JP4183240B2 - 金および金合金の電着浴とその用法 - Google Patents

金および金合金の電着浴とその用法 Download PDF

Info

Publication number: JP4183240B2
Authority: JP; Japan
Prior art keywords: bath; use according; gold; compound; bismuth
Prior art date: 2001-02-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

JP2002568818A

Other languages

English (en)

Japanese (ja)

Other versions

JP2004527653A (ja

Inventor

レーベルスザンネ

シュテュムケマンフレッド

Original Assignee

ヴィーラントデンタルウントテクニークゲーエムベーハーウントコーカーゲー

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-02-28

Filing date

2002-02-28

Publication date

2008-11-19

2001-02-28 Priority claimed from DE2001110743 external-priority patent/DE10110743A1/de

2002-02-28 Application filed by ヴィーラントデンタルウントテクニークゲーエムベーハーウントコーカーゲー filed Critical ヴィーラントデンタルウントテクニークゲーエムベーハーウントコーカーゲー

2004-09-09 Publication of JP2004527653A publication Critical patent/JP2004527653A/ja

2008-11-19 Application granted granted Critical

2008-11-19 Publication of JP4183240B2 publication Critical patent/JP4183240B2/ja

2022-02-28 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Dental Preparations (AREA)
Electroplating Methods And Accessories (AREA)

JP2002568818A 2001-02-28 2002-02-28 金および金合金の電着浴とその用法 Expired - Fee Related JP4183240B2 (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE2001110743 DE10110743A1 (de)	2001-02-28	2001-02-28	Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
EP01108448A EP1236814A1 (de)	2001-02-28	2001-04-04	Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
PCT/EP2002/002128 WO2002068728A1 (de)	2001-02-28	2002-02-28	Bad zur galvanischen abscheidung von gold und goldlegierungen sowie dessen verwendung

Publications (2)

Publication Number	Publication Date
JP2004527653A JP2004527653A (ja)	2004-09-09
JP4183240B2 true JP4183240B2 (ja)	2008-11-19

Family

ID=26008695

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2002568818A Expired - Fee Related JP4183240B2 (ja)	2001-02-28	2002-02-28	金および金合金の電着浴とその用法

Country Status (8)

Country	Link
US (1)	US20040065225A1 (pt)
EP (1)	EP1366219B1 (pt)
JP (1)	JP4183240B2 (pt)
CN (1)	CN100392155C (pt)
AU (1)	AU2002308221A1 (pt)
BR (1)	BR0207724A (pt)
CA (1)	CA2438207A1 (pt)
WO (1)	WO2002068728A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1378590A1 (fr) *	2002-07-04	2004-01-07	Metalor Technologies International S.A.	Bain pour dépôts electrolytiques d'or
CA2558475A1 (en) *	2004-02-18	2005-09-01	Marianna Cooley	Antimicrobial formulations and methods of using the same
CN1308493C (zh) *	2004-07-27	2007-04-04	滕先弟	硫代硫酸金铵络合物及其制备方法
JP5442400B2 (ja) *	2009-11-13	2014-03-12	ルネサスエレクトロニクス株式会社	半導体集積回路装置の製造方法
CN101781758B (zh) *	2010-04-09	2011-12-07	厦门华弘昌科技有限公司	化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺
US11579344B2 (en)	2012-09-17	2023-02-14	Government Of The United States Of America, As Represented By The Secretary Of Commerce	Metallic grating
US10889908B2 (en) *	2012-09-17	2021-01-12	Government Of The United States Of America, As Represented By The Secretary Of Commerce	Superconformal filling composition and superconformally filling a recessed feature of an article
ITFI20120208A1 (it) *	2012-10-12	2014-04-13	Bluclad S R L	Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante.
ITFI20130057A1 (it) *	2013-03-18	2014-09-19	Bluclad S R L	Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103938232B (zh) *	2014-03-04	2015-04-01	深圳市联合蓝海新技术有限公司	一种无氰电镀液及其应用
CN103938231B (zh) *	2014-03-04	2015-04-01	深圳市联合蓝海科技开发有限公司	一种电镀黄金的方法和硬质黄金的制备方法
CN104047037B (zh) *	2014-06-16	2015-06-03	深圳市联合蓝海科技开发有限公司	一种硬化剂
CN104862752B (zh) *	2015-06-12	2016-02-17	深圳市联合蓝海投资控股集团有限公司	改性无氰镀金液及其应用和硬质黄金的制备方法
US20240271306A1 (en) *	2021-09-16	2024-08-15	P & S, Galvasols	High-speed pure gold electroforming/electroplating bath
JP7219847B1 (ja) *	2022-09-26	2023-02-08	Ｅｅｊａ株式会社	金電気めっき液および金電気めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
BE754151A (fr) *	1969-08-08	1970-12-31	Sel Rex Corp	Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH622829A5 (pt) *	1977-08-29	1981-04-30	Systemes Traitements Surfaces
JP2592246B2 (ja) *	1987-04-10	1997-03-19	株式会社ジーシー	歯冠修復用複合冠の内側冠の作製方法及び装置
DE3805627A1 (de) *	1988-02-24	1989-09-07	Wieland Edelmetalle	Goldbad
US5277790A (en) *	1992-07-10	1994-01-11	Technic Incorporated	Non-cyanide electroplating solution for gold or alloys thereof
DE19629658C2 (de) *	1996-07-23	1999-01-14	Degussa	Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
DE19845506A1 (de) *	1998-10-02	2000-04-06	Wieland Edelmetalle	Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil

2002
- 2002-02-28 EP EP02744906.5A patent/EP1366219B1/de not_active Expired - Lifetime
- 2002-02-28 CA CA002438207A patent/CA2438207A1/en not_active Abandoned
- 2002-02-28 CN CNB028056736A patent/CN100392155C/zh not_active Expired - Lifetime
- 2002-02-28 JP JP2002568818A patent/JP4183240B2/ja not_active Expired - Fee Related
- 2002-02-28 BR BR0207724-8A patent/BR0207724A/pt not_active Application Discontinuation
- 2002-02-28 AU AU2002308221A patent/AU2002308221A1/en not_active Abandoned
- 2002-02-28 US US10/469,146 patent/US20040065225A1/en not_active Abandoned
- 2002-02-28 WO PCT/EP2002/002128 patent/WO2002068728A1/de active Application Filing

Also Published As

Publication number	Publication date
CN100392155C (zh)	2008-06-04
CN1494606A (zh)	2004-05-05
BR0207724A (pt)	2004-03-23
US20040065225A1 (en)	2004-04-08
EP1366219A2 (de)	2003-12-03
WO2002068728A1 (de)	2002-09-06
WO2002068728A8 (de)	2003-09-18
JP2004527653A (ja)	2004-09-09
CA2438207A1 (en)	2002-09-06
EP1366219B1 (de)	2014-09-03
AU2002308221A1 (en)	2002-09-12

Publication	Publication Date	Title
JP4183240B2 (ja)	2008-11-19	金および金合金の電着浴とその用法
JP4832962B2 (ja)	2011-12-07	改善された金合金電解質
JP2859316B2 (ja)	1999-02-17	白金または白金合金の電気めっき浴および電気めっき方法
CN107604393B (zh)	2018-07-13	一种无氰碱铜电镀组合物及其制备方法
US5256275A (en)	1993-10-26	Electroplated gold-copper-silver alloys
JPS6254397B2 (pt)	1987-11-14
US6852207B1 (en)	2005-02-08	Method for producing prosthetic moulded parts for dental use
US3380898A (en)	1968-04-30	Electrolyte and method for electrodepositing a pink gold alloy
JPS63203790A (ja)	1988-08-23	シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴
JPH0270084A (ja)	1990-03-08	金めっき浴及び金めっき方法
JPH0424440B2 (pt)	1992-04-27
JPH0321637B2 (pt)	1991-03-25
DE102005036133C5 (de)	2017-07-13	Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad
Kuhn et al.	1988	The electroforming of gold and its alloys
CA2105814A1 (en)	1995-03-10	Platinum alloy electrodeposition bath and process for manufacturing platinum alloy electrodeposited product using the same
EP1236814A1 (de)	2002-09-04	Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
CA1045577A (en)	1979-01-02	Electrodeposition of bright tin-nickel alloy
EP0384679A1 (en)	1990-08-29	Electrolytic deposition of gold-containing alloys
GB2077763A (en)	1981-12-23	Strongly acidic gold alloy electroplating bath
JPS5824509B2 (ja)	1983-05-21	銀パラジウム合金メツキ液及び銀パラジウム合金メツキ方法
SU1097717A1 (ru)	1984-06-15	Электролит дл осаждени сплава серебро-медь
RU2241410C2 (ru)	2004-12-10	Способ обработки зубных протезов
CA1272160A (en)	1990-07-31	Gold alloy plating bath and process
JPH07166392A (ja)	1995-06-27	金めっき液及び金めっき方法
JPH06264281A (ja)	1994-09-20	パラジウムメッキ液及び該メッキ液を用いたパラジウムメッキ方法

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