CN118102679A - Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof - Google Patents
Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof Download PDFInfo
- Publication number
- CN118102679A CN118102679A CN202410437173.3A CN202410437173A CN118102679A CN 118102679 A CN118102679 A CN 118102679A CN 202410437173 A CN202410437173 A CN 202410437173A CN 118102679 A CN118102679 A CN 118102679A
- Authority
- CN
- China
- Prior art keywords
- liquid cooling
- vapor chamber
- substrate
- soaking
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 193
- 238000001816 cooling Methods 0.000 title claims abstract description 154
- 230000008878 coupling Effects 0.000 title claims description 15
- 238000010168 coupling process Methods 0.000 title claims description 15
- 238000005859 coupling reaction Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 238000002791 soaking Methods 0.000 claims abstract description 89
- 238000001704 evaporation Methods 0.000 claims abstract description 53
- 230000008020 evaporation Effects 0.000 claims abstract description 46
- 239000003507 refrigerant Substances 0.000 claims abstract description 36
- 238000009833 condensation Methods 0.000 claims abstract description 23
- 230000005494 condensation Effects 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 54
- 230000004907 flux Effects 0.000 abstract description 21
- 230000006872 improvement Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a liquid cooling heat dissipation device coupled with a vapor chamber and a vapor chamber substrate thereof, wherein the liquid cooling heat dissipation device comprises the vapor chamber substrate and a liquid cooling radiator connected with the vapor chamber substrate; a soaking cavity filled with refrigerant is arranged in the soaking plate substrate, and the soaking plate comprises an evaporation end used for being contacted with a heat source and a condensation end opposite to the evaporation end, wherein the end surface area of the condensation end is larger than that of the evaporation end; the liquid cooling radiator is contacted with the condensing end of the soaking plate substrate and exchanges heat with the condensing end to condense the refrigerant which is heated and evaporated into gas in the soaking cavity into liquid. Through the arrangement of the soaking plate substrate, the large heat flux density of the heating surface of the electronic device is converted into the small heat flux density through the large-area condensing end, and the gaseous refrigerant filled in the soaking cavity can be cooled and condensed back to the liquid state at the condensing end more quickly through the liquid cooling radiator, so that the heat dissipation capacity is effectively improved, and the overall performance of the electronic device with high heat flux density can be ensured.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a liquid cooling heat dissipation device coupled with a vapor chamber and a vapor chamber substrate thereof.
Background
In recent years, high performance microelectronic devices continue to evolve toward miniaturization, compactness, and high power, resulting in an increasing effective heat flux density. While the operating state, operating stability, and lifetime of electronic devices are closely related to temperature, high heat flux density tends to place higher demands on electronic device thermal management in the case of semiconductor chips.
Compared with the air cooling heat dissipation technology, the liquid cooling heat dissipation technology has the advantages of great market application potential due to the excellent thermophysical parameters of the liquid working medium, strong heat dissipation capability and high response speed, especially the cold plate type single-phase liquid cooling heat dissipation technology, is combined with the micro-channel enhanced heat exchange technology, has good stability and high reliability, is relatively mature in technology, and is an effective application scheme for solving the problems of high-power high-heat flow heat dissipation and improving stability and reliability in the current electronic heat dissipation field.
However, with further increase of heat flux density, the heat-removing capability and temperature control of the cold plate type single-phase liquid cooling heat-dissipating technology are more and more difficult, especially, the temperature requirement of an electronic device cannot be guaranteed even under the constraint of certain specific conditions, and the heat-exchanging area is increased, however, the heat-exchanging capability of the single-phase liquid cooling technology in the horizontal direction to the periphery of the liquid cooling plate is poor, so that the heat-exchanging capability brought by the expansion area is limited, therefore, the single-phase cold plate type liquid cooling technology cannot solve the heat dissipation problem of the position with high heat flux density, especially local high heat flux, and the temperature of the local heat source surface and even the whole heat source surface is easy to exceed the required temperature range.
Disclosure of Invention
The invention provides a liquid cooling heat dissipation device of a coupling vapor chamber and a vapor chamber substrate, which are used for solving the problem of insufficient local heat dissipation capability of an electronic device with high heat flux.
In order to solve the above technical problems, in a first aspect, an embodiment of the present invention provides a liquid cooling heat dissipation device coupled to a vapor chamber, including: a vapor chamber substrate and a liquid-cooled radiator connected with the vapor chamber substrate; a soaking cavity filled with refrigerant is arranged in the soaking plate substrate, and the soaking plate substrate comprises an evaporation end used for being contacted with a heat source and a condensation end opposite to the evaporation end, wherein the end surface area of the condensation end is larger than that of the evaporation end; the liquid cooling radiator is contacted with the condensing end of the soaking plate substrate and exchanges heat with the condensing end so as to condense the refrigerant heated and evaporated into gas in the soaking cavity into liquid.
As a further improvement of the above technical scheme:
The soaking board base plate is including being equipped with the mainboard body and locating the hem on mainboard body top, the liquid cooling radiator is including locating the liquid cooling board base plate on mainboard body top, the soaking chamber is including being located the liquid cooling board base plate with between the mainboard body the cavity.
As a further improvement of the above technical scheme:
The soaking plate substrate further comprises a boss formed by protruding outwards from the bottom surface of the main plate body, an evaporation tank communicated with the concave cavity is arranged in the boss, and the boss is formed into an evaporation end of the soaking plate substrate and is used for being in contact with a heating surface of an electronic device to be cooled.
As a further improvement of the above technical scheme:
and a plurality of support columns are arranged in the concave cavities and/or the evaporation tanks, and the tops of the support columns are abutted against the liquid cooling radiator.
As a further improvement of the above technical scheme:
At least one communication hole and a soaking plate flat tube correspondingly arranged at the communication hole are arranged on the liquid cooling plate substrate; the soaking plate flat tube comprises an opening end connected with the soaking plate substrate and a corresponding closed end, a flat tube cavity is formed in the soaking plate flat tube, the flat tube cavity is communicated with the concave cavity of the main plate body through the opening end, the soaking cavity comprises the flat tube cavity, the liquid cooling radiator completely covers the concave cavity of the soaking plate substrate, and the concave cavity and the flat tube cavity form a sealed cavity.
As a further improvement of the above technical scheme:
the liquid cooling radiator further comprises a liquid cooling plate cover plate, the liquid cooling plate cover plate is installed above the liquid cooling plate substrate, a flowing cavity is formed between the liquid cooling plate cover plate and the liquid cooling plate substrate, and the closed end of the soaking plate flat tube is connected with the liquid cooling plate cover plate.
As a further improvement of the above technical scheme:
A flat pipe clamping groove is formed in the communication hole of the liquid cooling plate substrate, and the soaking plate flat pipe is connected with the liquid cooling plate substrate in a sealing manner through the flat pipe clamping groove; the flat tube positioning groove is formed in the liquid cooling plate cover plate, and the closed end of the flat tube of the soaking plate is clamped into the flat tube positioning groove and is connected with the liquid cooling plate cover plate.
As a further improvement of the above technical scheme:
The liquid cooling plate cover plate is also provided with an inlet joint connecting hole for the single-phase liquid working medium to flow into the flowing cavity and an outlet joint connecting hole for the single-phase liquid working medium to flow out of the flowing cavity.
As a further improvement of the above technical scheme:
The inlet joint connecting holes are formed in the middle of the liquid cooling plate cover plate, two outlet joint connecting holes are formed in two opposite sides of the inlet joint connecting holes; the liquid cooling board cover plate is provided with an inlet buffer groove which is connected with the inlet joint connecting hole on one side facing the liquid cooling board base plate, and the extending direction of the inlet buffer groove is perpendicular to a connecting line between the outlet joint connecting holes.
In a second aspect, an embodiment of the present invention further provides a soaking board substrate, including a main board body provided with a concave cavity, a folded edge formed at a top end of the main board body, and a boss protruding outwards from a bottom surface of the main board body; an evaporation tank communicated with the concave cavity is arranged in the boss, and the boss is formed into an evaporation end of the soaking plate substrate and is used for being contacted with a heating surface of the electronic device to be radiated; the top end of the main board body is used for being coupled with the liquid cooling radiator to form a condensation end of the soaking board substrate; the end surface area of the condensing end is larger than that of the evaporating end.
According to the liquid cooling heat dissipation device for the coupling vapor chamber, disclosed by the embodiment of the invention, the liquid cooling heat dissipation device is thermally connected with the vapor chamber substrate, the end surface area of the condensing end of the vapor chamber substrate is larger than the end surface area of the evaporating end, the vapor chamber substrate absorbs heat through the evaporating end with relatively smaller end surface area, so that the heat of a refrigerant in the vapor chamber can be quickly expanded to the whole vapor chamber through heat absorption and vaporization, the large heat flux density of the heating surface of an electronic device is converted into small heat flux density through the large-area condensing end of the vapor chamber, the gaseous refrigerant filled in the vapor chamber can be more quickly cooled at the condensing end through the liquid cooling heat dissipation device to be condensed into liquid state, the large heat flux density is converted into the small heat flux density through continuous cyclic conversion between liquid and gas to be transmitted to the liquid cooling heat dissipation device, the heat dissipation capability is effectively improved, the high-efficiency heat dissipation of the electronic device is realized, and the integral performance of the electronic device with high heat flux density can be ensured.
In the above embodiments, the embodiments of the vapor chamber substrate and the liquid cooling heat dissipation device coupled to the vapor chamber belong to the same concept, so that the embodiments of the liquid cooling heat dissipation device coupled to the vapor chamber have the same technical effects, and are not described herein.
In addition to the objects, features and advantages described above, the present invention has other objects, features and advantages. The invention will be described in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:
FIG. 1 is a schematic perspective view of a liquid-cooled heat sink according to a preferred embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic view of a vapor chamber substrate according to a preferred embodiment of the present invention;
FIG. 4 is a schematic view of a vapor chamber substrate from another perspective in accordance with a preferred embodiment of the present invention;
FIG. 5 is a schematic perspective view of a liquid-cooled plate substrate according to a preferred embodiment of the present invention;
FIG. 6 is a top view of a liquid-cooled plate substrate according to a preferred embodiment of the present invention;
FIG. 7 is a bottom view of a liquid cooled plate substrate according to a preferred embodiment of the present invention;
FIG. 8 is a schematic structural view of a flat tube of a vapor chamber according to a preferred embodiment of the present invention;
FIG. 9 is a schematic view of a liquid cooling plate cover plate according to a preferred embodiment of the present invention;
FIG. 10 is a schematic view of a liquid-cooled plate cover according to another embodiment of the present invention;
fig. 11 is a schematic flow diagram of the single-phase liquid working medium in the liquid-cooled radiator according to the preferred embodiment of the present invention (wherein the arrow direction indicates the flow direction of the single-phase liquid working medium).
The reference numerals in the drawings denote:
1. A soaking plate substrate; 11. a support column; 12. a cavity; 13. an evaporation tank; 14. a boss; 15. a main board body; 16. folding edges; 2. a liquid cooling plate substrate; 21. a heat radiation fin; 22. a flat pipe clamping groove; 23. a communication hole; 3. flat tube of vapor chamber; 31. a flat lumen; 4. a liquid cooling plate cover plate; 41. an inlet joint connection hole; 42. an outlet connector connecting hole; 43. an inlet buffer tank; 44. a flat tube positioning groove; 45. a flow chamber; 46. an outlet buffer tank; 5. an inlet fitting; 6. an outlet fitting; 7. and (5) evaporating the end.
Detailed Description
Embodiments of the invention are described in detail below with reference to the attached drawings, but the invention can be implemented in a number of different ways, which are defined and covered by the claims.
Furthermore, unless defined otherwise, technical or scientific terms used in the description of the application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the application pertains. The terms "upper," "lower," "left," "right," "center," "vertical," "horizontal," "inner," "outer," and the like as used in the description of the present application are merely used for indicating relative directions or positional relationships, and do not imply that the devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and that the relative positional relationships may be changed when the absolute position of the object to be described is changed, thus not being construed as limiting the application. The terms "first," "second," "third," and the like, as used in the description of the present application, are used for descriptive purposes only and are not to be construed as indicating or implying any particular importance to the various components. The use of the terms "a," "an," or "the" and similar referents in the description of the application are not to be construed as limiting the amount absolutely, but rather as existence of at least one. The use of the terms "comprising" or "includes" and the like in this description of the application, are intended to cover an element or article that appears before the term or article and equivalents thereof, but does not exclude other elements or articles.
It should also be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and the like as used in the description of the present application should be construed broadly, and for example, the connection may be a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can also be communicated with the inside of two elements, and the specific meaning of the two elements can be understood by a person skilled in the art according to specific situations.
As shown in fig. 1 and 2, the liquid cooling heat dissipation device of the coupling vapor chamber of the present embodiment includes: a vapor chamber substrate 1 and a liquid-cooled radiator connected to the vapor chamber substrate 1; a soaking cavity filled with refrigerant is arranged in the soaking plate substrate 1 and comprises an evaporation end 7 used for being contacted with a heat source and a condensation end opposite to the evaporation end 7, and the end surface area of the condensation end is larger than that of the evaporation end 7; the liquid cooling radiator is contacted with the condensing end of the soaking plate substrate 1 and exchanges heat with the condensing end to condense the refrigerant which is heated and evaporated into gas in the soaking cavity into liquid.
In the liquid cooling heat dissipation device of the coupling vapor chamber of the embodiment, the evaporation end 7 of the vapor chamber substrate 1 contacts with the electronic device, the liquid cooling heat dissipation device is thermally connected with the vapor chamber substrate 1, the condensation end surface area of the vapor chamber substrate 1 is larger than the evaporation end surface area, the refrigerant in the vapor chamber enables heat to be rapidly spread to the whole vapor chamber through heat absorption and vaporization, so that the large heat flux density of the heating surface of the electronic device is converted into small heat flux density through the large-area condensation end of the vapor chamber substrate 1, the gaseous refrigerant filled in the vapor chamber can be rapidly cooled and condensed back into liquid state through the liquid cooling heat dissipation device at the condensation end, the large heat flux density is converted into small heat flux density through continuous cyclic conversion of the refrigerant in the vapor chamber between the liquid and the gas and is transferred to the liquid cooling heat dissipation device, the heat dissipation capability is effectively improved, the high-efficiency heat dissipation of the electronic device is realized, and the integral performance of the electronic device with high heat flux density can be ensured.
In some embodiments, as shown in fig. 3 and 4, the soaking board substrate 1 includes a main board body 15 provided with a cavity 12 and a flange 16 provided at the top end of the main board body, the liquid cooling radiator includes a liquid cooling board substrate 2 provided at the top end of the main board body 15, and the soaking cavity includes the cavity 12 between the liquid cooling board substrate 2 and the main board body 15.
The contact area of the coupling connection between the vapor chamber substrate 1 and the liquid cooling plate substrate 2 can be increased by the arrangement of the folded edges 16, the liquid cooling plate substrate 2 is directly formed into a cover plate of the vapor chamber substrate 1, the top end of the concave cavity 12 is covered to form a condensation end of the vapor chamber substrate 1, and the refrigerant is filled in the concave cavity 12, so that a sealed cavity is formed between the vapor chamber and the concave cavity, after the evaporation end 7 of the vapor chamber substrate 1 absorbs heat to enable the refrigerant in the concave cavity 12 to be heated and vaporized, the gaseous refrigerant is rapidly cooled and condensed into liquid refrigerant after encountering the liquid cooling plate substrate 2, and then falls into the concave cavity 12, and the vapor chamber is circulated in such a way, so that efficient heat dissipation of electronic devices is realized. The liquid cooling plate substrate 2 is directly formed into the design of the cover plate of the vapor chamber substrate 1, so that when the vapor chamber and the liquid cooling radiator are coupled to form an integral liquid cooling heat dissipation device, the integral liquid cooling radiator is lighter, heat resistance between the vapor chamber and the liquid cooling radiator is reduced, and heat dissipation efficiency is improved.
Further, the vapor chamber substrate 1 further includes a boss 14 protruding outwards from the bottom surface of the main board body 15, the boss 14 is provided with an evaporation tank 13 communicating with the cavity 12, and the boss 14 is formed as the evaporation end 7 of the vapor chamber substrate 1 and is used for contacting with the heating surface of the electronic device to be heat-dissipated.
Specifically, the area of the boss 14 may be the same as the area of the heat generating surface of the electronic device, and the area of the cavity 12 is larger than the area of the evaporation tank 13. The liquid refrigerant in the soaking cavity can firstly ensure to fill the evaporation tank 13 of the boss 14, the boss 14 is directly contacted with the heating surface of the electronic device, heat is firstly transferred to the liquid refrigerant in the evaporation tank 13 of the boss 14, so that the liquid refrigerant can be quickly warmed up to be gasified, the gaseous refrigerant can be quickly filled in the whole cavity 12 (meanwhile, the liquid refrigerant in the soaking cavity can be quickly replenished into the evaporation tank 13 filled with the boss 14), the liquid cooling plate substrate 2 covered at the top end of the cavity 12 and the cavity 12 have a large contact area, namely the evaporation surface area of the soaking plate substrate 1 is small, the condensation end area is large, and the heat can be quickly expanded to the whole soaking cavity by the refrigerant in the cavity 12 through heat absorption gasification, so that the large heat flow density of the heating surface of the electronic device is converted into small heat flow density through the large condensation surface of the soaking plate substrate 1, namely the liquid cooling plate substrate 2; the bottom surface of evaporation tank 13 is lower than the bottom surface of soaking cavity, and the liquid refrigerant in cavity 12 can fill evaporation tank 13 at first, not only can accelerate the conversion efficiency of refrigerant from liquid state to gaseous state, can avoid the refrigerant to appear evaporating the dry phenomenon moreover for the heat of boss 14 that corresponds with it is taken away effectively, thereby effectively controlling the temperature of electronic device.
Further, a plurality of support columns 11 are arranged in the concave cavity 12 and/or the evaporation tank 13, and the tops of the support columns 11 are abutted against the liquid cooling radiator.
Specifically, the support columns 11 in the embodiment are disposed in the concave cavities 12 and the evaporation tanks 13, and the heights of the support columns 11 in the concave cavities 12 are equal to the heights of the concave cavities 12, and the heights of the support columns 11 in the evaporation tanks 13 are equal to the heights of the evaporation tanks 13, so that the tops of the support columns 11 can be abutted against the liquid cooling plate substrate 2, and the structural strength of the vapor chamber is enhanced.
Compared with the prior conventional scheme, the two heat dissipation elements are connected, a metal plate and soldering tin connection mode is often set, in this embodiment, the liquid cooling plate substrate 2 is directly set to be a bottom plate of the liquid cooling radiator and a cover plate of the vapor chamber, so that heat conduction resistance caused by the metal plate and soldering tin is eliminated, in addition, the liquid cooling plate substrate 2 and the vapor chamber cover plate can be integrally processed, heat transfer resistance is further reduced, temperature of an electronic device is favorably controlled, influence of high heat conduction resistance on heat dissipation performance is avoided, the liquid cooling plate substrate 2 is supported by the support columns 11, structural stability is enhanced, and compared with a soldering mode, the connection mode of the vapor chamber and the liquid cooling plate in this embodiment is more reliable.
In some embodiments, as shown in fig. 5 to 8, at least one communication hole 23 and a soaking plate flat tube 3 correspondingly installed at the communication hole 23 are arranged on the liquid cooling plate substrate 2; the soaking plate flat tube 3 comprises an opening end connected with the soaking plate substrate 1 and an opposite closed end, a flat tube cavity 31 is formed in the soaking plate flat tube 3, the flat tube cavity 31 is communicated with the concave cavity 12 of the main plate body through the opening end, the soaking cavity comprises the flat tube cavity 31, the liquid cooling radiator completely covers the concave cavity 12 of the soaking plate substrate 1, and the concave cavity 12 and the flat tube cavity 31 form a sealed cavity.
The communication holes 23 are provided in one-to-one correspondence with the flat tubes 3 of the soaking plate. Specifically, in this embodiment, six symmetrical communication holes 23 and six corresponding soaking plate flat tubes 3 are provided on the liquid cooling plate substrate 2, it should be noted that, in this embodiment, the number of the communication holes 23 is only used for illustration and is not to be construed as limiting the present application, and in other embodiments, any number of the communication holes 23 and soaking plate flat tubes 3 may be selected according to actual requirements; in this embodiment, the flat tube 3 of the vapor chamber is rectangular, and five surfaces thereof are closed sections, and form a flat tube cavity 31 by surrounding, and the remaining surface is an open end, in other embodiments, the flat tube 3 of the vapor chamber may be any flat tube with a plane opening, and the open end is pressed on the communication hole 23 of the liquid cooling plate substrate 2, so that the flat tube cavity 31 and the concave cavity 12 are communicated, and the communicated flat tube cavity 31 and the concave cavity 12 jointly form a vapor chamber for diffusing the gaseous refrigerant.
In some embodiments, as shown in fig. 9 and 10, the liquid cooling radiator further includes a liquid cooling plate cover plate 4, the liquid cooling plate cover plate 4 is installed above the liquid cooling plate substrate 2 and forms a flow cavity 45 therebetween, the closed end of the soaking plate flat tube 3 is connected with the liquid cooling plate cover plate 4, the flow cavity 45 is used for flowing a single-phase liquid working medium, so that the liquid cooling plate substrate 2 is cooled, the single-phase liquid working medium in the flow cavity 45 is also a cooling working medium, and the same as the refrigerant in the soaking cavity, in other embodiments, the refrigerant in the soaking cavity and the single-phase liquid working medium in the flow cavity 45 are different working mediums with cooling functions.
Further, a flat tube clamping groove 22 is arranged at the communication hole 23 of the liquid cooling plate substrate 2, and the soaking plate flat tube 3 is connected with the liquid cooling plate substrate 2 in a sealing way through the flat tube clamping groove 22; the liquid cooling plate cover plate 4 is provided with a flat pipe positioning groove 44, and the closed end of the soaking plate flat pipe 3 is clamped into the flat pipe positioning groove 44 to be connected with the liquid cooling plate cover plate 4.
Specifically, the flat tube clamping groove 22 is arranged in the communication hole 23 and is not completely punched, and the size of the flat tube clamping groove 22 is adapted to that of the flat tube 3 of the vapor chamber, so that the flat tube 3 of the vapor chamber can directly fall into the flat tube clamping groove 22, the flat tube 3 of the vapor chamber is in sealed connection with the liquid cooling plate substrate 2, thereby facilitating gaseous refrigerant to enter the flat tube cavity 31 from the concave cavity 12, and the gaseous refrigerant enters the flat tube 3 of the vapor chamber to exchange heat with the single-phase liquid working medium in the flow cavity 45, thereby increasing the heat exchange area of the vapor chamber and enhancing the heat exchange performance of the heat dissipating device; meanwhile, the flat tube positioning groove 44 on the liquid cooling plate cover plate 4 is matched with the flat tube 3 of the soaking plate, in the embodiment, the flat tube 3 of the soaking plate is fixedly connected through welding after being inserted into the flat tube positioning groove 44, so that the structural strength of the inside of the flowing cavity 45 is ensured.
In some embodiments, the liquid cooling plate cover plate 4 is further provided with an inlet joint connecting hole 41 for the single-phase liquid working medium to flow into the flow cavity 45 and an outlet joint connecting hole 42 for the single-phase liquid working medium to flow out of the flow cavity 45, and the single-phase liquid working medium in the flow cavity 45 circulates through the inlet joint connecting hole 41 and the outlet joint connecting hole 42, so that the temperature of the soaking plate flat tube 3 is reduced better, and the heat dissipation effect of the heat dissipation device is enhanced.
Further, the inlet joint connecting holes 41 are formed in the middle of the liquid cooling plate cover plate 4, and two outlet joint connecting holes 42 are formed in two opposite sides of the inlet joint connecting holes 41; an inlet buffer groove 43 connected with the inlet joint connecting hole 41 is arranged on one side of the liquid cooling plate cover plate 4 facing the liquid cooling plate substrate 2, and the extending direction of the inlet buffer groove 43 is perpendicular to the connecting line between the outlet joint connecting holes 42.
Specifically, the inlet connector connecting hole 41 may be disposed at a central position of the liquid cooling plate cover plate 4, the outlet connector connecting holes 42 are symmetrically disposed at two sides of the inlet connector connecting hole 41, the inlet connector connecting hole 41 is connected to the inlet connector 5, the two outlet connector connecting holes 42 are connected to the two outlet connectors 6, the inlet connector 5 and the outlet connector 6 are connected to a storage device for storing a single-phase liquid working medium, so that the single-phase liquid working medium can circularly flow in the storage device and the flow cavity 45 of the liquid cooling radiator. An inlet buffer groove 43 is formed in the position, facing the liquid cooling plate substrate 2, of the liquid cooling plate cover plate 4, an inlet buffer groove 43 is formed in the position, facing the liquid cooling plate substrate 2, of the connecting inlet joint connecting hole 41, and an outlet buffer groove is formed in the position, facing the two outlet joint connecting holes 42, of the connecting inlet joint connecting hole, and can split the single-phase liquid working medium, so that the single-phase liquid working medium can flow into the flow cavity 45 more quickly and in a larger range, and the six soaking plate flat pipes 3 can be cooled; the middle part of liquid cooling board apron 4 is located to entry joint connecting hole 41, and exit joint connecting hole 42 is two, locates the opposite both sides of entry joint connecting hole 41, because vapor end 7 of vapor chamber that the vapor chamber was the vapor chamber base plate 1 center department evaporates, the single-phase liquid working medium of the flow cavity 45 of liquid cooling board adopts the design of middle business turn over both sides, the heat transfer performance at liquid cooling board center has been strengthened, then make vapor chamber condensation end center be the condensation ability strongest at liquid cooling board base plate 2 center department, can improve vapor chamber's heat dispersion with maximum efficiency, and then improved whole heat abstractor's heat transfer performance.
In some embodiments, the liquid cooling plate substrate 2 is further provided with a plurality of groups of heat dissipation fins 21, the soaking plate flat tubes 3 are arranged between two adjacent groups of heat dissipation fins 21, the heat dissipation fins 21 and the flat tube clamping grooves 22 are distributed in an array, and the two adjacent groups of heat dissipation fins 21 form channels for placing the soaking plate flat tubes 3, so that single-phase liquid working medium flows on the channels, a plurality of soaking plate flat tubes 3 can be efficiently dissipated, and the condensation efficiency of the condensation end of the soaking plate substrate 1 is improved.
Further, each group of heat dissipation fins 21 comprises a plurality of heat dissipation fins which are arranged in parallel and at intervals, and a flow passage is formed between any two adjacent heat dissipation fins; the extending direction of the inlet buffer groove 43 is perpendicular to the extending direction of the flow channel, in the flow cavity 45 of the liquid cooling plate, single-phase liquid working medium enters the inlet buffer groove 43 from the inlet joint 5 under the action of external driving force, can flow along the guide of the inlet buffer groove 43 and flow into the micro flow channel between the cooling fins more uniformly, flow in the micro flow channel area, absorb heat transferred from the soaking plate during the flow, and flow out of the liquid cooling plate from the outlet joint 6 through the outlet buffer groove to complete heat exchange.
According to the liquid cooling heat dissipation device for the coupling vapor chamber, when the liquid cooling heat dissipation device works, heat is conducted through the boss 14 on the vapor chamber substrate 1 and transferred to the inner surface of the vapor chamber substrate 1, so that liquid refrigerant in the evaporation tank 13 absorbs heat and is gasified, gaseous refrigerant is expanded into the whole vapor chamber and contacts with the bottom surface of the liquid cooling plate substrate 2 and the inner wall surface in the flat tube cavity 31, the condensed liquid refrigerant is condensed into liquid refrigerant, and then flows back into the concave cavity 12 and the evaporation tank 13, so that heat exchange with the liquid cooling heat dissipation device is realized, in the liquid cooling heat dissipation device, as shown in fig. 11, single-phase liquid working medium enters the inlet buffer groove 43 from the inlet joint 5 under the action of external driving force, flows into a micro flow channel between cooling fins after being shunted through the inlet buffer groove 43, flows in a micro flow channel area, absorbs heat transferred from the vapor chamber, and further passes around the vapor chamber flat tube 3, absorbs heat transferred from the vapor chamber flat tube 3, and the single-phase liquid working medium after heat exchange flows out of the liquid cooling plate through the outlet buffer groove through the outlet joint 6.
The liquid cooling heat dissipation device of the coupling vapor chamber of the embodiment of the application has at least the following characteristics:
1. The heat flux density of the electronic device is effectively reduced by the design of the vapor chamber 13 in the vapor chamber, the vapor chamber and the vapor chamber, and the heat dissipation performance of the whole heat dissipation device is improved.
2. The liquid cooling plate substrate 2 is not only a bottom plate of the liquid cooling radiator, but also a cover plate of the vapor chamber, thereby reducing heat transfer thermal resistance and being beneficial to controlling the temperature of an electronic device.
3. The soaking plate is added with the soaking plate flat tube 3, so that the heat exchange area of the soaking plate is increased, the heat exchange performance of the radiator is enhanced, and the soaking plate flat tube 3 can be used as an internal supporting structure of the internal flow cavity 45 of the liquid cooling radiator, so that the structural strength of the liquid cooling radiator is enhanced.
4. The vapor chamber evaporation end 7 is arranged at the center of the bottom surface of the vapor chamber substrate 1, the evaporation tank in the vapor chamber 7 is lower than the bottom surface of the evaporation cavity, and the single-phase liquid working medium of the liquid cooling radiator adopts the design of middle inlet and outlet at two sides, so that the heat exchange performance of the center of the liquid cooling radiator is enhanced, the condensation capacity of the vapor chamber condensation end center, namely the center of the liquid cooling plate substrate 2, is strongest, the heat dissipation performance of the vapor chamber can be improved at maximum efficiency, and the heat exchange performance of the whole radiator is improved.
In another aspect of the embodiment of the present application, there is further provided a soaking board substrate, including a main board body 15 provided with a cavity 12, a folded edge 16 formed at the top end of the main board body, and a boss 14 formed to protrude outwards from the bottom surface of the main board body; an evaporation tank 13 communicated with the concave cavity 12 is arranged in the boss 14, and the boss 14 is formed into an evaporation end 7 of the vapor chamber substrate 1 and is used for being contacted with a heating surface of an electronic device to be radiated; the top end of the main board body 15 is used for being coupled with the liquid cooling radiator to form a condensation end of the vapor chamber substrate 1; the end surface area of the condensing end is larger than the end surface area of the evaporating end 7.
The soaking plate substrate of the embodiment is applied to the liquid cooling heat dissipation device coupled with the soaking plate, so that the heat flux density of an electronic device can be effectively reduced, and the heat dissipation effect is enhanced.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A liquid-cooled heat sink coupled to a vapor chamber, comprising: a vapor chamber substrate (1) and a liquid-cooled radiator connected with the vapor chamber substrate (1), wherein the liquid-cooled radiator covers the vapor chamber substrate (1);
A soaking cavity filled with refrigerant is arranged in the soaking plate substrate (1), and the soaking plate substrate comprises an evaporation end (7) used for being contacted with a heat source and a condensation end opposite to the evaporation end (7), wherein the end surface area of the condensation end is larger than that of the evaporation end (7);
The liquid cooling radiator is in contact with the condensing end of the soaking board substrate (1) and performs heat exchange with the condensing end so as to condense the refrigerant heated and evaporated into gas in the soaking cavity into liquid.
2. The liquid cooling heat dissipating device for coupling a vapor chamber according to claim 1, wherein the vapor chamber substrate (1) comprises a main plate body (15) provided with a cavity (12) and a flange (16) provided at a top end of the main plate body (15), the liquid cooling heat dissipating device comprises a liquid cooling plate substrate (2) provided at a top end of the main plate body (15), and the vapor chamber comprises the cavity (12) between the liquid cooling plate substrate (2) and the main plate body (15).
3. The liquid cooling heat dissipating device for coupling a vapor chamber according to claim 2, wherein the vapor chamber substrate (1) further comprises a boss (14) formed to protrude outward from the bottom surface of the main board body (15), an evaporation tank (13) communicating with the cavity (12) is provided in the boss (14), and the boss (14) is formed as the evaporation end (7) of the vapor chamber substrate (1) for contacting with a heat generating surface of an electronic device to be heat dissipated.
4. A liquid-cooled heat sink coupled to a vapor chamber according to claim 3, wherein a plurality of support columns (11) are disposed in the cavity (12) and/or the evaporation tank (13), and the top of the support column (11) abuts against the liquid-cooled heat sink.
5. The liquid cooling heat radiating device for coupling a vapor chamber according to claim 2, wherein the liquid cooling plate substrate (2) is provided with at least one communication hole (23) and vapor chamber flat tubes (3) correspondingly arranged at the communication holes (23);
The soaking plate flat tube (3) comprises an opening end connected with the soaking plate substrate (1) and a corresponding closed end, a flat tube cavity (31) is formed in the soaking plate flat tube (3), the flat tube cavity (31) is communicated with the concave cavity (12) of the main plate body (15) through the opening end, the soaking cavity comprises the flat tube cavity (31), and the liquid cooling radiator completely covers the concave cavity (12) of the soaking plate substrate (1), so that the concave cavity (12) and the flat tube cavity (31) form a sealed cavity.
6. The liquid cooling heat radiating device for coupling a soaking plate according to claim 5, wherein the liquid cooling heat radiator further comprises a liquid cooling plate cover plate (4), the liquid cooling plate cover plate (4) is installed above the liquid cooling plate substrate (2) and forms a flow cavity (45) therebetween, and the closed end of the soaking plate flat tube (3) is connected with the liquid cooling plate cover plate (4).
7. The liquid cooling heat sink coupled with a soaking plate according to claim 6, wherein a flat tube clamping groove (22) is provided at the communication hole (23) of the liquid cooling plate substrate (2), and the soaking plate flat tube (3) is connected with the liquid cooling plate substrate (2) in a sealing manner through the flat tube clamping groove (22);
The flat tube positioning groove (44) is formed in the liquid cooling plate cover plate (4), and the closed end of the soaking plate flat tube (3) is clamped into the flat tube positioning groove (44) and connected with the liquid cooling plate cover plate (4).
8. The liquid cooling heat dissipating device for coupling a vapor chamber according to claim 6, wherein the liquid cooling plate cover plate (4) is further provided with an inlet joint connection hole (41) for the single-phase liquid working medium to flow into the flow chamber (45), and an outlet joint connection hole (42) for the single-phase liquid working medium to flow out of the flow chamber (45).
9. The liquid cooling heat dissipating device for coupling a vapor chamber according to claim 8, wherein the inlet joint connection holes (41) are provided in the middle of the liquid cooling plate cover plate (4), and the two outlet joint connection holes (42) are provided on opposite sides of the inlet joint connection holes (41);
An inlet buffer groove (43) connected with the inlet joint connecting hole (41) is formed in one side, facing the liquid cooling plate substrate (2), of the liquid cooling plate cover plate (4), and the extending direction of the inlet buffer groove (43) is perpendicular to a connecting line between the outlet joint connecting holes (42).
10. The soaking board substrate is characterized by comprising a main board body (15) provided with a concave cavity (12), a folded edge (16) formed at the top end of the main board body (15) and a boss (14) formed by protruding outwards from the bottom surface of the main board body (15);
An evaporation tank (13) communicated with the concave cavity (12) is arranged in the boss (14), and the boss (14) is formed into an evaporation end (7) of the soaking board substrate (1) and is used for being in contact with a heating surface of an electronic device to be radiated;
The top end of the main board body (15) is used for being coupled with a liquid cooling radiator to form a condensation end of the soaking board substrate (1); the end surface area of the condensing end is larger than that of the evaporating end (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437173.3A CN118102679A (en) | 2024-04-11 | 2024-04-11 | Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410437173.3A CN118102679A (en) | 2024-04-11 | 2024-04-11 | Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118102679A true CN118102679A (en) | 2024-05-28 |
Family
ID=91150819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410437173.3A Pending CN118102679A (en) | 2024-04-11 | 2024-04-11 | Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118102679A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119376511A (en) * | 2024-12-25 | 2025-01-28 | 苏州元脑智能科技有限公司 | Server cooling device and server |
| CN119677070A (en) * | 2025-02-19 | 2025-03-21 | 深圳市顺熵科技有限公司 | Temperature-averaged liquid cooling plate heat dissipation device and liquid cooling circulation heat dissipation system |
-
2024
- 2024-04-11 CN CN202410437173.3A patent/CN118102679A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119376511A (en) * | 2024-12-25 | 2025-01-28 | 苏州元脑智能科技有限公司 | Server cooling device and server |
| CN119376511B (en) * | 2024-12-25 | 2025-05-06 | 苏州元脑智能科技有限公司 | Server cooling device and server |
| CN119677070A (en) * | 2025-02-19 | 2025-03-21 | 深圳市顺熵科技有限公司 | Temperature-averaged liquid cooling plate heat dissipation device and liquid cooling circulation heat dissipation system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8833435B2 (en) | Microscale cooling apparatus and method | |
| JPH04233259A (en) | Removal device of heat | |
| CN113613468B (en) | Brazing refrigerant radiator | |
| CN213816733U (en) | Heat dissipation device and laser light source | |
| US12336149B2 (en) | Heat sink and communication device | |
| CN111681999A (en) | A vacuum heat-conducting cavity soaking plate and an air-cooled heat sink | |
| CN112188792A (en) | Heat radiator | |
| CN118102679A (en) | Liquid cooling heat abstractor of coupling vapor chamber and vapor chamber base plate thereof | |
| CN211457823U (en) | Air conditioner and fin type phase change heat dissipation control box thereof | |
| JP2005229102A (en) | heatsink | |
| CN114599216A (en) | Phase-change cooling energy-storage converter | |
| CN206909027U (en) | Radiator and cooling system | |
| CN222674767U (en) | Liquid cooling device coupled with vapor chamber and vapor chamber substrate thereof | |
| WO2025039513A1 (en) | Inverter and heat sink | |
| CN115551301B (en) | Cooling systems and electronic equipment | |
| JPH06120382A (en) | Semiconductor cooling equipment | |
| CN209745070U (en) | Phase change heat dissipation device | |
| WO2024234693A1 (en) | Heat dissipation assembly, elevator control cabinet, and elevator | |
| CN214581473U (en) | Radiator and air conditioner outdoor unit | |
| JPH1054624A (en) | Thermoelectric cooling device | |
| CN213244790U (en) | Heat radiator | |
| WO2023236698A1 (en) | Heat dissipator and air conditioner outdoor unit | |
| CN113225990B (en) | Phase change heat sink and electronic device | |
| JP2006202798A (en) | heatsink | |
| WO2021077631A1 (en) | Radiator and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |