CN201957347U - Die for laminating rigid and flexible combined multilayer printed circuit board - Google Patents
Die for laminating rigid and flexible combined multilayer printed circuit board Download PDFInfo
- Publication number
- CN201957347U CN201957347U CN2011200082111U CN201120008211U CN201957347U CN 201957347 U CN201957347 U CN 201957347U CN 2011200082111 U CN2011200082111 U CN 2011200082111U CN 201120008211 U CN201120008211 U CN 201120008211U CN 201957347 U CN201957347 U CN 201957347U
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- Prior art keywords
- location hole
- rigid
- multilayer board
- circuit board
- flexible combination
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- 238000010030 laminating Methods 0.000 title abstract 3
- 238000003475 lamination Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a die for laminating a rigid and flexible combined multilayer printed circuit board, which comprises a carrier plate and a plurality of positioning pins. At least four first positioning holes which are used for positioning the sides of the circuit board are arranged on the carrier plate and are matched with the positioning pins. At least four second positioning holes which are used for positioning the sides of the circuit board are arranged on the carrier plate. The second positioning holes and the first positioning holes are staggered. The second positioning holes are matched with the positioning pins. The first positioning holes and the second positioning holes are respectively used for primary lamination and secondary lamination, two-time lamination of circuit boards in the same style is realized by using one die, and dies with corresponding dimensions can be manufactured flexibly and conveniently aiming at the circuit boards with different dimensions. Therefore, the die for laminating the rigid and flexible combined multilayer printed circuit board has the advantages that the production cost is saved and the production operation is simplified.
Description
Technical field
The utility model relates to the equipment that is used to make multilayer board, especially a kind of lamination mould of multilayer board of rigid-flexible combination.
Background technology
Along with the continuous development of printed circuit technique, the market demand and technology trends from printed circuit board (PCB) (hereinafter to be referred as PCB) have both direction at present, and the one, compact, the 2nd, high multilayer.For high laminate, its contraposition is the emphasis and the difficult point of making always, and the multi-layer flexible and rigid-flex board product of especially various concerning material, complex process, because the harmomegathus of material is big, the interlayer off normal is the thorny problem that faces at present after the pressing.
In order to solve off normal between laminate layers, high laminate uses the lamination positioning mode usually.Can be divided into stud registration (Pin-lam) and rivet positioning mode (Mass-lam) by the localization method between each layer, latter's positioning accuracy is low, has been proved to be inapplicable for the lamination of high laminate.Stud registration can solve the accurate orientation problem of interlayer, stud registration goes out four slotted eyes by the surrounding punching out at photographic negative and each layer central layer and is correspondingly located with four flute profile pins, be characterized in being " benchmark " with plate face center, the flexible size that produces in the pressing is evenly scattering state of four sides, promptly form the off normal method of " center zero setting ", thereby multi-layer sheet interlayer error is reduced by half or reduce by 50%, therefore, this is a kind of desirable alignment system, is particluarly suitable for adopting on the high laminate.In order to control the stable of overflow glue amount and holding circuit board size, the multilayer board of rigid-flexible combination need adopt the mode of twice pressing such as flexible pressing and hard and soft pressing to make usually, and present lamination generally only is provided with the location hole of four fixed positions with steel mould, can only realize one step press to baseboard of the same race, therefore, need the above steel mould of two covers during the processing various boards, the production cost height.
Summary of the invention
The purpose of this utility model is, provides a kind of lamination mould of multilayer board of the rigid-flexible combination that can realize twice pressing, to reduce production costs.
The lamination mould of the multilayer board of a kind of rigid-flexible combination that the utility model provides, comprise support plate and a plurality of shop bolt, on this support plate, be provided with at least four and be used for first location hole that each limit of circuit board is positioned, this first location hole cooperates with described shop bolt, on described support plate, also be provided with at least four and be used for second location hole that each limit of circuit board is positioned, this second location hole and described first location hole stagger, and this second location hole cooperates with described shop bolt.
Preferably, all described first location holes and the rectangular layout of all described second location holes.
Preferably, first location hole and second location hole that is positioned at least one group of opposite side of described rectangle is asymmetric arrangement.
