CN100392155C - 用于电沉积金和金合金的镀液及其应用 - Google Patents
用于电沉积金和金合金的镀液及其应用 Download PDFInfo
- Publication number
- CN100392155C CN100392155C CNB028056736A CN02805673A CN100392155C CN 100392155 C CN100392155 C CN 100392155C CN B028056736 A CNB028056736 A CN B028056736A CN 02805673 A CN02805673 A CN 02805673A CN 100392155 C CN100392155 C CN 100392155C
- Authority
- CN
- China
- Prior art keywords
- plating bath
- compound
- gold
- bismuth
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010931 gold Substances 0.000 title claims abstract description 49
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 35
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 34
- 230000008021 deposition Effects 0.000 title claims abstract description 27
- 239000003353 gold alloy Substances 0.000 title claims abstract description 10
- 239000000654 additive Substances 0.000 claims abstract description 54
- 150000001622 bismuth compounds Chemical class 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 150000001875 compounds Chemical class 0.000 claims abstract description 27
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 5
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims abstract description 5
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims abstract description 4
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 189
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- JCDVTZPJEWWGHU-UHFFFAOYSA-N gold sulfurous acid Chemical compound [Au].S(O)(O)=O JCDVTZPJEWWGHU-UHFFFAOYSA-N 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 229920002994 synthetic fiber Polymers 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 claims description 10
- 150000001463 antimony compounds Chemical class 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- GKSYFVIEBZCLEQ-UHFFFAOYSA-N OS(O)=O.N.[Au+3] Chemical group OS(O)=O.N.[Au+3] GKSYFVIEBZCLEQ-UHFFFAOYSA-N 0.000 claims description 7
- 239000010970 precious metal Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 150000001495 arsenic compounds Chemical group 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims description 2
- 150000003476 thallium compounds Chemical class 0.000 claims description 2
- 239000005749 Copper compound Substances 0.000 claims 2
- 150000001880 copper compounds Chemical class 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 abstract description 21
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract description 20
- 230000008901 benefit Effects 0.000 abstract description 10
- 150000002739 metals Chemical class 0.000 abstract description 3
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical class [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract 2
- 239000008139 complexing agent Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 description 43
- 238000000151 deposition Methods 0.000 description 24
- 239000000203 mixture Substances 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- -1 metals compound Chemical class 0.000 description 13
- 229910052787 antimony Inorganic materials 0.000 description 11
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 11
- 238000009713 electroplating Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 6
- 230000009918 complex formation Effects 0.000 description 6
- 229910052602 gypsum Inorganic materials 0.000 description 6
- 239000010440 gypsum Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052785 arsenic Inorganic materials 0.000 description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052716 thallium Inorganic materials 0.000 description 4
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- SZXAQBAUDGBVLT-UHFFFAOYSA-H antimony(3+);2,3-dihydroxybutanedioate Chemical compound [Sb+3].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SZXAQBAUDGBVLT-UHFFFAOYSA-H 0.000 description 3
- RDQSSKKUSGYZQB-UHFFFAOYSA-N bismuthanylidyneiron Chemical compound [Fe].[Bi] RDQSSKKUSGYZQB-UHFFFAOYSA-N 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 3
- 150000002828 nitro derivatives Chemical class 0.000 description 3
- 230000035479 physiological effects, processes and functions Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 2
- 150000001621 bismuth Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229960001484 edetic acid Drugs 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- HTUCIKZVQXLMEZ-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;bismuth Chemical compound [Bi].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O HTUCIKZVQXLMEZ-UHFFFAOYSA-N 0.000 description 1
- LMSDCGXQALIMLM-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;iron Chemical compound [Fe].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O LMSDCGXQALIMLM-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 241000403354 Microplus Species 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- AVCQBEJQAWLZDA-UHFFFAOYSA-N [Au].[Na].S(O)(O)=O Chemical class [Au].[Na].S(O)(O)=O AVCQBEJQAWLZDA-UHFFFAOYSA-N 0.000 description 1
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 description 1
- NCCQHYICMZBROO-UHFFFAOYSA-N [Fe].[Cu].[Bi] Chemical compound [Fe].[Cu].[Bi] NCCQHYICMZBROO-UHFFFAOYSA-N 0.000 description 1
- JTPLPDIKCDKODU-UHFFFAOYSA-N acetic acid;2-(2-aminoethylamino)ethanol Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.NCCNCCO JTPLPDIKCDKODU-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000002052 anaphylactic effect Effects 0.000 description 1
- 229940026189 antimony potassium tartrate Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003788 bath preparation Substances 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000003564 dental alloy Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical class [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 231100000171 higher toxicity Toxicity 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000004698 iron complex Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 150000003475 thallium Chemical class 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Dental Preparations (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10110743.9 | 2001-02-28 | ||
| DE2001110743 DE10110743A1 (de) | 2001-02-28 | 2001-02-28 | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
| EP01108448.0 | 2001-04-04 | ||
| EP01108448A EP1236814A1 (de) | 2001-02-28 | 2001-04-04 | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1494606A CN1494606A (zh) | 2004-05-05 |
| CN100392155C true CN100392155C (zh) | 2008-06-04 |
Family
ID=26008695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028056736A Expired - Lifetime CN100392155C (zh) | 2001-02-28 | 2002-02-28 | 用于电沉积金和金合金的镀液及其应用 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040065225A1 (pt) |
| EP (1) | EP1366219B1 (pt) |
| JP (1) | JP4183240B2 (pt) |
| CN (1) | CN100392155C (pt) |
| AU (1) | AU2002308221A1 (pt) |
| BR (1) | BR0207724A (pt) |
| CA (1) | CA2438207A1 (pt) |
| WO (1) | WO2002068728A1 (pt) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1378590A1 (fr) * | 2002-07-04 | 2004-01-07 | Metalor Technologies International S.A. | Bain pour dépôts electrolytiques d'or |
| CA2558475A1 (en) * | 2004-02-18 | 2005-09-01 | Marianna Cooley | Antimicrobial formulations and methods of using the same |
| CN1308493C (zh) * | 2004-07-27 | 2007-04-04 | 滕先弟 | 硫代硫酸金铵络合物及其制备方法 |
| JP5442400B2 (ja) * | 2009-11-13 | 2014-03-12 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| CN101781758B (zh) * | 2010-04-09 | 2011-12-07 | 厦门华弘昌科技有限公司 | 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺 |
| US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
| US10889908B2 (en) * | 2012-09-17 | 2021-01-12 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Superconformal filling composition and superconformally filling a recessed feature of an article |
| ITFI20120208A1 (it) * | 2012-10-12 | 2014-04-13 | Bluclad S R L | Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante. |
| ITFI20130057A1 (it) * | 2013-03-18 | 2014-09-19 | Bluclad S R L | Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante. |
| CN103938232B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海新技术有限公司 | 一种无氰电镀液及其应用 |
| CN103938231B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海科技开发有限公司 | 一种电镀黄金的方法和硬质黄金的制备方法 |
| CN104047037B (zh) * | 2014-06-16 | 2015-06-03 | 深圳市联合蓝海科技开发有限公司 | 一种硬化剂 |
| CN104862752B (zh) * | 2015-06-12 | 2016-02-17 | 深圳市联合蓝海投资控股集团有限公司 | 改性无氰镀金液及其应用和硬质黄金的制备方法 |
| US20240271306A1 (en) * | 2021-09-16 | 2024-08-15 | P & S, Galvasols | High-speed pure gold electroforming/electroplating bath |
| JP7219847B1 (ja) * | 2022-09-26 | 2023-02-08 | Ｅｅｊａ株式会社 | 金電気めっき液および金電気めっき方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1325352A (en) * | 1969-08-08 | 1973-08-01 | Sel Rex Corp | Electrodeposition of gold and gold alloys |
| US4820387A (en) * | 1987-04-10 | 1989-04-11 | G-C Dental Industrial Corp. | Method and apparatus for making the inner crowns of composite-layered crowns for restoring crowns |
| DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| WO2000019936A1 (de) * | 1998-10-02 | 2000-04-13 | Wieland Edelmetalle Gmbh & Co. | Verfahren zur herstellung von prothetischen formteilen für den dentalbereich und prothetisches formteil |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH622829A5 (pt) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| DE19629658C2 (de) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
-
2002
- 2002-02-28 EP EP02744906.5A patent/EP1366219B1/de not_active Expired - Lifetime
- 2002-02-28 CA CA002438207A patent/CA2438207A1/en not_active Abandoned
- 2002-02-28 CN CNB028056736A patent/CN100392155C/zh not_active Expired - Lifetime
- 2002-02-28 JP JP2002568818A patent/JP4183240B2/ja not_active Expired - Fee Related
- 2002-02-28 BR BR0207724-8A patent/BR0207724A/pt not_active Application Discontinuation
- 2002-02-28 AU AU2002308221A patent/AU2002308221A1/en not_active Abandoned
- 2002-02-28 US US10/469,146 patent/US20040065225A1/en not_active Abandoned
- 2002-02-28 WO PCT/EP2002/002128 patent/WO2002068728A1/de active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1325352A (en) * | 1969-08-08 | 1973-08-01 | Sel Rex Corp | Electrodeposition of gold and gold alloys |
| US4820387A (en) * | 1987-04-10 | 1989-04-11 | G-C Dental Industrial Corp. | Method and apparatus for making the inner crowns of composite-layered crowns for restoring crowns |
| DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| WO2000019936A1 (de) * | 1998-10-02 | 2000-04-13 | Wieland Edelmetalle Gmbh & Co. | Verfahren zur herstellung von prothetischen formteilen für den dentalbereich und prothetisches formteil |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4183240B2 (ja) | 2008-11-19 |
| CN1494606A (zh) | 2004-05-05 |
| BR0207724A (pt) | 2004-03-23 |
| US20040065225A1 (en) | 2004-04-08 |
| EP1366219A2 (de) | 2003-12-03 |
| WO2002068728A1 (de) | 2002-09-06 |
| WO2002068728A8 (de) | 2003-09-18 |
| JP2004527653A (ja) | 2004-09-09 |
| CA2438207A1 (en) | 2002-09-06 |
| EP1366219B1 (de) | 2014-09-03 |
| AU2002308221A1 (en) | 2002-09-12 |
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