CN222192930U - 3D Vapor Chamber Cooling Module - Google Patents
3D Vapor Chamber Cooling Module Download PDFInfo
- Publication number
- CN222192930U CN222192930U CN202420917496.8U CN202420917496U CN222192930U CN 222192930 U CN222192930 U CN 222192930U CN 202420917496 U CN202420917496 U CN 202420917496U CN 222192930 U CN222192930 U CN 222192930U
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- Prior art keywords
- fin group
- heat
- heat dissipation
- group
- fin
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- 238000001816 cooling Methods 0.000 title 1
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 230000005855 radiation Effects 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000012935 Averaging Methods 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了3D均温板散热模组，包括均温板、设于均温板上的热管组、由多个散热鳍片组成的第一鳍片组和第二鳍片组；所述第二鳍片组设于第一鳍片组的一侧，且第二鳍片组与第一鳍片组的散热鳍片堆叠方向相垂直；所述热管组穿设于散热鳍片之间。第二鳍片组根据需要可设多组，并设于第一鳍片组相应的侧边，使得发热芯片上部的散热空间得以充分利用，通过增加散热面积，以达到更好的散热效果。
The utility model discloses a 3D temperature averaging board heat dissipation module, comprising a temperature averaging board, a heat pipe group arranged on the temperature averaging board, a first fin group consisting of a plurality of heat dissipation fins, and a second fin group; the second fin group is arranged on one side of the first fin group, and the stacking direction of the heat dissipation fins of the second fin group and the first fin group is perpendicular; the heat pipe group is inserted between the heat dissipation fins. The second fin group can be provided in multiple groups as needed, and is arranged on the corresponding side of the first fin group, so that the heat dissipation space on the upper part of the heat generating chip can be fully utilized, and a better heat dissipation effect can be achieved by increasing the heat dissipation area.
Description
Technical Field
The utility model relates to the field of heat dissipation of electronic devices, in particular to a 3D temperature-equalizing plate heat dissipation module.
Background
With the development of technology, computers and various electronic devices are rapidly developed and the performance is continuously improved, but in the process, the heat dissipation problem caused by high-performance hardware is also caused. Generally, heat dissipation devices are used to dissipate heat of computers and various electronic devices, such as conventional heat pipe heat dissipation modules, or heat conduction paste or heat dissipation fins are used to attach to heat generating chips, so as to suck out and dissipate heat.
In the prior art, a heat source is cooled by adopting a mode of arranging a vapor chamber or a heat pipe, and the heat pipe is inserted among a plurality of heat dissipation fins so as to fully dissipate heat of each part of the heat pipe. However, in the prior art, the fin group is generally formed by stacking a plurality of heat dissipation fins with the same shape along the same direction, and correspondingly, the extending direction of the heat pipe is the same as the stacking direction of the heat dissipation fins. If a better heat dissipation effect is desired, the heat pipes are generally arranged in a shape similar to a U shape, and the same heat pipe is repeatedly inserted into the fin group through repeated bending, so that the heat dissipation area is increased, the heat dissipation capability of the heat pipe is affected by excessive bending, and the bent part cannot be fully dissipated.
Meanwhile, the installation area in the device is limited, the shape and the stacking direction of the radiating fins are fixed, only the upper fixed area of the heat source can be used for radiating, and the limited radiating space causes limited radiating effect.
Disclosure of utility model
In order to solve the technical problems, the utility model provides a 3D temperature equalizing plate heat radiation module, wherein a cavity is shared by a temperature equalizing plate and a heat pipe set, and a second heat pipe extends outwards to enable a first fin set and second fin sets on two sides of the first fin set to be a T-shaped heat radiation module, so that the heat radiation space on the upper part of a heating chip is fully utilized, and the heat radiation area is increased to improve the performance of the heat radiation module.
The technical scheme of the utility model is as follows:
the heat pipe comprises a temperature equalizing plate, a heat pipe group arranged on the temperature equalizing plate, a first fin group and a second fin group, wherein the first fin group and the second fin group are formed by a plurality of heat dissipation fins, and the heat pipe group is arranged between the heat dissipation fins in a penetrating way;
the second fin group is arranged on the side edge of the first fin group, and the second fin group is perpendicular to the stacking direction of the radiating fins of the first fin group.
The heat pipe group is further characterized in that the penetrating direction of the heat pipe group is the same as the stacking direction of the heat radiating fins.
The further technical scheme is as follows:
the heat dissipation fins of the first fin group are stacked along the direction perpendicular to the temperature equalizing plate.
The further technical scheme is as follows:
The heat pipe group comprises a plurality of first heat pipes, and the first heat pipes penetrate through each heat radiation fin of the first fin group through vertical through holes arranged on the first fin group.
The further technical scheme is as follows:
The heat pipe group comprises a plurality of second heat pipes, and the second heat pipes are provided with vertical parts and horizontal parts which are connected;
wherein, the vertical part is penetrated with part of the radiating fins of the first fin group, and the horizontal part is penetrated with each radiating fin of the second fin group.
The further technical scheme is as follows:
The upper end face of the second fin group and the upper end face of the first fin group are located on the same plane.
The further technical scheme is as follows:
The lower end of the side surface of the first fin group, which is opposite to the second fin group, is provided with a concave square space, a third fin group is arranged in the square space, and the second heat pipe is positioned between the first fin group and the third fin group.
The further technical scheme is as follows:
The second fin groups are arranged in a plurality of groups and are correspondingly arranged on each side edge of the first fin group.
The further technical scheme is as follows:
Screw grooves are formed in the periphery of the first fin group, and the temperature equalizing plate is fixed on a substrate through locking screw assemblies in the screw grooves.
The further technical scheme is as follows:
and the contact surface of the temperature equalizing plate and the heat source is coated with heat conducting paste.
The utility model provides a 3D temperature equalizing plate heat radiation module, wherein a plurality of first fin groups are arranged on the surface of a temperature equalizing plate attached to a heat source, a plurality of second fin groups are arranged on the side edges of the first fin groups, and a plurality of heat pipes are arranged among the heat radiation fins in a penetrating manner. Because the second fin group is perpendicular to the stacking direction of the first fin group, even if the heat pipe is designed to be of a bending structure, the whole heat pipe can be fully radiated.
In the embodiment, the heat dissipation module can maximally utilize the system space at the upper part of the heating chip, namely, the two groups of second fin groups increase the heat dissipation area, so that the performance of the heat dissipation module can be greatly improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is an exploded view of the present utility model;
FIG. 3 is a schematic view of the square space position of the present utility model;
FIG. 4 is a schematic view of the structure of the heat pipe set and the temperature equalizing plate of the present utility model
The heat pipe type heat pipe comprises a temperature equalizing plate 1, an upper surface 11, a heat pipe group 2, a first heat pipe 21, a second heat pipe 22, a vertical part 221, a vertical part 222, a horizontal part 3, a first fin group 4, a second fin group 5, a vertical through hole 6, a vertical through groove 7, a horizontal through hole 8, a third fin group 9, a locking screw sleeve and a base plate 10.
Detailed Description
In order that the manner in which the above recited features of the present utility model are attained and can be understood in detail, a more particular description of the utility model, briefly summarized below, may be had by reference to the appended drawings and examples, which are illustrated in their embodiments, but are not intended to limit the scope of the utility model.
As shown in fig. 1 to 4, the 3D heat dissipation module for a temperature equalization plate according to the present utility model includes a temperature equalization plate 1, a heat pipe group 2 connected to the temperature equalization plate 1, a first fin group 3, and a second fin group 4 disposed on a side of the first fin group 3, where the first fin group 3 and the second fin group 4 are each composed of a plurality of heat dissipation fins. Specifically, the heat dissipation fins of the first fin group 3 are stacked on the surface of the temperature equalization plate 1 along the direction perpendicular to the temperature equalization plate 1, and the second fin group 4 is perpendicular to the stacking direction of the heat dissipation fins of the first fin group 3.
In this embodiment, the heat pipe set 2 includes a plurality of first heat pipes 21 and a plurality of second heat pipes 22 uniformly arranged on the upper surface 11, a plurality of first heat pipes 21 and a plurality of second heat pipes 22 are all of thin-walled hollow cylindrical structures, and one end vertically connected with the temperature equalization plate 1 is an open end, one end far away from the temperature equalization plate 1 is a closed end, a plurality of second heat pipes 22 are arranged on the periphery of the heat pipe set 2, and a plurality of second heat pipes 22 are L-shaped, and are bent and extended outwards through a vertical portion 221 of the second heat pipes 22 to form a horizontal portion 222 parallel to the temperature equalization plate 1, and the heat dissipation fins of the second fin set 4 are arranged along the extending direction of the horizontal portion 222. Further, the horizontal portion 222 is lower than the upper end surface of the first fin group 3.
The first fin group 3 is provided with a plurality of vertical through holes 5 which are vertically penetrated, the plurality of first heat pipes 21 are in one-to-one correspondence with the vertical through holes 5 and sleeved in the vertical through holes 5, the closed ends of the first heat pipes 21 are mutually flush with the upper end faces of the first fin group 3, vertical through grooves 6 which are vertically penetrated are arranged at the corresponding positions of the two sides of the first fin group 3 and the second heat pipes 22, the cross section of each vertical through groove 6 is U-shaped, when the first fin group 3 is installed, the vertical parts 221 of the second heat pipes 22 are positioned in the vertical through grooves 6, and the horizontal parts 222 of the second heat pipes 22 extend outwards along the opening sides of the vertical through grooves 6.
The second fin group 4 has a plurality of horizontal through holes 7 penetrating from left to right, the second fin group 4 is sleeved on the horizontal portion 222 of the second heat pipe 22 through the horizontal through holes 7, the upper end surface of the second fin group 4 and the upper end surface of the first fin group 3 are located on the same plane, and the outermost fins of the second fin group 4 are mutually flush with the closed end of the second heat pipe 22.
In this embodiment, the two second fin groups 4 are symmetrically disposed on two sides of the first fin group 3, and may be further disposed as needed, where the thickness of the first fin group 3 stacked on the upper surface 11 of the temperature equalizing plate 1 is greater than the height of the second fin group 4 in the vertical direction, so that the first fin group 3 and the second fin group 4 on two sides are in a T-shaped heat dissipation structure, and the horizontal portion 222 of the second heat pipe 22 is sleeved with the second fin group 4, thereby maximizing the utilization of the system space and increasing the heat dissipation area.
Further, since the second fin group 4 is located at the upper parts of both sides of the first fin group 3, the second heat pipe 22 has an exposed part located at the lower part of the second fin group 4 in the U-shaped vertical through groove 6, in this embodiment, the lower end of the side surface of the first fin group 3 opposite to the second fin group 4 is provided with a concave square space, and the square space is provided with a third fin group 8. The second heat pipe 22 is located between the first fin group 3 and the third fin group 8, the square space longitudinally extends from the side surface to the vertical part 221 of the second heat pipe 22, the square space transversely communicates with all vertical through grooves 6 on one side of the first fin group 3, and the third fin group 8 is square and is in clearance fit with the square space, so that the exposed part of the second heat pipe 22 is effectively covered.
In this embodiment, the overall appearance shape of the first fin group 3 may be similar to the upper surface 11 of the temperature equalizing plate 1, that is, the first fin group 3 may completely cover the upper surface 11 of the temperature equalizing plate 1.
In this embodiment, the temperature equalization plate 1 is fixed on the substrate 10 through the locking screw set 9, specifically, screw grooves are formed around the first fin group 3, the bottom of the locking screw set 9 extends to the bottom of the substrate 10 through the screw grooves, and the locking screw set 9 includes a screw and a spring sleeved on the screw.
In this embodiment, the temperature equalizing plate 1 and the heat pipe group 2 are integrally formed, so that the temperature equalizing plate 1 and the heat pipe group 2 share a cavity, thereby effectively reducing thermal resistance and improving performance of the heat dissipation module.
The structure is mounted by respectively corresponding a vertical through hole 5 and a vertical through groove 6 of a first fin group 3 to a first heat pipe 21 and a second heat pipe 22 one by one, mounting the first fin group 3 on a temperature equalizing plate 1, respectively embedding two groups of third fin groups 8 into square spaces at two sides of the first fin group 3, sleeving the second fin groups 4 at two sides on a horizontal part 222 of the second heat pipe 22 through a horizontal through hole 7, and fixing the temperature equalizing plate 1 on a substrate 10 through a locking screw sleeve 9 after furnace welding to finish mounting.
When the heat dissipation device is used, the heating chip is positioned below the center of the temperature equalization plate 1, heat conduction paste is arranged between the heating chip and the temperature equalization plate 1 for better heat conduction of the heating chip, after heat emitted by the heating chip is conducted to the central area of the bottom of the temperature equalization plate 1, the heat is rapidly dispersed to the upper surface 11 of the whole temperature equalization plate 1, one part of the heat is uniformly conducted to the first fin group 3 and the third fin group 8 through the first heat pipe 21 and the second heat pipe 22, the other part of the heat can be quickly and efficiently conducted to the second fin group 4 in an auxiliary heat dissipation mode through the heat conduction effect of the second heat pipe 22, and the heat dissipation space at the upper part of the heating chip can be fully utilized through the T-shaped structure so as to achieve better heat dissipation effect.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims (10)
- The heat-dissipation module of the 3D temperature-equalizing plate is characterized by comprising a temperature-equalizing plate (1), a heat pipe group (2) arranged on the temperature-equalizing plate (1), a first fin group (3) and a second fin group (4) which are formed by a plurality of heat-dissipation fins, wherein the heat pipe group (2) is penetrated between the heat-dissipation fins;The second fin group (4) is arranged on the side edge of the first fin group (3), and the second fin group (4) is perpendicular to the stacking direction of the radiating fins of the first fin group (3).
- 2. The heat dissipation module of the 3D heat dissipation plate as set forth in claim 1, wherein the penetrating direction of the heat pipe group (2) is the same as the stacking direction of the heat dissipation fins.
- 3. The 3D temperature equalization plate heat dissipation module as set forth in claim 1, wherein the heat dissipation fins of the first fin group (3) are stacked along a direction perpendicular to the temperature equalization plate (1).
- 4. The heat dissipation module as set forth in claim 3, wherein the heat pipe group (2) comprises a plurality of first heat pipes (21), and the first heat pipes (21) are arranged through each heat dissipation fin of the first fin group (3) in a penetrating manner through vertical through holes (5) arranged on the first fin group (3).
- 5. The 3D heat sink module according to claim 3, wherein the heat pipe group (2) comprises a plurality of second heat pipes (22), and the second heat pipes (22) have a vertical portion (221) and a horizontal portion (222) connected to each other;The vertical part (221) is penetrated with a plurality of radiating fins of the first fin group (3), and the horizontal part (222) is penetrated with a plurality of radiating fins of the second fin group (4).
- 6. The heat dissipation module for 3D heat sink as set forth in claim 3, wherein the upper end surface of the second fin group (4) and the upper end surface of the first fin group (3) are located on the same plane.
- 7. The heat radiation module for the 3D temperature equalizing plate of claim 5, wherein a concave square space is arranged at the lower end of the side surface of the first fin group (3) opposite to the second fin group (4), a third fin group (8) is arranged in the square space, and the second heat pipe (22) is positioned between the first fin group (3) and the third fin group (8).
- 8. The heat dissipation module for 3D heat sink as set forth in claim 1, wherein the second fin group (4) is a plurality of groups and is disposed on each side of the first fin group (3).
- 9. The heat dissipation module for 3D temperature equalization plates according to claim 1, wherein screw grooves are formed around the first fin group (3), and the temperature equalization plates (1) are fixed on a substrate (10) through locking screw sets (9) in the screw grooves.
- 10. The 3D temperature equalization plate heat dissipation module as set forth in claim 1, wherein a heat conducting paste is coated on the contact surface of the temperature equalization plate (1) and the heat source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420917496.8U CN222192930U (en) | 2024-04-29 | 2024-04-29 | 3D Vapor Chamber Cooling Module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420917496.8U CN222192930U (en) | 2024-04-29 | 2024-04-29 | 3D Vapor Chamber Cooling Module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222192930U true CN222192930U (en) | 2024-12-17 |
Family
ID=93835018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420917496.8U Active CN222192930U (en) | 2024-04-29 | 2024-04-29 | 3D Vapor Chamber Cooling Module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222192930U (en) |
-
2024
- 2024-04-29 CN CN202420917496.8U patent/CN222192930U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |