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CN1625474A - 用于喷墨打印头的打印头芯片中的离散空气和喷嘴室 - Google Patents

用于喷墨打印头的打印头芯片中的离散空气和喷嘴室 Download PDF

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CN1625474A
CN1625474A CNA028287169A CN02828716A CN1625474A CN 1625474 A CN1625474 A CN 1625474A CN A028287169 A CNA028287169 A CN A028287169A CN 02828716 A CN02828716 A CN 02828716A CN 1625474 A CN1625474 A CN 1625474A
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substrate
print head
ink ejection
china ink
nozzle
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CN100402290C (zh
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卡·西尔弗布鲁克
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Silverbrook Research Pty Ltd
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
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    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J2/16—Production of nozzles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17513—Inner structure
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    • H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/2628—Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/135—Nozzles
    • B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
    • B41J2/16585—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles for paper-width or non-reciprocating print heads
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    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
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Abstract

一种用于喷墨打印头的打印头芯片包括基片。多个喷嘴装置被安置在基片上。每个喷嘴装置都包括喷嘴室壁和顶部，其限定喷嘴室，而顶部限定与喷嘴室在流体上连通的墨喷出端口。墨喷出构件被安置在喷嘴室中。墨喷出构件可向着和远离墨喷出端口而移位以使喷嘴室内墨压力上的所得到的波动导致从墨喷出端口喷出墨。至少一个功传送结构可相对于基片而移位并且被连接于墨喷出构件以使功传送结构的移位导致墨喷出构件的移位。激励器被连接于功传送结构。一旦收到电驱动信号，该激励器能移位功传送结构。空气室壁和覆盖层构造被放置在激励器以上，空气室壁和覆盖层构造限定激励器所安置的空气室。顶部、功传送结构和覆盖层构造一起限定被安置在公用平面中的保护性结构。

Description

用于喷墨打印头的打印头芯片中的离散空气和喷嘴室
技术领域
本发明涉及一种用于喷墨打印头的打印头芯片。更具体而言，本发明涉及一种用于喷墨打印头的打印头芯片，其包括离散的空气和喷嘴室。
背景技术
如在以上参考的申请/专利中所提出的，申请人已在开发打印头上花费了大量的时间和精力，该打印头结合了基于微机电系统(MEMS)的部件以实现打印所必要的墨喷出。
作为申请人研究和开发的结果，申请人已能开发具有一个或多个打印头芯片的打印头，所述芯片在一起结合了高达84000喷嘴的装置。申请人亦已开发了能控制这种打印头的操作的适当处理器技术。具体而言，所述处理器技术和打印头在一些情况下能合作产生1600dpi或以上的分辨率。适当处理器技术的实例被提供在以上参考的专利申请/专利中。
申请人已克服了实现喷墨打印头内必要墨水流动和墨滴分离的基本困难。申请人已开发的许多打印头芯片结合了喷嘴装置，其每个都具有喷嘴室，而墨喷出构件被安置在喷嘴室中。墨喷出构件然后可在喷嘴室内移位以从喷嘴室喷出墨。
申请人在本发明中所针对的特定困难涉及包括打印头芯片的每个喷嘴装置的各种部件的精密特性。在以上参考的事项中，各种部件常常被揭示为对其功能的要求。在MEMS尺度上，所述各种部件很适合于其特定任务，并且申请人已发现它们是适当强有力的。
然而，在宏观尺度上，所述各种部件可容易地被以下因素损坏，如微观碎屑的处理和进入(ingress)。该微观碎屑可采取纸尘的形式。
因此，理想的是提供一种保护部件的方式。然而，申请人已发现，难以制造用于部件的适当覆盖层同时仍实现对墨喷出部件的力的传递和喷嘴室的有效密封。
申请人已设想了本发明，以针对这些困难。
发明内容
依照本发明，提供了一种用于喷墨打印头的打印头芯片，该打印头芯片包括
基片；以及
多个喷嘴装置，其被安置在基片上，每个喷嘴装置都包括
喷嘴室壁和顶部，其限定喷嘴室，而顶部限定与喷嘴室在流体上连通的墨喷出端口；
墨喷出构件，其被安置在喷嘴室中，该墨喷出构件可向着和远离墨喷出端口而移位，以使喷嘴室内墨压力上的所得到的波动导致从墨喷出端口喷出墨；
至少一个功传送结构，其可相对于基片而移位并且被连接于墨喷出构件，以使功传送结构的移位导致墨喷出构件的移位；
激励器，其被连接于功传送结构，一旦收到电驱动信号，该激励器能移位功传送结构；以及
空气室壁和覆盖层构造，其被安置在激励器以上，空气室壁和覆盖层构造限定激励器被安置的空气室，顶部、功传送结构和覆盖层构造一起限定被安置在公用平面中的保护性结构。
为了举例，现在参照附图来描述本发明。以下描述并不旨在限制以上概述的宽广范围。
附图说明
在附图中：
图1示出依照本发明的用于喷墨打印头的打印头芯片的喷嘴装置的截面三维视图；并且
图2示出图1的喷嘴装置的三维视图。
具体实施方式
在附图中，参考数字10概括指示依照本发明的用于喷墨打印头芯片的第一实施例的喷嘴装置。
喷嘴装置10是被形成于硅晶片基片12上以限定本发明的打印头芯片的多个这种喷嘴装置之一。如在本说明书的背景中所提出的，单个打印头可包含高达84000个这种喷嘴装置。为了清楚且容易地描述，仅一个喷嘴装置被描述。应理解，本领域的普通技术人员可通过在晶片基片12上简单地复制喷嘴装置10而容易地获得打印头芯片。
打印头芯片是集成电路制造技术的产物。具体而言，每个喷嘴装置10都是基于MEMS的制造技术的产物。如所知的，这种制造技术包含淀积集成电路材料的功能层和牺牲层。功能层被刻蚀以限定各种移动部件，而牺牲层被刻蚀掉以释放所述部件。如所知的，这种制造技术通常涉及在单个晶片上复制大量类似的部件，所述晶片随后被切成小片以使各种部件彼此分离。这加强了这样的看法，即本领域的普通技术人员可通过复制喷嘴装置10而容易地获得本发明的打印头芯片。
电驱动电路层14被安置在硅晶片基片12上。电驱动电路层14包括CMOS驱动电路。CMOS驱动电路的特定配置对于本描述并不重要，并因此在附图中被示意性地示出。说明以下是足够的：它被连接于一个适当的微处理器，并且一旦从所述适当的微处理器接收到使能信号则提供电流给喷嘴装置10。适当的微处理器的实例被描述在以上参考的专利/专利申请中。所遵循的是这种细节水平将不在本说明书中提出。
墨钝化层16被安置在驱动电路层14上。墨钝化层16可以是任何适当的材料，如氮化硅。
喷嘴装置10包括喷嘴室壁18，其被安置在墨钝化层16上。顶部20被安置在喷嘴室壁18上以使顶部20和喷嘴室壁18限定喷嘴室22。喷嘴室壁18包括远端壁24、近端壁26和一对相对侧壁28。墨喷出端口30被限定于顶部20中以与喷嘴室22在流体上连通。顶部20限定喷嘴轮圈32和被安置在轮圈32周围的凹槽34以适应墨散布。
壁18和顶部20被配置成使喷嘴室22在平面图中是矩形的。
其中一个在附图中被示出的多个墨入口通道36通过基片12、驱动电路层14和墨钝化层16而限定。墨入口通道36与喷嘴室18在流体上连通以使墨可被提供给喷嘴室18。
喷嘴装置10包括杠杆机构38形式的功传送结构。杠杆机构38包括有动力构造40、支点构造42和负载构造44。支点构造42被置于动力构造40和负载构造44之间。
支点构造42与墨钝化层16是紧固的。具体而言，支点构造42是用主层46和次层48来复合的。层46、48被配置成使支点构造42可弹性地变形以允许支点构造42相对于基片12枢轴运动。层46、48可由被用在集成电路制造中的许多材料制成。申请人已发现，氮化铝钛(TiAlN)是用于层46的适当材料，而钛是用于层48的适当材料。
负载构造44限定近端壁26的部分。负载构造44是用主层50和次层52来复合的。与支点构造42一样，层50、52可由被用在集成电路制造中的许多材料的任何一种制成。然而，如上述所述，喷嘴装置10是通过是使用相继的淀积和刻蚀步骤来制造的。所遵循的是，方便的是层50、52与层46、48由相同材料制成。这样，层50、52可分别由TiAlN和钛制成。
喷嘴装置10包括拉长矩形桨板54形式的墨喷出构件。桨板54被固定于负载构造44并向着远端壁24延伸。此外，桨板54被定尺寸以与喷嘴室22一般对应。所遵循的是，以足够能量的向着和远离墨喷出端口30的桨板54的位移导致从墨喷出端口喷出墨滴。实现滴喷出的方式被详细描述在以上参考的专利/申请中，并因此不在此以任何细节进行讨论。
为便于制造，桨板54由TiAlN制成。具体而言，桨板54是杠杆机构38的负载构造44的层50的延伸。
桨板54具有波纹56以在操作期间强化桨板54以防止挠曲(flexture)。
动力构造40也是用主层58和次层60来复合的。
层58、60可由被用在集成电路制造中的许多材料中的任何一种制成。然而，如在以上所提出的，喷嘴装置10是通过是使用相继的淀积和刻蚀步骤来制造的。所遵循的是，方便的是层58、60与层46、48由相同材料制成。这样，层58、60可分别由TiAlN和钛制成。
喷嘴装置10包括热弯曲激励器62形式的激励器。热弯曲激励器62由能用电阻加热的传导性材料制成。该传导性材料具有这样的热膨胀系数：当被加热并且随后被冷却时，该材料能膨胀和收缩到足以在MEMS尺度上进行工作的程度。
热弯曲激励器62可以是在以上专利/专利申请中描述的许多热弯曲激励器的任何一个。在一个实例中，热弯曲激励器62包括激励器臂64，其具有主动(active)部分82和被动(passive)部分。主动部分82具有一对内腿66，而被动部分由被安置在所述一对内腿66的每侧上的腿来限定。桥部分68互连主动(active)腿66和被动(passive)腿。每个腿66都被固定于主动(active)锚70形式的一对锚构造之一，所述主动锚从墨钝化层16延伸。每个主动锚70都被配置成使腿66被电连接于驱动电路层14。
每个被动腿都被固定于被动(passive)锚88形式的一对锚构造之一，所述被动锚被电隔离于驱动电路层14。
这样，腿66和桥部分68被配置成当来自驱动电路层14的电流被产生于腿66中时，激励器臂64经历差温加热。具体而言，激励器臂64被成形以使被动腿被插入于至少一部分腿66和基片12之间。将理解，这导致激励器臂64向着基片12弯曲。
桥部分68因此限定激励器62的工作端。具体而言，桥部分68限定动力构造40的主层58。这样，激励器62由TiAlN制成。申请人已发现该材料很适合于激励器62。
杠杆机构38包括杠杆臂构造72，其分别被放置在支点构造42、负载构造44和动力构造40的次层48、52、60上并与它们是紧固的。这样，向着和远离基片12的激励器62的可逆运动通过杠杆机构38转换成桨板54的可逆角度移位以从墨喷出端口30喷出墨滴。
每个主动锚70和被动锚也都是用主层74和次层76来复合的。层74、76可由被用在集成电路制造中的许多材料的任何一种制成。然而，为了便于制造，层74由TiAlN制成，而层76由钛制成。
覆盖构造78被安置在锚70、88上以在激励器62以上延伸并覆盖激励器62。空气室壁90延伸于墨钝化层16和覆盖构造78之间以使覆盖构造78和空气室壁90限定空气室80。这样，激励器62和锚被安置在空气室80中。
覆盖构造78、杠杆臂构造72和顶部20为统一保护性结构92的形式以抑制对喷嘴装置10的损坏。
保护性结构92可由被用在集成电路制造技术中的许多材料的任何一种制成。申请人已发现二氧化硅对于该任务是特别有用的。
将理解，杠杆臂构造72相对于覆盖构造78和顶部20而被移位是有必要的。所遵循的是，覆盖构造78和杠杆臂构造72由与空气室80在流体上连通的有槽开口94来划定界限。顶部20和杠杆臂构造72由与喷嘴室22在流体上连通的有槽开口96来划定界限。
杠杆臂构造72和顶部20一起限定脊98，其界定有槽开口96。这样，当喷嘴室22被填充有墨时，脊98在墨喷出期间限定流体密封。脊98用来通过提供适当的粘附表面来抑制墨散布，以得到由墨形成的弯液面。
有槽开口94、96划定扭转构造100的界限，该扭转构造由保护性结构92来限定。扭转构造100用来将杠杆机构38支持在原位。此外，扭转构造100被配置成经历扭动变形以适应喷嘴装置10的操作期间杠杆机构38的枢轴运动。保护性结构92的二氧化硅在MEMS的尺度上是弹性可弯曲的，并由此适合于这样的重复性形变。
申请人认为，本发明提供了一种在处理期间对损坏有抵抗力的打印头芯片。其主要原因是提供了保护性结构92，其覆盖打印头芯片的喷嘴装置的移动部件。保护性结构92被安置在公用平面中。所遵循的是，当多个喷嘴装置10被安置在一起以限定打印头芯片时，该打印头芯片提供了对损坏有抵抗力的基本上均匀的表面。

