AM26LS31, AM26LS31C, AM26LS31M

www.ti.com SLLS114J – JANUARY 1979 – REVISED JANUARY 2014

AM26LS31x Quadruple Differential Line Driver

Check for Samples: AM26LS31, AM26LS31C, AM26LS31M

1FEATURES DESCRIPTION
• Meets or Exceeds the Requirements of ANSI The AM26LS31 device is a quadruple
TIA/EIA-422-B and ITU complementary-output line driver designed to meet
the requirements of ANSI TIA/EIA-422-B and ITU
• Operates From a Single 5-V Supply (formerly CCITT) Recommendation V.11. The 3-state
• TTL Compatible outputs have high-current capability for driving
• Complementary Outputs balanced lines such as twisted-pair or parallel-wire
transmission lines, and they are in the high-
• High Output Impedance in Power-Off impedance state in the power-off condition. The
Conditions enable function is common to all four drivers and
• Complementary Output-Enable Inputs offers the choice of an active-high or active-low
• On Products Compliant to MIL-PRF-38535, enable (G, G) input. Low-power Schottky circuitry
All Parameters Are Tested Unless Otherwise reduces power consumption without sacrificing
speed.
Noted. On All Other Products, Production
Processing Does Not Necessarily Include
Testing of All Parameters.

D, DB, N, NS, J, OR W PACKAGE

(TOP VIEW)

1A 1 16 VCC
1Y 2 15 4A
1Z 3 14 4Y
G 4 13 4Z
2Z 5 12 G
2Y 6 11 3Z
2A 7 10 3Y
GND 8 9 3A

FK PACKAGE
(TOP VIEW)
V CC
NC
1Y
1A

4A

3 2 1 20 19
1Z 4 18 4Y
G 5 17 4Z
NC 6 16 NC
2Z 7 15 G
2Y 8 14 3Z
9 10 11 12 13
GND
NC
2A

3A
3Y

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1979–2014, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
AM26LS31, AM26LS31C, AM26LS31M
SLLS114J – JANUARY 1979 – REVISED JANUARY 2014 www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Function Table (1)

(Each Driver)
INPUT ENABLES OUTPUTS
A G G Y Z
H H X H L
L H X L H
H X L H L
L X L L H
X L H Z Z

(1) H = high level, L = low level,

X = irrelevant,
Z = high impedance (off)

Logic Diagram (Positive Logic)

4
G
12
G
2
1 1Y
1A 3
1Z
6
7 2Y
2A 5
2Z

10
9 3Y
3A 11
3Z

14
15 4Y
4A 13
4Z

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Schematic (Each Driver)

Input A

V
22 kΩ

9Ω
9Ω
Output Z
Output Y

Common to All Four Drivers

VCC

V 22 kΩ
22 kΩ To Three Other Drivers

Enable G

Enable G

GND

All resistor values are nominal.

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Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
(2)
VCC Supply voltage 7 V
VI Input voltage 7 V
Output off-state voltage 5.5 V
D package 73
DB package 82
θJA Package thermal impedance (3) °C/W
N package 67
NS package 64
Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C
Lead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °C
Tstg Storage temperature range –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential output voltage VOD, are with respect to network GND.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.

Recommended Operating Conditions

MIN NOM MAX UNIT
AM26LS31C 4.75 5 5.25
VCC Supply voltage V
AM26LS31M 4.5 5 5.5
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
IOH High-level output current –20 mA
IOL Low-level output current 20 mA
AM26LS31C 0 70
TA Operating free-air temperature °C
AM26LS31M –55 125

Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT
VIK Input clamp voltage VCC = MIN, II = –18 mA –1.5 V
VOH High-level output voltage VCC = MIN, IOH = –20 mA 2.5 V
VOL Low-level output voltage VCC = MIN, IOL = 20 mA 0.5 V
Off-state (high-impedance-state) VO = 0.5 V –20
IOZ VCC = MIN, μA
output current VO = 2.5 V 20
II Input current at maximum input voltage VCC = MAX, VI = 7 V 0.1 mA
IIH High-level input current VCC = MAX, VI = 2.7 V 20 μA
IIL Low-level input current VCC = MAX, VI = 0.4 V –0.36 mA
IOS Short-circuit output current (3) VCC = MAX –30 –150 mA
ICC Supply current VCC = MAX, All outputs disabled 32 80 mA

(1) For C-suffix devices, VCC min = 4.75 V and VCC max = 5.25 V. For M-suffix devices, VCC min = 4.5 V and VCC max = 5.5 V.
(2) All typical values are at VCC = 5 V and TA = 25°C.
(3) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.

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Switching Characteristics
VCC = 5 V (see Figure 1)
TA = 25°C AM26LS31M
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN MAX
Propagation delay time, low- to high-
tPLH 14 20 30
level output
CL = 30 pF, S1 and S2 open ns
Propagation delay time, high- to low-
tPHL 14 20 30
level output
tPZH Output enable time to high level RL = 75 Ω 25 40 60
CL = 30 pF ns
tPZL Output enable time to low level RL = 180 Ω 37 45 68
tPHZ Output disable time from high level 21 30 45
CL = 10 pF, S1 and S2 closed ns
tPLZ Output disable time from low level 23 35 53
tSKEW Output-to-output skew CL = 30 pF, S1 and S2 open 1 6 9 ns

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Parameter Measurement Information

Input A 3V
(see Notes B 1.3 V 1.3 V
and C) 0V
Test Point VCC
tPLH tPHL

180 Ω VOH
S1 Output Y 1.5 V
From Output VOL
Under Test
Skew Skew
CL 75 Ω tPHL tPLH
(see Note A) S2
VOH
Output Z 1.5 V
VOL
PROPAGATION DELAY TIMES AND SKEW TEST CIRCUIT

Enable G 3V
(see Note D) 1.5 V See Note D 1.5 V
Enable G 0V
tPZL tPLZ S1 Closed
≈4.5 V S2 Closed
Waveform 1 S1 Closed 1.5 V ≈1.5 V
(see Note E) S2 Open VOL
0.5 V
tPZH tPHZ
0.5 V
S1 Open VOH
Waveform 2
(see Note E) S2 Closed 1.5 V ≈1.5 V
≈0 V
S1 Closed
S2 Closed
ENABLE AND DISABLE TIME WAVEFORMS

NOTES: A. CL includes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 15 ns, tf ≤ 6 ns.
C. When measuring propagation delay times and skew, switches S1 and S2 are open.
D. Each enable is tested separately.
E. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.

Figure 1. Test Circuit and Voltage Waveforms

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Typical Characteristics
4 4
Load = 470 Ω to GND VCC = 5.25 V VCC = 5 V
TA = 70°C
TA = 25°C Load = 470 Ω to GND
See Note A VCC = 5 V See Note A

3 3 TA = 0°C

VO − Y Output Voltage − V
VO − Y Output Voltage − V

VCC = 4.75 V
TA = 25°C

2 2

1 1

0 0
0 1 2 3 0 1 2 3
VI − Enable G Input Voltage − V VI − Enable G Input Voltage − V
Figure 2. Output Voltage Figure 3. Output Voltage
vs vs
Enable G Input Voltage Enable G Input Voltage

6 6
VCC = 5.25 V

5 5
VCC = 5 V

VCC = 4.75 V

VO − Output Voltage − V
VO − Output Voltage − V

4 4

TA = 70°C
3 3
TA = 25°C
TA = 0°C
2 2

1 Load = 470 Ω to VCC 1 VCC = 5 V

TA = 25°C Load = 470 Ω to VCC
See Note B See Note B
0 0
0 1 2 3 0 1 2 3
VI − Enable G Input Voltage − V VI − Enable G Input Voltage − V
Figure 4. Output Voltage Figure 5. Output Voltage
vs vs
Enable G Input Voltage Enable G Input Voltage

5
VCC = 5 V
See Note A
VOH − High-Level Output Voltage − V

4
IOH = −20 mA

3
IOH = −40 mA

0
0 25 50 75
TA − Free-Air Temperature − °C
Figure 6. High-Level Output Voltage
vs
Free-Air Temperature

