CN2726120Y - Image sensor package structure - Google Patents

Abstract

An image sensor package structure comprises a substrate having an upper surface and a lower surface, wherein the upper surface is provided with a plurality of through holes, a proper distance is left between each through hole and the edge of the substrate, and a conductive body is filled in each through hole; the flange layer is a frame body and is arranged on the upper surface of the substrate to form a groove with the substrate; an image sensing chip is arranged on the upper surface of the substrate in the groove; two ends of the plurality of wires are respectively electrically connected with the first connection points of the image sensing chip and the substrate; a transparent layer covers the flange layer. The manufacture is convenient, the production cost can be effectively reduced, and better reliability and reliability can be obtained.

Description

Image sensor package structure

technical field

The utility model relates to an image sensor, in particular to an image sensor packaging structure which is relatively convenient to manufacture, can effectively reduce production costs, and obtain better reliability and reliability.

Background technique

Referring to Figures 1 and 2, it is a conventional image sensor, which mainly includes: a substrate 10, a flange layer 18, an image sensing chip 26, several wires 28 and a light-transmitting layer 34; wherein:

A substrate 10 is provided with a first surface 12 and a second surface 14, the first surface 12 is provided with several first contacts 15, the second surface 14 is provided with several second contacts 16, and each first contact 15 and second contact 16 The intervals are connected to each other by several wires 17 along the sides of the substrate 10;

A flange layer 18, which is a frame-shaped body, is provided with an upper surface 20 and a lower surface 22, and the lower surface 22 is arranged on the first surface 12 of the substrate 10 to form an accommodating chamber 24 with the substrate 10; an image sensor The chip 26 is fixed on the substrate 10 in the accommodating chamber 24; several wires 28 having a first terminal 30 and a second terminal 32 make each first terminal 30 electrically connected to the image sensing chip 26, and the second terminal 32 is electrically connected to the corresponding first contact 15 (signal input end) on the substrate 10; a transparent layer 34 is glued on the upper surface 20 of the flange layer 18.

As shown in FIG. 2 , the substrate 10 has several blocks 13 , and through holes 25 are provided between the sides of each block 13 ; a hollow groove 21 is cut into adjacent parts of each block 13 , so that the through holes 25 form semicircular holes. The flange layer 18 is stacked on the substrate 10 , and the corresponding hollow holes 19 are cut according to the positions of the hollow grooves 21 to form the substrate 10 of a single image sensor.

Since the hollow grooves 21 must be formed in the manufacture, the cost of cutting will be increased, and the manufacturing cost will inevitably be relatively increased, and when the through holes 25 are cut into semicircles, the reliability will be relatively reduced.

Contents of the invention

The main purpose of the present invention is to provide an image sensor packaging structure that is more convenient to manufacture, can effectively reduce production costs, and obtain better reliability and reliability.

An image sensor packaging structure mainly includes: a substrate, a flange layer, an image sensing chip, several wires and a light-transmitting layer; the substrate is provided with an upper and lower surface, and the flange layer is a frame-shaped body It is arranged on the upper surface of the substrate to form a groove with the substrate; the image sensor chip is arranged on the upper surface of the substrate in the groove; on the contact; the light-transmitting layer is covered on the upper surface of the flange layer, and the image sensing chip is covered in the groove; it is characterized in that: the upper surface of the substrate is provided with several through holes that penetrate to the lower surface, each There is an appropriate distance between the through hole and the edge of the substrate, and each conductor is filled in each corresponding through hole, and conducts the first contact on the upper surface with the second contact on the lower surface.

The material of the substrate is plastic.

The material of the flange layer is plastic.

The flange layer is formed on the substrate by injection molding.

The utility model has the advantages that only a few through holes need to be drilled on the substrate, and then cut along each adjacent single substrate to complete the production of a single substrate, which is more convenient to manufacture and can effectively reduce the production cost ; And the through holes have not been cut, so better reliability and reliability can be obtained.

Description of drawings

FIG. 1 is a cross-sectional view of a conventional image sensor package structure.

FIG. 2 is a schematic diagram of manufacturing a conventional image sensor packaging structure.

Fig. 3 is a sectional view of the utility model.

Fig. 4, is the structural representation of the utility model.

Detailed ways

In order to have a further understanding and understanding of the structure, features and effects of the present utility model, a preferred embodiment is given hereby, and the detailed description is as follows in conjunction with the accompanying drawings:

Referring to FIG. 3, an image sensor packaging structure mainly includes: a substrate 40, a flange layer 42, an image sensing chip 44, several wires 46 and a light-transmitting layer 48; wherein:

The substrate 40 is made of plastic, and is provided with an upper and lower surface 50, 52. The upper surface 50 is provided with a plurality of through holes 54 penetrating to the lower surface 52. There is an appropriate distance between each through hole 54 and the edge of the substrate 40, and each conducts electricity. The body 56 is filled in the corresponding through hole 54 to make the first contact 58 on the upper surface 50 and the second contact 60 on the lower surface 52 conduct with each other.

The flange layer 42 is a plastic frame and is disposed on the upper surface 50 of the substrate 40 to form a groove 62 with the substrate 40 . The flange layer 42 is formed on the substrate 40 by injection molding.

The image sensing chip 44 is disposed on the upper surface 50 of the substrate in the groove 62;

Two ends of the wires 46 are respectively electrically connected to the first contact 58 between the image sensor chip 44 and the substrate 40 .

The transparent layer 48 covers the upper surface of the flange layer 42 such that the image sensor chip 44 is covered in the groove 62 .

Referring to Fig. 4, during manufacture, it is only necessary to drill several through holes 54 on the substrate 40, and then cut along each adjacent single substrate 40 to complete the production of a single substrate, so the manufacture is more convenient and can be The production cost is effectively reduced; and each through hole 54 is not cut, so better reliability and reliability can be obtained.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of implementation of the present utility model. Those who are familiar with this art can use the principles and technical characteristics of the present utility model to make various changes and decorations. , should be covered within the scope of protection of the claims.

Claims (4)

1. An image sensor packaging structure, mainly comprising: a substrate, a flange layer, an image sensing chip, several wires and a light-transmitting layer; the substrate is provided with an upper and lower surface, and the flange layer is a The frame-shaped body is arranged on the upper surface of the substrate to form a groove with the substrate; the image sensor chip is arranged on the upper surface of the substrate in the groove; On the first contact; the light-transmitting layer is covered on the upper surface of the flange layer, and the image sensing chip is covered in the groove; it is characterized in that: the upper surface of the substrate is provided with several through holes penetrating to the lower surface An appropriate distance is left between each through hole and the edge of the substrate, each conductor is filled in each corresponding through hole, and conducts the first contact on the upper surface with the second contact on the lower surface. 2. The image sensor package structure according to claim 1, wherein the substrate is made of plastic. 3. The image sensor package structure according to claim 1, wherein the flange layer is made of plastic. 4. The image sensor package structure according to claim 1, wherein the flange layer is formed on the substrate by injection molding.

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