DE602004018852D1 - Herstellungsverfahren für ein Kameramodul - Google Patents
Herstellungsverfahren für ein KameramodulInfo
- Publication number
- DE602004018852D1 DE602004018852D1 DE602004018852T DE602004018852T DE602004018852D1 DE 602004018852 D1 DE602004018852 D1 DE 602004018852D1 DE 602004018852 T DE602004018852 T DE 602004018852T DE 602004018852 T DE602004018852 T DE 602004018852T DE 602004018852 D1 DE602004018852 D1 DE 602004018852D1
- Authority
- DE
- Germany
- Prior art keywords
- solid
- imaging device
- state imaging
- optical unit
- receiving elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 5
- 238000003384 imaging method Methods 0.000 abstract 4
- 239000006059 cover glass Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L9/00—Disinfection, sterilisation or deodorisation of air
- A61L9/16—Disinfection, sterilisation or deodorisation of air using physical phenomena
- A61L9/22—Ionisation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/021—Power management, e.g. power saving
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/028—Generation of voltages supplied to electrode drivers in a matrix display other than LCD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Veterinary Medicine (AREA)
- Epidemiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003130599A JP4510403B2 (ja) | 2003-05-08 | 2003-05-08 | カメラモジュール及びカメラモジュールの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004018852D1 true DE602004018852D1 (de) | 2009-02-12 |
Family
ID=32985658
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004018852T Expired - Lifetime DE602004018852D1 (de) | 2003-05-08 | 2004-05-04 | Herstellungsverfahren für ein Kameramodul |
DE602004015191T Expired - Lifetime DE602004015191D1 (de) | 2003-05-08 | 2004-05-04 | Kameramodul |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004015191T Expired - Lifetime DE602004015191D1 (de) | 2003-05-08 | 2004-05-04 | Kameramodul |
Country Status (7)
Country | Link |
---|---|
US (2) | US7570297B2 (de) |
EP (2) | EP1796376B1 (de) |
JP (1) | JP4510403B2 (de) |
KR (1) | KR100614476B1 (de) |
CN (1) | CN1323550C (de) |
AT (1) | ATE402563T1 (de) |
DE (2) | DE602004018852D1 (de) |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US7061106B2 (en) * | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
US20060109366A1 (en) * | 2004-05-04 | 2006-05-25 | Tessera, Inc. | Compact lens turret assembly |
WO2005109861A1 (en) | 2004-05-04 | 2005-11-17 | Tessera, Inc. | Compact lens turret assembly |
JP2006032886A (ja) * | 2004-06-15 | 2006-02-02 | Fuji Photo Film Co Ltd | 固体撮像装置及びその製造方法及びカメラモジュール |
WO2005125181A1 (ja) * | 2004-06-15 | 2005-12-29 | Renesas Technology Corp. | 光学モジュールの製造方法及び組立装置 |
EP1628493A1 (de) * | 2004-08-17 | 2006-02-22 | Dialog Semiconductor GmbH | Handhabungssystem für Kamera |
JP2006100763A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法及び接合装置 |
EP1648181A1 (de) * | 2004-10-12 | 2006-04-19 | Dialog Semiconductor GmbH | Einzelbildabspeichervorrichtung |
KR100630705B1 (ko) * | 2004-10-20 | 2006-10-02 | 삼성전자주식회사 | 카메라 모듈 및 그 제조방법 |
JP4562538B2 (ja) * | 2005-01-31 | 2010-10-13 | モレックス インコーポレイテド | モジュール用ソケット |
FR2881847A1 (fr) * | 2005-02-10 | 2006-08-11 | St Microelectronics Sa | Dispositif comportant un module de camera a mise au point automatique et procede de montage correspondant |
DE102005006756A1 (de) * | 2005-02-15 | 2006-08-17 | Robert Bosch Gmbh | Bildaufnahmesystem |
EP1713126A1 (de) * | 2005-04-14 | 2006-10-18 | Shih-Hsien Tseng | Bildaufnahmevorrichtung und deren Herstellungsverfahren |
JP4684771B2 (ja) * | 2005-06-30 | 2011-05-18 | Hoya株式会社 | 像振れ補正装置 |
US7531773B2 (en) | 2005-09-08 | 2009-05-12 | Flextronics Ap, Llc | Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group |
FR2891088A1 (fr) * | 2005-09-20 | 2007-03-23 | St Microelectronics Sa | Structure de montage d'un objectif mobile au-dessus d'un capteur optique |
KR100658149B1 (ko) | 2005-11-25 | 2006-12-15 | 삼성전기주식회사 | 이미지센서 모듈과 이를 포함하는 카메라 모듈 패키지 |
WO2007096992A1 (ja) * | 2006-02-24 | 2007-08-30 | Matsushita Electric Industrial Co., Ltd. | 撮像装置及び携帯端末装置 |
KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
KR100770684B1 (ko) * | 2006-05-18 | 2007-10-29 | 삼성전기주식회사 | 카메라 모듈 패키지 |
KR100795181B1 (ko) | 2006-08-23 | 2008-01-16 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
KR100823686B1 (ko) | 2006-08-23 | 2008-04-18 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
KR100810284B1 (ko) * | 2006-09-28 | 2008-03-06 | 삼성전자주식회사 | 카메라 모듈과 그 제조 방법 |
JP5154783B2 (ja) * | 2006-11-14 | 2013-02-27 | オリンパス株式会社 | 撮像モジュールの製造方法 |
KR100868052B1 (ko) * | 2006-12-05 | 2008-11-10 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
JP2008148222A (ja) * | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | 固体撮像装置とその製造方法 |
US20080170141A1 (en) * | 2007-01-11 | 2008-07-17 | Samuel Waising Tam | Folded package camera module and method of manufacture |
US8605208B2 (en) | 2007-04-24 | 2013-12-10 | Digitaloptics Corporation | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
CN100592131C (zh) * | 2007-10-24 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
CN101420526B (zh) * | 2007-10-26 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器承载装置及相机模组 |
DE102007055322B4 (de) * | 2007-11-20 | 2012-09-06 | Continental Automotive Gmbh | Herstellungsverfahren für eine Kamera |
DE102007057172B4 (de) * | 2007-11-26 | 2009-07-02 | Silicon Micro Sensors Gmbh | Stereokamera zur Umgebungserfassung |
US9350976B2 (en) | 2007-11-26 | 2016-05-24 | First Sensor Mobility Gmbh | Imaging unit of a camera for recording the surroundings with optics uncoupled from a circuit board |
US8488046B2 (en) | 2007-12-27 | 2013-07-16 | Digitaloptics Corporation | Configurable tele wide module |
US8031477B2 (en) * | 2008-02-15 | 2011-10-04 | Optoelectronics Co., Ltd. | System and method for coupling a lens to a printed circuit |
JP4667480B2 (ja) * | 2008-03-07 | 2011-04-13 | Okiセミコンダクタ株式会社 | カメラモジュール |
JP5165437B2 (ja) * | 2008-03-27 | 2013-03-21 | シャープ株式会社 | 固体撮像装置、および電子機器 |
TWI459032B (zh) * | 2009-03-09 | 2014-11-01 | 鏡頭模組之組裝方法、組裝設備及檢測方法 | |
TWI464477B (zh) * | 2009-12-22 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組及其組裝方法 |
CN102109655B (zh) * | 2009-12-24 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组及其组装方法 |
WO2011111248A1 (ja) * | 2010-03-10 | 2011-09-15 | Smk株式会社 | カメラモジュール |
WO2011120480A1 (de) * | 2010-04-01 | 2011-10-06 | Conti Temic Microelectronic Gmbh | Vorrichtung mit optischem modul und trägerplatte |
DE112010005015A5 (de) * | 2010-04-01 | 2012-11-22 | Conti Temic Microelectronic Gmbh | Vorrichtung mit optischem Modul und Objektivhalter |
KR20110127913A (ko) * | 2010-05-20 | 2011-11-28 | 삼성전자주식회사 | 카메라 모듈 |
US8308379B2 (en) * | 2010-12-01 | 2012-11-13 | Digitaloptics Corporation | Three-pole tilt control system for camera module |
DE102011011527A1 (de) * | 2011-02-17 | 2012-08-23 | Conti Temic Microelectronic Gmbh | Kameramodul |
US10009528B2 (en) | 2011-02-24 | 2018-06-26 | Nan Chang O-Film Optoelectronics Technology Ltd | Autofocus camera module packaging with circuitry-integrated actuator system |
US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
US8982267B2 (en) | 2011-07-27 | 2015-03-17 | Flextronics Ap, Llc | Camera module with particle trap |
CN103765865A (zh) | 2011-08-19 | 2014-04-30 | 富士胶片株式会社 | 摄像元件模块及其制造方法 |
US9197796B2 (en) * | 2011-11-23 | 2015-11-24 | Lg Innotek Co., Ltd. | Camera module |
US20130258182A1 (en) * | 2012-03-30 | 2013-10-03 | Omnivision Technologies, Inc. | Wafer level camera module with protective tube |
JP5711178B2 (ja) * | 2012-04-06 | 2015-04-30 | オリンパスメディカルシステムズ株式会社 | 撮像装置及びこの撮像装置を用いた内視鏡 |
US9001268B2 (en) | 2012-08-10 | 2015-04-07 | Nan Chang O-Film Optoelectronics Technology Ltd | Auto-focus camera module with flexible printed circuit extension |
KR101500041B1 (ko) * | 2012-12-14 | 2015-03-06 | 엘지이노텍 주식회사 | 카메라 모듈 및 그를 갖는 카메라 장치 |
WO2014173774A1 (en) * | 2013-04-22 | 2014-10-30 | Sanofi-Aventis Deutschland Gmbh | A method of assembling a supplemental device comprising a camera module for an injection pen and said supplemental device |
TWI512961B (zh) * | 2013-08-16 | 2015-12-11 | Azurewave Technologies Inc | 用於降低整體厚度的影像感測模組及其製作方法 |
US9167161B1 (en) | 2013-08-30 | 2015-10-20 | Amazon Technologies, Inc. | Camera module package with a folded substrate and laterally positioned components |
JP6262536B2 (ja) * | 2014-01-08 | 2018-01-17 | 新光電気工業株式会社 | カメラモジュールの製造方法 |
CN105025206B (zh) * | 2014-04-30 | 2018-10-02 | 光宝科技股份有限公司 | 用于增加组装平整度的影像撷取模块及其组装方法 |
CN104219428B (zh) * | 2014-08-21 | 2019-04-26 | 深圳市金立通信设备有限公司 | 一种摄像头安装装置 |
CN104219427A (zh) * | 2014-08-21 | 2014-12-17 | 深圳市金立通信设备有限公司 | 一种摄像头安装方法 |
US20170307842A1 (en) * | 2014-10-16 | 2017-10-26 | Sharp Kabushiki Kaisha | Camera module manufacturing method and camera module manufacturing apparatus |
US10236312B2 (en) * | 2015-02-16 | 2019-03-19 | Sony Corporation | Camera module and electronic apparatus to lower risk of breakage of camera module |
DE102015002534B4 (de) * | 2015-02-28 | 2016-10-06 | Schölly Fiberoptic GmbH | Verfahren zur Fertigung eines Kameramoduls und Kameramodul |
KR102360319B1 (ko) * | 2016-03-12 | 2022-02-08 | 닝보 써니 오포테크 코., 엘티디. | 카메라 모듈, 그 감광성 부품 및 그 제조 방법 |
JP2017223739A (ja) * | 2016-06-13 | 2017-12-21 | 富士通株式会社 | 光モジュール及び光モジュール製造方法 |
US10925160B1 (en) | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
KR102248312B1 (ko) | 2016-07-03 | 2021-05-04 | 닝보 써니 오포테크 코., 엘티디. | 감광성 부품과 카메라 모듈 및 그 제조방법 |
US10321028B2 (en) | 2016-07-03 | 2019-06-11 | Ningbo Sunny Opotech Co., Ltd. | Photosensitive assembly and camera module and manufacturing method thereof |
US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
FR3060851B1 (fr) * | 2016-12-20 | 2018-12-07 | 3D Plus | Module optoelectronique 3d d'imagerie |
EP4072120B1 (de) * | 2017-05-18 | 2025-03-26 | Ningbo Sunny Opotech Co., Ltd. | Kameramodul und gegossene leiterplattenanordnung davon, gruppenkameramodul und elektronische vorrichtung |
JP2019082623A (ja) * | 2017-10-31 | 2019-05-30 | 日本電産三協電子(東莞)有限公司 | 光学ユニット |
TWI657305B (zh) * | 2018-05-04 | 2019-04-21 | 致伸科技股份有限公司 | 攝像模組之組裝方法 |
JP2020004901A (ja) * | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
JP2020150207A (ja) | 2019-03-15 | 2020-09-17 | キヤノン株式会社 | 電子部品およびその製造方法、機器 |
KR102796386B1 (ko) | 2019-08-14 | 2025-04-17 | 삼성전자주식회사 | 이미지 센서 칩을 포함하는 반도체 패키지 |
AT522995B1 (de) * | 2019-10-07 | 2021-05-15 | Vexcel Imaging Gmbh | Sensoranordnung |
CN111641762B (zh) * | 2020-05-28 | 2021-11-02 | 维沃移动通信有限公司 | 摄像模组及电子设备 |
KR102380310B1 (ko) * | 2020-08-26 | 2022-03-30 | 삼성전기주식회사 | 카메라 모듈 |
KR102560901B1 (ko) * | 2020-11-16 | 2023-07-28 | (주)파트론 | 온도 센서 모듈 |
AT525579B1 (de) | 2022-03-09 | 2023-05-15 | Vexcel Imaging Gmbh | Verfahren und Kamera zur Korrektur eines geometrischen Abbildungsfehlers in einer Bildaufnahme |
US12149803B1 (en) * | 2022-08-10 | 2024-11-19 | Meta Platforms Technologies, Llc | Camera module with a folded flexible interconnect tape package |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4942539A (en) * | 1988-12-21 | 1990-07-17 | Gmf Robotics Corporation | Method and system for automatically determining the position and orientation of an object in 3-D space |
JPH05102448A (ja) | 1991-10-04 | 1993-04-23 | Sony Corp | 固体撮像素子 |
JPH05136384A (ja) * | 1991-11-13 | 1993-06-01 | Toshiba Corp | 固体撮像モジユール |