A. The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B. The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.

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Typical Characteristics (continued)

4 0.5
VCC = 5 V
VCC = 5.25 V
IOL = 40 mA
VCC = 5 V See Note B
VOH − High-Level Output Voltage − V

0.4

VOL− Low-Level Output Voltage − V

3

0.3
VCC = 4.75 V
2

0.2

1
0.1

TA = 25°C
See Note A
0 0
0 −20 −40 −60 −80 −100 0 25 50 75
IOH − High-Level Output Current − mA TA − Free-Air Temperature − °C
Figure 7. High-Level Output Voltage Figure 8. Low-Level Output Voltage
vs vs
High-Level Output Current Free-Air Temperature

1 5
TA = 25°C No Load
0.9 See Note B TA = 25°C
VOL− Low-Level Output Voltage − V

0.8 4 VCC = 5.25 V

VO − Y Output Voltage − V
VCC = 5 V
0.7
VCC = 4.75 V
0.6 3

0.5 VCC = 4.75 V

0.4 2
VCC = 5.25 V
0.3

0.2 1

0.1

0 0
0 20 40 60 80 100 120 0 1 2 3
IOL − Low-Level Output Current − mA VI − Data Input Voltage − V
Figure 9. Low-Level Output Voltage Figure 10. Y Output Voltage
vs vs
Low-Level Output Current Data Input Voltage

5
No Load

4 TA = 70°C
VO − Y Output Voltage − V

TA = 0°C
3
TA = 25°C

0
0 1 2 3
VI − Data Input Voltage − V
Figure 11. Y Output Voltage
vs
Data Input Voltage

A. The A input is connected to VCC during testing of the Y outputs and to ground during testing of the Z outputs.
B. The A input is connected to ground during testing of the Y outputs and to VCC during testing of the Z outputs.

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REVISION HISTORY

Changes from Revision I (February 2006) to Revision J Page

• Updated document to new TI data sheet format - no specification changes. ...................................................................... 1

• Deleted Ordering Information table. ...................................................................................................................................... 1
• Updated Features. ................................................................................................................................................................ 1
• Added ESD warning. ............................................................................................................................................................ 2

Copyright © 1979–2014, Texas Instruments Incorporated Submit Documentation Feedback 9

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 PACKAGE OPTION ADDENDUM

www.ti.com 10-Jun-2014

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

5962-7802301M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
7802301M2A
AM26LS31
MFKB
5962-7802301MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME
A
AM26LS31MJB
5962-7802301MFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF
A
AM26LS31MWB
5962-7802301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 5962-
7802301Q2A
AM26LS31M
AM26LS31CD ACTIVE SOIC D 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C
& no Sb/Br)
AM26LS31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 SA31C
& no Sb/Br)
AM26LS31CDE4 ACTIVE SOIC D 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CDG4 ACTIVE SOIC D 16 40 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CDR ACTIVE SOIC D 16 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 AM26LS31C
& no Sb/Br)
AM26LS31CN ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN
(RoHS)
AM26LS31CNE4 ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 AM26LS31CN
(RoHS)
AM26LS31CNSR ACTIVE SO NS 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 26LS31
& no Sb/Br)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Jun-2014

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

AM26LS31MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
7802301M2A
AM26LS31
MFKB
AM26LS31MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301ME
A
AM26LS31MJB
AM26LS31MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-7802301MF
A
AM26LS31MWB

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Jun-2014

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF AM26LS31, AM26LS31M :

• Catalog: AM26LS31
• Military: AM26LS31M

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Military - QML certified for Military and Defense Applications

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 21-Jan-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AM26LS31CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 21-Jan-2014

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26LS31CDBR SSOP DB 16 2000 367.0 367.0 38.0
AM26LS31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26LS31CDR SOIC D 16 2500 367.0 367.0 38.0
AM26LS31CDRG4 SOIC D 16 2500 367.0 367.0 38.0
AM26LS31CDRG4 SOIC D 16 2500 333.2 345.9 28.6

Pack Materials-Page 2
 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

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