CN216250709U - Uniform temperature heat dissipation device - Google Patents
Uniform temperature heat dissipation device Download PDFInfo
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- CN216250709U CN216250709U CN202122923055.8U CN202122923055U CN216250709U CN 216250709 U CN216250709 U CN 216250709U CN 202122923055 U CN202122923055 U CN 202122923055U CN 216250709 U CN216250709 U CN 216250709U
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Abstract
The application relates to the technical field of heat dissipation equipment, especially, relate to a samming heat abstractor, samming heat abstractor includes: a heat conducting assembly in contact with the heat source; the temperature equalizing component comprises a first temperature equalizing part and a second temperature equalizing part which are connected with each other; a heat dissipation assembly, which is formed with an embedding part; the first temperature equalizing part is connected with the heat conducting component, and the second temperature equalizing part is arranged in the embedding part. The samming heat abstractor that this application embodiment provided absorbs, releases the heat of chip release fast, uniformly through the mode of samming, no matter the condition that local heat is concentrated can effectively be avoided to chip or this samming heat abstractor homoenergetic, and is good, the radiating efficiency height to the chip to ensure that the temperature of chip can maintain throughout in the fit for the within range, ensure the performance and the life-span of chip.
Description
Technical Field
The application relates to the technical field of heat dissipation equipment, in particular to a uniform-temperature heat dissipation device.
Background
At present, a way of submerging a water cooling channel in a chip or a way of adhering a heat sink to the chip is often adopted for dissipating heat to a chip so as to enable the temperature of the chip to be reduced to or maintained in a proper range, the water cooling way generally needs to improve the adaptability of the structure of the chip, the process is complex, the manufacturing cost is high, the heat sink generally needs to be matched with a fan to dissipate heat in a forced air cooling way, but due to the influences of the setting position and the power of the fan, the heat sink and the chip are difficult to dissipate heat uniformly, the phenomenon of local heat concentration is easy to occur, the heat dissipation effect of the chip is influenced, more time is needed for reducing the temperature of the chip to an expected value, and the heat dissipation efficiency of the chip is influenced.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a samming heat abstractor to solve the radiating in-process of chip that exists among the prior art to a certain extent and be difficult to realize even heat dissipation, the local heat of chip or fin appears easily and concentrates, influences radiating effect and radiating efficiency's technical problem.
The application provides a samming heat abstractor includes:
a heat conducting assembly in contact with a heat source;
the temperature equalizing component comprises a first temperature equalizing part and a second temperature equalizing part which are connected with each other;
a heat dissipation assembly formed with an embedding portion; the first temperature equalizing part is connected with the heat conducting assembly, and the second temperature equalizing part is located in the embedding part.
In the above technical solution, further, the heat conducting assembly includes:
a heat conducting member in contact with the heat source;
and a substrate formed with a notch portion, the heat conductive member being disposed at the notch portion.
In any of the above technical solutions, further, the first temperature equalizing portion includes a plurality of first temperature equalizing members;
the substrate is provided with a plurality of grooves at intervals, the first temperature equalizing pieces are arranged in the grooves respectively, and at least one first temperature equalizing piece is correspondingly arranged in each groove.
In any of the above technical solutions, further, the second temperature equalizing portion includes a plurality of heat pipes, and the plurality of heat pipes are connected to all or part of the plurality of first temperature equalizing members.
In any of the above technical solutions, further, the first temperature equalizing member has a plate structure or a rod structure, and a bent portion is formed on the first temperature equalizing member.
In any of the above technical solutions, further, the embedding portion includes a plurality of embedding slots, the plurality of heat pipes are respectively disposed in the plurality of embedding slots, and at least one heat pipe is disposed in each of the embedding slots.
In any of the above technical solutions, further, the heat dissipation assembly includes:
the heat pipes are in contact with each heat radiating fin; one end of each radiating fin is contacted with the base plate and the first temperature equalizing part;
and the air outlet direction of the fan faces to the radiating fins.
In any of the above technical solutions, further, an angle is formed between a depth direction of the caulking groove and a height direction of the heat dissipation fin.