Claims (11)

1.一种用于喷墨打印头的打印头芯片，该打印头芯片包括
基片；以及
多个喷嘴装置，其被安置在基片上，每个喷嘴装置都包括
安置在基片上的喷嘴室壁和顶部，其限定喷嘴室，而顶部限定与喷嘴室在流体上连通的墨喷出端口；
墨喷出构件，其被安置在喷嘴室中，该墨喷出构件可向着和远离墨喷出端口而移位，以使喷嘴室内墨压力上的所得到的波动导致从墨喷出端口喷出墨；
至少一个功传送结构，其可相对于基片而移位并且被连接于墨喷出构件，以使功传送结构的移位导致墨喷出构件的移位；
激励器，其被连接于功传送结构，一旦收到电驱动信号，该激励器能移位功传送结构；以及
空气室壁和覆盖层构造，其被安置在激励器以上，空气室壁和覆盖层构造限定激励器被安置的空气室，顶部、功传送结构和覆盖层构造一起限定被安置在公用平面中的保护性结构。
2.权利要求1的打印头芯片，其是集成电路制造技术的产物。
3.权利要求2的打印头芯片，其中基片包括硅晶片基片、被安置在硅晶片基片上的CMOS驱动电路层和被安置在CMOS驱动电路层上的墨钝化层。
4.权利要求3的打印头芯片，其中多个墨入口通道通过基片而限定，而每个墨入口通道开口到相应的喷嘴室中。
5.权利要求4的打印头芯片，其中顶部、功传送结构和覆盖层构造被配置成使保护性结构是统一的。
6.权利要求3的打印头芯片，其中喷嘴室壁被配置成使喷嘴室在平面视图中通常为矩形，而喷嘴室壁包括一对相对侧壁、远端壁和近端壁。
7.权利要求6的打印头芯片，其中功传送结构相对于基片而被枢轴地安装以限定至少一部分近端壁，功传送结构被连接于墨喷出构件的近端以使墨喷出构件基于相对于基片的功传送结构的枢轴移位而向着和远离墨喷出端口在角度上被移位。
8.权利要求7的打印头芯片，其中激励器具有相对于基片而被固定的固定端和可向着和远离基片而移位的工作端，工作端被连接于功传送结构以使功传送结构基于向着和远离基片的激励器的移位而被枢轴地移位，其结果是墨喷出构件向着和远离墨喷出端口在角度上被移位。
9.权利要求8的打印头芯片，其中激励器为热弯曲激励器的形式，该激励器被配置成在接收到来自电驱动电路层的驱动信号时，激励器向着基片而弯曲，其结果是功传送结构远离喷嘴室做枢轴转动并且墨喷出构件向着墨喷出端口被移位。
10.权利要求9的打印头芯片，其中功传送结构限定杠杆机构，其具有被连接于激励器工作端的动力构造、被连接于墨喷出构件的负载构造、被插入于动力构造和负载构造之间并被枢轴地连接于基片的支点构造以及互连动力、支点和负载构造的杠杆臂构造，杠杆臂构造限定保护性结构的整体部分，顶部、杠杆臂构造和覆盖构造由挠性材料制成，从而允许杠杆臂构造相对于顶部和覆盖构造作枢轴转动。
11.一种喷墨打印头，包括权利要求1的至少一个打印头芯片。
CNB028287169A 2002-04-12 2002-08-29 具有喷嘴室和离散空气室的用于喷墨打印头的打印头芯片 Expired - Fee Related CN100402290C (zh)

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CN104786658B (zh) * 2014-01-21 2018-03-02 施乐公司 喷墨板的减式三维制造

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IL164448A0 (en) 2005-12-18
US20060244782A1 (en) 2006-11-02
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DE60230549D1 (de) 2009-02-05
US20080111861A1 (en) 2008-05-15
EP1494866B1 (en) 2008-12-24
KR100643659B1 (ko) 2006-11-10
US7334873B2 (en) 2008-02-26
AU2002325640A1 (en) 2003-10-27
US7771017B2 (en) 2010-08-10
AU2002325640B2 (en) 2007-01-25
IL164448A (en) 2006-10-31
US6666543B2 (en) 2003-12-23
WO2003086766A1 (en) 2003-10-23
ZA200408147B (en) 2005-07-06
KR20050000383A (ko) 2005-01-03
ATE418455T1 (de) 2009-01-15
US20030076383A1 (en) 2003-04-24
US20020149648A1 (en) 2002-10-17
US6582059B2 (en) 2003-06-24
US20100295902A1 (en) 2010-11-25
EP1494866A4 (en) 2007-07-04

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