CN101983249B - 电子材料用Cu-Ni-Si-Co-Cr系合金 - Google Patents

电子材料用Cu-Ni-Si-Co-Cr系合金 Download PDF

Info

Publication number: CN101983249B
Authority: CN; China
Prior art keywords: mass; alloy; compound; strength; electrical conductivity
Prior art date: 2008-03-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN2009801119161A

Other languages

English (en)

Chinese (zh)

Other versions

CN101983249A (zh

Inventor

江良尚彦

桑垣宽

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

JX Nippon Mining and Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-03-31

Filing date

2009-03-30

Publication date

2012-10-03

2009-03-30 Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp

2011-03-02 Publication of CN101983249A publication Critical patent/CN101983249A/zh

2012-10-03 Application granted granted Critical

2012-10-03 Publication of CN101983249B publication Critical patent/CN101983249B/zh

Status Active legal-status Critical Current

2029-03-30 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)

CN2009801119161A 2008-03-31 2009-03-30 电子材料用Cu-Ni-Si-Co-Cr系合金 Active CN101983249B (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2008093780A JP4440313B2 (ja)	2008-03-31	2008-03-31	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金
JP2008-093780		2008-03-31
PCT/JP2009/056537 WO2009123137A1 (ja)	2008-03-31	2009-03-30	電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ－Ｃｒ系合金

Publications (2)

Publication Number	Publication Date
CN101983249A CN101983249A (zh)	2011-03-02
CN101983249B true CN101983249B (zh)	2012-10-03

Family

ID=41135511

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN2009801119161A Active CN101983249B (zh)	2008-03-31	2009-03-30	电子材料用Cu-Ni-Si-Co-Cr系合金

Country Status (7)

Country	Link
US (1)	US20110027122A1 (ja)
JP (1)	JP4440313B2 (ja)
KR (1)	KR101297485B1 (ja)
CN (1)	CN101983249B (ja)
DE (1)	DE112009000731B4 (ja)
TW (1)	TWI382097B (ja)
WO (1)	WO2009123137A1 (ja)

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JP4677505B1 (ja)	2010-03-31	2011-04-27	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5281031B2 (ja) *	2010-03-31	2013-09-04	Ｊｘ日鉱日石金属株式会社	曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
US8821655B1 (en)	2010-12-02	2014-09-02	Fisk Alloy Inc.	High strength, high conductivity copper alloys and electrical conductors made therefrom
JP5441876B2 (ja)	2010-12-13	2014-03-12	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
WO2012081571A1 (ja)	2010-12-13	2012-06-21	日本精線株式会社	銅合金線及び銅合金ばね
EP2653574B1 (en)	2010-12-13	2017-05-31	Nippon Seisen Co., Ltd.	Copper alloy and method for producing copper alloy
JP5451674B2 (ja)	2011-03-28	2014-03-26	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja)	2011-03-29	2011-10-26	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
US9395869B2 (en) *	2012-02-02	2016-07-19	Apple Inc.	Global z-order for windows
JP5802150B2 (ja) *	2012-02-24	2015-10-28	株式会社神戸製鋼所	銅合金
JP6039999B2 (ja) *	2012-10-31	2016-12-07	Ｄｏｗａメタルテック株式会社	Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
JP6730784B2 (ja) *	2015-03-19	2020-07-29	Ｊｘ金属株式会社	電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
CN105821238B (zh) *	2016-05-31	2018-01-02	黄河科技学院	一种铜合金材料及其制备方法
CN106399751A (zh) *	2016-10-13	2017-02-15	龙岩学院	一种高强高导铜合金的制备方法
CN107267806A (zh) *	2017-06-06	2017-10-20	深圳天珑无线科技有限公司	弹片及其制备方法、电子装置
JP7648724B1 (ja)	2023-12-07	2025-03-18	Ｊｘ金属株式会社	銅合金及び電子部品

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US4191601A (en) *	1979-02-12	1980-03-04	Ampco-Pittsburgh Corporation	Copper-nickel-silicon-chromium alloy having improved electrical conductivity
US4657601A (en) *	1983-11-10	1987-04-14	Brush Wellman Inc.	Thermomechanical processing of beryllium-copper alloys
JPH0238653B2 (ja) *	1986-01-27	1990-08-31	Kobe Steel Ltd	Purasuchitsukukanagatayodogokinoyobisonoseizohoho
JPH04180531A (ja) *	1990-11-14	1992-06-26	Nikko Kyodo Co Ltd	通電材料
US6506269B2 (en) *	1999-01-15	2003-01-14	Industrial Technology Research Institute	High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
WO2003076672A1 (fr) *	2002-03-12	2003-09-18	The Furukawa Electric Co., Ltd.	Fil en alliage de cuivre extremement conducteur et resistant a la relaxation a l'effort
JP4177221B2 (ja)	2003-10-06	2008-11-05	古河電気工業株式会社	電子機器用銅合金
US8317948B2 (en) *	2005-03-24	2012-11-27	Jx Nippon Mining & Metals Corporation	Copper alloy for electronic materials
JP4068626B2 (ja) *	2005-03-31	2008-03-26	日鉱金属株式会社	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2006284120A (ja)	2005-04-01	2006-10-19	Mitsubishi Electric Corp	飛しょう体誘導装置
JP4754930B2 (ja) *	2005-10-14	2011-08-24	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP2007169765A (ja) *	2005-12-26	2007-07-05	Furukawa Electric Co Ltd:The	銅合金とその製造方法
JP4006467B1 (ja) *	2006-09-22	2007-11-14	株式会社神戸製鋼所	高強度、高導電率および曲げ加工性に優れた銅合金
EP2426225B1 (en) *	2006-05-26	2015-12-02	Kabushiki Kaisha Kobe Seiko Sho	Copper alloy with high strength, high electrical conductivity, and excellent bendability

2008
- 2008-03-31 JP JP2008093780A patent/JP4440313B2/ja active Active
2009
- 2009-03-30 CN CN2009801119161A patent/CN101983249B/zh active Active
- 2009-03-30 US US12/935,688 patent/US20110027122A1/en not_active Abandoned
- 2009-03-30 DE DE112009000731.7T patent/DE112009000731B4/de active Active
- 2009-03-30 KR KR1020107021569A patent/KR101297485B1/ko active Active
- 2009-03-30 WO PCT/JP2009/056537 patent/WO2009123137A1/ja active Application Filing
- 2009-03-31 TW TW098110574A patent/TWI382097B/zh active

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP昭59-215272A 1984.12.05
JP特开2006-283120A 2006.10.19
JP特开2007-107062A 2007.04.26

Also Published As

Publication number	Publication date
KR101297485B1 (ko)	2013-08-16
DE112009000731T5 (de)	2011-05-26
KR20100113644A (ko)	2010-10-21
TW200946697A (en)	2009-11-16
DE112009000731B4 (de)	2018-02-08
WO2009123137A1 (ja)	2009-10-08
US20110027122A1 (en)	2011-02-03
TWI382097B (zh)	2013-01-11
JP2009242921A (ja)	2009-10-22
CN101983249A (zh)	2011-03-02
JP4440313B2 (ja)	2010-03-24

Publication	Publication Date	Title
CN101983249B (zh)	2012-10-03	电子材料用Cu-Ni-Si-Co-Cr系合金
JP4418028B2 (ja)	2010-02-17	電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
JP5319700B2 (ja)	2013-10-16	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4937815B2 (ja)	2012-05-23	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
TWI381398B (zh)	2013-01-01	Cu-Ni-Si alloy for electronic materials
JP4247922B2 (ja)	2009-04-02	電気・電子機器用銅合金板材およびその製造方法
JP3699701B2 (ja)	2005-09-28	易加工高力高導電性銅合金
JP5261500B2 (ja)	2013-08-14	導電性と曲げ性を改善したＣｕ−Ｎｉ−Ｓｉ−Ｍｇ系合金
CN101270423B (zh)	2010-10-06	电子材料用Cu-Ni-Si系铜合金
TW200948990A (en)	2009-12-01	Cu-ni-si alloy to be used in electrically conductive spring material
JPWO2009041197A1 (ja)	2011-01-20	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
EP2270242B1 (en)	2014-06-04	Copper alloy material for electric or electronic apparatuses, method for producing it and component
JP2008081762A (ja)	2008-04-10	電子材料用Ｃｕ−Ｃｒ系銅合金
JPWO2002053790A1 (ja)	2004-05-13	曲げ加工性に優れた高強度銅合金及びその製造方法及びそれを用いた端子・コネクタ
JP2002180161A (ja)	2002-06-26	高強度銅合金
CN1329541C (zh)	2007-08-01	高强度高导电性铜合金
JP6222885B2 (ja)	2017-11-01	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP2016183418A (ja)	2016-10-20	電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
TW201714185A (zh)	2017-04-16	電子零件用Ｃｕ－Ｃｏ－Ｎｉ－Ｓｉ合金
JP2012012630A (ja)	2012-01-19	電子材料用銅合金の製造方法
WO2020152967A1 (ja)	2020-07-30	銅合金板材およびその製造方法
EP2267173A1 (en)	2010-12-29	Copper alloy material for electric and electronic apparatuses, and electric and electronic components

Legal Events

Date	Code	Title	Description
2011-03-02	C06	Publication
2011-03-02	PB01	Publication
2011-04-13	C10	Entry into substantive examination
2011-04-13	SE01	Entry into force of request for substantive examination
2012-10-03	C14	Grant of patent or utility model
2012-10-03	GR01	Patent grant
2017-04-19	CP01	Change in the name or title of a patent holder
2017-04-19	CP01	Change in the name or title of a patent holder	Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd.
2017-05-17	CP01	Change in the name or title of a patent holder
2017-05-17	CP01	Change in the name or title of a patent holder	Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION
2021-04-09	CP02	Change in the address of a patent holder
2021-04-09	CP02	Change in the address of a patent holder	Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd.