CN105950115A - Environment-friendly abrasive paste suitable for gallium oxide substrate and preparation method of environment-friendly abrasive paste - Google Patents
Environment-friendly abrasive paste suitable for gallium oxide substrate and preparation method of environment-friendly abrasive paste Download PDFInfo
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- CN105950115A CN105950115A CN201610314540.6A CN201610314540A CN105950115A CN 105950115 A CN105950115 A CN 105950115A CN 201610314540 A CN201610314540 A CN 201610314540A CN 105950115 A CN105950115 A CN 105950115A
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- Prior art keywords
- gallium oxide
- grinding
- environment
- paste suitable
- stir
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- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910001195 gallium oxide Inorganic materials 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000000227 grinding Methods 0.000 claims abstract description 68
- 238000003756 stirring Methods 0.000 claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000003755 preservative agent Substances 0.000 claims abstract description 22
- 230000002335 preservative effect Effects 0.000 claims abstract description 21
- 239000008367 deionised water Substances 0.000 claims abstract description 20
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 20
- 239000007790 solid phase Substances 0.000 claims abstract description 20
- 239000012071 phase Substances 0.000 claims abstract description 14
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000013530 defoamer Substances 0.000 claims abstract description 10
- 239000008139 complexing agent Substances 0.000 claims abstract description 9
- 239000000546 pharmaceutical excipient Substances 0.000 claims abstract description 9
- 239000002562 thickening agent Substances 0.000 claims abstract description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- -1 fatty acid monoglycerides Chemical class 0.000 claims description 11
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 11
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
- 235000011187 glycerol Nutrition 0.000 claims description 10
- 229920002125 Sokalan® Polymers 0.000 claims description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 8
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- 150000002191 fatty alcohols Chemical class 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical group [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 6
- 239000008346 aqueous phase Substances 0.000 claims description 6
- 229960001631 carbomer Drugs 0.000 claims description 6
- 239000010431 corundum Substances 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000001509 sodium citrate Substances 0.000 claims description 6
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 6
- 150000002193 fatty amides Chemical class 0.000 claims description 5
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 5
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 4
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 4
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 4
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 4
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 4
- 239000000679 carrageenan Substances 0.000 claims description 4
- 235000010418 carrageenan Nutrition 0.000 claims description 4
- 229920001525 carrageenan Polymers 0.000 claims description 4
- 229940113118 carrageenan Drugs 0.000 claims description 4
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 4
- 229920013818 hydroxypropyl guar gum Polymers 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- ONQDVAFWWYYXHM-UHFFFAOYSA-M potassium lauryl sulfate Chemical compound [K+].CCCCCCCCCCCCOS([O-])(=O)=O ONQDVAFWWYYXHM-UHFFFAOYSA-M 0.000 claims description 4
- 229940116985 potassium lauryl sulfate Drugs 0.000 claims description 4
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 4
- 239000000600 sorbitol Substances 0.000 claims description 4
- 239000000230 xanthan gum Substances 0.000 claims description 4
- 229920001285 xanthan gum Polymers 0.000 claims description 4
- 235000010493 xanthan gum Nutrition 0.000 claims description 4
- 229940082509 xanthan gum Drugs 0.000 claims description 4
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 claims description 4
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical group OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 3
- 229920001732 Lignosulfonate Polymers 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 238000000265 homogenisation Methods 0.000 claims description 3
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 3
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 3
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 3
- 229920000223 polyglycerol Polymers 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims 2
- OSNIIMCBVLBNGS-UHFFFAOYSA-N 1-(1,3-benzodioxol-5-yl)-2-(dimethylamino)propan-1-one Chemical compound CN(C)C(C)C(=O)C1=CC=C2OCOC2=C1 OSNIIMCBVLBNGS-UHFFFAOYSA-N 0.000 claims 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims 1
- 108010068370 Glutens Proteins 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000174 gluconic acid Substances 0.000 claims 1
- 235000012208 gluconic acid Nutrition 0.000 claims 1
- 235000021312 gluten Nutrition 0.000 claims 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 239000001488 sodium phosphate Substances 0.000 claims 1
- 229910000162 sodium phosphate Inorganic materials 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims 1
- 238000003776 cleavage reaction Methods 0.000 abstract description 12
- 230000007017 scission Effects 0.000 abstract description 11
- 239000013078 crystal Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 7
- 239000000176 sodium gluconate Substances 0.000 description 7
- 235000012207 sodium gluconate Nutrition 0.000 description 7
- 229940005574 sodium gluconate Drugs 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- 238000012876 topography Methods 0.000 description 6
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 4
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229940083037 simethicone Drugs 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 108700004121 sarkosyl Proteins 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 2
- HSHXDCVZWHOWCS-UHFFFAOYSA-N N'-hexadecylthiophene-2-carbohydrazide Chemical compound CCCCCCCCCCCCCCCCNNC(=O)c1cccs1 HSHXDCVZWHOWCS-UHFFFAOYSA-N 0.000 description 2
- BACYUWVYYTXETD-UHFFFAOYSA-N N-Lauroylsarcosine Chemical compound CCCCCCCCCCCC(=O)N(C)CC(O)=O BACYUWVYYTXETD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 2
- 229920000847 nonoxynol Polymers 0.000 description 2
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229960001790 sodium citrate Drugs 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- KFDNQUWMBLVQNB-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].[Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KFDNQUWMBLVQNB-UHFFFAOYSA-N 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229960003511 macrogol Drugs 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 1
- 235000019796 monopotassium phosphate Nutrition 0.000 description 1
- 229920002113 octoxynol Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229940113116 polyethylene glycol 1000 Drugs 0.000 description 1
- 229940094541 polyglycerin-10 Drugs 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 235000011083 sodium citrates Nutrition 0.000 description 1
- KSAVQLQVUXSOCR-UHFFFAOYSA-M sodium lauroyl sarcosinate Chemical compound [Na+].CCCCCCCCCCCC(=O)N(C)CC([O-])=O KSAVQLQVUXSOCR-UHFFFAOYSA-M 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本发明公开了一种适用于氧化镓衬底的环保研磨膏及其制备方法,该研磨膏由以下各质量分数的组分组成:主磨剂0.5‑10%、助磨剂0.5‑10%、赋形剂10‑50%、表面活性剂0.5‑30%、增稠剂0.3‑5%、络合剂0.3‑5%、防腐剂0.1‑0.3%、消泡剂0.05‑0.3%、去离子水30‑80%。制备方法:将去离子水、增稠剂,搅拌后升温,加入赋形剂、络合剂、助磨剂,搅拌,加入表面活性剂、消泡剂,搅拌均质,形成水相;将主磨剂粉碎,形成固相;将水相和固相搅拌均质后加入防腐剂,继续搅拌均质即得。本发明制得的研磨膏对环境和操作者友好,同时能够缓解氧化镓表面的解理现象。
The invention discloses an environmentally friendly grinding paste suitable for gallium oxide substrates and a preparation method thereof. The grinding paste is composed of the following components in mass fractions: 0.5-10% of the main grinding agent, 0.5-10% of the grinding aid, Excipient 10‑50%, surfactant 0.5‑30%, thickener 0.3‑5%, complexing agent 0.3‑5%, preservative 0.1‑0.3%, defoamer 0.05‑0.3%, deionized water 30‑80%. Preparation method: stir deionized water and thickener, heat up after stirring, add excipient, complexing agent, grinding aid, stir, add surfactant, defoamer, stir homogeneously, form water phase; The grinding agent is pulverized to form a solid phase; the water phase and the solid phase are stirred and homogenized, and then the preservative is added, and the stirring is continued until the homogeneity is obtained. The abrasive paste prepared by the invention is friendly to the environment and operators, and at the same time can alleviate the cleavage phenomenon on the gallium oxide surface.
Description
技术领域 technical field
本发明属于研磨膏技术领域,具体涉及一种适用于氧化镓衬底的环保研磨膏及其制备方法。 The invention belongs to the technical field of grinding paste, and in particular relates to an environmentally friendly grinding paste suitable for gallium oxide substrates and a preparation method thereof.
背景技术 Background technique
2013年1月,在东京举行的“日本第3届LED及有机EL照明展”上,田村制作所及其子公司光波公司展出了其开发的使用氧化镓单晶(β-Ga2O3)的白色LED,其与传统使用在蓝宝石基板上制作的普通蓝色LED芯片时相比,具有容易提高光输出功率的特点,因此备受业界的广泛关注。因为氧化镓单晶材料属于新型晶体材料,目前的晶体生长、超精密加工工艺等相关技术并不成熟,所以与氧化镓衬底相关的生产技术报道并不多,即使在日本也只是展示了氧化镓衬底的成品及其制作的LED器件,而很少涉及氧化镓衬底制备工艺技术。 In January 2013, at the "Japan 3rd LED and Organic EL Lighting Exhibition" held in Tokyo, Tamura Manufacturing Co., Ltd. and its subsidiary Lightwave Corporation exhibited the gallium oxide single crystal (β-Ga 2 O 3 ) white LEDs, compared with the traditional use of ordinary blue LED chips made on sapphire substrates, has the characteristics of easily increasing the light output power, so it has attracted widespread attention in the industry. Because gallium oxide single crystal materials are new crystal materials, the current related technologies such as crystal growth and ultra-precision processing technology are not mature, so there are not many reports on the production technology related to gallium oxide substrates. Even in Japan, only the oxidation The finished products of gallium substrates and the LED devices made of them rarely involve the preparation process technology of gallium oxide substrates.
研磨膏是目前晶体材料加工过程中最常见的辅料耗材之一,但是研磨膏并不具备普适性。因为不同的晶体材料其物化特性并不相同,如软脆性的铌酸锂、钽酸锂、高硬脆的碳化硅和蓝宝石、易潮解的磷酸二氢钾、脆性易解理的氧化镓等,利用通用的研磨膏加工上述晶体可能会发生不适的现象,所以有必要开发更科学合理的专用抛光膏。此外,市面上或早期专利涉及的某些研磨膏内包含目前较少使用或避免使用的化学药剂,这些化学药剂往往给人或环境带来危害,如壬基酚聚氧乙烯醚和辛基酚聚氧乙烯醚类表面活性剂。 Abrasive paste is one of the most common auxiliary consumables in the process of crystal material processing, but the abrasive paste is not universal. Because different crystal materials have different physical and chemical properties, such as soft and brittle lithium niobate and lithium tantalate, high-hard and brittle silicon carbide and sapphire, deliquescent potassium dihydrogen phosphate, brittle and easy-to-cleavage gallium oxide, etc. Uncomfortable phenomena may occur when processing the above-mentioned crystals with a general-purpose abrasive paste, so it is necessary to develop a more scientific and reasonable special-purpose polishing paste. In addition, some abrasive pastes on the market or in earlier patents contain less used or avoided chemicals that are often harmful to humans or the environment, such as nonylphenol ethoxylates and octylphenol Polyoxyethylene ether surfactants.
发明内容 Contents of the invention
为了克服以上现有技术的不足,本发明提供了一种适用于氧化镓衬底的环保研磨膏及其制备方法,对环境和操作者友好,同时能够缓解氧化镓表面的解理现象。 In order to overcome the deficiencies of the prior art above, the present invention provides an environmentally friendly abrasive paste suitable for gallium oxide substrates and a preparation method thereof, which is friendly to the environment and operators, and can alleviate the cleavage phenomenon on the surface of gallium oxide.
本发明采用的技术方案是: The technical scheme adopted in the present invention is:
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:主磨剂0.5-10%、助磨剂0.5-10%、赋形剂10-50%、表面活性剂0.5-30%、增稠剂0.3-5%、络合剂0.3-5%、防腐剂0.1-0.3%、消泡剂0.05-0.3%、去离子水30-80%。 An environmentally friendly grinding paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: main grinding agent 0.5-10%, grinding aid 0.5-10%, excipient 10-50%, surfactant 0.5-30%, thickener 0.3-5%, complexing agent 0.3-5%, preservative 0.1-0.3%, defoamer 0.05-0.3%, deionized water 30-80%.
优选的,上述主磨剂为刚玉、碳化硅、人造金刚石中一种或几种的混合物,粒径为0.25-5μm。 Preferably, the above-mentioned main grinding agent is a mixture of one or more of corundum, silicon carbide, and synthetic diamond, with a particle size of 0.25-5 μm.
优选的,上述助磨剂为氢氧化钠、氢氧化钾、二甲胺、三乙醇胺、二甲基乙胺、二乙烯三胺、环己胺、二正丁胺中一种或几种的混合物。 Preferably, the above-mentioned grinding aid is a mixture of one or more of sodium hydroxide, potassium hydroxide, dimethylamine, triethanolamine, dimethylethylamine, diethylenetriamine, cyclohexylamine, and di-n-butylamine .
优选的,上述赋形剂为山梨糖醇、丙三醇、聚乙二醇、聚丙二醇、聚甘油10、脂肪酸单甘油酯中一种或几种的混合物。 Preferably, the above-mentioned excipients are one or a mixture of sorbitol, glycerol, polyethylene glycol, polypropylene glycol, polyglycerol 10, and fatty acid monoglycerides.
优选的,上述表面活性剂为烷醇酰胺、脂肪酰胺磺基琥珀酸单酯、N-月桂酰基肌氨酸钠、脂肪醇聚氧乙烯醚硫酸钠、月桂基硫酸钠、月桂基硫酸钾、木质素磺酸盐、脂肪醇聚氧乙烯醚中一种或几种的混合物。 Preferably, the above-mentioned surfactant is alkanolamide, fatty amide sulfosuccinic acid monoester, sodium N-lauroyl sarcosinate, fatty alcohol polyoxyethylene ether sodium sulfate, sodium lauryl sulfate, potassium lauryl sulfate, woody Sulfonate, fatty alcohol polyoxyethylene ether or a mixture of several.
优选的,上述增稠剂为羧甲基纤维素、羟乙基纤维素、羟丙基甲基纤维素、卡拉胶、黄原胶、羟丙基瓜尔胶、卡波姆、聚丙烯酸中一种或几种的混合物。 Preferably, the above thickener is one of carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl methyl cellulose, carrageenan, xanthan gum, hydroxypropyl guar gum, carbomer, polyacrylic acid species or a mixture of several species.
优选的,上述络合剂为乙二胺四乙酸二钠、乙二胺四乙酸四钠、葡萄糖酸钠、柠檬酸钠中一种或几种的混合物。 Preferably, the complexing agent is one or a mixture of disodium edetate, tetrasodium edetate, sodium gluconate, and sodium citrate.
优选的,上述防腐剂为凯松防腐剂。 Preferably, the above-mentioned preservative is Kethon preservative.
优选的,上述消泡剂为聚醚型消泡剂、硅酮类消泡剂中的一种。 Preferably, the above-mentioned defoamer is one of polyether defoamers and silicone defoamers.
一种适用于氧化镓衬底的环保研磨膏制备方法,包括以下步骤: A method for preparing an environmentally friendly abrasive paste suitable for gallium oxide substrates, comprising the following steps:
(1)向搅拌器中加入去离子水、增稠剂,搅拌溶解后升温至60-80℃,依次加入赋形剂、络合剂、助磨剂,搅拌溶解,再依次加入表面活性剂、消泡剂,搅拌,均质,形成水相; (1) Add deionized water and thickener to the agitator, stir to dissolve and heat up to 60-80°C, add excipients, complexing agents, grinding aids in turn, stir to dissolve, then add surfactants, Defoamer, stirring, homogenizing, forming an aqueous phase;
(2)将主磨剂置于粉料罐中粉碎,形成固相; (2) Put the main grinding agent in the powder tank and pulverize to form a solid phase;
(3)向真空制膏机中加入水相、固相,搅拌均质后加入防腐剂,继续搅拌均质,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, stir for homogenization, add preservative, continue stirring for homogeneity, and obtain the environmentally friendly abrasive paste suitable for gallium oxide substrates.
各组分作用如下: The functions of each component are as follows:
主磨剂:硬度比氧化镓的硬度高,在压力作用下剪切去除氧化镓衬底晶面因上一道加工工序产生的表面和亚表面损伤层。 Main grinding agent: the hardness is higher than that of gallium oxide. Under the action of pressure, the surface and subsurface damage layer of the crystal plane of gallium oxide substrate caused by the previous processing process is removed by shearing.
助磨剂:具有腐蚀氧化镓晶体表面的作用,使氧化镓形成较软的碱式化合物,遏制被加工晶面解理断裂的发生,帮助主磨剂更快地研磨氧化镓晶体。 Grinding aid: It has the effect of corroding the surface of gallium oxide crystal, making gallium oxide form a softer basic compound, restraining the occurrence of cleavage fracture of the processed crystal plane, and helping the main grinding agent to grind gallium oxide crystal faster.
表面活性剂、络合剂和增稠剂:吸附于磨料颗粒的表面,平衡和中和磨料颗粒的表面自由能,从而使得研磨膏在配制生产过程中主磨剂颗粒不再相互粘结团聚,起到研磨膏内磨料均匀分散和防止聚集的效果;在研磨过程中吸附于被研磨粉碎的氧化镓微细废屑表面,并将其分散和包裹,在研磨盘(或研磨垫)和水流的共同作用下将加工废屑带出研磨界面;在研磨膏配制生产、研磨衬底基片过程中,提高研磨膏的黏附性和流动性,更有利于研磨膏的配制生产和研磨应用;中和研磨过程中研磨盘(或研磨垫)和衬底表面摩擦产生的电荷,进而消除工件表面被加工环境中污染物黏附的现象,提高研磨晶面质量。 Surfactants, complexing agents and thickeners: adsorbed on the surface of abrasive particles, balance and neutralize the surface free energy of abrasive particles, so that the main abrasive particles will no longer bond and agglomerate during the production process of the abrasive paste, It has the effect of uniformly dispersing the abrasive in the grinding paste and preventing aggregation; during the grinding process, it is adsorbed on the surface of the ground gallium oxide fine waste, and disperses and wraps it, in the joint of the grinding disc (or grinding pad) and the water flow Under the action, the processing waste is taken out of the grinding interface; in the process of preparing the grinding paste and grinding the substrate substrate, the adhesion and fluidity of the grinding paste are improved, which is more conducive to the preparation, production and grinding application of the grinding paste; neutralize the grinding The charge generated by the friction between the grinding disc (or grinding pad) and the surface of the substrate during the process can eliminate the adhesion of pollutants in the processed environment on the surface of the workpiece and improve the quality of the grinding crystal surface.
赋形剂,用于提高研磨膏的保湿性,并在应用过程中起到增塑、润滑、分散和助悬的作用,并可将不同规格用途的研磨膏进行着色处理,利于分类使用。 Excipients are used to improve the moisture retention of the grinding paste, and play the role of plasticizing, lubricating, dispersing and suspending during the application process, and can be used for coloring the grinding paste with different specifications and uses, which is convenient for classified use.
防腐剂:防止研磨膏内药剂成分因化学变化等原因引起腐败变质。 Preservatives: prevent the chemical components in the grinding paste from being corrupted and deteriorated due to chemical changes and other reasons.
消泡剂:消除因表面活性剂的应用而在研磨过程中产生的泡沫,避免泡沫干扰研磨工艺的顺利开展。 Defoaming agent: eliminate the foam generated during the grinding process due to the application of surfactants, and prevent the foam from interfering with the smooth progress of the grinding process.
本发明制得的研磨膏具有以下优点: The grinding paste prepared by the present invention has the following advantages:
(1)采用环保组分,不添加壬基酚聚氧乙烯醚和辛基酚聚氧乙烯醚等表面活性剂,对环境和操作者友好; (1) Environmentally friendly components are used without adding surfactants such as nonylphenol ethoxylates and octylphenol ethoxylates, which are friendly to the environment and operators;
(2)适用于氧化镓衬底,能够缓解氧化镓表面的解理现象,填补了现有技术的空白。 (2) It is suitable for gallium oxide substrates, can alleviate the cleavage phenomenon on the surface of gallium oxide, and fills the gap in the prior art.
附图说明 Description of drawings
图1是实施例5 研磨前晶片表面形貌图; Fig. 1 is the surface topography figure of wafer before grinding of embodiment 5;
图2是实施例5研磨后晶片表面形貌图; Fig. 2 is the surface topography figure of wafer after grinding of embodiment 5;
图3是实施例6 研磨前晶片表面形貌图; Fig. 3 is the surface topography figure of wafer before grinding of embodiment 6;
图4是实施例6 研磨后晶片表面形貌图; Fig. 4 is the wafer surface topography figure after grinding of embodiment 6;
图5是实施例7 研磨前晶片表面形貌图; Fig. 5 is the surface topography figure of wafer before grinding of embodiment 7;
图6是实施例7 研磨后晶片表面形貌图。 Fig. 6 is a topography diagram of the wafer surface after grinding in Example 7.
具体实施方式 detailed description
下面通过具体实施方式对本发明作进一步详细说明。 The present invention will be further described in detail through specific embodiments below.
实施例1 Example 1
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:碳化硅0.5%(粒径为0.5μm)、环己胺0.5%、丙三醇17.75%、木质素磺酸盐0.5%、羟乙基纤维素0.3%、柠檬酸钠0.3%、凯松防腐剂0.1%、硅酮二乙醇消泡剂0.05%、去离子水80%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: 0.5% silicon carbide (particle size: 0.5 μm), 0.5% cyclohexylamine, 17.75% glycerol, lignin sulfonate 0.5% salt, 0.3% hydroxyethyl cellulose, 0.3% sodium citrate, 0.1% Kaisong preservative, 0.05% silicone diethanol defoamer, 80% deionized water.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、羟乙基纤维素,以60r/min速率搅拌10分钟,溶解后升温至60℃,依次加入丙三醇、柠檬酸钠、环己胺,以150r/min速率搅拌溶解,再依次加入木质素磺酸盐、硅酮二乙醇消泡剂,以150r/min速率搅拌20分钟,以1500r/min速率均质10分钟,形成水相; (1) Add deionized water and hydroxyethyl cellulose to the stirrer, stir at 60r/min for 10 minutes, heat up to 60°C after dissolving, add glycerol, sodium citrate, cyclohexylamine in sequence, and stir at 150r/min Stir at a speed of 1/min to dissolve, then add lignosulfonate and silicone diethanol antifoaming agent in sequence, stir at a speed of 150r/min for 20 minutes, and homogenize at a speed of 1500r/min for 10 minutes to form a water phase;
(2)将碳化硅置于粉料罐中粉碎,形成固相; (2) Put the silicon carbide in the powder tank and pulverize it to form a solid phase;
(3)向真空制膏机中加入水相、固相,30℃温度下以300r/min速率搅拌20分钟,再以1500r/min速率均质10分钟,加入凯松防腐剂,1500r/min速率均质10分钟,再以15r/min速率搅拌20分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, stir at 300r/min for 20 minutes at 30°C, then homogenize at 1500r/min for 10 minutes, add Kaisong preservative, 1500r/min Homogenize for 10 minutes, and then stir at 15 r/min for 20 minutes to obtain the environmentally friendly abrasive paste suitable for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,晶片的表面粗糙度由65nm降至7nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this embodiment, the gallium oxide substrate was ground on a precision grinding machine, the surface roughness of the wafer was reduced from 65 nm to 7 nm, and the surface cleavage phenomenon was significantly alleviated.
实施例2 Example 2
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:刚玉10%(粒径为5μm)、二甲胺10%、聚丙二醇10%、N-月桂酰基肌氨酸钠29.4%、黄原胶2%、卡波姆3%、葡萄糖酸钠5%、凯松防腐剂0.3%、硅酮二乙醇消泡剂0.3%、去离子水30%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: 10% corundum (with a particle size of 5 μm), 10% dimethylamine, 10% polypropylene glycol, and N-lauroyl sarcosine Sodium Acetate 29.4%, Xanthan Gum 2%, Carbomer 3%, Sodium Gluconate 5%, Kaison Preservative 0.3%, Silicone Diethanol Antifoaming Agent 0.3%, Deionized Water 30%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、黄原胶、卡波姆,以240r/min速率搅拌30分钟,溶解后升温至80℃,依次加入聚丙二醇、葡萄糖酸钠、二甲胺,以300r/min速率搅拌溶解,再依次加入N-月桂酰基肌氨酸钠、硅酮二乙醇消泡剂,以300r/min速率搅拌40分钟,以15000r/min速率均质30分钟,形成水相; (1) Add deionized water, xanthan gum, and carbomer to the mixer, stir at 240r/min for 30 minutes, heat up to 80°C after dissolving, add polypropylene glycol, sodium gluconate, and dimethylamine in sequence, to Stir at 300r/min to dissolve, then add N-lauroyl sarcosinate and silicone diethanol defoamer in turn, stir at 300r/min for 40 minutes, and homogenize at 15000r/min for 30 minutes to form a water phase;
(2)将刚玉置于粉料罐中粉碎,形成固相; (2) Pulverize the corundum in a powder tank to form a solid phase;
(3)向真空制膏机中加入水相、固相,60℃温度下以600 r/min速率搅拌40分钟,再以15000r/min速率均质30分钟,加入凯松防腐剂,15000r/min速率均质30分钟,再以150r/min速率搅拌60分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, Stir at a rate of r/min for 40 minutes, then homogenize at a rate of 15000r/min for 30 minutes; Environmentally friendly abrasive paste for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,晶片的表面粗糙度由345nm降至189nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this embodiment, the gallium oxide substrate was ground on a precision grinding machine, the surface roughness of the wafer was reduced from 345nm to 189nm, and the surface cleavage phenomenon was significantly alleviated.
实施例3 Example 3
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:碳化硅0.5%(粒径为5μm)、刚玉0.5%(粒径为5μm)、二乙烯三胺2%、脂肪酸单甘油酯50%、月桂基硫酸钾10%、羟丙基瓜尔胶3%、葡萄糖酸钠1%、柠檬酸钠1%、乙二胺四乙酸四钠1%、凯松防腐剂0.2%、二甲基硅油0.1%、去离子水30.7%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: silicon carbide 0.5% (particle size 5 μm), corundum 0.5% (particle size 5 μm), diethylenetriamine 2% , Fatty acid monoglyceride 50%, Potassium lauryl sulfate 10%, Hydroxypropyl guar gum 3%, Sodium gluconate 1%, Sodium citrate 1%, Tetrasodium edetate 1%, Kayson preservative 0.2%, simethicone 0.1%, deionized water 30.7%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、羟丙基瓜尔胶、葡萄糖酸钠、柠檬酸钠,以80r/min速率搅拌12分钟,溶解后升温至60-80℃,依次加入脂肪酸单甘油酯、乙二胺四乙酸四钠、二乙烯三胺,以180r/min速率搅拌溶解,再依次加入月桂基硫酸钾、二甲基硅油,以180r/min速率搅拌25分钟,以2500r/min速率均质15分钟,形成水相; (1) Add deionized water, hydroxypropyl guar gum, sodium gluconate, and sodium citrate to the mixer, stir at 80r/min for 12 minutes, heat up to 60-80°C after dissolving, and add fatty acid monoglyceride in turn Esters, tetrasodium ethylenediaminetetraacetic acid, diethylenetriamine, stirring and dissolving at 180r/min, then adding potassium lauryl sulfate, simethicone, stirring at 180r/min for 25 minutes, at 2500r/min Homogenize for 15 minutes to form an aqueous phase;
(2)将碳化硅、刚玉置于粉料罐中粉碎,形成固相; (2) Put silicon carbide and corundum in a powder tank to pulverize to form a solid phase;
(3)向真空制膏机中加入水相、固相,35℃温度下以350 r/min速率搅拌25分钟,再以2500r/min速率均质15分钟,加入凯松防腐剂,2500r/min速率均质15分钟,再以25r/min速率搅拌25分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, Stir at a rate of r/min for 25 minutes, then homogenize at a rate of 2500r/min for 15 minutes; Environmentally friendly abrasive paste for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,晶片的表面粗糙度由339nm降至177nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this embodiment, the gallium oxide substrate was ground on a precision grinding machine, the surface roughness of the wafer was reduced from 339 nm to 177 nm, and the surface cleavage phenomenon was significantly alleviated.
实施例4 Example 4
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:碳化硅5%(粒径为3μm)、二甲基乙胺3%、脂肪酸单甘油酯20%、脂肪酰胺磺基琥珀酸单酯30%、卡拉胶2%、乙二胺四乙酸四钠2%、凯松防腐剂0.2%、二甲基硅油0.2%、去离子水37.6%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: 5% silicon carbide (particle size 3 μm), 3% dimethylethylamine, 20% fatty acid monoglyceride, fat Amide sulfosuccinic acid monoester 30%, carrageenan 2%, tetrasodium edetate 2%, Kethon preservative 0.2%, simethicone 0.2%, deionized water 37.6%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、卡拉胶,以220r/min速率搅拌25分钟,溶解后升温至65℃,依次加入脂肪酸单甘油酯、乙二胺四乙酸四钠、二甲基乙胺,以250r/min速率搅拌溶解,再依次加入脂肪酰胺磺基琥珀酸单酯、二甲基硅油,以280r/min速率搅拌35分钟,以13000r/min速率均质25分钟,形成水相; (1) Add deionized water and carrageenan to the mixer, stir at 220r/min for 25 minutes, heat up to 65°C after dissolving, add fatty acid monoglyceride, tetrasodium ethylenediaminetetraacetate, dimethyl ethyl alcohol in sequence Amine, stirred at 250r/min to dissolve, then added fatty amide sulfosuccinic acid monoester and simethicone in sequence, stirred at 280r/min for 35 minutes, and homogenized at 13000r/min for 25 minutes to form a water phase;
(2)将碳化硅置于粉料罐中粉碎,形成固相; (2) Put the silicon carbide in the powder tank and pulverize it to form a solid phase;
(3)向真空制膏机中加入水相、固相,55℃温度下以550r/min速率搅拌35分钟,再以13000r/min速率均质25分钟,加入凯松防腐剂,13000r/min速率均质25分钟,再以120r/min速率搅拌50分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, stir at 550r/min for 35 minutes at 55°C, then homogenize at 13000r/min for 25 minutes, add Kaisong preservative, 13000r/min Homogenize for 25 minutes, and then stir at 120 r/min for 50 minutes to obtain the environmentally friendly abrasive paste suitable for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,晶片的表面粗糙度由305nm降至167nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this embodiment, the gallium oxide substrate was ground on a precision grinding machine, the surface roughness of the wafer was reduced from 305nm to 167nm, and the surface cleavage phenomenon was significantly alleviated.
实施例5 Example 5
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:W3金刚石微粉5.0%(粒径为1.5-3μm)、氢氧化钾1.5%、二正丁胺1.5%、脂肪酸单甘油酯20%、聚乙二醇200 5%、聚乙二醇1000 10%、烷醇酰胺1.5%、脂肪酰胺磺基琥珀酸单酯1.5%、乙二胺四乙酸二钠1.8%、卡波姆2.0%、凯松防腐剂0.2%、GP 型甘油聚醚0.1%、去离子水49.9%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: W3 diamond powder 5.0% (particle size 1.5-3μm), potassium hydroxide 1.5%, di-n-butylamine 1.5%, Fatty acid monoglycerides 20%, polyethylene glycol 200 5%, Macrogol 1000 10%, Alkanolamide 1.5%, Fatty Amide Sulfosuccinic Acid Monoester 1.5%, Disodium EDTA 1.8%, Carbomer 2.0%, Kayson Preservative 0.2% , GP type glycerol polyether 0.1%, deionized water 49.9%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、卡波姆,以110r/min速率搅拌18分钟,溶解后升温至75℃,依次加入脂肪酸单甘油酯、聚乙二醇200、聚乙二醇1000、乙二胺四乙酸二钠、氢氧化钾、二正丁胺,以200r/min速率搅拌溶解,再依次加入烷醇酰胺、脂肪酰胺磺基琥珀酸单酯、GP 型甘油聚醚,以200r/min速率搅拌30分钟,以10000r/min速率均质20分钟,形成水相; (1) Add deionized water and carbomer to the mixer, stir at 110r/min for 18 minutes, heat up to 75°C after dissolving, add fatty acid monoglycerides, polyethylene glycol 200, polyethylene glycol 1000 in sequence , disodium edetate, potassium hydroxide, di-n-butylamine, stirred and dissolved at a rate of 200r/min, and then added alkanolamide, fatty amide sulfosuccinic acid monoester, GP glycerol polyether, at 200r/min Stir at a speed of 10000r/min for 30 minutes, and homogenize for 20 minutes at a speed of 10000r/min to form an aqueous phase;
(2)将金刚石微粉置于粉料罐中粉碎,形成固相; (2) Put the diamond powder in the powder tank and pulverize it to form a solid phase;
(3)向真空制膏机中加入水相、固相,45℃温度下以450r/min速率搅拌30分钟,再以10000r/min速率均质20分钟,加入凯松防腐剂,10000r/min速率均质20分钟,再以100r/min速率搅拌40分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, stir at 450r/min for 30 minutes at 45°C, then homogenize at 10,000r/min for 20 minutes, add Kaisong preservative, 10,000r/min Homogenize for 20 minutes, and then stir for 40 minutes at a rate of 100 r/min to obtain the environmentally friendly abrasive paste suitable for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,使用基恩士三维形貌仪观察晶面形貌,研磨前晶片表面形貌如图1所示,研磨后晶片表面形貌如图2所示,晶片的表面粗糙度由296nm降至155nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this example, grind the gallium oxide substrate substrate on a precision grinder, and use the Keyence three-dimensional morphology instrument to observe the crystal surface morphology. The surface morphology of the wafer before grinding is shown in Figure 1. After grinding The surface morphology of the wafer is shown in Figure 2. The surface roughness of the wafer is reduced from 296nm to 155nm, and the surface cleavage phenomenon is obviously alleviated.
实施例6 Example 6
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:W1.5金刚石微粉5.0%(粒径为0.75-1.5μm)、氢氧化钠1.0%、三乙醇胺1.0%、丙三醇15.0%、山梨糖醇30.0%、脂肪醇聚氧乙烯醚硫酸钠0.5%、脂肪醇聚氧乙烯醚0.5%、乙二胺四乙酸二钠1.3%、羟丙基甲基纤维素0.5%、聚丙烯酸0.5%、凯松防腐剂0.2%、GP 型甘油聚醚0.1%、去离子水43.9%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: W1.5 diamond micropowder 5.0% (particle size 0.75-1.5μm), sodium hydroxide 1.0%, triethanolamine 1.0% , Glycerin 15.0%, Sorbitol 30.0%, Sodium Fatty Alcohol Polyoxyethylene Ether Sulfate 0.5%, Fatty Alcohol Polyoxyethylene Ether 0.5%, Disodium EDTA 1.3%, Hydroxypropyl Methyl Cellulose 0.5%, polyacrylic acid 0.5%, Kaisong preservative 0.2%, GP type glycerol polyether 0.1%, deionized water 43.9%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、聚丙烯酸,以150r/min速率搅拌20分钟,溶解后升温至70℃,依次加入丙三醇、山梨糖醇、乙二胺四乙酸二钠、氢氧化钠、三乙醇胺,以200r/min速率搅拌溶解,再依次加入脂肪醇聚氧乙烯醚硫酸钠、脂肪醇聚氧乙烯醚、GP 型甘油聚醚,以250r/min速率搅拌30分钟,以9000r/min速率均质15分钟,形成水相; (1) Add deionized water and polyacrylic acid to the mixer, stir at 150r/min for 20 minutes, heat up to 70°C after dissolving, add glycerol, sorbitol, disodium edetate, hydrogen Sodium oxide and triethanolamine were stirred and dissolved at a rate of 200r/min, and then fatty alcohol polyoxyethylene ether sodium sulfate, fatty alcohol polyoxyethylene ether, and GP glycerol polyether were added successively, stirred at a rate of 250r/min for 30 minutes, and then stirred at a rate of 9000r/min. /min rate of homogenization for 15 minutes to form an aqueous phase;
(2)将金刚石微粉置于粉料罐中粉碎,形成固相; (2) Put the diamond powder in the powder tank and pulverize it to form a solid phase;
(3)向真空制膏机中加入水相、固相,50℃温度下以400 r/min速率搅拌35分钟,再以9000r/min速率均质20分钟,加入凯松防腐剂,9000r/min速率均质25分钟,再以100r/min速率搅拌40分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, Stir at a rate of r/min for 35 minutes, then homogenize at a rate of 9000r/min for 20 minutes; Environmentally friendly abrasive paste for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,使用基恩士三维形貌仪观察晶面形貌,研磨前晶片表面形貌如图3所示,研磨后晶片表面形貌如图4所示,晶片的表面粗糙度由185nm降至35nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this example, grind the gallium oxide substrate substrate on a precision grinder, and use the Keyence three-dimensional morphology instrument to observe the crystal surface morphology. The surface morphology of the wafer before grinding is shown in Figure 3. After grinding The surface morphology of the wafer is shown in Figure 4, the surface roughness of the wafer is reduced from 185nm to 35nm, and the surface cleavage phenomenon is obviously alleviated.
实施例7 Example 7
一种适用于氧化镓衬底的环保研磨膏,由以下各质量分数的组分组成:W0.5金刚石微粉5.0%(粒径为0.25-0.5μm)、氢氧化钠1.5%、三乙醇胺1.5%、聚甘油10 35%、月桂基硫酸钠1.5%、脂肪醇聚氧乙烯醚0.5%、葡萄糖酸钠1.0%、羧甲基纤维素1.8%、凯松防腐剂0.2%、GPE 型聚氧乙烯聚氧丙烯甘油醚0.1%、去离子水43.9%。 An environmentally friendly abrasive paste suitable for gallium oxide substrates, consisting of the following components in mass fractions: W0.5 diamond powder 5.0% (particle size 0.25-0.5μm), sodium hydroxide 1.5%, triethanolamine 1.5% , Polyglycerin 10 35%, Sodium Lauryl Sulfate 1.5%, Fatty Alcohol Polyoxyethylene Ether 0.5%, Sodium Gluconate 1.0%, Carboxymethyl Cellulose 1.8%, Kayson Preservative 0.2%, GPE Polyoxyethylene Polyethylene Oxypropylene glyceryl ether 0.1%, deionized water 43.9%.
制备方法,包括以下步骤: The preparation method comprises the following steps:
(1)向搅拌器中加入去离子水、羧甲基纤维素,以200r/min速率搅拌20分钟,溶解后升温至70℃,依次加入聚甘油10、葡萄糖酸钠、氢氧化钠、三乙醇胺,以200r/min速率搅拌溶解,再依次加入月桂基硫酸钠、脂肪醇聚氧乙烯醚、GPE 型聚氧乙烯聚氧丙烯甘油醚,以200r/min速率搅拌30分钟,以8000r/min速率均质20分钟,形成水相; (1) Add deionized water and carboxymethyl cellulose to the mixer, stir at 200r/min for 20 minutes, heat up to 70°C after dissolving, add polyglycerol 10, sodium gluconate, sodium hydroxide, triethanolamine in sequence , stir and dissolve at a rate of 200r/min, then add sodium lauryl sulfate, fatty alcohol polyoxyethylene ether, GPE polyoxyethylene polyoxypropylene glyceryl ether in sequence, stir at a rate of 200r/min for 30 minutes, and mix at a rate of 8000r/min Matter for 20 minutes to form an aqueous phase;
(2)将金刚石微粉置于粉料罐中粉碎,形成固相; (2) Put the diamond powder in the powder tank and pulverize it to form a solid phase;
(3)向真空制膏机中加入水相、固相,50℃温度下以400 r/min速率搅拌30分钟,再以8000r/min速率均质20分钟,加入凯松防腐剂,8000r/min速率均质20分钟,再以80r/min速率搅拌40分钟,即得所述适用于氧化镓衬底的环保研磨膏。 (3) Add water phase and solid phase to the vacuum paste making machine, Stir at a rate of r/min for 30 minutes, then homogenize at a rate of 8000r/min for 20 minutes, add Kaisong preservative, homogenize at a rate of 8000r/min for 20 minutes, and stir at a rate of 80r/min for 40 minutes to obtain the said Environmentally friendly abrasive paste for gallium oxide substrates.
采用本实施例制得的研磨膏,在精密研磨机上研磨氧化镓衬底基片,使用基恩士三维形貌仪观察晶面形貌,研磨前晶片表面形貌如图5所示,研磨后晶片表面形貌如图6所示,晶片的表面粗糙度由62nm降至5nm,表面的解理现象得到明显缓解。 Using the abrasive paste prepared in this example, grind the gallium oxide substrate substrate on a precision grinder, and use the Keyence three-dimensional morphology instrument to observe the crystal surface morphology. The surface morphology of the wafer before grinding is shown in Figure 5, and after grinding The surface morphology of the wafer is shown in Figure 6, the surface roughness of the wafer is reduced from 62nm to 5nm, and the surface cleavage phenomenon is obviously alleviated.
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