WO2024234693A1 - Heat dissipation assembly, elevator control cabinet, and elevator - Google Patents

Abstract

A heat dissipation assembly, an elevator control cabinet, and an elevator. The heat dissipation assembly comprises a heat dissipation plate, a fin group, and heat transfer members; the heat dissipation plate is provided with a bearing surface and a heat dissipation surface arranged opposite to the bearing surface, the bearing surface is used for bearing a heating device, and the heat dissipation surface and the bearing surface are arranged in a first direction; the fin group comprises a plurality of fins arranged at intervals in a second direction, the plurality of fins are in contact with the heat dissipation surface, and a heat dissipation duct is formed between every two adjacent fins; the heat transfer members are each provided with a heat absorption part and a heat release part connected to the heat absorption part, the heat absorption parts extend in the second direction and are inserted into the plurality of fins, and the heat absorption parts are in contact with the heat dissipation surface; the heat release parts are located on the side of the heat absorption parts distant from the heat dissipation plate, the heat release parts extend in the second direction and are inserted into the plurality of fins, and heat transfer is carried out between the heat release parts and the heat dissipation plate by means of the heat absorption parts.

Description

Heat dissipation component, elevator control cabinet, and elevator

Cross-references to related publications

This application claims priority to Chinese patent publication number "202310548944.1" entitled "A heat dissipation component and elevator control cabinet" filed by Lingwang Elevator Co., Ltd. and Guangdong Midea HVAC Equipment Co., Ltd. on May 15, 2023.

Technical Field

The present disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation component and an elevator control cabinet.

Background Art

With the development of the power electronics industry, power equipment such as elevator control cabinets has a trend towards miniaturization and thinness. However, when the size of power equipment becomes smaller, the size of the heat dissipation components used to dissipate heat from heating devices in the power equipment also needs to become smaller, resulting in a decrease in the heat dissipation efficiency of the heat dissipation components, which easily leads to the heat of the heating devices not being dissipated in time.

Summary of the invention

The present disclosure aims to solve one of the technical problems in the related art at least to some extent.

To this end, the present disclosure provides a heat dissipation component and an elevator control cabinet.

In a first aspect, the present disclosure provides a heat dissipation assembly, comprising: a heat sink, comprising a bearing surface and a heat dissipation surface arranged opposite to the bearing surface, the bearing surface is used to bear a heating device, and the heat dissipation surface and the bearing surface are arranged along a first direction; a fin group, the fin group comprising a plurality of fins arranged at intervals along a second direction, the plurality of fins are in contact with the heat dissipation surface, a heat dissipation duct is formed between two adjacent fins, and the second direction forms an angle with the first direction; and a heat transfer member, comprising a heat absorbing portion and a heat releasing portion connected to the heat absorbing portion, the heat absorbing portion extends along the second direction and is inserted into the plurality of fins, and the heat absorbing portion is in contact with the heat dissipation surface; the heat releasing portion is located on a side of the heat absorbing portion away from the heat sink, the heat releasing portion extends along the second direction and is inserted into the plurality of fins, and heat is conducted between the heat releasing portion and the heat sink through the heat absorbing portion.

In some embodiments, the heat sink is a vapor chamber, which has a high thermal conductivity and can quickly diffuse the heat generated by the heating device to improve heat dissipation efficiency.

In some embodiments, a limiting groove is provided on the side of the fin group close to the heat sink, and the heat absorbing part is embedded in the limiting groove. The limiting groove is used to limit the heat absorbing part to prevent the heat transfer element from moving in the fin group. In addition, the space in the fin group can be fully utilized to reduce the overall volume of the heat dissipation assembly.

In some embodiments, the heat transfer element is a heat pipe, which utilizes the phase change process of a medium evaporating in a heat absorbing part and condensing in a heat releasing part to quickly conduct heat, thereby quickly transferring heat from the heat sink to the fins.

In some embodiments, the heat transfer element further includes a heat conducting portion, and the heat absorbing portion is heat-conductingly connected to the heat releasing portion through the heat conducting portion. The heat absorbed by the heat absorbing portion is transferred to the heat releasing portion through the heat conducting portion.

In some embodiments, the outer peripheral side surface of the fin group includes a first side surface and a second side surface arranged along the second direction, and the fin group is provided with a receiving groove for receiving the heat conducting part, and one end of the receiving groove extends along the second direction to penetrate the first side surface or the second side surface. The receiving groove can receive the heat conducting part to fully utilize the space in the fin group and reduce the overall volume of the heat dissipation assembly; in addition, the heat in the heat conducting part can also be dissipated to the outside through the receiving groove, thereby improving the heat dissipation effect.

In some embodiments, a limiting groove is provided on the side of the fin group close to the heat sink, the heat absorbing part is embedded in the limiting groove, and the receiving groove is connected to the limiting groove, so that the heat emitted from the heat absorbing part and the heat sink to the receiving groove can be emitted to the outside through the limiting groove, thereby improving the heat dissipation efficiency.

In some embodiments, the edge of the heat conducting portion is flush with the outer peripheral side of the fin group, or the edge of the heat conducting portion is lower than the outer peripheral side of the fin group, so as to avoid the edge of the heat conducting portion protruding from the fin group, reduce the overall size of the heat dissipation assembly, and facilitate the installation of the heat dissipation assembly.

In some embodiments, the heat transfer element is provided in plurality, and the plurality of heat transfer elements are arranged at intervals along a third direction, and the third direction forms an angle with the first direction and the second direction. The plurality of heat transfer elements can transfer heat from the heat sink to the fins, thereby improving heat dissipation efficiency.

In some embodiments, of two adjacent heat transfer members, the heat conduction portion of one heat transfer member is disposed close to the first side surface, and the heat conduction portion of the other heat transfer member is disposed close to the second side surface, so that the heat absorption portions of the two adjacent heat transfer members can dissipate heat in different directions, thereby improving heat dissipation efficiency.

In some embodiments, the heat absorbing part is in a flat tube shape, and includes a first flat surface that fits the heat dissipation surface, thereby increasing the contact area between the heat absorbing part and the heat dissipation plate, thereby improving the heat absorption efficiency of the heat absorbing part.

In some embodiments, the heat release portion is in the shape of a circular tube as a whole, thereby increasing the contact area between the heat release portion and the fin group, thereby improving the heat conduction efficiency of the heat transfer element.

In some embodiments, the end of the heat absorbing part and the end of the heat releasing part both pass through the fin group to be exposed from the fin group, so that the heat in the heat absorbing part and the heat in the heat releasing part can be directly dissipated into the air, thereby improving the heat dissipation efficiency.

In some embodiments, the end surface of the heat absorbing part and/or the end surface of the heat releasing part are flush with the peripheral side surface of the fin group, or the end surface of the heat absorbing part and/or the end surface of the heat releasing part are lower than the peripheral side surface of the fin group. This can prevent the end of the heat absorbing part and/or the heat releasing part from protruding from the fin group, reduce the overall size of the heat dissipation assembly, and facilitate the installation of the heat dissipation assembly.

In a second aspect, the present disclosure further provides an elevator control cabinet, comprising: a cabinet body having an installation cavity; a heat dissipation component as described in any of the above embodiments, the heat dissipation component being installed in the installation cavity; a heating device connected to the bearing surface and, a blowing device installed in the installation cavity, the blowing device being used to blow air into the heat dissipation air duct.

In a third aspect, the present disclosure also provides an elevator, comprising the above-mentioned elevator control cabinet.

Additional aspects and advantages of the present disclosure will be given in part in the following description and in part will be obvious from the following description or will be learned through practice of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a heat dissipation assembly in some embodiments of the present disclosure;

FIG2 is a schematic structural diagram of a fin assembly and a heat transfer element in some embodiments of the present disclosure at a first viewing angle;

FIG3 is a schematic structural diagram of a fin assembly and a heat transfer element in some embodiments of the present disclosure at a second viewing angle;

FIG4 is a schematic diagram of the structure of a heat transfer element in some embodiments of the present disclosure;

FIG. 5 is a schematic diagram of a partial structure of an elevator control cabinet in some embodiments of the present disclosure.

DETAILED DESCRIPTION

Embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be construed as limiting the present disclosure.

The present disclosure provides a heat dissipation component and an elevator control cabinet to solve the problem that the heat dissipation efficiency of the heat dissipation component is reduced, which easily leads to the problem that the heat of the heating device cannot be dissipated in time.

In a first aspect, the present disclosure provides a heat dissipation assembly 10 , as shown in FIG. 1 , the heat dissipation assembly 10 includes a heat dissipation plate 11 , a fin assembly 12 , and a heat transfer element 13 .

Among them, the heat sink 11 has a bearing surface 111 and a heat dissipation surface (not shown in the figure) arranged opposite to the bearing surface 111, the bearing surface 111 is used to carry the heating device 30 (as shown in Figure 5), and the heat dissipation surface and the bearing surface 111 are arranged along the first direction XX; it can be understood that the heat sink 11 has the function of diffusing heat. When the heat dissipation assembly 10 is used to dissipate heat for the heating device 30, the heating device 30 is installed on the bearing surface 111, and the heat emitted by the heating device 30 can be diffused through the heat sink 11, so that the heat dissipation efficiency can be improved by increasing the heat dissipation area.

The fin group 12 includes a plurality of fins 121 spaced apart along a second direction YY, and the plurality of fins 121 are in contact with the heat dissipation surface, and a heat dissipation duct 122 is formed between two adjacent fins 121, and the second direction YY forms an angle with the first direction XX; it can be understood that after the heat on the heat sink 11 is transferred from the bearing surface 111 to the heat dissipation surface, the heat on the heat sink 11 is transferred from the heat dissipation surface to the fin group 12, and the heat on the fin 121 is dissipated through the heat dissipation duct 122. In addition, the wind generated by equipment such as a fan can pass through the heat dissipation duct 122 to quickly take away the heat, thereby achieving a rapid heat dissipation effect; the specific working principle of the fin 121 has long been disclosed in the relevant technology, and the present disclosure will not elaborate on it. The specific type and shape of the fin 121 can also be selected according to actual needs, and the present disclosure does not make specific restrictions. The second direction YY and the first direction XX can be perpendicular to each other. Of course, the angle formed by the second direction YY and the first direction XX can also be other degrees, such as 30 degrees, 45 degrees, 60 degrees or 75 degrees.

The heat transfer member 13 has a heat absorption portion 131 and a heat release portion 132 connected to the heat absorption portion 131. The heat absorption portion 131 extends along the second direction YY and is inserted into the plurality of fins 121. The heat absorption portion 131 is in contact with the heat dissipation surface. The heat release portion 132 is located on the side of the heat absorption portion 131 away from the heat dissipation plate 11. The heat release portion 132 extends along the second direction YY and is inserted into the plurality of fins 121. The heat release portion 132 and the heat dissipation plate 11 are heat-conducted through the heat absorption portion 131. It should be noted that the heat transfer member 13 has the function of transferring heat. The heat absorption portion 131 can quickly absorb the heat on the heat dissipation plate 11, and conduct the absorbed heat to the heat release portion 132, and then conduct it to the plurality of fins 121 through the heat release portion 132, so that the heat can be more quickly and evenly distributed on the plurality of fins 121 to improve the heat dissipation efficiency.

The heat dissipation element 11 is preferably a heat dissipation element, and the heat dissipation area of the heat dissipation element 30 is increased when the heat dissipation assembly 10 is used to dissipate the heat generated by the heat dissipation element 30. In addition, part of the heat on the heat dissipation plate 11 is naturally dissipated to the surroundings of the heat dissipation plate 11. At the same time, the heat dissipation plate 11 directly transfers part of the heat on the heat dissipation plate 11 to the fins 121 through contact with the fins 121. In addition, the heat on the heat dissipation plate 11 can also be quickly and evenly transferred to the plurality of fins 121 through the heat transfer element 13. The heat dissipation portion 132 is arranged away from the heat dissipation plate 11, which can increase the distance between the heat dissipation portion 132 and the heat dissipation plate 11, provide sufficient heat dissipation space for the heat dissipation portion 132, and improve the heat dissipation efficiency of the heat dissipation portion 132. By combining various methods, the heat dissipation assembly 10 has a higher heat dissipation efficiency. Therefore, even if the volume of the heat dissipation assembly 10 is reduced, the heat generated by the heat dissipation element 30 can be dissipated in time through the heat dissipation assembly 10 to prevent heat accumulation from affecting the operation of the heat dissipation element 30 or even causing damage to the heat dissipation element 30.

In some embodiments of the present disclosure, the heat sink 11 is a heat spreader. It should be noted that the heat spreader is also called a VC (Vapor Chambers) plate, a flat heat pipe plate or a temperature spreader, etc. The heat spreader has a high thermal conductivity. Generally speaking, the thermal conductivity of the heat spreader can reach 20 times the thermal conductivity of pure copper. The heat spreader is a vacuum cavity with a microstructure on the inner wall, usually made of a high thermal conductivity material, and its working principle is: when heat is transferred from the heat source to the evaporation zone, the coolant in the cavity begins to vaporize after being heated in a low vacuum environment, and the gas phase cooling medium quickly fills the entire cavity. When the gas phase cooling medium contacts a relatively cold area, condensation will occur, and the accumulated heat during evaporation will be released by the condensation phenomenon. The condensed coolant will return to the heat source through the capillary tube of the microstructure. This operation will be repeated in the cavity, so that the heat generated by the heating device 30 can be quickly diffused to improve the heat dissipation efficiency. The more specific working principle of the heat spreader has been disclosed in the relevant technology for a long time, and will not be elaborated in this disclosure.

It should also be noted that the heat sink 11 may also be a plate-like structure made of other high thermal conductivity materials. For example, the heat sink 11 may also be made of high thermal conductivity ceramics (such as polycrystalline diamond ceramics) or thermal conductive graphite.

In some embodiments of the present disclosure, the heat transfer element 13 is a heat pipe. It should be noted that the heat pipe uses the phase change process of the medium evaporating in the heat absorption part 131 and condensing in the heat release part 132 (i.e., using the liquid to absorb heat by evaporation and release heat by condensation) to quickly conduct heat, thereby quickly transferring the heat on the heat sink 11 to the fins 121. A heat pipe generally consists of a tube shell, a liquid absorption core and a heat exchanger. The heat pipe is composed of an end cap. The inside of the heat pipe is pumped into a negative pressure state and filled with a suitable liquid. This liquid has a low boiling point and is easy to volatilize. The tube wall of the tube shell has a liquid wick, which is made of a capillary porous material. One end of the heat pipe is a heat absorption part 131, and the other end is a heat release part 132. When the heat absorption part 131 of the heat pipe is heated, the liquid in the capillary tube is rapidly vaporized, and the vapor flows to the heat release part 132 under the power of heat diffusion, and condenses in the heat release part 132 to release heat. The liquid then flows back to the heat absorption part 131 along the porous material by capillary action, and the cycle continues until the temperature of the heat absorption part 131 is equal to that of the heat release part 132 (at this time, the steam heat diffusion stops). This cycle is carried out quickly, and heat can be conducted continuously. The more specific working principle of the heat pipe has long been disclosed in the relevant technology, and this disclosure will not be repeated.

It should also be noted that the heat transfer element 13 may also be other devices, such as a semiconductor refrigeration element or a high thermal conductivity device made of a high thermal conductivity material such as pure copper.

As shown in FIGS. 1 to 3, in some embodiments of the present disclosure, a limiting groove 123 is provided on the side of the fin group 12 close to the heat sink 11, and the heat absorbing portion 131 is inserted into the limiting groove 123. The limiting groove 123 is used to limit the heat absorbing portion 131 to prevent the heat transfer element 13 from moving in the fin group 12. In addition, the space in the fin group 12 can be fully utilized to reduce the overall volume of the heat dissipation assembly 10.

As shown in Figures 2 to 4, in some embodiments of the present disclosure, the heat transfer element 13 also includes a heat conducting portion 133, and the heat absorbing portion 131 is thermally connected to the heat releasing portion 132 through the heat conducting portion 133; it can be understood that the heat absorbed by the heat absorbing portion 131 is conducted to the heat releasing portion 132 through the heat conducting portion 133, and the receiving groove 124 can accommodate the heat conducting portion 133 to make full use of the space in the fin group 12 and reduce the overall volume of the heat dissipation assembly 10.

The outer peripheral side of the fin group 12 includes a first side 125 and a second side 126 arranged along the second direction YY, and a receiving groove 124 for receiving the heat conducting part 133 is provided on the fin group 12, and one end of the receiving groove 124 extends along the second direction YY to penetrate the first side 125 or the second side 126. The heat in the heat conducting part 133 can also be dissipated to the outside through the receiving groove 124, thereby improving the heat dissipation effect. The heat absorbing part 131, the heat conducting part 133 and the heat releasing part 132 can be integrally formed, and the heat absorbing part 131, the heat conducting part 133 and the heat releasing part 132 can also be formed separately and then spliced by welding, gluing or threaded connection.

In some embodiments of the present disclosure, the receiving groove 124 is connected to the limiting groove 123, so that the heat dissipated from the heat absorption part 131 and the heat dissipation plate 11 to the receiving groove 124 can also be dissipated to the outside through the limiting groove 123, thereby improving the heat dissipation efficiency.

In some embodiments of the present disclosure, the edge of the heat-conducting portion 133 is flush with the outer peripheral side of the fin group 12, or the edge of the heat-conducting portion 133 is lower than the outer peripheral side of the fin group 12, so that the edge of the heat-conducting portion 133 can be prevented from protruding from the fin group 12, and the overall size of the heat dissipation assembly 10 can be reduced, which is convenient for the installation of the heat dissipation assembly 10. In some embodiments of the present disclosure, a plurality of heat transfer elements 13 are provided, and the plurality of heat transfer elements 13 are arranged at intervals along the third direction ZZ, and the third direction ZZ forms an angle with the first direction XX and the second direction YY. The plurality of heat transfer elements 13 can transfer heat from the heat sink 11 to the fins 121, thereby improving the heat dissipation efficiency. The number of heat transfer elements 13 can be 2, 3 or more, and the present disclosure does not impose any specific limitation on the number of heat transfer elements 13. The third direction ZZ can be perpendicular to the first direction XX and the second direction YY. Of course, the third direction ZZ can be perpendicular to the first direction XX and the second direction YY. The angle formed by the third direction ZZ and the first direction XX may also be other degrees, such as 30 degrees, 45 degrees, 60 degrees or 75 degrees, and the angle formed by the third direction ZZ and the second direction YY may also be other degrees, such as 30 degrees, 45 degrees, 60 degrees or 75 degrees.

Among them, among the two adjacent heat transfer elements 13, the heat transfer part 133 of one heat transfer element 13 is arranged close to the first side surface 125, and the heat transfer part 133 of the other heat transfer element 13 is arranged close to the second side surface 126. It can be understood that, taking any two adjacent heat transfer elements 13, one heat transfer element 13 is the first heat transfer element, and the other heat transfer element 13 is the second heat transfer element as an example, the first heat transfer element and the second heat transfer element are arranged alternately along the third direction ZZ, the heat transfer part 133 of the first heat transfer element is located on the side of the heat absorption part 131 and the heat release part 132 of the first heat transfer element close to the first side surface 125, and the heat transfer part 133 of the second heat transfer element is located on the side of the heat absorption part 131 and the heat release part 132 of the second heat transfer element close to the second side surface 126. With this design, the heat absorption part 131 of the first heat transfer element and the heat absorption part 131 of the second heat transfer element can dissipate heat in different directions respectively, which can improve the heat dissipation efficiency.

It should also be noted that when there are multiple heat transfer elements 13, multiple receiving grooves 124 are also provided on the fin group 12, and the multiple receiving grooves 124 correspond one-to-one to the heat conducting parts 133 of the multiple heat transfer elements 13, and the receiving groove 124 for receiving the heat conducting part 133 of the first heat transfer element passes through the first side surface 125, and the receiving groove 124 for receiving the heat conducting part 133 of the second heat transfer element passes through the second side surface 126.

Continuing to refer to FIGS. 2 to 4 , in some embodiments of the present disclosure, the heat absorbing portion 131 is in the shape of a flat tube, and the heat absorbing portion 131 includes a first flat surface 131a that fits with the heat dissipation surface. It is understandable that the first flat surface 131a is a plane and fits with the heat dissipation surface, which can increase the contact area between the heat absorbing portion 131 and the heat dissipation plate 11, thereby increasing the heat absorption efficiency of the heat absorbing portion 131, so that the heat on the heat dissipation plate 11 can be transferred to the fins 121 more quickly; in addition, the thickness of the heat absorbing portion 131 can be reduced, and the overall volume of the heat transfer element 13 can be reduced, thereby reducing the overall volume of the heat dissipation assembly 10. The heat absorbing portion 131 also includes a second flat surface (not shown in the figure) that is arranged opposite to the first flat surface 131a to reduce the overall volume of the heat dissipation assembly 10.

In some embodiments of the present disclosure, the heat release portion 132 is in the shape of a circular tube as a whole, which can increase the contact area between the heat release portion 132 and the fin assembly 12 , thereby improving the heat conduction efficiency of the heat transfer element 13 .

In some embodiments of the present disclosure, the heat transfer element 13 may be in a U-shaped tube shape so as to facilitate the insertion of the heat transfer element 13 into the fin group 12. Of course, according to actual needs, the heat transfer element 13 may also be in other shapes, such as wavy, "Z" or "L" shape.

In some embodiments of the present disclosure, the end of the heat absorbing portion 131 and the end of the heat releasing portion 132 both penetrate the fin group 12 to be exposed from the fin group 12, so that the heat in the heat absorbing portion 131 and the heat releasing portion 132 can be directly dissipated to the air, thereby improving the heat dissipation efficiency. The length of the heat absorbing portion 131 along the second direction YY is greater than or equal to the length of the heat dissipating plate 11 along the second direction YY to ensure the contact area between the heat absorbing portion 131 and the heat dissipating plate 11; the length of the heat releasing portion 132 along the second direction YY is greater than the length of the fin group 12 along the second direction YY to ensure that each fin 121 can contact the heat releasing portion 132.

One end of the heat absorbing portion 131 is connected to the heat conducting portion 133, and the other end of the heat absorbing portion 131 passes through the fin group 12 to pass through the fin group 12. one end of the heat dissipating portion 132 is connected to the heat conducting portion 133, and the other end of the heat dissipating portion 132 passes through the fin group 12 to be exposed from the fin group 12.

In other embodiments of the present disclosure, the end surface of the heat absorbing portion 131 and/or the end surface of the heat releasing portion 132 are flush with the outer peripheral side surface of the fin group 12, or the end surface of the heat absorbing portion 131 and/or the end surface of the heat releasing portion 132 are lower than the outer peripheral side surface of the fin group 12. This can prevent the end of the heat absorbing portion 131 and/or the heat releasing portion 132 from protruding from the fin group 12, and can reduce the overall size of the heat dissipation assembly 10, which is convenient for installation of the heat dissipation assembly 10.

Based on the above heat dissipation assembly 10, the present disclosure further provides an elevator control cabinet, as shown in FIG5, the elevator control cabinet includes a cabinet body 20, a heating device 30, a blowing device 40 and a heat dissipation assembly 10 as in any of the above embodiments.

The cabinet 20 has an installation cavity 21 ; the heat dissipation assembly 10 is installed in the installation cavity 21 ; the heating device 30 is in contact with the bearing surface 111 ; the blowing device 40 is installed in the installation cavity 21 , and the blowing device 40 is used to blow air into the heat dissipation air duct 122 .

It should be noted that the heating device 30 can be an insulated gate bipolar transistor (IGBT) chip, a rectifier bridge chip or other devices; the blowing device 40 can be a fan or a blower or other devices. When the wind generated by the blowing device 40 passes through the heat dissipation duct 122, it can quickly take away the heat in the heat dissipation duct 122, thereby achieving the effect of rapid heat dissipation.

In some embodiments of the present disclosure, the blowing device 40 is located on one side of the heat dissipation component 10 along the third direction ZZ, and the air outlet of the blowing device 40 faces the heat dissipation air duct 122, so that the wind generated by the blowing device 40 can be concentrated in the area where the heat dissipation component 10 is located to improve the heat dissipation efficiency; in addition, the wind generated by the blowing device 40 can pass through the first side surface 125 and the second side surface 126, so that the heat in the receiving groove 124 can also be quickly dissipated.

The present disclosure also provides an elevator, which includes the above-mentioned elevator control cabinet.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

In the present disclosure, unless otherwise expressly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be two The internal connection of an element or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.

In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some embodiments" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are illustrative and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims (16)

A heat dissipation component, comprising: A heat sink having a bearing surface and a heat dissipation surface arranged opposite to the bearing surface, the bearing surface is used to bear the heating device, and the heat dissipation surface and the bearing surface are arranged along a first direction; A fin group, the fin group includes a plurality of fins spaced apart along a second direction, the plurality of fins are in contact with the heat dissipation surface, a heat dissipation duct is formed between two adjacent fins, and the second direction forms an angle with the first direction; and, The heat transfer component comprises a heat absorbing portion and a heat releasing portion connected to the heat absorbing portion, wherein the heat absorbing portion extends along the second direction and is inserted into the plurality of fins, and the heat absorbing portion contacts the heat dissipation surface; the heat releasing portion is located on a side of the heat absorbing portion away from the heat dissipation plate, wherein the heat releasing portion extends along the second direction and is inserted into the plurality of fins, and heat is conducted between the heat releasing portion and the heat dissipation plate through the heat absorbing portion. The heat dissipation assembly according to claim 1, wherein the heat dissipation plate is a heat spreader. The heat dissipation assembly according to claim 1 or 2, wherein a limiting groove is provided on the side surface of the fin group close to the heat dissipation plate, and the heat absorption part is embedded in the limiting groove. The heat dissipation assembly according to any one of claims 1 to 3, wherein the heat transfer element is a heat pipe. The heat dissipation assembly according to any one of claims 1 to 4, wherein the heat transfer element further comprises a heat conducting portion, and the heat absorbing portion is thermally connected to the heat releasing portion through the heat conducting portion. The heat dissipation assembly according to claim 5, wherein the outer peripheral side surface of the fin group includes a first side surface and a second side surface arranged along the second direction, and the fin group is provided with a receiving groove for accommodating the heat conducting part, and one end of the receiving groove extends along the second direction to pass through the first side surface or the second side surface. According to the heat dissipation assembly of claim 6, a limiting groove is provided on the side surface of the fin group close to the heat dissipation plate, the heat absorption part is embedded in the limiting groove, and the accommodating groove is connected to the limiting groove. The heat dissipation assembly according to any one of claims 5 to 7, wherein the edge of the heat conducting portion is flush with the outer peripheral side surface of the fin group, or the edge of the heat conducting portion is lower than the outer peripheral side surface of the fin group. The heat dissipation assembly according to any one of claims 5 to 8, wherein a plurality of the heat transfer members are provided, and the plurality of the heat transfer members are arranged at intervals along a third direction, and the third direction forms an angle with the first direction and the second direction. The heat dissipation assembly according to claim 9, wherein, among two adjacent heat transfer members, the heat conduction portion of one heat transfer member is arranged close to the first side surface, and the heat conduction portion of the other heat transfer member is arranged close to the second side surface. The heat dissipation assembly according to any one of claims 1 to 10, wherein the heat absorption portion is in the shape of a flat tube as a whole, and the heat absorption portion includes a first flat surface that is in contact with the heat dissipation surface. The heat dissipation assembly according to claim 11, wherein the heat dissipation portion is in the shape of a circular tube as a whole. The heat dissipation assembly according to any one of claims 1 to 12, wherein an end portion of the heat absorbing portion and an end portion of the heat radiating portion both penetrate the fin group to be exposed from the fin group. The heat dissipation assembly according to any one of claims 1 to 13, wherein the end surface of the heat absorbing portion and/or the end surface of the heat releasing portion are flush with the peripheral side surface of the fin group, or the end surface of the heat absorbing portion and/or the end surface of the heat releasing portion are lower than the peripheral side surface of the fin group. An elevator control cabinet, comprising: A cabinet having a mounting cavity; The heat dissipation assembly according to any one of claims 1 to 14, wherein the heat dissipation assembly is installed in the installation cavity; a heating device in contact with the bearing surface; and A blowing device is installed in the installation cavity, and the blowing device is used to blow air to the heat dissipation air duct. An elevator comprises the elevator control cabinet according to claim 15.