DE69112713D1 - Halbleiteranordnung mit verbessertem Transistor vom isolierten Gatetyp. - Google Patents
Halbleiteranordnung mit verbessertem Transistor vom isolierten Gatetyp.Info
- Publication number
- DE69112713D1 DE69112713D1 DE69112713T DE69112713T DE69112713D1 DE 69112713 D1 DE69112713 D1 DE 69112713D1 DE 69112713 T DE69112713 T DE 69112713T DE 69112713 T DE69112713 T DE 69112713T DE 69112713 D1 DE69112713 D1 DE 69112713D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- type transistor
- insulated gate
- gate type
- improved insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000009413 insulation Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2144544A JP2790362B2 (ja) | 1990-06-04 | 1990-06-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69112713D1 true DE69112713D1 (de) | 1995-10-12 |
DE69112713T2 DE69112713T2 (de) | 1996-02-22 |
Family
ID=15364769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69112713T Expired - Fee Related DE69112713T2 (de) | 1990-06-04 | 1991-06-04 | Halbleiteranordnung mit verbessertem Transistor vom isolierten Gatetyp. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5302846A (de) |
EP (1) | EP0460918B1 (de) |
JP (1) | JP2790362B2 (de) |
KR (1) | KR950006482B1 (de) |
CN (1) | CN1032173C (de) |
AT (1) | ATE127618T1 (de) |
DE (1) | DE69112713T2 (de) |
ES (1) | ES2076468T3 (de) |
MY (1) | MY107193A (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5512517A (en) * | 1995-04-25 | 1996-04-30 | International Business Machines Corporation | Self-aligned gate sidewall spacer in a corrugated FET and method of making same |
US5705409A (en) * | 1995-09-28 | 1998-01-06 | Motorola Inc. | Method for forming trench transistor structure |
US5879971A (en) * | 1995-09-28 | 1999-03-09 | Motorola Inc. | Trench random access memory cell and method of formation |
US5929476A (en) * | 1996-06-21 | 1999-07-27 | Prall; Kirk | Semiconductor-on-insulator transistor and memory circuitry employing semiconductor-on-insulator transistors |
US5838176A (en) * | 1996-07-11 | 1998-11-17 | Foveonics, Inc. | Correlated double sampling circuit |
DE19720193C2 (de) | 1997-05-14 | 2002-10-17 | Infineon Technologies Ag | Integrierte Schaltungsanordnung mit mindestens zwei vertikalen MOS-Transistoren und Verfahren zu deren Herstellung |
US5886382A (en) * | 1997-07-18 | 1999-03-23 | Motorola, Inc. | Trench transistor structure comprising at least two vertical transistors |
US6500744B2 (en) | 1999-09-02 | 2002-12-31 | Micron Technology, Inc. | Methods of forming DRAM assemblies, transistor devices, and openings in substrates |
EP2275807B1 (de) | 1999-11-15 | 2014-04-23 | Panasonic Healthcare Co., Ltd. | Biosensor zur Quantifizierung eines Substrats |
US7745289B2 (en) * | 2000-08-16 | 2010-06-29 | Fairchild Semiconductor Corporation | Method of forming a FET having ultra-low on-resistance and low gate charge |
US9590065B2 (en) * | 2013-12-04 | 2017-03-07 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device with metal gate structure comprising work-function metal layer and work-fuction adjustment layer |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5423478A (en) * | 1977-07-25 | 1979-02-22 | Toshiba Corp | Semiconductor device of field effect type |
JPS57192080A (en) * | 1981-05-21 | 1982-11-26 | Fujitsu Ltd | Semiconductor device |
JPS59129472A (ja) * | 1983-01-14 | 1984-07-25 | Sanyo Electric Co Ltd | Mos型トランジスタ |
JPS59228762A (ja) * | 1983-06-10 | 1984-12-22 | Hitachi Ltd | マルチゲ−トトランジスタ |
US4786953A (en) * | 1984-07-16 | 1988-11-22 | Nippon Telegraph & Telephone | Vertical MOSFET and method of manufacturing the same |
US4835585A (en) * | 1984-11-26 | 1989-05-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Trench gate structures |
KR940005451B1 (ko) * | 1984-11-27 | 1994-06-18 | 아메리칸 텔리폰 앤드 텔레그라프 캄파니 | Mos 트렌치 트랜지스터 장치 및 그 제조 방법 |
JPS62136877A (ja) * | 1985-12-11 | 1987-06-19 | Toshiba Corp | 絶縁ゲ−ト型電界効果トランジスタ |
GB2195663B (en) * | 1986-08-15 | 1990-08-22 | Nippon Telegraph & Telephone | Chemical vapour deposition method and apparatus therefor |
US4835584A (en) * | 1986-11-27 | 1989-05-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Trench transistor |
US4910564A (en) * | 1987-07-01 | 1990-03-20 | Mitsubishi Denki Kabushiki Kaisha | Highly integrated field effect transistor and method for manufacturing the same |
JPS6421968A (en) * | 1987-07-17 | 1989-01-25 | Oki Electric Ind Co Ltd | Vertical type mosfet device and manufacture thereof |
JPH01183855A (ja) * | 1988-01-18 | 1989-07-21 | Mitsubishi Electric Corp | Mos形トランジスタ |
JPH0214578A (ja) * | 1988-07-01 | 1990-01-18 | Fujitsu Ltd | 半導体装置 |
US5047812A (en) * | 1989-02-27 | 1991-09-10 | Motorola, Inc. | Insulated gate field effect device |
US4964080A (en) * | 1990-03-09 | 1990-10-16 | Intel Corporation | Three-dimensional memory cell with integral select transistor |
-
1990
- 1990-06-04 JP JP2144544A patent/JP2790362B2/ja not_active Expired - Fee Related
-
1991
- 1991-05-28 KR KR1019910008738A patent/KR950006482B1/ko not_active IP Right Cessation
- 1991-05-31 MY MYPI91000958A patent/MY107193A/en unknown
- 1991-06-03 CN CN91103681A patent/CN1032173C/zh not_active Expired - Fee Related
- 1991-06-04 AT AT91305045T patent/ATE127618T1/de not_active IP Right Cessation
- 1991-06-04 EP EP91305045A patent/EP0460918B1/de not_active Expired - Lifetime
- 1991-06-04 ES ES91305045T patent/ES2076468T3/es not_active Expired - Lifetime
- 1991-06-04 DE DE69112713T patent/DE69112713T2/de not_active Expired - Fee Related
-
1992
- 1992-12-08 US US07/986,890 patent/US5302846A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0438877A (ja) | 1992-02-10 |
EP0460918A2 (de) | 1991-12-11 |
CN1057131A (zh) | 1991-12-18 |
DE69112713T2 (de) | 1996-02-22 |
EP0460918A3 (en) | 1992-05-06 |
ATE127618T1 (de) | 1995-09-15 |
KR950006482B1 (ko) | 1995-06-15 |
JP2790362B2 (ja) | 1998-08-27 |
US5302846A (en) | 1994-04-12 |
CN1032173C (zh) | 1996-06-26 |
EP0460918B1 (de) | 1995-09-06 |
KR920001749A (ko) | 1992-01-30 |
ES2076468T3 (es) | 1995-11-01 |
MY107193A (en) | 1995-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |