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BR0207724A - Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo - Google Patents

Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Info

Publication number
BR0207724A
BR0207724A BR0207724-8A BR0207724A BR0207724A BR 0207724 A BR0207724 A BR 0207724A BR 0207724 A BR0207724 A BR 0207724A BR 0207724 A BR0207724 A BR 0207724A
Authority
BR
Brazil
Prior art keywords
gold
bath
bismuth
alloys
compound
Prior art date
Application number
BR0207724-8A
Other languages
English (en)
Inventor
Susane Ruebel
Manfred Stuemke
Original Assignee
Wieland Dental & Technik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2001110743 external-priority patent/DE10110743A1/de
Application filed by Wieland Dental & Technik Gmbh filed Critical Wieland Dental & Technik Gmbh
Publication of BR0207724A publication Critical patent/BR0207724A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Dental Preparations (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

"BANHO PARA A ELETRODEPOSIçãO DE OURO E LIGAS DE OURO E O USO DO MESMO". A invenção refere-se a um banho para a eletrodeposição de ouro e ligas de ouro e ao seu uso para a produção de modelagens dentais. Neste banho, o ouro está na forma de um complexo de sulfito de ouro. O banho de acordo com a invenção e/ou o uso de acordo com a invenção é distinguido pelo fato de que, além da presença opcional de outros metais e aditivos usuais para os banhos de sulfito de ouro deste tipo, há pelo menos um composto de bismuto. Este composto de bismuto é, de preferência, um composto de complexo, em particular com os agentes formadores de complexos NTA, HEDTA, TEPA, DTPA, EDNTA e EDTA. A invenção tem uma faixa ampla de vantagens associadas a essa. Uma vantagem que deve ser particularmente enfatizada é que a adição de bismuto pode ser feita ao banho tão cedo como durante a sua preparação. Isso significa que o usuário é provido com um banho, que é capaz de funcionar por um período de tempo prolongado e ao qual não é imperativo adicionar outros aditivos, antes da eletrodeposição.
BR0207724-8A 2001-02-28 2002-02-28 Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo BR0207724A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2001110743 DE10110743A1 (de) 2001-02-28 2001-02-28 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
EP01108448A EP1236814A1 (de) 2001-02-28 2001-04-04 Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
PCT/EP2002/002128 WO2002068728A1 (de) 2001-02-28 2002-02-28 Bad zur galvanischen abscheidung von gold und goldlegierungen sowie dessen verwendung

Publications (1)

Publication Number Publication Date
BR0207724A true BR0207724A (pt) 2004-03-23

Family

ID=26008695

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0207724-8A BR0207724A (pt) 2001-02-28 2002-02-28 Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Country Status (8)

Country Link
US (1) US20040065225A1 (pt)
EP (1) EP1366219B1 (pt)
JP (1) JP4183240B2 (pt)
CN (1) CN100392155C (pt)
AU (1) AU2002308221A1 (pt)
BR (1) BR0207724A (pt)
CA (1) CA2438207A1 (pt)
WO (1) WO2002068728A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378590A1 (fr) * 2002-07-04 2004-01-07 Metalor Technologies International S.A. Bain pour dépôts electrolytiques d'or
CA2558475A1 (en) * 2004-02-18 2005-09-01 Marianna Cooley Antimicrobial formulations and methods of using the same
CN1308493C (zh) * 2004-07-27 2007-04-04 滕先弟 硫代硫酸金铵络合物及其制备方法
JP5442400B2 (ja) * 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
CN101781758B (zh) * 2010-04-09 2011-12-07 厦门华弘昌科技有限公司 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺
US11579344B2 (en) 2012-09-17 2023-02-14 Government Of The United States Of America, As Represented By The Secretary Of Commerce Metallic grating
US10889908B2 (en) * 2012-09-17 2021-01-12 Government Of The United States Of America, As Represented By The Secretary Of Commerce Superconformal filling composition and superconformally filling a recessed feature of an article
ITFI20120208A1 (it) * 2012-10-12 2014-04-13 Bluclad S R L Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante.
ITFI20130057A1 (it) * 2013-03-18 2014-09-19 Bluclad S R L Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103938232B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海新技术有限公司 一种无氰电镀液及其应用
CN103938231B (zh) * 2014-03-04 2015-04-01 深圳市联合蓝海科技开发有限公司 一种电镀黄金的方法和硬质黄金的制备方法
CN104047037B (zh) * 2014-06-16 2015-06-03 深圳市联合蓝海科技开发有限公司 一种硬化剂
CN104862752B (zh) * 2015-06-12 2016-02-17 深圳市联合蓝海投资控股集团有限公司 改性无氰镀金液及其应用和硬质黄金的制备方法
WO2023041972A1 (en) * 2021-09-16 2023-03-23 Galvasols P & S High-speed pure gold electroforming/electroplating bath
JP7219847B1 (ja) * 2022-09-26 2023-02-08 Ｅｅｊａ株式会社 金電気めっき液および金電気めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754151A (fr) * 1969-08-08 1970-12-31 Sel Rex Corp Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH622829A5 (pt) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JP2592246B2 (ja) * 1987-04-10 1997-03-19 株式会社ジーシー 歯冠修復用複合冠の内側冠の作製方法及び装置
DE3805627A1 (de) * 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
DE19845506A1 (de) * 1998-10-02 2000-04-06 Wieland Edelmetalle Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil

Also Published As

Publication number Publication date
EP1366219B1 (de) 2014-09-03
CA2438207A1 (en) 2002-09-06
US20040065225A1 (en) 2004-04-08
JP4183240B2 (ja) 2008-11-19
CN1494606A (zh) 2004-05-05
WO2002068728A8 (de) 2003-09-18
EP1366219A2 (de) 2003-12-03
WO2002068728A1 (de) 2002-09-06
AU2002308221A1 (en) 2002-09-12
JP2004527653A (ja) 2004-09-09
CN100392155C (zh) 2008-06-04

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]