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CN1638611A - 具有倾斜通孔的印刷电路板及封装 - Google Patents

具有倾斜通孔的印刷电路板及封装 Download PDF

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CN1638611A
CN1638611A CNA2004100319653A CN200410031965A CN1638611A CN 1638611 A CN1638611 A CN 1638611A CN A2004100319653 A CNA2004100319653 A CN A2004100319653A CN 200410031965 A CN200410031965 A CN 200410031965A CN 1638611 A CN1638611 A CN 1638611A
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pcb
vias
package
signal
holes
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金汉�
崔凤圭
徐大喆
金兴圭
朴相甲
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Samsung Electro Mechanics Co Ltd
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/115—Via connections; Lands around holes or via connections
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    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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    • H01L2924/151—Die mounting substrate
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Abstract

在此公开的是最小化高频损耗的通孔结构。本发明的PCB或IC封装包括绝缘层、多个电路层，以及相对于电路层倾斜地形成且构成为相对于信号和电源传送方向具有钝角度的一个或多个通孔。

Description

具有倾斜通孔的印刷电路板及封装
与相关申请的关系
本申请要求2003年12月24在韩国知识产权局申请的韩国专利申请号KR 2003-96784的权益，在此引入其公开作为参考。
技术领域
本发明总体上涉及具有通孔的印刷电路板和封装，更具体涉及具有相对于印刷电路板和封装中的电路层表面倾斜地形成的倾斜通孔以便最小化高频损耗的印刷电路板和封装。
背景技术
通孔指多层印刷电路板(PCB)和封装中的层之间的电信号的连接通路，基本用来连接双面PCB的顶面和底面上形成的电路。通常，通过形成孔和电镀孔的内壁的方式形成这种通孔，以通过孔连接PCB的顶面和底面。
以前使用机械钻形成孔，但是最近使用激光钻形成孔。
这种通孔可以分为以下类型：完全穿透和连接所有的电镀穿孔(PTH)型通孔、穿透和连接内层的空隙通孔(IVH)型通孔以及其中一部分被堵塞的掩埋通孔或封闭通孔。
此外，存在直径小于100μm的微小通孔、具有用铜填充通孔的铜填充通孔以及具有依次垂直地层叠的多个通孔的层叠通孔。
常规集成电路(IC)封装或PCB中使用的通孔结构垂直于电路层的表面，与通孔种类无关。
由此，电源或信号的通路由以直角弯曲几次的导电线和一个或多个通孔形成，以在PCB或IC封装中将电源或信号从一个点传送到其它点。
图1示出了根据现有技术安装在PCB主板100上的、用于高性能产品如中央处理器(CPU)或图形芯片组的倒装芯片接合封装120的视图。
参考图1，电源和地线包括在PCB主板100中，倒装芯片接合封装120的基底通过球接合110连接到PCB主板100，芯片140通过焊料凸块接合130安装在倒装芯片接合封装120的基底上。
图1还包括微通孔160、具有用于电源或信号流动的阶梯式通路的交错通孔170、具有一个在另一个上层叠的多个微通孔的层叠通孔180。
如图1所示，为了从芯片140传送电源或信号到PCB主板100，电源或信号的通路由以直角弯曲几次的导电线和通孔的组合形成。
电源或信号的通路由以直角弯曲几次的导电线和通孔的组合形成以将电源或信号从芯片140传送到PCB母板100的原因主要是常规通孔结构垂直于信号线而与通孔的类型无关。
由此，电源或信号的通路由以直角弯曲几次的导电线和通孔的结合形成，以将电源或信号从芯片140传送到PCB母板100，以致产生由数字信号的高速产生的高频损耗。
高频损耗是高频通过电路或器件时产生的损耗(例如，插入损耗)。损耗随电子器件的工作频率变得更高而增加，这使信号的传输特性变坏。
由此，为了在IC封装或PCB中以高频适当地传送电源或信号，必须最大限度地减小高频损耗。例如，目前使用的CPU在2至3GHz的频带范围工作。但是，在将来，CPU的工作频率将增加到10至20GHz或更多，以有效地执行其功能。
当工作频率增加时，由于高频损耗，常规通孔结构限制IC封装或PCB的工作频率范围。
而且，在将来，使用高频的电子产品将增加并且减小通孔中的高频损耗的需求也将增加。
在附图中，图2a和3a示出了常规通孔结构，图4a示出了常规通孔结构中的电场分布。
此外，图5使用散射参数(S-parameters)示出了频带范围从0至10GHz的常规通孔的损耗值。图5示出了当对数标度的散射参数数值(db)减小时，高频损耗减小。
发明概述
由此，本发明着眼于常规技术中出现的上述问题，且本发明的目的是提供一种最小化高频损耗的通孔结构。
为了完成上述目的，本发明提供一种PCB或IC封装，包括绝缘层、多个电路层以及相对于电路层倾斜地形成且相对于信号和电源传送方向具有钝角度的一个或多个通孔。
此外，本发明提供一种PCB或IC封装，包括倾斜地形成以相对于信号和电源传送方向具有钝角度的一个或多个通孔。
附图简述
从下面结合附图的详细说明将更清楚地理解本发明的上述及其他目的、特点和优点，其中：
图1示出了根据常规技术安装在PCB主板上的用于高性能产品如中央处理器(CPU)或图形芯片组的倒装芯片接合封装的视图。
图2a示出了常规通孔结构的视图；
图2b示出了根据本发明的倾斜通孔结构的视图；
图3a示出了常规层叠的通孔结构的视图；
图3b示出了根据本发明的层叠的通孔结构的视图；
图4a示出了包括常规倾斜通孔的部分PCB或封装的电场分布的视图；
图4b示出了包括根据本实施例的倾斜通孔的部分PCB或封装中的电场分布的视图；
图5示出了根据包括本发明的倾斜通孔的部分PCB或封装中的频率的S-参数的视图；
图6示出了包括本发明的倾斜通孔的PCB或封装的剖面图；
图7a示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的实施例的倾斜交错通孔；
图7b示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的另一实施例的倾斜通孔；
图7c示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的又一实施例的倾斜层叠通孔。
具体实施方式
现在将参考附图，其中在所有不同的附图中使用的相同的参考数字指相同的或相似的元件。
下面参考图2a至7c详细描述本发明的实施例。
图2a至2b分别示出了通孔210a和210b的结构，将在PCB的上表面上形成的信号线200a和200b分别连接到在PCB的底面上形成的信号线220a和220b。
图2a示出了垂直地连接信号线200a和220a的常规通孔结构。如相关技术中所述常规通孔结构是高频损耗的主要原因。
亦即，信号和电源的传输路径的突然弯曲在突然弯曲发生处引起电磁噪声并阻碍信号和电源的传送。具体，当频率变得更高时上述问题变得更严重。在本观点中，图2b示出了根据本发明的改进通孔结构。
在根据本发明的改进通孔结构中，倾斜地形成通孔，以允许待平稳地执行的高频流动，以便与常规通孔结构相比减小高频损耗。
图3a至3b示出了层叠的多层PCB中的通孔结构。
图3a示出了常规多层PCB中的层叠通孔结构，其中在单层PCB中垂直地形成通孔，然后排列多个通孔和依次层叠以将在PCB的上表面上形成的信号线300a连接到PCB的底面上形成的信号线330a。
具体，在图3a示出的通孔结构中，在多个层中垂直地形成通孔并以之字形方式彼此连接。该结构具有不能减小高频损耗的限制，因为通孔是垂直地形成在层中。
图3b示出了在多个层上形成的连接在PCB的上表面上形成的信号线300b到在PCB的底面上形成的信号线330b的多层导电通孔结构的视图。
在图3b所示的通孔结构中，由于不同于垂直通孔的倾斜通孔是基本形成和依次层叠的，通孔结构有效的减小高频损耗。
图4a至4b示出了电场分布的视图。
图4a示出了常规垂直通孔结构中的电场分布。图4b示出了本发明的倾斜通孔结构中的电场分布。
参考附图，本发明中提供的倾斜通孔结构与常规通孔结构相比减小了电场大小，且在由箭头表示的部分中减小了电场离散。
图5示出了根据频率的散射参数的图形，以证实高频损耗减少。
沿X轴绘制了从0至10GHz的频带范围，沿Y轴以对数标度绘制了散射参数的值。本发明的通孔结构与常规通孔结构相比可以减小频带范围从0至10GHz高频损耗平均超过20分贝。
图6至7c示出了其中倾斜通孔应用于PCB的例子。
参考图6，PCB包括在覆铜薄层压板(CCL)601中倾斜地形成的倾斜通孔604以及形成在倾斜通孔604上以提供导电性的镀铜层605。
图7a示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的实施例的倾斜交错通孔；图7b示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的另一实施例的倾斜通孔；图7c示出了安装在PCB主板上用于高性能产品如CPU或图形芯片的倒装芯片接合封装的视图，包括根据本发明的又一实施例的倾斜层叠通孔。
在图7a中，倾斜地形成交错通孔750，以相对于电源或信号的流动具有钝角度，以便防止高频损耗。
当电源或信号从芯片740流到PCB主板700时，交错通孔750允许电源或信号沿倾斜通路流动，以便当施加高频时防止高频损耗。
在图7b中，倾斜地形成微通孔760，以相对于电源或信号的流动具有钝角度，以便防止高频损耗。
在图7c中，倾斜地形成层叠通孔770，以相对于电源或信号的流动具有钝角度，以便防止高频损耗。
与此同时，在用一般方法制造PCB的情况下，在铜板上实现电路的图形，因此形成PCB的内层和外层。但是，最近，以使用聚合体和玻璃纤维的光波导插入PCB中，以接收和传送光形式的信号。PCB称为电光电路板(EOCB)。
本发明的通孔可以应用于一般通孔和用于EOCB的光学通孔。
此外，现在的移动通信终端必须小型化和轻便化以支持高速、大容量通讯和便于携带。
因此，已经出现用于移动通信终端的元件，以便实现极端微型化和复杂的功能，相关的元件发展很快，以便与移动通信终端的发展一致实现用于将多个裸芯片安装在低温共烧陶瓷(LTCC)上的多芯片模块(MCM)。
通过在约800至1000℃的低温下使用共烧陶瓷和金属的方法形成基底制造LTCC。通过具有低熔点的玻璃和陶瓷混合以形成具有合适的介电常数生片的方式形成基底，在生片上印刷导电膏和一个在另一个之上地依次层叠印刷有导电膏的生片。本发明的倾斜通孔结构可用于使用LTCC的基底。
如上所述，倾斜通孔结构可用于具有垂直通孔结构的基底和PCB，以减小高频损耗。
本发明在克服高频的信号干扰方面是有效的，高频是由于数字信号的高速度产生的。
而且，本发明在减小在采用通孔结构的IC封装或PCB的通孔中产生的高频损耗是有效的，因此改进高频带中的信号传输性能。
尽管为了说明性目的已经公开了本发明的优选实施例，但是在不脱离的权利要求中所公开的本发明的范围和精神的条件下，所属领域的技术人员将可以进行各种修改、添加和替换。

Claims (4)

1.一种印刷电路板(PCB)包括：
绝缘层；
多个电路层；以及
相对于电路层倾斜地形成且构成为相对于信号和电源传送方向具有钝角度的一个或多个通孔。
2.一种集成电路(IC)封装包括：
绝缘层；
多个电路层；以及
相对于电路层倾斜地形成且构成为相对于信号和电源传送方向具有钝角度的一个或多个通孔。
3.一种印刷电路板，包括：
倾斜地形成以相对于信号和电源传送方向具有钝角度的一个或多个通孔。
4.一种IC封装，包括：
倾斜地形成以相对于信号和电源传送方向具有钝角度的一个或多个通孔。
CNA2004100319653A 2003-12-24 2004-03-31 具有倾斜通孔的印刷电路板及封装 Pending CN1638611A (zh)

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