CN113225990B - Phase change heat sink and electronic device - Google Patents
Phase change heat sink and electronic device Download PDFInfo
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- CN113225990B CN113225990B CN202110487948.4A CN202110487948A CN113225990B CN 113225990 B CN113225990 B CN 113225990B CN 202110487948 A CN202110487948 A CN 202110487948A CN 113225990 B CN113225990 B CN 113225990B
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- 230000008859 change Effects 0.000 title claims abstract description 63
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
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- 238000009434 installation Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 239000007792 gaseous phase Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
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- 230000007704 transition Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
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- 238000007664 blowing Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a phase change radiator and an electronic device, wherein the phase change radiator comprises a temperature equalizing plate and radiating fins: the temperature equalizing plate comprises a first temperature equalizing plate and a plurality of second temperature equalizing plates, the extending direction of the first temperature equalizing plate is intersected with the extending direction of the second temperature equalizing plates, the first surface of the first temperature equalizing plate is a heating device contact surface, the second surface of the first temperature equalizing plate is in contact with the second temperature equalizing plates, and the outer walls of the second temperature equalizing plates are provided with a plurality of radiating fins; a plurality of closed vacuum cavities are arranged in the temperature equalizing plate, and phase change working media are filled in the closed vacuum cavities. The phase change working medium in the first temperature equalizing plate absorbs heat emitted by the device to be cooled and transfers the heat to the second temperature equalizing plate, so that the temperature of the device to be cooled is quickly reduced, and the heat dissipation effect of the small device to be cooled is good. And because the phase change radiator can ensure uniform temperature, the radiating effect of the device to be radiated can be greatly improved.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a phase change heat sink and an electronic device.
Background
In the field of heat dissipation, a heat sink mainly dissipates heat of a device with large heat loss, and quickly transfers heat of the device to the heat sink, so that the device can work normally and stably. In the prior art, a heat dissipation plate is generally installed on the surface of a device, and a plurality of copper plates or aluminum plates are welded on the heat dissipation plate to serve as heat dissipation fins, so that heat dissipation is performed by the heat dissipation fins. The heat conductivity coefficient of copper is about 400W/m.K, the heat conductivity coefficient of aluminum is about 200W/m.K, the thermal diffusion performance is poor, the overall temperature difference of the radiator is large, the temperature of one end close to a device is high, the temperature of one end far away from the device is low, the temperature uniformity is poor, and for small devices, the radiating surface is small, so that the temperature nonuniformity of the radiator greatly limits the radiating performance of the radiator on the small devices.
Disclosure of Invention
The invention mainly aims to provide a phase-change radiator, and aims to solve the problem that the heat radiation effect of a radiator is influenced by the uneven temperature distribution on the radiator in the prior art.
In order to achieve the above object, the present invention provides a phase change heat sink, which includes a temperature equalizing plate and heat dissipating fins:
the temperature equalizing plate comprises a first temperature equalizing plate and a plurality of second temperature equalizing plates, the extending direction of the first temperature equalizing plate is intersected with the extending direction of the second temperature equalizing plates, the first surface of the first temperature equalizing plate is a heating device contact surface, the second surface of the first temperature equalizing plate is in contact with the second temperature equalizing plates, and the outer walls of the second temperature equalizing plates are provided with a plurality of radiating fins;
a plurality of closed vacuum cavities are arranged in the temperature equalizing plate, and phase change working media are filled in the closed vacuum cavities.
Optionally, the vacuum chamber presents a capillary force to the phase change working substance.
Optionally, an extending direction of the first temperature equalizing plate is perpendicular to an extending direction of the second temperature equalizing plate.
Optionally, the plurality of second temperature-uniforming plates are arranged in parallel, each second temperature-uniforming plate includes a first temperature-uniforming plate section and a second temperature-uniforming plate section that are perpendicular to each other, the second temperature-uniforming plate section is in contact with the first temperature-uniforming plate section, and the first temperature-uniforming plate section is provided with a plurality of parallel heat dissipation fins.
Optionally, each of the second temperature equalizing plates includes a third section of temperature equalizing plate, the third section of temperature equalizing plate is parallel to the first section of temperature equalizing plate, two ends of the second section of temperature equalizing plate are respectively connected to the first section of temperature equalizing plate and the third section of temperature equalizing plate, and the third section of temperature equalizing plate is provided with a plurality of heat dissipation fins arranged in parallel.
Optionally, both ends of each second temperature equalizing plate are hermetically welded.
Optionally, a plurality of mutually independent sealed vacuum chambers are arranged in the first temperature-uniforming plate, and two ends of the first temperature-uniforming plate are welded and sealed.
Optionally, the inner wall of the vacuum cavity is provided with a capillary structure, and the capillary structure is a hole and/or a groove;
or the like, or, alternatively,
the capillary structure is a metal mesh disposed in the vacuum chamber.
Optionally, the aperture of the vacuum chamber is smaller than or equal to 3mm and a plurality of burrs are arranged in the vacuum chamber, and the distance between the plurality of burrs is smaller than 0.2mm.
The invention also provides an electronic device, which comprises a heating device and the phase change radiator, wherein the heating device is fixed on the first surface of the first temperature equalizing plate of the phase change radiator.
According to the technical scheme, a first temperature-uniforming plate and a plurality of second temperature-uniforming plates are arranged on the first temperature-uniforming plate, the extending direction of the first temperature-uniforming plate is intersected with the extending direction of the second temperature-uniforming plate, the first surface of the first temperature-uniforming plate is a heating device contact surface, the second surface of the first temperature-uniforming plate is in contact with the second temperature-uniforming plate, and a plurality of radiating fins are arranged on the outer wall of the second temperature-uniforming plate; a plurality of closed vacuum cavities are arranged in the temperature equalizing plate, and phase change working media are filled in the closed vacuum cavities. The phase change working medium in the first temperature equalizing plate absorbs heat emitted by the device to be cooled and transfers the heat to the second temperature equalizing plate, so that the temperature of the device to be cooled is quickly reduced, and the heat dissipation effect of the small device to be cooled is good. And because the phase change radiator can ensure uniform temperature, the radiating effect of the device to be radiated can be greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a phase change heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a first vapor chamber of the phase change heat sink of the present invention taken along line m-m in FIG. 1;
FIG. 3 is a schematic enlarged view of a portion A of FIG. 2;
FIG. 4 is a schematic view of a phase change heat sink according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a phase change heat sink according to another embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name(s) |
| 10 | A first temperature- |
20 | Second |
| 11 | |
21 | First section |
| 12 | |
22 | Second section |
| 13 | Second surface | 23 | Third-stage |
| 14 | Trough | 222 | Radiating fin |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicators are changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, in order to achieve the above object, the present invention provides a phase change heat sink, which includes a temperature-uniforming plate and heat dissipation fins, wherein the temperature-uniforming plate includes a first temperature-uniforming plate and a plurality of second temperature-uniforming plates 20, an extending direction of the first temperature-uniforming plate 10 intersects an extending direction of the second temperature-uniforming plate 20, a first surface 12 of the first temperature-uniforming plate 10 is a heat generating device contact surface, a second surface 13 of the first temperature-uniforming plate 10 contacts the second temperature-uniforming plate 20, and a plurality of heat dissipation fins 24 are disposed on an outer wall of the second temperature-uniforming plate 20;
the temperature equalizing plate is internally provided with a plurality of closed vacuum cavities 11, and the plurality of closed vacuum cavities 11 are filled with phase-change working media.
The phase change heat sink provided in this embodiment is used for dissipating heat of a device to be dissipated, for example, a control board or a transistor integrated module installed on the control board, and the device to be dissipated is installed on the first temperature uniforming plate 10, and heat generated by the device to be dissipated is transferred to the first temperature uniforming plate 10. The two ends of the first temperature equalizing plate 10 are welded in a sealing mode, the two ends of each second temperature equalizing plate 20 are welded in a sealing mode, a sealed vacuum cavity 11 is arranged in the first temperature equalizing plate 10, the vacuum cavity 11 is used for filling phase-change working media, the phase-change working media exist in the vacuum cavity 11 in a liquid state and a gas state, and heat on the first temperature equalizing plate 10 is taken away by phase-change media. The phase change medium may be a heat dissipation refrigerant, such as a refrigerant in an air conditioner or other refrigerant medium with better quality. In this embodiment, the cavity in which the phase change working medium is located is a vacuum cavity 11, and has a certain vacuum degree, where the vacuum degree may be below 0.2PA, and under the vacuum degree, the phase change working medium may exist in two states, a liquid state and a gaseous state, and the temperature of the liquid phase change working medium is the same as that of the gaseous phase change working medium, and meanwhile, the boiling point of the phase change working medium is reduced in an environment lower than atmospheric pressure, so that the phase change working medium in the vacuum cavity 11 can be evaporated from the liquid state to the gaseous state in the temperature environment lower than the boiling point, and the process can absorb heat of the surrounding environment. The critical temperature of the phase-change working medium evaporated from the liquid state to the gaseous state is determined by the vacuum degree of the vacuum cavity 11, and the lower the vacuum degree is, the lower the critical temperature is. The part of the device to be cooled, which is close to the vacuum cavity 11 and has the liquid refrigerant, is arranged, so that the heat emitted by the device to be cooled can be fully absorbed by the phase-change working medium, the phase-change working medium is in a gaseous state after absorbing heat and evaporating, is condensed at one end far away from the device to be cooled, and is converged into the liquid phase-change medium along the capillary structure, and the purpose of cooling the device to be cooled is achieved.
The capillary structure is used to guide the condensed phase change medium back into the liquid phase change medium. In practical application, as the device to be cooled continuously dissipates heat, the liquid phase change medium in the vacuum cavity 11 continuously absorbs heat and evaporates, the space in the vacuum cavity 11 is limited, and the gaseous phase change medium often causes air blockage to the liquid phase change medium condensed and reflowed along the inner wall of the vacuum cavity 11, so that the heat dissipation performance of the phase change heat sink is affected, the capillary structure arranged in the vacuum cavity 11 guides the phase change medium to reflow, so that the condensed phase change medium can be prevented from reflowing along the inner wall of the vacuum cavity 11, the air blockage is effectively improved, and the heat dissipation performance is improved. And because the vacuum cavity 11 has certain vacuum degree, when being lower than the critical temperature, the liquid phase-change working medium and the gaseous phase-change working medium in the vacuum cavity 11 are in a balanced state, once reaching the critical temperature, the liquid phase-change medium in the vacuum cavity 11 is heated and evaporated into gaseous state, therefore, compared with the mode that the common aluminum or copper heat-radiating plate conducts heat by virtue of the heat conductivity coefficient of the material, the phase-change heat radiator provided by the embodiment ensures more uniform temperature, can greatly improve the heat-radiating effect, can quickly transfer the heat generated by the small-sized device to be cooled which generates heat in a local small range, ensures the working performance of the small-sized electronic component, and prolongs the service life of the small-sized electronic component. In practical application, can combine phase transition radiator and ordinary heating panel to use, for example, to the calorific capacity big treat that the heat dissipation device installs the phase transition radiator, ordinary heating panel is installed to other positions to improve cost advantage, can guarantee good radiating effect again.
It can be understood that, in order to ensure reliability, a plurality of sealed vacuum chambers 11 may be formed on the first vapor chamber 10, and the vacuum chambers 11 are not communicated with each other, so that even if one vacuum chamber 11 leaks, the normal operation of the other vacuum chambers 11 is not affected.
The first vapor chamber 10 is made of copper or aluminum.
In a further embodiment, as shown in fig. 2 and 3, the capillary structure may be specifically holes and/or grooves 14 formed on the inner wall of the first vapor chamber 10 and the inner wall of the second vapor chamber 20.
The pore size of the pores and/or the width of the grooves 14 should be sufficiently thin, e.g., in this embodiment, the pore size of the pores and/or the width of the grooves 14 are less than or equal to 3mm, and the smaller the pore size of the pores and/or the width of the grooves 14, the greater the capillary force, and in a preferred embodiment, the pore size of the pores and/or the width of the grooves 14 is between 0.1mm and 0.2mm. Under the size structure, the holes and/or the grooves 14 generate capillary force on the liquid, so that the liquid flows along the holes and/or the grooves 14, and the gas blockage of the gaseous phase-change working medium on the backflow condensed phase-change working medium is avoided. As an example, very closely spaced burrs (less than 0.2mm burr spacing) may be placed in the holes and/or grooves 14 to increase capillary force.
In another embodiment, the vacuum chamber 11 itself may also be a vacuum chamber 11 with a small aperture, and burrs (the burr spacing is less than 0.2 mm) with a small spacing are arranged in the aperture, when the aperture of the vacuum chamber 11 is less than or equal to 3mm and the burrs are arranged therein, the vacuum chamber 11 itself has capillary force on the condensed liquid phase-change working medium, so as to avoid air lock. In the present embodiment, a plurality of vacuum chambers 11 (shown in fig. 2) are disposed in the second vapor chamber 20.
In an embodiment, the capillary structure is a metal mesh (not labeled in the figure) disposed in the vacuum chamber 11, the aperture of a mesh hole on the metal mesh is less than or equal to 1mm, and the metal mesh can be disposed in multiple layers, so that the mesh hole has a capillary force on the condensed liquid phase-change working medium, and the occurrence of air blockage can be avoided. Because the capillary structure has capillary force to the liquid phase change working medium of condensation, the phase change radiator that this embodiment provided can place horizontally also can place vertically, promptly, because need not rely on gravity to make the liquid phase change working medium of condensation flow back along the inner wall of vacuum chamber 11, its installation direction need not consider the influence of the factor of gravity to the liquid phase change working medium of condensation, in practical application, can install by arbitrary angle.
The phase change heat sink further comprises a second temperature-uniforming plate 20, and the second temperature-uniforming plate 20 is arranged on the surface of the first temperature-uniforming plate 10.
The second temperature equalizing plate 20 is used for accelerating the rapid cooling of the gaseous refrigerant after heat absorption and evaporation, the second temperature equalizing plate 20 is fixed on the surface of the first temperature equalizing plate 10, the first temperature equalizing plate 10 is provided with a first surface 12 and a second surface 13 which are oppositely arranged, the device to be cooled is installed on the first surface 12, the second temperature equalizing plate 20 is installed on the second surface 13, namely, the first temperature equalizing plate 10 is located between the second temperature equalizing plate 20 and the device to be cooled, and the phase change working medium in the first temperature equalizing plate 10 absorbs the heat emitted by the device to be cooled and transfers the heat to the second temperature equalizing plate 20, so as to rapidly reduce the temperature of the device to be cooled.
The second temperature equalizing plate 20 comprises a second section of temperature equalizing plate 22 and heat dissipating fins 24, the second section of temperature equalizing plate 22 is fixed on the surface of the first temperature equalizing plate 10, and the heat dissipating fins 24 are fixed on the first temperature equalizing plate 10. The installation angle of the first temperature-uniforming plate 10 and the second temperature-uniforming plate 20 can be vertical installation or inclined installation, and can be determined according to actual needs, when the first temperature-uniforming plate 10 and the second temperature-uniforming plate 20 are vertically installed, the extending direction of the first temperature-uniforming plate 10 is perpendicular to the extending direction of the second temperature-uniforming plate 20, more second temperature-uniforming plates 20 can be arranged on the first temperature-uniforming plate 10, and space is utilized to the maximum. The plurality of second temperature-uniforming plates 20 are arranged in parallel at intervals, each second temperature-uniforming plate 20 comprises a first section of temperature-uniforming plate 23 and a second section of temperature-uniforming plate 22 which are perpendicular to each other, the second section of temperature-uniforming plate 22 is in contact with the first section of temperature-uniforming plate 23, and the first section of temperature-uniforming plate 23 is provided with a plurality of parallel radiating fins 24.
The second section of uniform temperature plate 22 is used for transferring the heat of the first uniform temperature plate 10 to the first uniform temperature plate 10, the first uniform temperature plate 10 is provided with a plurality of heat dissipation fins 24, and the plurality of heat dissipation fins 24 are arranged at intervals to increase the heat dissipation area and accelerate the heat dissipation efficiency. The second section of the temperature-uniforming plate 22 and the first section of the temperature-uniforming plate 21 can be connected to form various shapes, such as a straight plate shape, an L shape (the first section of the temperature-uniforming plate 21 and the second section of the temperature-uniforming plate 22 are perpendicular to each other, as shown in fig. 4), a U shape (as shown in fig. 5), and a C shape. Because the temperature of the end of the heat dissipation fin 24 close to the second section of the temperature equalizing plate 22 is higher than the temperature of the end far from the second section of the temperature equalizing plate 22, if the heat dissipation fin 24 extends to a direction far from the second section of the temperature equalizing plate 22, the heat dissipation effect of the end of the heat dissipation fin 24 far from the second section of the temperature equalizing plate 22 is worse, therefore, in an optional embodiment, each second temperature equalizing plate 20 comprises a third section of the temperature equalizing plate 23, the third section of the temperature equalizing plate 23 is parallel to the first section of the temperature equalizing plate 21, two ends of the second section of the temperature equalizing plate 22 are respectively connected with the first section of the temperature equalizing plate 21 and the third section of the temperature equalizing plate 23, and the third section of the temperature equalizing plate 23 is provided with a plurality of heat dissipation fins 24 arranged in parallel. The heat dissipation fins 24 can be arranged on the first section of the temperature equalizing plate 21 and the third section of the temperature equalizing plate 23, at the moment, the second temperature equalizing plate 20 is in a U shape, the two opposite side surfaces of the first section of the temperature equalizing plate 21 and the third section of the temperature equalizing plate 23 are respectively provided with the heat dissipation fins 24, namely, each second temperature equalizing plate 20 is provided with two rows of the heat dissipation fins 24, so that the extension height of one end, far away from the second section of the temperature equalizing plate 22, of each heat dissipation fin 24 is limited, but the number of the heat dissipation fins 24 connected with the second section of the temperature equalizing plate 22 can be increased, the temperature uniformity can be further improved, and the heat dissipation performance is improved.
In an embodiment, as shown in fig. 5, the second section of the temperature-uniforming plate 22 has two mounting portions 222 arranged parallel to each other, where the second section of the temperature-uniforming plate 22 is U-shaped, two opposite side walls of the two mounting portions 222 are provided with a plurality of heat dissipation fins 24, and the plurality of heat dissipation fins 24 are arranged at intervals, so that a large number of heat dissipation fins 24 with low extension height can be arranged on the second section of the temperature-uniforming plate 22.
In this embodiment, the heat dissipation fins 24 and the second section of the temperature-uniforming plate 22 may be made of copper or aluminum, the first temperature-uniforming plate 10 and the second section of the temperature-uniforming plate 22 may be fixedly connected by welding or assembling by gluing, and the heat dissipation fins 24 may be welded on the second section of the temperature-uniforming plate 22.
In a further embodiment, in order to improve the temperature uniformity of the heat dissipation fins 24 and the second-stage temperature equalization plate 22, an accommodating cavity (not shown) may be further disposed in the heat dissipation fins 24 and/or the second-stage temperature equalization plate 22, and a phase change working medium is disposed in the accommodating cavity. The holding cavity can have a certain vacuum degree, so that the boiling point of the phase change working medium in the holding cavity is reduced, and the holding cavity is more sensitive to temperature change. The phase-change working medium in the accommodating cavity can exist in two states of liquid and gas, the temperature of the liquid phase-change working medium is consistent with that of the gas phase-change working medium, meanwhile, the boiling point of the phase-change working medium in the environment lower than the atmospheric pressure is reduced, so that the phase-change working medium in the accommodating cavity can be evaporated into the gas state from the liquid state in the temperature environment lower than the boiling point, and the process can absorb the heat of the surrounding environment. The critical temperature of the phase-change working medium evaporated from the liquid state to the gaseous state is determined by the vacuum degree of the accommodating cavity, and the lower the vacuum degree is, the lower the critical temperature is. In this embodiment, the vacuum degree of the accommodating cavity may be lower than that of the vacuum cavity 11, so that the phase change working medium in the accommodating cavity has a lower boiling point than that of the phase change working medium in the vacuum cavity 11, and the heat on the first temperature equalization plate 10 can be taken away quickly.
It can be understood that a plurality of second-stage temperature-equalizing plates 22 can be arranged at intervals, so that more radiating fins 24 can be installed, and the radiating effect of the whole phase-change radiator is improved. The second vapor chamber 20 may further include a blower for blowing air toward the heat dissipating fins 24 to remove heat from the surfaces of the heat dissipating fins 24.
The invention also provides an electronic device, which comprises a device to be cooled and the phase-change heat radiator, wherein the device to be cooled is fixed on the first temperature-uniforming plate 10 of the phase-change heat radiator.
The first temperature equalizing plate 10 is provided with a first surface 12 and a second surface 13 which are oppositely arranged, the device to be cooled is arranged on the first surface 12, the second temperature equalizing plate 20 is arranged on the second surface 13, namely, the first temperature equalizing plate 10 is positioned between the second temperature equalizing plate 20 and the device to be cooled, and the phase change working medium in the first temperature equalizing plate 10 absorbs heat emitted by the device to be cooled and transfers the heat to the second temperature equalizing plate 20, so that the temperature of the device to be cooled is rapidly reduced, and the heat radiating effect of the small device to be cooled is good. Because the phase change radiator can guarantee that the temperature is even, can promote the radiating effect of treating the heat dissipation device by a wide margin, simultaneously, because capillary structure has the capillary force to the liquid phase change working medium of condensation, the phase change radiator that this embodiment provided can the level place also can vertically place, also promptly, because need not rely on gravity to make the liquid phase change working medium of condensation follow the inner wall backward flow of vacuum chamber 11, the influence of the factor of gravity to the liquid phase change working medium of condensation need not be considered to its installation direction, in practical application, can arbitrary angle installation.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The phase change radiator is characterized by comprising a temperature equalizing plate and radiating fins:
the temperature equalizing plate comprises a first temperature equalizing plate and a plurality of second temperature equalizing plates, the extending direction of the first temperature equalizing plate is intersected with the extending direction of the second temperature equalizing plates, the first surface of the first temperature equalizing plate is a heating device contact surface, the second surface of the first temperature equalizing plate is in contact with the second temperature equalizing plates, and the outer walls of the second temperature equalizing plates are provided with a plurality of radiating fins;
a plurality of closed vacuum cavities are arranged in the temperature equalizing plate, and phase change working media are filled in the closed vacuum cavities;
the extending direction of the first temperature equalizing plate is vertical to the extending direction of the second temperature equalizing plate;
the plurality of second temperature equalizing plates are arranged in parallel, each second temperature equalizing plate comprises a first section of temperature equalizing plate and a second section of temperature equalizing plate which are perpendicular to each other, the second section of temperature equalizing plate is in contact with the first temperature equalizing plate, and the first section of temperature equalizing plate is provided with a plurality of parallel radiating fins.
2. The phase change heat sink of claim 1, wherein the vacuum chamber has a capillary force on the phase change working medium.
3. The phase-change heat sink according to claim 1, wherein each of the second temperature-equalizing plates comprises a third temperature-equalizing plate, the third temperature-equalizing plate is parallel to the first temperature-equalizing plate, two ends of the second temperature-equalizing plate are respectively connected to the first temperature-equalizing plate and the third temperature-equalizing plate, and the third temperature-equalizing plate is provided with a plurality of heat dissipation fins arranged in parallel.
4. The phase change heat sink as claimed in claim 1, wherein both ends of each of the second temperature equalizing plates are hermetically welded.
5. The phase change heat sink according to claim 1, wherein the second vapor chamber has a plurality of independent sealed vacuum chambers therein, and both ends of the first vapor chamber are welded and sealed.
6. The phase-change heat sink according to claim 1, wherein the inner wall of the vacuum chamber is provided with a capillary structure, the capillary structure being a hole and/or a groove;
or the like, or a combination thereof,
the capillary structure is a metal mesh disposed in the vacuum chamber.
7. The phase change heat sink according to claim 1, wherein the vacuum chamber has an aperture of 3mm or less and a plurality of burrs formed therein, the plurality of burrs being spaced apart by less than 0.2mm.
8. An electronic device, characterized in that the electronic device comprises a heat generating device and the phase change heat sink as claimed in any one of claims 1-7, wherein the heat generating device is fixed on the first surface of the first temperature equalizing plate of the phase change heat sink.
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