CN108811338B - Processing method of newly-added positioning hole of circuit board with any thickness - Google Patents
Processing method of newly-added positioning hole of circuit board with any thickness Download PDFInfo
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- CN108811338B CN108811338B CN201810697098.9A CN201810697098A CN108811338B CN 108811338 B CN108811338 B CN 108811338B CN 201810697098 A CN201810697098 A CN 201810697098A CN 108811338 B CN108811338 B CN 108811338B
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- positioning hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A processing method for newly adding positioning holes on a circuit board with any thickness comprises the steps of randomly processing positioning holes on the process edge around the circuit board with any thickness; respectively measuring the distance between the positioning hole and two pads closest to the positioning hole in the circuit board pattern area to obtain two groups of distance data; in all engineering data, two sets of measured distance data are taken as radii, the center point of a measured bonding pad is taken as the center of a circle, two circles are respectively drawn, the intersection point of the two circles on a process edge is the center of a newly added positioning hole required to be added on a circuit board, the intersection point is taken as the center of a circle, and the circle drawn by taking the diameter of the positioning hole as the diameter is taken as the newly added positioning hole; and (5) carrying out subsequent processing by taking the newly added positioning hole as a positioning reference. The invention can ensure the alignment precision of drilling and milling twice up and down in the graph area in the subsequent process, and the method can be widely applied to the production, manufacture and remedial measures of single-double panels, multilayer boards, semi-finished products and finished boards with any thickness.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a method for processing newly added positioning holes of a circuit board with any thickness.
Background
In recent years, as the thickness of circuit boards has been increased, many boards have a thickness exceeding 10mm or more, and thus the process for producing thick boards has been receiving much attention. However, most production and processing equipment in the prior industry has the plate thickness capability of 0.05 mm-8 mm, so that plates with the plate thickness of more than 10mm cannot be produced. The Maryland positioning holes cannot be manufactured by a target drilling machine and a punching machine, so that all equipment needing machining of the Maryland positioning holes in the subsequent process cannot be produced; even if the device can be produced reluctantly, the precision deviation of important dimensions such as back drilling, butt drilling, through grooves, butt milling shapes and the like is difficult to guarantee. Therefore, the research interest of people on the circuit board with the thickness of more than 10mm is stimulated, and the thick plate is widely applied to various electronic products and the like, and has a very great development prospect.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the method for processing the newly added positioning hole of the circuit board with any thickness, which can process the circuit board with any thickness and improve the alignment precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
a processing method for newly adding positioning holes on a circuit board with any thickness comprises the following steps:
the method comprises the following steps: randomly processing positioning holes on the process edge around the circuit board with any thickness;
step two: respectively measuring the distance between the positioning hole and two bonding pads which are closest to the positioning hole in the circuit board pattern area to obtain two groups of distance data;
step three: in all engineering data, two sets of measured distance data are taken as radii, the measured central point of the bonding pad is taken as the circle center, two circles are respectively drawn, the intersection point of the two circles on the process edge is the circle center of a newly-added positioning hole required to be added on the circuit board, the intersection point is taken as the circle center, and the circle drawn by taking the diameter of the positioning hole as the diameter is taken as the newly-added positioning hole;
step four: and carrying out subsequent processing by taking the newly added positioning hole as a positioning reference.
Further, in the first step, a corresponding cutter is selected according to the thickness of the actual circuit board, and the positioning hole is machined in a one-time drilling-through mode.
Further, in the second step, a 2D or 3D measuring instrument is used to measure the distance between the positioning hole and the circular pad or the square pad, and each positioning hole measures two sets of data, namely the distance between the positioning hole and the two nearest circular pads or square pads.
And further, processing a plurality of positioning holes, measuring the distance between each positioning hole and the bonding pad, and sequentially adding a plurality of newly added positioning holes in the third step.
