CN102412027B - Manufacturing method of H-level and 200-level electromagnetic wire - Google Patents
Manufacturing method of H-level and 200-level electromagnetic wire Download PDFInfo
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- CN102412027B CN102412027B CN 201110412025 CN201110412025A CN102412027B CN 102412027 B CN102412027 B CN 102412027B CN 201110412025 CN201110412025 CN 201110412025 CN 201110412025 A CN201110412025 A CN 201110412025A CN 102412027 B CN102412027 B CN 102412027B
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- bare copper
- copper wire
- extruder
- insulating resin
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000002086 nanomaterial Substances 0.000 claims description 12
- 239000008188 pellet Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229910017083 AlN Inorganic materials 0.000 claims description 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 238000001994 activation Methods 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 230000004913 activation Effects 0.000 abstract description 2
- 238000010292 electrical insulation Methods 0.000 abstract description 2
- 238000004134 energy conservation Methods 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000010754 BS 2869 Class F Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Organic Insulating Materials (AREA)
Abstract
The invention relates to a manufacturing method of an H-level and 200-level electromagnetic wire, and the manufacturing method provided by the invention is lower in manufacturing cost, is suitable for energy conservation and emission reduction can be used for reducing the environmental pollution and ensuring the product performance to be higher. The manufacturing method comprises the following steps: adding a polyester resin into a nanometer material subjected to surface activation treatment, uniformly stirring and then delivering into an extruder hopper; the insulation resin to be in a high-temperature viscous flow state by virtue of an extruder and continuously extruding from a die sleeve port of the extruder; meanwhile, aligning and preheating a bare copper wire, enabling the aligned and preheated bare copper wire to pass through a forming die of a machine head of the extruder, and packaging the insulation resin extruded from the die sleeve onto the bare copper wire; and cooling the bare copper wire covered with the insulation resin so as to obtain the H-level and 200-level electromagnetic wire; the electromagnetic wire eliminates a gap at a joint seam of a pin hole and a rolling covered wire, thus the electrical insulation performance is improved; and meanwhile, an inorganic nanometer material with high corona resistance and high thermal conductivity is added into insulating layer, the heat resistance of the insulating layer is improved, and the heat-conduction coefficient can achieve 0.60 W/Mk.
Description
Technical field
The present invention relates to the technical field that the electrician makes with electromagnetic wire, relate to the coming of new technique of electromagnetic wire such as high-voltage generator, high-tension motor, track drawing motor, frequency-conversion and speed-regulation motor, wind-driven generator, specifically the manufacture method of a kind of H level, 200 grades of electromagnetic wires.
Background technology
In electrician trade, the electromagnetic wire demand is very large.Usually the electromagnetic wire of using in motor, the electrical apparatus industry has two large classes: enamelled wire and lapped wire.The amount of solid of wire enamel is very little in the enamelled wire manufacture process, less than 20%, be coated onto certain film thickness, just must be coated with repeatedly, cures repeatedly, makes solvent evaporates and makes film curing.Not only waste a large amount of organic solvents, and caused the severe contamination of environment, repeatedly cured the huge consumption that also causes electric power.Concerning lapped wire, the particularly coiling of the lapped wire used of the specific type of electric machines such as Large-scale High-Pressure generator, high-tension motor, track traffic traction electric machine, high-voltage frequency conversion and speed-adjusting motor or mica (polyester film) or polyimide film sintered line, or the outside of Transposed wind (sintering) layer wrapped mica tape again, what have also wants the again structure of dipping lacquer of wrapped glass fiber on above insulating barrier.Wherein mica tape or the polyimide film used of lapping electromagnetic wire all used a large amount of organic solvents, and consumed a large amount of electric power, causes waste, improved the production cost of electromagnetic wire, simultaneously also severe contamination environment.On the other hand, enamelled wire inevitably has pin hole, and mica lapped wire and Transposed wind sintering line all have seam crossing, and these all are the weak link of electricity undoubtedly on electrical property.Be the high-pressure trend that adapts to high-rating generator, the frequency conversion of variable working condition high-tension motor, track traffic high speed and heavy loading require electromagnetic wire that higher reliability and long useful life are arranged.
How solving the pollution in the electromagnetic wire production process, the problem of high energy consumption, improve simultaneously the performance of electromagnetic wire, is the technical barrier of this area.
Summary of the invention
The technical problem to be solved in the present invention provides the manufacture method that a kind of production cost is lower, be suitable for the higher H level of energy-saving and emission-reduction, environmental contamination reduction and properties of product, 200 grades of electromagnetic wires.
In order to solve the problems of the technologies described above, the manufacture method of single-side reinforced H level provided by the invention, 200 grades of electromagnetic wires comprises: will add through the nano material of surface activation process that to obtain insulating resin after stirring in the polyimide resin for subsequent use; Wherein, the quality of nano material is the 12-25% of polyimide resin, and nano material is mixed by the silicon dioxide of 35～40wt%, the alundum (Al2O3) of 15～20wt% and the aluminium nitride of 50～40wt%; Described insulating resin is sent into the extruder hopper, and extruder makes insulating resin be the high temperature viscous state, and extrudes from the die sleeve mouth of extruder continuously; Simultaneously, with bare copper wire through alignment, be preheated to after 100-120 ℃ through the shaping mould of cross-head, the insulating resin of being extruded by described die sleeve mouth is extruded on the bare copper wire; Be coated with the bare copper wire of insulating resin after cooling, namely obtain H level, 200 grades of electromagnetic wires.
Described extruder is heated to 260～300 ℃, 350～360 ℃ and 360～365 ℃ successively to described insulating resin segmentation, so that insulating resin is the high temperature viscous state, and press to continuously head, arrive the annular gap that the material of head flows through between core rod and die sleeve and extrude from the die sleeve mouth, bare copper wire be extruded in through head with when being installed in shaping mould in the head bare copper wire around.
During cooling, adopt successively the room temperature water of the warm water, 15-30 ℃ of 80-90 ℃ hot water, 50-60 ℃ to cool off successively 0.5-1 minute, to form continuously closely knit insulating barrier, prevent that unexpected cooling from may make the situation of insulating resin Local Cracking.
Nano material is pellet, this pellet is no less than 6 hour processing to 90～95 ℃ by vacuumize through heating, with with the moisture in the pellet, volatile matter and relevant low molecule content baking to the greatest extent, make not to be prone to bubble on the final insulating resin, can guarantee that product has higher electrical property and reliability.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) manufacture method of H level of the present invention, 200 grades of electromagnetic wires, the high temperature resistant polyimide resin of the nano materials such as the silicon dioxide of employing adding process surface activation process, alundum (Al2O3), aluminium nitride is insulating resin, produces H level, 200 grades of electromagnetic wires by the technique with extrusion modling.The electromagnetic wire of making has like this been eliminated the gap of pin hole and the lapped wire seam crossing of enamelled wire, has improved electrical insulation properties; In its insulation, added simultaneously the inorganic nano material with high corona resistance, high-termal conductivity: silicon dioxide, alundum (Al2O3) and aluminium nitride, the proportioning of these three kinds of inorganic nano materials, be suitable for improving the thermal endurance of insulating barrier, and make the electromagnetic wire of producing reach H level, 200 class F insulations; Conductive coefficient reaches 0.60W/Mk.Thickness of insulating layer can be by regulating in 0.15～1.4mm (two-sided thickness) scope.
(2) process of the present invention need not organic solvent, has stopped the discharging of organic solvent, has eliminated the pollution to environment; Compare insulating barrier with enamelled wire and need not repeatedly to paint, repeatedly cure and hot setting, compare the operation of having saved thin film fabrication with film wrapped wire, heater power only has several kilowatts, and economize on electricity is more than at least 200 kilowatts.So the product quality that process of the present invention is produced is higher, production process is pollution-free, zero discharge, production efficiency are higher, can be significantly energy-conservation.Process of the present invention is applicable to make circle and rectangular electromagnetic wire with other insulating resins with thermoplastic characteristics.
(3) preheat temperature of described bare copper wire is 100-120 ℃, and this temperature is suitable for avoiding the generation Quick Oxidation of bare copper wire, can dry by the fire again moisture content and volatile impurity on the bare copper wire, guarantees the electrical property of electromagnetic wire.In addition, dwindle the temperature difference of bare copper wire and the insulating resin extruded, there is larger contraction in the insulating resin that can avoid extruding when being extruded on the bare copper wire and affects electrical property.
Description of drawings
For content of the present invention is more likely to be clearly understood, below specific embodiment and the combination of basis
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the production line of H level of the present invention, 200 grades of electromagnetic wires.
Reference numeral: 1--actinobacillus device, 2--regulating wheel, 3--preheater, 4--extruder, 5--automatic feeding device, 6--bosh, 7--meter counter, 8--draw-gear, 9--winding and arranging device, 10--control cubicle.
Embodiment
The H level of present embodiment, the production method of 200 grades of electromagnetic wires comprise: pellet through nano materials such as the silicon dioxide of activation processing, alundum (Al2O3), aluminium nitride, is made in the surface; This pellet is no less than processing in 6 hours through (90～95 ℃) vacuumize of heating, to remove volatile matter and the moisture in the pellet.
Pellet comprises: the aluminium nitride of the silicon dioxide of 37wt%, the alundum (Al2O3) of 17wt% and 46wt%; This pellet added to obtain insulating resin after polyimide resin stirs for subsequent use.
Described insulating resin is put into the extruder hopper, start extruder; Described extruder is heated to 260～300 ℃, 350～360 ℃ and 360～365 ℃ successively to described insulating resin segmentation.This moment, pellet was the high temperature viscous state, and was pressed against head; Extrude from the die sleeve mouth annular gap that the material of arrival head is flowed through between core rod and die sleeve, make the bare copper wire that is preheated to 110 ℃ pass cross-head and the shaping mould that is installed in the head, the insulating resin that is melt into viscous state is expressed on the bare copper wire that is extruded in circle or rectangle on the bare copper wire, then adopt successively 85 ℃ hot water, 55 ℃ warm water, 20 ℃ room temperature water to cool off successively 40 seconds, to form the continuous closely knit insulating barrier that is close to bare copper wire of even thickness, the most then rolling is to take-up reel.