JPH06113214A (ja) * | 1992-09-28 | 1994-04-22 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH07202152A (ja) * | 1993-12-28 | 1995-08-04 | Olympus Optical Co Ltd | 固体撮像装置 |
KR960015001A (ko) * | 1994-10-07 | 1996-05-22 | 가나이 쓰토무 | 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치 |
US6148097A (en) * | 1995-06-07 | 2000-11-14 | Asahi Kogaku Kogyo Kabushiki Kaisha | Optical member inspecting apparatus and method of inspection thereof |
JPH08243078A (ja) * | 1995-03-07 | 1996-09-24 | Fuji Photo Optical Co Ltd | 電子内視鏡の撮像素子組付け体 |
JP3498775B2 (ja) * | 1995-05-31 | 2004-02-16 | ソニー株式会社 | 撮像装置 |
CN1100437C (zh) * | 1995-05-31 | 2003-01-29 | 索尼公司 | 摄象装置及其制造方法、摄象拾音装置、信号处理装置及信号处理方法、以及信息处理装置及信息处理方法 |
JP2001517361A (ja) * | 1995-06-30 | 2001-10-02 | デザイン・コンポーネンツ・インコーポレーテッド | 要素配置用の自動化されたシステム |
JP3594439B2 (ja) * | 1997-02-20 | 2004-12-02 | 松下電器産業株式会社 | カメラ |
JP2956651B2 (ja) * | 1997-05-20 | 1999-10-04 | 日本電気株式会社 | 微細パターン検査装置および検査方法 |
JP3836235B2 (ja) * | 1997-12-25 | 2006-10-25 | 松下電器産業株式会社 | 固体撮像装置及びその製造方法 |
JP4562820B2 (ja) * | 1998-03-02 | 2010-10-13 | 富士フイルム株式会社 | 固体撮像素子の取付方法 |
US6762796B1 (en) * | 1998-08-10 | 2004-07-13 | Olympus Optical Co., Ltd. | Image pickup module having integrated lens and semiconductor chip |
US6215578B1 (en) * | 1998-09-17 | 2001-04-10 | Vanguard International Semiconductor Corporation | Electronically switchable off-axis illumination blade for stepper illumination system |
EP1122945A4 (de) * | 1999-08-19 | 2004-06-23 | Mitsubishi Electric Corp | Bildaufnahmevorrichtung und kamera |
JP4849703B2 (ja) * | 1999-09-03 | 2012-01-11 | ソニー株式会社 | 光学モジュール |
US6483101B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
JP3651577B2 (ja) * | 2000-02-23 | 2005-05-25 | 三菱電機株式会社 | 撮像装置 |
JP4004705B2 (ja) * | 2000-02-29 | 2007-11-07 | 松下電器産業株式会社 | 撮像装置と撮像装置組立方法 |
KR20030004353A (ko) * | 2000-03-02 | 2003-01-14 | 올림파스 고가꾸 고교 가부시키가이샤 | 소형 촬상모듈 |
JP2001245217A (ja) * | 2000-03-02 | 2001-09-07 | Olympus Optical Co Ltd | 小型撮像モジュール |
JP3607160B2 (ja) * | 2000-04-07 | 2005-01-05 | 三菱電機株式会社 | 撮像装置 |
JP4405062B2 (ja) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | 固体撮像装置 |
JP3887162B2 (ja) * | 2000-10-19 | 2007-02-28 | 富士通株式会社 | 撮像用半導体装置 |
JP4740405B2 (ja) * | 2000-11-09 | 2011-08-03 | 東京エレクトロン株式会社 | 位置合わせ方法及びプログラム記録媒体 |
JP3540281B2 (ja) * | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
JP3490694B2 (ja) * | 2001-03-28 | 2004-01-26 | 三菱電機株式会社 | 撮像装置及びその製造方法 |
JP3613193B2 (ja) * | 2001-03-30 | 2005-01-26 | 三菱電機株式会社 | 撮像装置 |
JP4698874B2 (ja) * | 2001-04-24 | 2011-06-08 | ローム株式会社 | イメージセンサモジュール、およびイメージセンサモジュールの製造方法 |
JP2003032525A (ja) * | 2001-05-09 | 2003-01-31 | Seiko Precision Inc | 固体撮像装置 |
JP2003060948A (ja) * | 2001-06-05 | 2003-02-28 | Seiko Precision Inc | 固体撮像装置 |
JP4000507B2 (ja) * | 2001-10-04 | 2007-10-31 | ソニー株式会社 | 固体撮像装置の製造方法 |
JP2003116067A (ja) * | 2001-10-09 | 2003-04-18 | Mitsubishi Electric Corp | 固体撮像装置の製造方法 |