In any of the above technical solutions, further, the heat dissipation assembly further includes:
the shrouding, the shrouding covers the radiating fin keeps away from the one end of base plate to inject arbitrary adjacent two the air-out direction in wind channel that forms between the radiating fin.
In any of the above technical solutions, further, the temperature-equalizing heat dissipation device further includes a heat conduction layer, and the heat conduction layer is disposed at a portion where the heat source contacts the heat conduction member.
Compared with the prior art, the beneficial effect of this application is:
the application provides a samming heat abstractor includes: a heat conducting assembly in contact with the heat source; the temperature equalizing component comprises a first temperature equalizing part and a second temperature equalizing part which are connected with each other; a heat dissipation assembly, which is formed with an embedding part; the first temperature equalizing part is connected with the heat conducting component, and the second temperature equalizing part is arranged in the embedding part.
The samming heat abstractor that this application embodiment provided absorbs, releases the heat of chip release fast, uniformly through the mode of samming, no matter the condition that local heat is concentrated can effectively be avoided to chip or this samming heat abstractor homoenergetic, and is good, the radiating efficiency height to the chip to ensure that the temperature of chip can maintain throughout in the fit for the within range, ensure the performance and the life-span of chip.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a uniform temperature heat dissipation device according to an embodiment of the present application;
fig. 2 is a schematic partial structural view of a uniform temperature heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a temperature equalization heat dissipation device according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a substrate of a uniform temperature heat dissipation device according to an embodiment of the present application;
fig. 5 is another perspective view of a substrate of a uniform temperature heat dissipation device according to an embodiment of the present application.
Reference numerals: the heat pipe comprises a heat conducting piece 1, a base plate 2, a groove 201, a first temperature equalizing piece 3, a bent part 301, a heat pipe 4, a bent pipe 401, a straight pipe 402, a radiating fin 5, a caulking groove 6, a sealing plate 7 and a fan 8.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.
The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1-5, a temperature equalization heat sink according to some embodiments of the present application is described.
Referring to fig. 1 to 5, an embodiment of the present application provides a temperature-equalizing heat dissipation device for dissipating heat from a chip, including: heat conduction assembly, samming subassembly and radiator unit, heat conduction assembly and heat source (in this embodiment, the heat source is the chip) contact, heat conduction assembly sets up between heat source and samming heat conduction assembly, heat conduction assembly can absorb the heat of heat source release fast and transmit the heat to samming subassembly fast, make heat conduction assembly's temperature reduce in order to absorb the heat of heat source release continuously, distribute in whole samming subassembly with the mode of dispersion behind the heat transmission to samming subassembly, radiator unit acts on the heat on samming subassembly in order to dispel the samming subassembly, behind heat dispersion to samming subassembly, the condition that the heat concentrates can not appear in whole samming subassembly, the temperature is shared equally, radiator unit to the radiating degree of difficulty of samming subassembly has been reduced, thereby improve the radiating efficiency, also can strengthen the radiating effect.
Specifically, the heat conducting assembly includes: heat-conducting member 1 and base plate 2, heat-conducting member 1 specifically is the copper billet, and the copper billet contacts with the heat source, and base plate 2 is formed with breach portion, the shape of breach portion and the shape adaptation of copper billet to make the copper billet can set up and fix in breach portion, the upper and lower surface of base plate 2 position that is formed with breach portion runs through.
Preferably, the surface of the heat source (chip) attached to the copper block is coated with heat-conducting silicone grease, so that the heat transfer efficiency between the heat source and the copper block is further improved.
Further, the upper surface of the substrate 2 is provided with a plurality of groove portions 201, the plurality of groove portions 201 are provided at intervals, and each of the plurality of groove portions 201 communicates with the notched portion.
Preferably, the substrate 2 is made of aluminum.
Further, the temperature equalizing assembly comprises a first temperature equalizing part and a second temperature equalizing part connected with the first temperature equalizing part, the first temperature equalizing part is in contact with or connected with the substrate 2, and the second temperature equalizing part is in contact with or connected with the heat dissipation assembly. Specifically, the first temperature equalizing part comprises a plurality of first temperature equalizing parts 3, the number of the first temperature equalizing parts 3 is the same as that of the groove parts 201 on the substrate 2, one first temperature equalizing part 3 is arranged in each groove part 201, preferably, the first temperature equalizing part 3 has a plate structure or a rod structure, and the shape of the first temperature equalizing part 3 is the same as that of the groove parts 201, so that the first temperature equalizing part 3 can be embedded in the groove parts 201. And the edge of first samming piece 3 and the edge contact of slot part 201 to on making heat on the base plate 2 can transmit to each first samming piece 3, the lower surface of each first samming piece 3 all contacts with the copper billet simultaneously, also can assist the samming effect of strengthening base plate 2 to a certain extent.
Preferably, the first temperature equalizing member 3 is formed with a bending portion 301, the number of the bending portion 301 may be one, so that the first temperature equalizing member 3 is in a bending state, and the number of the bending portion 301 may also be multiple, so that the first temperature equalizing member 3 is corrugated, the proportion of the first temperature equalizing member 3 occupied on the substrate 2 can be enlarged, and the efficiency of the substrate 2 in transferring heat to the multiple first temperature equalizing members 3 is improved.
Further, the second temperature equalizing portion comprises a plurality of heat pipes 4, each heat pipe 4 comprises a straight pipe section 402 and a bent pipe section 401, one end of the bent pipe section 401 is connected with one end of the first temperature equalizing member 3, the other end of the bent pipe section 401 is connected with the straight pipe section 402, the straight pipe section 402 faces the first temperature equalizing member 3, preferably, the straight pipe section 402 is arranged in parallel with the first temperature equalizing member 3, and heat absorbed by the first temperature equalizing member 3 can be rapidly transferred to the heat pipe 4.
Preferably, the first temperature equalization member 3 and the heat pipe 4 are made of copper metal.
Further, the heat dissipation assembly comprises a plurality of heat dissipation fins 5 and a fan 8, the heat dissipation fins 5 are arranged in parallel at intervals along the length direction of the heat pipe 4, an air channel is formed between every two adjacent heat dissipation fins 5, the fan 8 is used for blowing air towards the heat dissipation fins 5, and the air can flow through the air channel between any two adjacent heat dissipation fins 5, so that the heat on each heat dissipation fin 5 can be dispersed to an external heat sink.
Further, a plurality of radiating fin 5 have the same shape and size for a plurality of radiating fin 5 form the cuboid structure jointly, and the cuboid structure is formed with inlays the portion of establishing, and heat pipe 4 sets up in inlaying the portion of establishing, inlays the portion of establishing specifically including a plurality of caulking grooves 6, and the quantity of caulking groove 6 is the same with the quantity of heat pipe 4, and in this embodiment, the quantity of caulking groove 6 all prefers threely with the quantity of heat pipe 4, and three heat pipe 4 sets up respectively in three caulking groove 6.
Preferably, the bottom edge of each heat dissipation fin 5 is in contact with the upper surface of the substrate 2, so that the source of the heat dissipation fin 5 is not limited to the heat pipe 4, and meanwhile, the heat on the substrate 2 can be absorbed, the heat dissipation speed of the substrate 2 is increased, and the rapid cooling is realized.
More preferably, the depth direction of the middle one of the three insertion grooves 6 is parallel or the same direction as the height direction of the heat dissipation fins 5, the other two insertion grooves 6 are positioned at two sides of the middle insertion groove 6 and are obliquely arranged relative to the middle insertion groove 6, and the three insertion grooves 6 can occupy more space in a rectangular parallelepiped structure formed by a plurality of heat dissipation fins 5, so as to ensure the efficiency of heat transfer between the heat pipe 4 and the heat dissipation fins 5.
Further, radiator unit still includes shrouding 7, and the cuboid structure that a plurality of radiating fin 5 formed is formed with the depressed part, and the shape of depressed part and the mutual adaptation of the shape of the frame of fan 8 for fan 8 can set up in the depressed part, and fan 8 sets up to a plurality of fins, in order to the wind channel air supply between two radiating fin 5 adjacent wantonly.
Shrouding 7 sets up in the upper surface that covers the cuboid structure that a plurality of radiating fin 5 formed to inject the direction that blows of wind in the wind channel, ensure the radiating effect, shrouding 7 also provides fixed fulcrum for the mount simultaneously, ensures fan 8 stability relative radiating fin 5.
To sum up, the samming heat abstractor that this application embodiment provided absorbs, releases the heat that the chip released through the mode of samming fast, uniformly, no matter the condition that local heat is concentrated can effectively be avoided to chip or this samming heat abstractor homoenergetic, and is good, the radiating efficiency height to the chip to ensure that the temperature of chip can maintain in the fit range all the time, ensure the performance and the life-span of chip.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A temperature-equalizing heat dissipation device is characterized by comprising:
a heat conducting assembly in contact with a heat source;
the temperature equalizing component comprises a first temperature equalizing part and a second temperature equalizing part which are connected with each other;
a heat dissipation assembly formed with an embedding portion; the first temperature equalizing part is connected with the heat conducting assembly, and the second temperature equalizing part is located in the embedding part.
2. The temperature-equalizing heat sink device according to claim 1, wherein the heat conducting assembly comprises:
a heat conducting member in contact with the heat source;
and a substrate formed with a notch portion, the heat conductive member being disposed at the notch portion.
3. The temperature-equalizing heat sink device according to claim 2, wherein the first temperature-equalizing portion comprises a plurality of first temperature-equalizing members;
the substrate is provided with a plurality of grooves at intervals, the first temperature equalizing pieces are arranged in the grooves respectively, and at least one first temperature equalizing piece is correspondingly arranged in each groove.
4. The temperature-equalizing heat sink device according to claim 3, wherein the second temperature-equalizing portion comprises a plurality of heat pipes, and the plurality of heat pipes are connected to all or part of the first temperature-equalizing members.
5. The temperature-equalizing heat sink device according to claim 3, wherein the first temperature-equalizing member has a plate structure or a rod structure, and the first temperature-equalizing member is formed with a bent portion.
6. The temperature-equalizing heat sink device as claimed in claim 4, wherein the embedding portion comprises a plurality of embedding slots, the plurality of heat pipes are respectively disposed in the plurality of embedding slots, and at least one heat pipe is disposed in each of the embedding slots.
7. The temperature-equalizing heat sink device according to claim 6, wherein the heat sink assembly comprises:
the heat pipes are in contact with each heat radiating fin; one end of each radiating fin is contacted with the base plate and the first temperature equalizing part;
and the air outlet direction of the fan faces to the radiating fins.
8. The temperature-equalizing heat sink device as claimed in claim 7, wherein the depth direction of the caulking groove forms an angle with the height direction of the heat dissipating fins.
9. The temperature-equalizing heat sink device according to claim 7, wherein the heat sink assembly further comprises:
the shrouding, the shrouding covers the radiating fin keeps away from the one end of base plate to inject arbitrary adjacent two the air-out direction in wind channel that forms between the radiating fin.
10. The temperature-equalizing heat sink according to any one of claims 2 to 9, further comprising a heat conducting layer disposed on a portion of the heat source in contact with the heat conducting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923055.8U CN216250709U (en) | 2021-11-25 | 2021-11-25 | Uniform temperature heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923055.8U CN216250709U (en) | 2021-11-25 | 2021-11-25 | Uniform temperature heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
| CN216250709U true CN216250709U (en) | 2022-04-08 |
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| CN202122923055.8U Active CN216250709U (en) | 2021-11-25 | 2021-11-25 | Uniform temperature heat dissipation device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114983028A (en) * | 2022-07-21 | 2022-09-02 | 北京微焓科技有限公司 | Cooling system and electron cigarette |
| WO2024234693A1 (en) * | 2023-05-15 | 2024-11-21 | 菱王电梯有限公司 | Heat dissipation assembly, elevator control cabinet, and elevator |
-
2021
- 2021-11-25 CN CN202122923055.8U patent/CN216250709U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114983028A (en) * | 2022-07-21 | 2022-09-02 | 北京微焓科技有限公司 | Cooling system and electron cigarette |
| WO2024234693A1 (en) * | 2023-05-15 | 2024-11-21 | 菱王电梯有限公司 | Heat dissipation assembly, elevator control cabinet, and elevator |
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