CN108811338A - The processing method that any thickness wiring board increases location hole newly - Google Patents
The processing method that any thickness wiring board increases location hole newly Download PDFInfo
- Publication number
- CN108811338A CN108811338A CN201810697098.9A CN201810697098A CN108811338A CN 108811338 A CN108811338 A CN 108811338A CN 201810697098 A CN201810697098 A CN 201810697098A CN 108811338 A CN108811338 A CN 108811338A
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- Prior art keywords
- location hole
- newly
- wiring board
- thickness
- circle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Drilling And Boring (AREA)
Abstract
A kind of processing method that any thickness wiring board increases location hole newly, includes arbitrarily processing location hole on the technique edges around the wiring board of any thickness；Measurement and positioning hole and the distance between two pads nearest from location hole in circuit board pattern area respectively, obtain two groups of range data；In all engineering datas, using two groups of range data of measurement as radius, using the central point of the pad of measurement as the center of circle, two circles are drawn respectively, crosspoint of two circles on technique edges is the center of circle of required newly-increased location hole to be added on wiring board, it is newly-increased location hole with the circle that a diameter of diameter of location hole is drawn using crosspoint as the center of circle；Using newly-increased location hole subsequent handling processing is carried out as positioning datum.Present invention can ensure that bored twice up and down in graph area in subsequent handling and the alignment precision of Milling Machining, the method can be widely applied to single dual platen of any thickness, multi-layer board, semi-finished product and production board manufacture in remedial measure.
Description
Technical field
The present invention relates to wiring board manufacturing technology fields, and location hole is increased newly more particularly to a kind of any thickness wiring board
Processing method.
Background technology
In recent years, with the continuous thickening of wiring board plate thickness, the plate thickness of many plates is above 10mm or more, therefore slab
Manufacture craft more and more widely paid close attention to.However most of manufacturing and processing equipment plate thickness ability in industry all exists at present
0.05mm --- between 8mm, causing plate thickness to be more than the plate of 10mm or more can not manufacture.Including brill target drone and perforating press
Generation orchid location hole of going into action can not be made, because hereafter process the Ma Shilan in need equipment that positions hole machined can not all produce；I.e.
Enabled production reluctantly is also difficult to ensure the accuracy error problem of the significant dimensions such as back drill hole, docking brill, straight slot, docking milling shape.
Therefore the research interest that people are more than 10mm or more circuit boards to plate thickness is excited, slab has been widely used for each electron-like production
Product etc. have very big development prospect.
Invention content
In view of the problems of the existing technology, the present invention provides a kind of wiring board for processing any thickness, and can improve
The processing method that any thickness wiring board of alignment precision increases location hole newly.
To achieve the goals above, the present invention adopts the following technical scheme that：
A kind of processing method that any thickness wiring board increases location hole newly, including：
Step 1：Location hole is arbitrarily processed on the technique edges around the wiring board of any thickness；
Step 2：The location hole and two welderings nearest from the location hole in the circuit board pattern area are measured respectively
The distance between disk obtains two groups of range data；
Step 3：In all engineering datas, using two groups of range data of measurement as radius, with the pad of measurement
Central point be the center of circle, draw two circles respectively, crosspoint of two circles on technique edges is required addition on wiring board
Newly-increased location hole the center of circle, using crosspoint as the center of circle, the circle drawn with a diameter of diameter of location hole is newly-increased location hole；
Step 4：Subsequent handling processing is carried out by positioning datum of the newly-increased location hole.
Further, in step 1, corresponding cutter is chosen according to the thickness of actual track plate, passes through the side disposably drilled
Formula processes the location hole.
Further, in step 2, the location hole and circular pad or square pads are measured using 2D or 3D measuring instruments
Distance, each described two groups of data of positioning hole measurement are the location hole respectively to two circular pads recently or rectangular weldering
The distance of disk.
Further, multiple location holes are processed, the distance between each location hole and pad are measured, in step 3
In, multiple newly-increased location holes are added successively.
Further, in step 1, the positioning of six a diameter of 3.18mm is arbitrarily processed on the technique edges of the wiring board
Hole measures two groups of data in step 2 respectively to six location holes, in step 3, added successively in engineering data six it is newly-increased
The diameter of location hole, the newly-increased location hole is also 3.18mm.
Further, it after step 4, is positioned according to newly-increased location hole, is laminated, milling side, is drilled.
Beneficial effects of the present invention：
It increases location hole newly on the plate of arbitrary relative contour road, and location hole is increased newly as positioning datum, because using using this
Same group of location hole, therefore can ensure figure in the processes such as subsequent back drill, opposite bore, docking hole milling/milling side, milling blind slot
It bores the alignment precision with Milling Machining in area twice up and down, it is important that back drill hole, docking brill, straight slot, docking milling shape etc. can be improved
The accuracy error problem of size, the wiring board to manufacture any thickness have established solid foundation, and the method can be extensive
Applied to single dual platen of any thickness, multi-layer board, semi-finished product and production board manufacture in remedial measure.
Description of the drawings
Fig. 1 is the flow chart for the processing method that any thickness wiring board of the present invention increases location hole newly；
Fig. 2 is the location hole schematic layout pattern of step 1 of the present invention；
Fig. 3 is the schematic diagram that step 2 of the present invention measures a distance between location hole and pad；
Fig. 4 is the schematic diagram that step 2 of the present invention measures distance between all location holes and pad；
Fig. 5 is the schematic diagram that step 3 of the present invention adds newly-increased location hole in engineering data；
In figure, 1-wiring board, 2-graph areas, 3-technique edges, 4-location holes, 5-pads.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining relative position relation, motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
Such as Fig. 1, the present invention provides a kind of processing method that any thickness wiring board increases location hole newly, includes the following steps：
Step 1：Location hole 4 is arbitrarily processed on the technique edges 3 around the wiring board 1 of any thickness.Such as Fig. 2, first adopt
With PP sawing sheets, then pre- folded, folding, pressing, destressing forms wiring board 1, is graph area 2 among wiring board 1, is around technique
Side 3.Corresponding cutter is chosen according to the thickness of actual track plate 1, location hole 4 is processed by way of disposably drilling,
In the present embodiment, the location hole 4 of six a diameter of 3.18mm is arbitrarily processed on the technique edges 3 of assist side 1, that arbitrarily processes determines
There are deviations between the well-regulated common location hole set in position hole 4 and engineering data.
Step 2：Respectively between 2 interior two pads 5 nearest from location hole 4 of measurement and positioning hole 4 and 1 graph area of wiring board
Distance, obtain two groups of range data.Such as Fig. 3 and Fig. 4, particularly, using the measuring instrument measurement and positioning holes 2D or 3D with it is round
The distance of pad or square pads, it is each to position two groups of data of hole measurement, it is that location hole 4 arrives two nearest circular pads respectively
Or the distance of square pads.In the present embodiment, six location holes 4 are measured respectively, each location hole 4 is required for surveying two groups of numbers
According to, and recorded data.
Step 3：Variation data adds in all engineering datas and increases location hole newly.Such as Fig. 5, with each positioning
Two groups of range data that hole 4 measures are radius, using the central point of the pad 5 of each measurement as the center of circle, draw two circles respectively, two
Crosspoint of a circle on technique edges 3 is the center of circle of required newly-increased location hole to be added on wiring board 1, then with crosspoint
It is newly-increased location hole with the circle that a diameter of diameter of location hole 4 is drawn for the center of circle.In the present embodiment, in engineering data
Six newly-increased location holes are added with identical method successively, the diameter for increasing location hole newly is also 3.18mm.
Step 4：Using newly-increased location hole subsequent handling processing is carried out as positioning datum.
It is positioned, is laminated, the processing on milling side, the processes such as drilling using newly-increased location hole, because using same
One group of location hole, therefore can ensure wiring board in the processes such as subsequent back drill, opposite bore, docking hole milling/milling side, milling blind slot
It bores the alignment precision with Milling Machining in graph area twice up and down, back drill hole, docking brill, straight slot, docking milling shape etc. can be improved
The accuracy error problem of significant dimensions, the wiring board to manufacture any thickness have established solid foundation, and the method can be with
Be widely used in single dual platen of any thickness, multi-layer board, semi-finished product and production board manufacture in remedial measure, especially
The design and manufacture field of to be for circuit plate thickness be more than 10mm or more, the present invention is pioneering for industry, significant.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferred embodiment to this hair
It is bright to be described in detail, it will be appreciated by those skilled in the art that can technical scheme of the present invention be modified or be waited
With replacing, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.
Claims (6)
1. the processing method that a kind of any thickness wiring board increases location hole newly, which is characterized in that including：
Step 1：Location hole is arbitrarily processed on the technique edges around the wiring board of any thickness；
Step 2：Measure respectively in the location hole and the circuit board pattern area from nearest two pads of the location hole it
Between distance, obtain two groups of range data；
Step 3：In all engineering datas, using two groups of range data of measurement as radius, in the pad of measurement
Heart point is the center of circle, draws two circles respectively, and crosspoint of two circles on technique edges is required to be added new on wiring board
The center of circle for increasing location hole is newly-increased location hole with the circle that a diameter of diameter of location hole is drawn using crosspoint as the center of circle；
Step 4：Subsequent handling processing is carried out by positioning datum of the newly-increased location hole.
2. the processing method that any thickness wiring board according to claim 1 increases location hole newly, it is characterised in that：Step 1
In, corresponding cutter is chosen according to the thickness of actual track plate, the location hole is processed by way of disposably drilling.
3. the processing method that any thickness wiring board according to claim 1 increases location hole newly, it is characterised in that：Step 2
In, the location hole is measured at a distance from circular pad or square pads using 2D or 3D measuring instruments, each location hole is surveyed
Two groups of data are measured, are distance of the location hole to nearest two circular pads or square pads respectively.
4. the processing method that any thickness wiring board according to claim 1 increases location hole newly, it is characterised in that：Processing is more
A location hole measures the distance between each location hole and pad, and in step 3, it is multiple newly-increased fixed to add successively
Position hole.
5. the processing method that any thickness wiring board according to claim 4 increases location hole newly, it is characterised in that：Step 1
In, the location hole of six a diameter of 3.18mm is arbitrarily processed on the technique edges of the wiring board, and six are positioned in step 2
Hole measures two groups of data respectively, in step 3, adds six newly-increased location holes, the newly-increased location hole successively in engineering data
Diameter also be 3.18mm.
6. the processing method that any thickness wiring board according to claim 1 increases location hole newly, it is characterised in that：Step 4
Later, it is positioned according to newly-increased location hole, is laminated, milling side, is drilled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697098.9A CN108811338B (en) | 2018-06-29 | 2018-06-29 | Processing method of newly-added positioning hole of circuit board with any thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697098.9A CN108811338B (en) | 2018-06-29 | 2018-06-29 | Processing method of newly-added positioning hole of circuit board with any thickness |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811338A true CN108811338A (en) | 2018-11-13 |
| CN108811338B CN108811338B (en) | 2021-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810697098.9A Active CN108811338B (en) | 2018-06-29 | 2018-06-29 | Processing method of newly-added positioning hole of circuit board with any thickness |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011189490A (en) * | 2010-03-17 | 2011-09-29 | Ngk Spark Plug Co Ltd | Non-contact carrying device of wiring board and method of manufacturing wiring board |
| US20120314391A1 (en) * | 2011-06-10 | 2012-12-13 | Hon Hai Precision Industry Co., Ltd. | Circuit board and method for making the same |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
| CN106488643A (en) * | 2015-08-31 | 2017-03-08 | 苹果公司 | Printed circuit-board assembly with damping layer |
-
2018
- 2018-06-29 CN CN201810697098.9A patent/CN108811338B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011189490A (en) * | 2010-03-17 | 2011-09-29 | Ngk Spark Plug Co Ltd | Non-contact carrying device of wiring board and method of manufacturing wiring board |
| US20120314391A1 (en) * | 2011-06-10 | 2012-12-13 | Hon Hai Precision Industry Co., Ltd. | Circuit board and method for making the same |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN106488643A (en) * | 2015-08-31 | 2017-03-08 | 苹果公司 | Printed circuit-board assembly with damping layer |
| CN106341940A (en) * | 2016-09-29 | 2017-01-18 | 广州兴森快捷电路科技有限公司 | Punching method of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108811338B (en) | 2021-04-16 |
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