Further, in the first step, six positioning holes with the diameter of 3.18mm are randomly processed on the process edge of the circuit board, two groups of data are respectively measured on the six positioning holes in the second step, and in the third step, six newly-added positioning holes are sequentially added into engineering data, wherein the diameter of the newly-added positioning holes is also 3.18 mm.
And further, after the fourth step, positioning according to the newly added positioning hole, and laminating, milling and drilling.
The invention has the beneficial effects that:
the method has the advantages that the positioning holes are newly added on the circuit board with any thickness, the newly added positioning holes are used as the positioning reference, and the same group of positioning holes are used, so that the alignment precision of upper and lower twice drilling and milling in a graph area in subsequent back drilling, butt milling/edge milling, blind slot milling and other processes can be ensured, the precision deviation problem of important dimensions such as back drilling, butt drilling, through slot, butt milling appearance and the like can be solved, a solid foundation is laid for manufacturing the circuit board with any thickness, and the method can be widely applied to the manufacturing and remedial measures of single-double panels, multilayer boards, semi-finished products and finished product boards with any thickness.
Drawings
FIG. 1 is a flow chart of a processing method for newly adding positioning holes to a circuit board with any thickness according to the present invention;
FIG. 2 is a schematic view of a positioning hole layout in a first step of the present invention;
FIG. 3 is a schematic view of measuring a distance between a positioning hole and a bonding pad according to a second step of the present invention;
FIG. 4 is a schematic view of measuring distances between all the positioning holes and the bonding pads in step two of the present invention;
FIG. 5 is a schematic view of a third step of adding a new positioning hole in the engineering data according to the present invention;
in the figure, 1-circuit board, 2-pattern area, 3-process edge, 4-positioning hole, 5-welding pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Referring to fig. 1, the invention provides a method for processing a newly added positioning hole of a circuit board with any thickness, comprising the following steps:
the method comprises the following steps: positioning holes 4 are optionally machined on the technical edge 3 around the circuit board 1 with any thickness. Referring to fig. 2, a circuit board 1 is formed by cutting PP, pre-stacking, folding, pressing, and removing stress, wherein a pattern area 2 is formed in the middle of the circuit board 1, and a process edge 3 is formed around the circuit board 1. According to the thickness of the actual circuit board 1, a corresponding cutter is selected, and the positioning hole 4 is processed in a one-time drilling-through mode, in the embodiment, six positioning holes 4 with the diameter of 3.18mm are randomly processed on the technical edge 3 of the circuit board 1, and deviation exists between the randomly processed positioning holes 4 and regular common positioning holes set in engineering data.
Step two: and respectively measuring the distance between the positioning hole 4 and two pads 5 which are closest to the positioning hole 4 in the pattern area 2 of the circuit board 1 to obtain two groups of distance data. As shown in fig. 3 and 4, specifically, a 2D or 3D measuring instrument is used to measure the distance between the locating hole and the circular pad or the square pad, and each locating hole measures two sets of data, namely the distance between the locating hole 4 and the two nearest circular pads or square pads. In the present embodiment, six positioning holes 4 are measured respectively, and each positioning hole 4 needs to measure two sets of data and record the data.
Step three: changing the engineering data, and adding new positioning holes in all the engineering data. As shown in fig. 5, two sets of distance data measured by each positioning hole 4 are taken as a radius, a center point of each measured bonding pad 5 is taken as a circle center, two circles are respectively drawn, an intersection point of the two circles on the process edge 3 is a circle center of a newly added positioning hole to be added on the circuit board 1, and then a circle drawn by taking the intersection point as a circle center and the diameter of the positioning hole 4 as a diameter is taken as a newly added positioning hole. In this embodiment, six additional positioning holes are added to the engineering data in the same way, and the diameter of the additional positioning holes is also 3.18 mm.
Step four: and (5) carrying out subsequent processing by taking the newly added positioning hole as a positioning reference.
The method can be widely applied to the production and manufacturing and remedial measures of single-double panels, multilayer boards, semi-finished products and finished product boards with any thickness, particularly to the design and manufacturing field of the circuit boards with the thickness of more than 10mm, and is initiated by the industry and has great significance.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (6)
1. A processing method for newly adding positioning holes on a circuit board with any thickness is characterized by comprising the following steps:
the method comprises the following steps: randomly processing positioning holes on the process edge around the circuit board with any thickness;
step two: respectively measuring the distance between the positioning hole and two bonding pads which are closest to the positioning hole in the circuit board pattern area to obtain two groups of distance data;
step three: in all engineering data, two sets of measured distance data are taken as radii, the measured central point of the bonding pad is taken as the circle center, two circles are respectively drawn, the intersection point of the two circles on the process edge is the circle center of a newly-added positioning hole required to be added on the circuit board, the intersection point is taken as the circle center, and the circle drawn by taking the diameter of the positioning hole as the diameter is taken as the newly-added positioning hole;
step four: and carrying out subsequent processing by taking the newly added positioning hole as a positioning reference.
2. The method for processing the newly added positioning hole of the circuit board with any thickness as claimed in claim 1, wherein: in the first step, a corresponding cutter is selected according to the thickness of the actual circuit board, and the positioning hole is machined in a one-time drilling-through mode.
3. The method for processing the newly added positioning hole of the circuit board with any thickness as claimed in claim 1, wherein: and in the second step, a 2D or 3D measuring instrument is adopted to measure the distance between the positioning hole and the circular bonding pad or the square bonding pad, and each positioning hole measures two groups of data, namely the distance between the positioning hole and the two nearest circular bonding pads or square bonding pads.
4. The method for processing the newly added positioning hole of the circuit board with any thickness as claimed in claim 1, wherein: and processing a plurality of positioning holes, measuring the distance between each positioning hole and the two nearest bonding pads, and sequentially adding a plurality of newly added positioning holes in the third step.
5. The method for processing the newly added positioning hole of the circuit board with any thickness as claimed in claim 4, wherein: in the first step, six positioning holes with the diameter of 3.18mm are randomly processed on the process edge of the circuit board, two groups of data are respectively measured on the six positioning holes in the second step, and in the third step, six newly-added positioning holes are sequentially added into engineering data, wherein the diameter of the newly-added positioning holes is also 3.18 mm.
6. The method for processing the newly added positioning hole of the circuit board with any thickness as claimed in claim 1, wherein: and after the fourth step, positioning according to the newly added positioning hole, and laminating, milling and drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697098.9A CN108811338B (en) | 2018-06-29 | 2018-06-29 | Processing method of newly-added positioning hole of circuit board with any thickness |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810697098.9A CN108811338B (en) | 2018-06-29 | 2018-06-29 | Processing method of newly-added positioning hole of circuit board with any thickness |
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| CN108811338A CN108811338A (en) | 2018-11-13 |
| CN108811338B true CN108811338B (en) | 2021-04-16 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011189490A (en) * | 2010-03-17 | 2011-09-29 | Ngk Spark Plug Co Ltd | Non-contact carrying device of wiring board and method of manufacturing wiring board |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
| CN106488643A (en) * | 2015-08-31 | 2017-03-08 | 苹果公司 | Printed circuit-board assembly with damping layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI441571B (en) * | 2011-06-10 | 2014-06-11 | Hon Hai Prec Ind Co Ltd | Capacitor performance optimization method and printed circuit boards using same |
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- 2018-06-29 CN CN201810697098.9A patent/CN108811338B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011189490A (en) * | 2010-03-17 | 2011-09-29 | Ngk Spark Plug Co Ltd | Non-contact carrying device of wiring board and method of manufacturing wiring board |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN106488643A (en) * | 2015-08-31 | 2017-03-08 | 苹果公司 | Printed circuit-board assembly with damping layer |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
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