CN102268225B - Permanent-suspension diamond grinding liquid - Google Patents
Permanent-suspension diamond grinding liquid Download PDFInfo
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- CN102268225B CN102268225B CN201110143348.2A CN201110143348A CN102268225B CN 102268225 B CN102268225 B CN 102268225B CN 201110143348 A CN201110143348 A CN 201110143348A CN 102268225 B CN102268225 B CN 102268225B
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- China
- Prior art keywords
- polishing
- suspension
- grinding liquid
- diamond grinding
- agent
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- 239000010432 diamond Substances 0.000 title claims abstract description 22
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 title claims abstract description 20
- 239000000725 suspension Substances 0.000 title claims abstract description 16
- 238000000227 grinding Methods 0.000 title claims abstract description 13
- 238000005498 polishing Methods 0.000 claims abstract description 30
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 14
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 11
- 239000003002 pH adjusting agent Substances 0.000 claims abstract description 11
- 239000006185 dispersion Substances 0.000 claims abstract description 8
- 239000013543 active substance Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- -1 polyoxyethylene Polymers 0.000 claims description 9
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 6
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- IIYFAKIEWZDVMP-UHFFFAOYSA-N tridecane Chemical compound CCCCCCCCCCCCC IIYFAKIEWZDVMP-UHFFFAOYSA-N 0.000 claims description 6
- 229960004418 trolamine Drugs 0.000 claims description 6
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 abstract description 9
- 238000002360 preparation method Methods 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 239000010437 gem Substances 0.000 abstract description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 abstract description 2
- 238000001556 precipitation Methods 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract 2
- 239000004094 surface-active agent Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
- 238000013517 stratification Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012669 liquid formulation Substances 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000010775 animal oil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a permanent-suspension diamond grinding liquid, which is characterized in that the liquid is prepared by mixing the following components according to the ratios: 80-90% of alkanes, 1-5% of dispersion thixotropic agents, 10% of surfactants, 1-3% of pH adjusting agents, 0.1-1% of diamond micropowder; the preparation method comprises the following steps: fully stirring and mixing the alkanes, the dispersion thixotropic agents, and the surfactants according to the ratios, adding diamond micropowder into the dissolved solution, performing ultrasonic dispersion, and adjusting the pH to be neutral by the pH adjusting agent. The invention is applicable to the grinding and polishing of LED chips, LED display screens, optical crystals, silicon wafers, compound crystals, liquid crystal panels, jewels, ceramics, germanium wafers, metal workpieces and the like, can maintain a uniform suspension state for a long time, and does not generate any phenomenon of precipitation, stratification, or failure.
Description
Technical field
The present invention relates to a kind of lapping liquid, belong to the polishing technology field of chemical machinery, particularly a kind of suspension diamond grinding liquid forever.
Background technology
In semiconductor fabrication processes, initial semiconductor chip need to carry out polishing, and polishing process adopts lapping liquid to carry out conventionally.The common composition of lapping liquid is diamond differential, aviation spirit, kerosene, transformer oil, each vegetable oil, animal oil and hydro carbons, being equipped with some emulsifying agents is mixed again, this lapping liquid can reach suspension in use, thereby reach the effect that abrasive material is suspended, but for the larger abrasive material of particle, need the lapping liquid that suspension is higher, above-mentioned lapping liquid normally suspends in use, shake up before use, during use always in whipped state, wasting manpower and material resources, and not good for macrobead suspension effect.
If Chinese Patent Application No. is 02138718.4, title is " high suspension force water soluble anti-rust grinding liquid ", and its preparation method is had relatively high expectations to temperature and vacuum tightness, has improved cost.
For prior art, on market, need a kind of lapping liquid that forever suspends, after completing, preparation can guarantee suspended state, reach a kind of " forever suspending " state, polishing effect is better in use can to make it, saves man-hour, increases work efficiency, and preserves conveniently.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of suspension diamond grinding liquid forever, prepared and can reach suspended state, convenient preservation, during use without always in whipped state, raise the efficiency, reduce costs.
The present invention realizes by following technical scheme:
A suspension diamond grinding liquid is forever that the material by following component and proportioning mixes:
Alkane 80～90%;
Disperse thixotropic agent 1～5%;
Tensio-active agent 10%;
PH adjusting agent 1～3%;
Diamond differential 0.1～1%.
The optimal component of described suspension diamond grinding liquid forever and proportioning are:
Alkane 87%;
Disperse thixotropic agent 1%;
Tensio-active agent 10%;
PH adjusting agent 1%;
Diamond differential 1%.
Described alkane is one or more mixtures in undecane, dodecane or the tridecane of straight chain.
Described dispersion thixotropic agent is one or more mixtures in polyvinyl alcohol, Vinyl Ether or polyoxyethylene nonyl phenyl.
Described tensio-active agent is one or both mixtures in polyoxyethylene ethyl phenolic ether or epoxy the third hydrocarbon.
Described pH adjusting agent is a kind of in thanomin, trolamine, hydrochloric acid or phosphoric acid.
Described diadust is that particle diameter is the diadust of 1～10 μ m.
Preparation technology of the present invention is: the alkane of aforementioned proportion, dispersion thixotropic agent, tensio-active agent are fully stirred fused, diamond differential is added in the solution after above-mentioned fusing, adopt ultrasonic dispersion, ultrasonic dispersion adopts 500 watts, jitter time is 10～20min, after end, by pH adjusting agent, be adjusted to neutrality, to 6～8.
Beneficial effect of the present invention is:
For LED chip, LED display, the grinding and polishing of optical crystal, silicon chip, compound crystal, liquid crystal panel, jewel, pottery, germanium wafer, metal works etc.This lapping liquid can keep even suspended state for a long time, can not produce any precipitation, layering and failure phenomenon; This product is stable suspension forever, before using and in use procedure without any need for whipping appts can effectively guarantee the stable use of product simultaneously.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1
Lapping liquid formulation selection:
Undecane 87%;
Disperse thixotropic agent (polyvinyl alcohol) 1%;
Tensio-active agent (polyoxyethylene ethyl phenolic ether) 10%;
PH adjusting agent (mixture of thanomin and trolamine) 1%;
Diamond differential 1%.
Preparation method: the alkane of aforementioned proportion, dispersion thixotropic agent, tensio-active agent are fully stirred fused, the diamond differential that is 1～10 μ m by particle diameter adds in the solution after above-mentioned fusing, adopt ultrasonic dispersion, ultrasonic dispersion adopts 500 watts, jitter time is 10min, finishes the rear mixture with thanomin and trolamine and adjusts pH to 7.8.
Use the above-mentioned polishing fluid preparing 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface extra coarse degree is in 0.05 μ m left and right, polish pressure is 40 kilograms, polishing disk rotating speed is 80rpm, polishing fluid flow is 2ml/min, polishing time is 10min, and after polishing, sapphire sheet surface extra coarse degree becomes 0.008 μ m.Glazed surface is without obvious cut, and polishing speed is 2.2 μ m/min.
Embodiment 2
Lapping liquid formulation selection:
Dodecane 85%;
Disperse thixotropic agent (polyoxyethylene nonyl phenyl) 3%;
Tensio-active agent (propylene oxide) 10%;
PH adjusting agent (hydrochloric acid) 2%;
Diamond differential 1%.
Preparation method: the alkane of aforementioned proportion, dispersion thixotropic agent, tensio-active agent are fully stirred fused, the diamond differential that is 1～10 μ m by particle diameter adds in the solution after above-mentioned fusing, adopt ultrasonic dispersion, ultrasonic dispersion adopts 500 watts, jitter time is 15min, finishes the rear mixture with thanomin and trolamine and adjusts pH to 6.8.
Use the above-mentioned polishing fluid preparing 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface extra coarse degree is in 0.05 μ m left and right, polish pressure is 40 kilograms, polishing disk rotating speed is 80rpm, polishing fluid flow is 2ml/min, polishing time is 10min, and after polishing, sapphire sheet surface extra coarse degree becomes 0.009 μ m.Glazed surface is without obvious cut, and polishing speed is 2.6 μ m/min.
Embodiment 3
Lapping liquid formulation selection:
Tridecane 82%;
Disperse thixotropic agent (Vinyl Ether and polyoxyethylene nonyl phenyl mixture) 5%;
Tensio-active agent (propylene oxide) 10%;
PH adjusting agent (phosphoric acid and ethanolamine mixtures) 2%;
Diamond differential 1%.
Preparation method: the alkane of aforementioned proportion, dispersion thixotropic agent, tensio-active agent are fully stirred fused, the diamond differential that is 1～10 μ m by particle diameter adds in the solution after above-mentioned fusing, adopt ultrasonic dispersion, ultrasonic dispersion adopts 500 watts, jitter time is 20min, finishes the rear mixture with thanomin and trolamine and adjusts pH to 7.2.
Use the above-mentioned polishing fluid preparing 2 inches of 5 sapphire sheet of polishing on special glazing machine, polishing front surface extra coarse degree is in 0.05 μ m left and right, polish pressure is 40 kilograms, polishing disk rotating speed is 80rpm, polishing fluid flow is 2ml/min, polishing time is 10min, and after polishing, sapphire sheet surface extra coarse degree becomes 0.008 μ m.Glazed surface is without obvious cut, and polishing speed is 1.8 μ m/min.
Claims (1)
1. a suspension diamond grinding liquid forever, described in it is characterized in that, the component of suspension diamond grinding liquid and proportioning are forever:
Alkane 87%;
Disperse thixotropic agent 1%;
Tensio-active agent 10%;
PH adjusting agent 1%;
Diadust 1%;
Described alkane is one or more mixtures in undecane, dodecane or the tridecane of straight chain;
Described dispersion thixotropic agent is one or both mixtures in polyvinyl alcohol, Vinyl Ether;
Described tensio-active agent is polyoxyethylene ethyl phenolic ether;
Described pH adjusting agent is a kind of in thanomin, trolamine, hydrochloric acid or phosphoric acid;
Described diadust is that particle diameter is the diadust of 1～10 μ m;
Described suspension diamond grinding liquid is forever exclusively used in sapphire polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110143348.2A CN102268225B (en) | 2011-05-30 | 2011-05-30 | Permanent-suspension diamond grinding liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110143348.2A CN102268225B (en) | 2011-05-30 | 2011-05-30 | Permanent-suspension diamond grinding liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102268225A CN102268225A (en) | 2011-12-07 |
| CN102268225B true CN102268225B (en) | 2014-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110143348.2A Expired - Fee Related CN102268225B (en) | 2011-05-30 | 2011-05-30 | Permanent-suspension diamond grinding liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102268225B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102690606A (en) * | 2012-05-10 | 2012-09-26 | 宁波晨阳光电科技有限公司 | Polishing agent used for optical fiber ferrule |
| CN103756573A (en) * | 2014-01-23 | 2014-04-30 | 上海百兰朵电子科技有限公司 | Low-scratch diamond grinding fluid |
| KR20170136577A (en) * | 2015-04-13 | 2017-12-11 | 캐보트 마이크로일렉트로닉스 코포레이션 | Diamond-based slurry with improved sapphire removal rate and surface roughness |
| CN105273638B (en) * | 2015-10-14 | 2017-08-29 | 盐城工学院 | Anti- cleavage suspension lapping liquid of gallium oxide wafer and preparation method thereof |
| CN109648404A (en) * | 2017-10-11 | 2019-04-19 | 蓝思科技（长沙）有限公司 | A kind of rough polishing light technology of ceramic product |
| CN114686171A (en) * | 2022-05-19 | 2022-07-01 | 中国振华集团云科电子有限公司 | Suspensible diamond grinding fluid and preparation process thereof |
| CN115926747B (en) * | 2022-12-08 | 2024-05-28 | 郑州磨料磨具磨削研究所有限公司 | Concentrated aqueous grinding aid and preparation method thereof |
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|---|---|---|---|---|
| US6270393B1 (en) * | 1998-10-05 | 2001-08-07 | Tdk Corporation | Abrasive slurry and preparation process thereof |
| WO2002081123A2 (en) * | 2001-04-04 | 2002-10-17 | Vesuvius Crucible Company | Improved regulation of a stream of molten metal |
| CN1560161A (en) * | 2004-03-01 | 2005-01-05 | 长沙矿冶研究院 | Water-based nano diamond polishing solution and preparation method thereof |
| CN1651544A (en) * | 2005-01-07 | 2005-08-10 | 清华大学 | A kind of abrasive liquid used for grinding the back of magnetic head of memory hard disk |
| WO2007111813A2 (en) * | 2006-03-23 | 2007-10-04 | Cabot Microelectronics Corporation | Iodate-containing chemical-mechanical polishing compositions and methods |
| CN101831243A (en) * | 2010-04-30 | 2010-09-15 | 中国计量学院 | High-precision non-water-based nano-diamond grinding fluid and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
-
2011
- 2011-05-30 CN CN201110143348.2A patent/CN102268225B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6270393B1 (en) * | 1998-10-05 | 2001-08-07 | Tdk Corporation | Abrasive slurry and preparation process thereof |
| WO2002081123A2 (en) * | 2001-04-04 | 2002-10-17 | Vesuvius Crucible Company | Improved regulation of a stream of molten metal |
| CN1560161A (en) * | 2004-03-01 | 2005-01-05 | 长沙矿冶研究院 | Water-based nano diamond polishing solution and preparation method thereof |
| CN1651544A (en) * | 2005-01-07 | 2005-08-10 | 清华大学 | A kind of abrasive liquid used for grinding the back of magnetic head of memory hard disk |
| WO2007111813A2 (en) * | 2006-03-23 | 2007-10-04 | Cabot Microelectronics Corporation | Iodate-containing chemical-mechanical polishing compositions and methods |
| CN101831243A (en) * | 2010-04-30 | 2010-09-15 | 中国计量学院 | High-precision non-water-based nano-diamond grinding fluid and preparation method and application thereof |
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| Publication number | Publication date |
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| CN102268225A (en) | 2011-12-07 |
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