JP2003244560A (ja) * | 2002-02-21 | 2003-08-29 | Seiko Precision Inc | 固体撮像装置 |
JP2003274294A (ja) * | 2002-03-14 | 2003-09-26 | Mitsubishi Electric Corp | 固体撮像装置 |
JP2003289474A (ja) * | 2002-03-27 | 2003-10-10 | Canon Inc | 画像処理装置、撮像装置、画像処理方法、プログラム、及びコンピュータ読み取り可能な記憶媒体 |
US7074638B2 (en) | 2002-04-22 | 2006-07-11 | Fuji Photo Film Co., Ltd. | Solid-state imaging device and method of manufacturing said solid-state imaging device |
CN1685707A (zh) * | 2002-09-30 | 2005-10-19 | 皇家飞利浦电子股份有限公司 | 组装照相机模块的方法 |
JP2004312666A (ja) * | 2003-03-25 | 2004-11-04 | Fuji Photo Film Co Ltd | 固体撮像装置及び固体撮像装置の製造方法 |
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US20050036057A1 (en) * | 2003-07-24 | 2005-02-17 | Matsushita Electric Industrial Co., Ltd. | Image pickup device integrated with lens, method and apparatus for manufacturing the same |
JP2005158780A (ja) * | 2003-11-20 | 2005-06-16 | Hitachi Ltd | パターン欠陥検査方法及びその装置 |
KR100539259B1 (ko) * | 2004-04-26 | 2005-12-27 | 삼성전자주식회사 | 자동으로 정렬되는 렌즈를 포함하는 이미지 센서 모듈, 그제조방법 및 렌즈의 자동 초점 조절방법 |
JP4245577B2 (ja) * | 2005-03-22 | 2009-03-25 | シャープ株式会社 | レンズ位置制御装置及び撮像モジュール |
US7639861B2 (en) * | 2005-09-14 | 2009-12-29 | Cognex Technology And Investment Corporation | Method and apparatus for backlighting a wafer during alignment |
JP4781430B2 (ja) * | 2006-05-09 | 2011-09-28 | 東京エレクトロン株式会社 | 撮像位置補正方法及び基板撮像装置 |
-
2003
- 2003-05-08 JP JP2003130599A patent/JP4510403B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-04 AT AT04252587T patent/ATE402563T1/de not_active IP Right Cessation
- 2004-05-04 DE DE602004018852T patent/DE602004018852D1/de not_active Expired - Lifetime
- 2004-05-04 DE DE602004015191T patent/DE602004015191D1/de not_active Expired - Lifetime
- 2004-05-04 EP EP07002705A patent/EP1796376B1/de not_active Expired - Lifetime
- 2004-05-04 EP EP04252587A patent/EP1475960B1/de not_active Expired - Lifetime
- 2004-05-06 US US10/839,231 patent/US7570297B2/en not_active Expired - Fee Related
- 2004-05-07 KR KR1020040032333A patent/KR100614476B1/ko not_active Expired - Fee Related
- 2004-05-08 CN CNB200410042264XA patent/CN1323550C/zh not_active Expired - Fee Related
-
2007
- 2007-08-23 US US11/843,821 patent/US20080049127A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
ATE402563T1 (de) | 2008-08-15 |
JP2004335794A (ja) | 2004-11-25 |
US20080049127A1 (en) | 2008-02-28 |
CN1323550C (zh) | 2007-06-27 |
EP1475960B1 (de) | 2008-07-23 |
EP1796376A1 (de) | 2007-06-13 |
US20040223072A1 (en) | 2004-11-11 |
US7570297B2 (en) | 2009-08-04 |
JP4510403B2 (ja) | 2010-07-21 |
CN1551619A (zh) | 2004-12-01 |
EP1796376B1 (de) | 2008-12-31 |
EP1475960A2 (de) | 2004-11-10 |
DE602004015191D1 (de) | 2008-09-04 |
EP1475960A3 (de) | 2005-02-02 |
KR100614476B1 (ko) | 2006-08-22 |
KR20040095732A (ko) | 2004-11-15 |
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