Preferably, the cross sectional shape of described first location hole and described second location hole is circle or rectangle.
Preferably, the cross sectional shape of described first location hole and described second location hole is inequality.
Preferably, described support plate is made by the FR4 copper-clad plate of high Tg.
Preferably, on described support plate, be provided with described first location hole of at least two groups and described second location hole.
Preferably, the spacing between described first location hole of two adjacent groups and described second location hole is at least 3mm.
Preferably, also comprise demarcation strip, the thickness of this demarcation strip is less than the thickness of described support plate, and is provided with on this demarcation strip and described first location hole and corresponding the 3rd location hole of described second location hole.
Compared with prior art, the utlity model has following advantage.
(1) lamination mould of the present utility model has two cover location holes on its support plate, be respectively applied for one step press and second pressing, realized twice pressing of a mold, cooperate demarcation strip can accumulate the pressing simultaneously of superimposed several layers simultaneously, therefore saved production cost, improved efficient.
(2) material of mould of the present utility model adopts the FR4 copper-clad plate of high Tg, conveniently be easy to get, simultaneously as carrying out repeatedly pressing, can repeat location hole is processed, and can make the mould of corresponding size during the printed board of producing different size immediately, relative its production cost of steel mould is very low and efficient is high.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1.
Fig. 2 is the structural representation of the utility model embodiment 2.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is elaborated:
One of them embodiment of the present utility model as shown in Figure 1, the lamination of the multilayer board of rigid-flexible combination mainly is made up of rectangle support plate 1 and a plurality of shop bolt (not shown on the figure) with mould, the material of support plate 1 adopts the FR4 copper-clad plate of high Tg, the size dimension of support plate 1 can be according to circuit board size Selection to be produced, generally than producing the monolateral big 0.5-1 inch of circuit board size.On support plate 1, be provided with eight first location hole A1, A2 being used for each limit of circuit board is positioned ..., A7, A8 and four second location hole S1, S2, S3, S4, eight first location hole A1, A2 ..., A7, A8 and four second location hole S1, S2, S3, S4 stagger mutually and rectangular L arranges.The first location hole A3, the A7 and the second location hole S3, the S4 that are positioned on the left and right sides opposite side of rectangle L are asymmetric arrangement, can prevent that cover is anti-.
The first location hole A1, A2 ..., A7, A8 cross sectional shape be circular, the cross sectional shape of the second location hole S1, S2, S3, S4 is a rectangle, the cross sectional shape of first location hole and second location hole also can identical (deciding according to the pin shape).
M, n are PE-Punch punching contraposition target among Fig. 1.
Another embodiment of the present utility model as shown in Figure 2, as different from Example 1: on support plate 1, be provided with two group of first location hole A1, A2 ..., A7, A8 and the second location hole S1, S2, S3, S4, the two adjacent groups first location hole A1, A2 ..., the spacing between A7, A8 and the second location hole S1, S2, S3, the S4 is at least 3 mm, such mould pressing simultaneously two boards improves working (machining) efficiency.Certainly, at first location hole and second location hole that can also be provided with on the support plate 1 more than two groups.
Preferred as the foregoing description, lamination also is provided with demarcation strip with mould, its material adopts the FR4 copper-clad plate of high Tg, and the thickness of demarcation strip is less than the thickness of support plate, and is provided with on this demarcation strip and described first location hole and corresponding the 3rd location hole of second location hole.Cooperate demarcation strip can accumulate the pressing simultaneously of superimposed several layers, saved production cost, improved efficient.
Only be specific embodiment of the utility model below, do not limit protection range of the present utility model with this; Any replacement and the improvement done on the basis of not violating the utility model design all belong to protection range of the present utility model.
Claims (10)
1. the lamination mould of the multilayer board of a rigid-flexible combination, comprise support plate and a plurality of shop bolt, on this support plate, be provided with at least four and be used for first location hole that each limit of circuit board is positioned, this first location hole cooperates with described shop bolt, it is characterized in that: on described support plate, also be provided with at least four and be used for second location hole that each limit of circuit board is positioned, this second location hole and described first location hole stagger, and this second location hole cooperates with described shop bolt.
2. the lamination mould of the multilayer board of rigid-flexible combination according to claim 1 is characterized in that: all described first location holes and the rectangular layout of all described second location holes.
3. the lamination mould of the multilayer board of rigid-flexible combination according to claim 2 is characterized in that: first location hole and second location hole that are positioned at least one group of opposite side of described rectangle are asymmetric arrangement.
4. the lamination mould of the multilayer board of rigid-flexible combination according to claim 1, it is characterized in that: the cross sectional shape of described first location hole and described second location hole is circle or rectangle.
5. the lamination mould of the multilayer board of rigid-flexible combination according to claim 1, it is characterized in that: the cross sectional shape of described first location hole and described second location hole is inequality.
6. the lamination mould of the multilayer board of rigid-flexible combination according to claim 1, it is characterized in that: described support plate is made by the FR4 copper-clad plate of high Tg.
7. according to the lamination mould of the multilayer board of the arbitrary described rigid-flexible combination of claim 1 to 6, it is characterized in that: on described support plate, be provided with described first location hole of at least two groups and described second location hole.
8. the lamination mould of the multilayer board of rigid-flexible combination according to claim 7, it is characterized in that: the spacing between described first location hole of two adjacent groups and described second location hole is at least 3mm.
9. the lamination mould of the multilayer board of rigid-flexible combination according to claim 7, it is characterized in that: also comprise demarcation strip, the thickness of this demarcation strip is less than the thickness of described support plate, and is provided with on this demarcation strip and described first location hole and corresponding the 3rd location hole of described second location hole.
10. the lamination mould of the multilayer board of rigid-flexible combination according to claim 9, it is characterized in that: described demarcation strip is made by the FR4 copper-clad plate of high Tg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200082111U CN201957347U (en) | 2011-01-12 | 2011-01-12 | Die for laminating rigid and flexible combined multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200082111U CN201957347U (en) | 2011-01-12 | 2011-01-12 | Die for laminating rigid and flexible combined multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201957347U true CN201957347U (en) | 2011-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200082111U Expired - Lifetime CN201957347U (en) | 2011-01-12 | 2011-01-12 | Die for laminating rigid and flexible combined multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201957347U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658394A (en) * | 2012-04-25 | 2012-09-12 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102821547A (en) * | 2012-07-31 | 2012-12-12 | 苏州元坤电子有限公司 | Fixing method for double-faced circuit board machining process |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN103650719A (en) * | 2012-09-11 | 2014-03-26 | 现代农装科技股份有限公司 | Pot seedling transplanter |
| CN104519681A (en) * | 2014-11-19 | 2015-04-15 | 沪士电子股份有限公司 | Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree |
| CN106163142A (en) * | 2016-07-13 | 2016-11-23 | 博罗县精汇电子科技有限公司 | Make the method for Rigid Flex |
| CN113411968A (en) * | 2021-05-31 | 2021-09-17 | 徐伟文 | Metal-based printed circuit board laminating equipment |
-
2011
- 2011-01-12 CN CN2011200082111U patent/CN201957347U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658394A (en) * | 2012-04-25 | 2012-09-12 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102658394B (en) * | 2012-04-25 | 2014-03-26 | 深南电路有限公司 | Method and device for profile forming of packaging substrate |
| CN102821547A (en) * | 2012-07-31 | 2012-12-12 | 苏州元坤电子有限公司 | Fixing method for double-faced circuit board machining process |
| CN103650719A (en) * | 2012-09-11 | 2014-03-26 | 现代农装科技股份有限公司 | Pot seedling transplanter |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN104519681A (en) * | 2014-11-19 | 2015-04-15 | 沪士电子股份有限公司 | Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree |
| CN104519681B (en) * | 2014-11-19 | 2018-01-09 | 沪士电子股份有限公司 | The preparation method of the high Aligning degree line card type printed circuit board of high-layer oversize |
| CN106163142A (en) * | 2016-07-13 | 2016-11-23 | 博罗县精汇电子科技有限公司 | Make the method for Rigid Flex |
| CN113411968A (en) * | 2021-05-31 | 2021-09-17 | 徐伟文 | Metal-based printed circuit board laminating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110831 |