Obviously, above-described embodiment only is for example of the present invention clearly is described, and is not to be restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give all execution modes exhaustive.And these belong to apparent variation or the change that spirit of the present invention extended out and still are among protection scope of the present invention.
Claims (3)
1. the manufacture method of a H level, 200 grades of electromagnetic wires comprises:
It is for subsequent use to obtain insulating resin after will stirring through the nano material adding polyimide resin of surface activation process; Wherein, the quality of nano material is the 12-25% of polyimide resin, and nano material is mixed by the silicon dioxide of 35～40wt%, the alundum (Al2O3) of 15～20 wt % and the aluminium nitride of 50～40 wt %;
Described insulating resin is sent into the extruder hopper, and extruder makes insulating resin be the high temperature viscous state, and extrudes from the die sleeve mouth of extruder continuously;
Simultaneously, with bare copper wire through alignment, be preheated to after 100-120 ℃ through the shaping mould of cross-head, the insulating resin of being extruded by described die sleeve mouth is extruded on the bare copper wire;
Be coated with the bare copper wire of insulating resin after cooling, namely obtain H level, 200 grades of electromagnetic wires;
Nano material is pellet, and this pellet is no less than 6 hour processing to 90～95 ℃ by vacuumize through heating.
2. the manufacture method of H level according to claim 1,200 grades of electromagnetic wires, it is characterized in that: described extruder is heated to 260～300 ℃, 350～360 ℃ and 360～365 ℃ successively to described insulating resin segmentation.
3. according to the manufacture method of claims 2 described H levels, 200 grades of electromagnetic wires, it is characterized in that: when the described bare copper wire that is coated with insulating resin of cooling, adopt successively the room temperature water of the warm water, 15-30 ℃ of 80-90 ℃ hot water, 50-60 ℃ to cool off successively 0.5-1 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110412025 CN102412027B (en) | 2011-12-12 | 2011-12-12 | Manufacturing method of H-level and 200-level electromagnetic wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110412025 CN102412027B (en) | 2011-12-12 | 2011-12-12 | Manufacturing method of H-level and 200-level electromagnetic wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102412027A CN102412027A (en) | 2012-04-11 |
| CN102412027B true CN102412027B (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110412025 Expired - Fee Related CN102412027B (en) | 2011-12-12 | 2011-12-12 | Manufacturing method of H-level and 200-level electromagnetic wire |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102982902B (en) * | 2012-11-22 | 2015-10-07 | 安徽天星光纤通信设备有限公司 | A kind of production method of tandem wire |
| CN112102991A (en) * | 2020-08-14 | 2020-12-18 | 广西昌用电线电缆有限公司 | Corona-resistant cable and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100350003C (en) * | 2005-01-21 | 2007-11-21 | 桂林工学院 | Polyimide/inorganic nano-composite insulating varnish and its preparation method |
| CN102108263A (en) * | 2009-12-24 | 2011-06-29 | 天津鑫安天亿电子科技有限公司 | Insulating adhesive material with high thermal conductivity |
| CN101789654B (en) * | 2010-02-26 | 2012-12-26 | 株洲敏锐轨道电气有限责任公司 | Insulating method and device of oil pump motor stator of electric locomotive transformer powered up by frequency converter |
| CN101831175A (en) * | 2010-04-01 | 2010-09-15 | 辽宁科技大学 | Colorless and transparent polyimide nano-composite material membrane and preparation method thereof |
| CN101824268B (en) * | 2010-05-07 | 2013-04-17 | 八达电工集团有限公司 | Production method of nano composite modified insulating paint for enameled wire and high-performance nano composite enameled wire |
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| CN102412027A (en) | 2012-04-11 |
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Address after: 225402 Chengdong Industrial Zone, Taixing Economic Development Zone, Taizhou, Jiangsu Patentee after: JIANGSU ICE-CITY INSULATION MATERIALS STOCK CO.,LTD. Address before: 212323 Zhenjiang City, Jiangsu province Danyang City Jiepai Town Street No. 9 Patentee before: JIANGSU ICE-CITY INSULATION MATERIALS STOCK CO.,LTD. |
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Effective date of registration: 20161027 Address after: 212300 Zhenjiang City, Jiangsu province Danyang City Qingfeng road Yunyang Street South Patentee after: JIANGSU BINGCHENG HYDROGEN ENERGY TECHNOLOGY CO.,LTD. Address before: 225402 Chengdong Industrial Zone, Taixing Economic Development Zone, Taizhou, Jiangsu Patentee before: JIANGSU ICE-CITY INSULATION MATERIALS STOCK CO.,LTD. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 |