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ZA200306399B - Refractory metal plates with uniform texture and methods of making the same. - Google Patents

Refractory metal plates with uniform texture and methods of making the same. Download PDF

Info

Publication number
ZA200306399B
ZA200306399B ZA200306399A ZA200306399A ZA200306399B ZA 200306399 B ZA200306399 B ZA 200306399B ZA 200306399 A ZA200306399 A ZA 200306399A ZA 200306399 A ZA200306399 A ZA 200306399A ZA 200306399 B ZA200306399 B ZA 200306399B
Authority
ZA
South Africa
Prior art keywords
refractory metal
billet
plate
metal plate
thickness
Prior art date
Application number
ZA200306399A
Other languages
English (en)
Inventor
Peter R Jepson
Henning Uhlenhut
Prabhat Kumar
Original Assignee
Starck H C Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23029400&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA200306399(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Starck H C Inc filed Critical Starck H C Inc
Publication of ZA200306399B publication Critical patent/ZA200306399B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02—Alloys based on vanadium, niobium, or tantalum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Forging (AREA)
  • Powder Metallurgy (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Aerials With Secondary Devices (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Manufacture And Refinement Of Metals (AREA)
ZA200306399A 2001-02-20 2003-08-18 Refractory metal plates with uniform texture and methods of making the same. ZA200306399B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26998301P 2001-02-20 2001-02-20

Publications (1)

Publication Number Publication Date
ZA200306399B true ZA200306399B (en) 2004-08-18

Family

ID=23029400

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200306399A ZA200306399B (en) 2001-02-20 2003-08-18 Refractory metal plates with uniform texture and methods of making the same.

Country Status (20)

Country Link
US (1) US20020112789A1 (zh)
EP (1) EP1366203B1 (zh)
JP (1) JP4327460B2 (zh)
KR (1) KR100966682B1 (zh)
CN (2) CN1238547C (zh)
AT (1) ATE339532T1 (zh)
AU (1) AU2002257005B2 (zh)
BR (1) BR0207384A (zh)
CA (1) CA2438819A1 (zh)
CZ (1) CZ20032246A3 (zh)
DE (1) DE60214683T2 (zh)
ES (1) ES2272707T3 (zh)
HU (1) HUP0303269A3 (zh)
IL (1) IL157279A0 (zh)
MX (1) MXPA03007490A (zh)
NO (1) NO20033547L (zh)
NZ (1) NZ527628A (zh)
PT (1) PT1366203E (zh)
WO (1) WO2002070765A1 (zh)
ZA (1) ZA200306399B (zh)

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US7228722B2 (en) * 2003-06-09 2007-06-12 Cabot Corporation Method of forming sputtering articles by multidirectional deformation
CN1836307A (zh) * 2003-06-20 2006-09-20 卡伯特公司 溅镀靶安装到垫板上的方法和设计
CN1871372B (zh) * 2003-11-06 2010-11-17 日矿金属株式会社 钽溅射靶
WO2005080961A2 (en) * 2004-02-18 2005-09-01 Cabot Corporation Ultrasonic method for detecting banding in metals
AU2005230927A1 (en) * 2004-03-26 2005-10-20 H.C. Starck Inc. Refractory metal pots
US7666243B2 (en) 2004-10-27 2010-02-23 H.C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
US7998287B2 (en) * 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
CA2606478C (en) 2005-05-05 2013-10-08 H.C. Starck Gmbh Method for coating a substrate surface and coated product
JP4904341B2 (ja) * 2005-05-05 2012-03-28 ハー．ツェー．スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング スパッタターゲット及びｘ線アノードを製造又は再処理するための被覆方法
US20070044873A1 (en) * 2005-08-31 2007-03-01 H. C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
EE05493B1 (et) * 2006-03-07 2011-12-15 Cabot Corporation Meetod l?pliku paksusega metallesemete valmistamiseks, saadud metallplaat ja selle valmistamiseks kasutatav BCC- metall
JP4974362B2 (ja) 2006-04-13 2012-07-11 株式会社アルバック Ｔａスパッタリングターゲットおよびその製造方法
US20080078268A1 (en) * 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US7776166B2 (en) * 2006-12-05 2010-08-17 Praxair Technology, Inc. Texture and grain size controlled hollow cathode magnetron targets and method of manufacture
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8250895B2 (en) * 2007-08-06 2012-08-28 H.C. Starck Inc. Methods and apparatus for controlling texture of plates and sheets by tilt rolling
KR101201577B1 (ko) * 2007-08-06 2012-11-14 에이치. 씨. 스타아크 아이앤씨 향상된 조직 균일성을 가진 내화 금속판
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) * 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
CN101920436B (zh) * 2010-08-20 2011-10-26 宁夏东方钽业股份有限公司 溅射钽环件用钽条的制备工艺
CN102021523A (zh) * 2010-09-29 2011-04-20 吴江南玻华东工程玻璃有限公司 一种解决镀膜玻璃边缘效应的方法
US9120183B2 (en) 2011-09-29 2015-09-01 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets
CN102658346A (zh) * 2012-04-06 2012-09-12 宁夏东方钽业股份有限公司 一种大规格钽靶材的锻造方法
CN102699247B (zh) * 2012-05-18 2014-06-18 宁夏东方钽业股份有限公司 一种超导钽棒的锻造方法
CN103861982B (zh) * 2012-12-18 2016-06-15 宁夏东方钽业股份有限公司 一种铌旋转靶材铸锭的锻造方法
CN104419901B (zh) * 2013-08-27 2017-06-30 宁波江丰电子材料股份有限公司 一种钽靶材的制造方法
KR20160027122A (ko) * 2014-03-27 2016-03-09 제이엑스 킨조쿠 가부시키가이샤 탄탈 스퍼터링 타깃 및 그 제조 방법
JP6573629B2 (ja) 2014-04-11 2019-09-11 ハー ツェー シュタルク インコーポレイテッドＨ．Ｃ． Ｓｔａｒｃｋ， Ｉｎｃ． 高純度耐熱金属粉体、及び無秩序な組織を有し得るスパッタリングターゲットにおけるその使用
US10961613B2 (en) * 2014-12-22 2021-03-30 Agency For Defense Development Method for controlling microstructure and texture of tantalum
EP3260572A4 (en) 2015-05-22 2018-08-01 JX Nippon Mining & Metals Corporation Tantalum sputtering target, and production method therefor
WO2016190160A1 (ja) * 2015-05-22 2016-12-01 Ｊｘ金属株式会社 タンタルスパッタリングターゲット及びその製造方法
CN109154074B (zh) * 2017-03-30 2020-11-24 Ｊｘ金属株式会社 钽溅射靶
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
US20190161850A1 (en) * 2017-11-30 2019-05-30 Tosoh Smd, Inc. Ultra-fine grain size tantalum sputtering targets with improved voltage performance and methods thereby
US12020916B2 (en) 2019-03-26 2024-06-25 JX Metals Corpo tion Niobium sputtering target
CN110983218B (zh) * 2019-12-25 2021-09-03 西部超导材料科技股份有限公司 一种组织均匀的小规格纯铌棒材的制备方法
CN112143990B (zh) * 2020-09-04 2022-01-07 中国航发北京航空材料研究院 一种钛合金β相大尺寸单晶的制备方法
CN116288091A (zh) * 2023-03-28 2023-06-23 南昌大学 一种低温制备超细晶粒钽片的退火工艺
WO2025122801A1 (en) * 2023-12-05 2025-06-12 Tosoh Smd, Inc. Tantalum sputtering target with improved performance and predictability and method of manufacturing

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JP2796752B2 (ja) * 1990-04-27 1998-09-10 日本軽金属株式会社 耐食皮膜用Ａｌ―Ｎｉ―Ｓｉ合金製スパッタリングターゲット
JPH06264233A (ja) * 1993-03-12 1994-09-20 Nikko Kinzoku Kk Ｔｆｔ製造用スパッタリングタ−ゲット
JP2857015B2 (ja) * 1993-04-08 1999-02-10 株式会社ジャパンエナジー 高純度アルミニウムまたはその合金からなるスパッタリングターゲット
US5590389A (en) * 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
US5850755A (en) * 1995-02-08 1998-12-22 Segal; Vladimir M. Method and apparatus for intensive plastic deformation of flat billets
JPH10235670A (ja) * 1997-02-26 1998-09-08 Tosoh Corp ポリオレフィン樹脂連続気泡発泡体の製造方法
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US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
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Also Published As

Publication number Publication date
HK1066833A1 (zh) 2005-04-01
CZ20032246A3 (cs) 2004-03-17
JP4327460B2 (ja) 2009-09-09
HUP0303269A2 (hu) 2004-01-28
ATE339532T1 (de) 2006-10-15
WO2002070765A1 (en) 2002-09-12
IL157279A0 (en) 2004-02-19
ES2272707T3 (es) 2007-05-01
HUP0303269A3 (en) 2004-05-28
NZ527628A (en) 2004-07-30
CN1789476A (zh) 2006-06-21
MXPA03007490A (es) 2004-09-06
AU2002257005B2 (en) 2007-05-31
DE60214683D1 (de) 2006-10-26
KR100966682B1 (ko) 2010-06-29
BR0207384A (pt) 2004-02-10
CA2438819A1 (en) 2002-09-12
DE60214683T2 (de) 2007-09-13
KR20030090645A (ko) 2003-11-28
CN1238547C (zh) 2006-01-25
PT1366203E (pt) 2006-12-29
EP1366203B1 (en) 2006-09-13
JP2004526863A (ja) 2004-09-02
EP1366203A4 (en) 2004-07-28
CN1535322A (zh) 2004-10-06
EP1366203A1 (en) 2003-12-03
NO20033547L (no) 2003-09-26
NO20033547D0 (no) 2003-08-11
US20020112789A1 (en) 2002-08-22

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