いた光半導体装置
JP2010034287A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd キャップ及び光モジュール
US20100252856A1 (en) * 2009-01-28 2010-10-07 Coretek Opto Corp. Header structure of opto-electronic element and opto-electronic element using the same
DE102011013278B4 (de) * 2011-03-07 2020-06-18 Schott Ag Gehäuse für Hochleistungsleuchtdioden - "1-Lagen-System"
KR101778303B1 (ko) * 2011-04-13 2017-09-13 한국전자통신연구원 고속 신호 전송을 위한 ｔｏ－ｃａｎ(티오-캔) 구조의 광모듈
FR3001578B1 (fr) * 2013-01-31 2015-04-03 New Imaging Technologies Sas Matrice de photodiode a zone dopee absorbant les charges
JP6239970B2 (ja) * 2013-12-25 2017-11-29 京セラ株式会社 Ｔｏ−ｃａｎ型パッケージ用ヘッダーおよび半導体装置
CN107534021B (zh) * 2015-08-24 2020-12-01 京瓷株式会社 电子部件搭载用封装体以及使用其的电子装置
KR102164911B1 (ko) * 2016-04-26 2020-10-13 교세라 가부시키가이샤 반도체 패키지 및 그것을 사용한 반도체 장치
USD877707S1 (en) * 2017-03-30 2020-03-10 Mitsubishi Electric Corporation Semiconductor package
JP6408661B2 (ja) * 2017-07-21 2018-10-17 京セラ株式会社 Ｔｏ−ｃａｎ型パッケージ用ヘッダーおよび半導体装置
TWI657237B (zh) * 2018-02-21 2019-04-21 茂達電子股份有限公司 光學偵測裝置及光學封裝結構
JP7507682B2 (ja) * 2020-12-28 2024-06-28 新光電気工業株式会社 半導体パッケージ用ステム
KR102455733B1 (ko) * 2022-02-11 2022-10-18 주식회사 지오스테크놀러지 트랜지스터 아웃라인 패키지 제조 장치 및 이의 제조 방법

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JPH0448784A (ja) * 1990-06-15 1992-02-18 Sumitomo Electric Ind Ltd 受光素子パッケージ
JPH04111477A (ja) * 1990-08-31 1992-04-13 Sumitomo Electric Ind Ltd 受光素子
JPH05243604A (ja) * 1992-02-27 1993-09-21 Eastman Kodak Japan Kk 発光素子
KR100309623B1 (ko) * 1994-02-28 2002-04-24 사토 게니치로 발광다이오드램프및이를이용한매트릭스표시기
JP3047735B2 (ja) * 1994-05-16 2000-06-05 住友電気工業株式会社 光受信モジュ−ルとその製造方法
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Also Published As

Publication number Publication date
EP0825653A3 (de) 1998-04-08
KR980012310A (ko) 1998-04-30
EP0825653B1 (de) 2003-04-23
DE69721153T2 (de) 2004-02-19
JPH1051024A (ja) 1998-02-20
KR100265456B1 (ko) 2000-10-02
EP0825653A2 (de) 1998-02-25
US6034424A (en) 2000-03-07
JP3436009B2 (ja) 2003-08-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee