CN215068111U

CN215068111U - Heat dissipation base for notebook computer

Info

Publication number: CN215068111U
Application number: CN202120952510.4U
Authority: CN
Inventors: 曾观林
Original assignee: Anker Innovations Co Ltd
Current assignee: Anker Innovations Co Ltd
Priority date: 2021-05-06
Filing date: 2021-05-06
Publication date: 2021-12-07
Anticipated expiration: 2031-05-06

Abstract

The utility model discloses a heat dissipation base for notebook computer, include: the semiconductor refrigerating sheet comprises a refrigerating surface and a heating surface which are oppositely arranged; the lower surface of the heat conducting plate is in contact with the refrigerating surface of the semiconductor refrigerating sheet, and the upper surface of the heat conducting plate is in contact with the bottom shell of the notebook computer; the heat pipe is arranged below the semiconductor refrigerating sheet, and one part of the heat pipe is in contact with the heating surface of the semiconductor refrigerating sheet; the heat dissipation plate is arranged below the heat pipe, the upper surface of the heat dissipation plate is in contact with a part of the heat pipe, and the heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate which are arranged at two ends of the heat pipe; the radiator comprises a first radiator arranged below the first radiating plate and a second radiator arranged below the second radiating plate; and the fan comprises a first fan arranged below the first heat dissipation plate and a second fan arranged below the second heat dissipation plate.

Description

Heat dissipation base for notebook computer

Technical Field

The utility model relates to a radiator technical field particularly relates to a heat dissipation base for notebook computer.

Background

A Notebook Computer (Notebook Computer) is a personal Computer with a small and portable body, and can meet various requirements of users for office work, entertainment, operation and the like at any time and any place. However, the notebook computer has poor heat dissipation effect, affects the operation performance and the service life of hardware, and even causes a crash in severe cases. Therefore, the external heat dissipation base for helping the notebook computer to dissipate heat is widely applied.

However, the existing notebook computer heat dissipation base only uses a fan to blow air to the bottom of the notebook computer, and the heat dissipation effect is not good. When the environmental temperature is very high, the notebook computer cannot be controlled at a lower temperature, so that the CPU fan of the notebook computer works at full speed, higher fan noise is brought, and greater emotional fluctuation is caused to a user.

Therefore, there is a need for a new heat dissipation base for a notebook computer to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In the summary section a series of concepts in a simplified form is introduced, which will be described in further detail in the detailed description section. The inventive content does not imply any attempt to define the essential features and essential features of the claimed solution, nor is it implied to be intended to define the scope of the claimed solution.

The utility model provides a heat dissipation end for notebook computer, include:

the semiconductor refrigerating sheet comprises a refrigerating surface and a heating surface which are oppositely arranged;

the lower surface of the heat conducting plate is in contact with the refrigerating surface of the semiconductor refrigerating sheet, and the upper surface of the heat conducting plate is in contact with the bottom shell of the notebook computer;

the heat pipe is arranged below the semiconductor refrigerating sheet, and one part of the heat pipe is in contact with the heating surface of the semiconductor refrigerating sheet;

the heat dissipation plate is arranged below the heat pipe, the upper surface of the heat dissipation plate is in contact with a part of the heat pipe, and the heat dissipation plate at least comprises a first heat dissipation plate and a second heat dissipation plate which are arranged at two ends of the heat pipe;

the radiator at least comprises a first radiator arranged below the first radiating plate and a second radiator arranged below the second radiating plate;

the fan at least comprises a first fan arranged below the first heat dissipation plate and a second fan arranged below the second heat dissipation plate.

Further, the radiator and the fan are arranged on the same horizontal plane.

Further, the fan is arranged in an upward blowing mode and used for directly blowing the lower surface of the heat dissipation plate.

Further, the heat dissipation plate further comprises a third heat dissipation plate arranged below the semiconductor refrigeration piece.

Further, the area of the lower surface of the heat conducting plate is larger than the area of the refrigerating surface of the semiconductor refrigerating sheet.

Further, the lower surface of the heat conducting plate completely covers the refrigerating surface of the semiconductor refrigerating sheet.

Further, the heat conductive plate includes an aluminum plate.

Further, the heat dissipation plate includes a copper plate.

Further, the temperature of the cooling surface ranges from 0 ° to 10 °, and the temperature difference between the heating surface and the cooling surface ranges from 30 ° to 40 °.

According to the utility model provides a heat dissipation base for notebook computer, the refrigeration surface through making the semiconductor refrigeration piece contacts heat-conducting plate and heat pipe respectively with the surface of heating, then sets up radiator and fan below heating panel and heating panel at the both ends of heat pipe, has reduced the thickness of heat dissipation base, has improved the radiating efficiency when realizing that the heat dissipation base is frivolous.

Drawings

The following drawings of the present invention are used herein as part of the present invention for understanding the present invention. There are shown in the drawings, embodiments and descriptions of the invention, which are used to explain the principles of the invention.

In the drawings:

fig. 1 is a schematic view of a heat-dissipating base according to an exemplary embodiment of the present invention;

fig. 2 is an exploded schematic view of a heat-dissipating base according to an exemplary embodiment of the present invention;

fig. 3 is a front view of a heat-dissipating base according to an exemplary embodiment of the present invention;

fig. 4 is a top view of a heat-dissipating base according to an exemplary embodiment of the present invention;

fig. 5 is a bottom view of a heat dissipation base according to an exemplary embodiment of the present invention.

Reference numerals

1. Semiconductor refrigerating plate

11. Refrigeration surface

12. Heating surface

2. Heat conducting plate

3. Heat pipe

4. Heat radiation plate

5. Heat radiator

6. Fan with cooling device

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.

In order to thoroughly understand the utility model, a detailed description will be provided in the following description to illustrate the waste incineration power generation emergency emission supervision system, the analysis system and the user terminal equipment. It is apparent that the practice of the invention is not limited to the specific details familiar to those skilled in the art of waste treatment. The preferred embodiments of the present invention are described in detail below, however, other embodiments of the present invention are possible in addition to these detailed descriptions.

It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Exemplary embodiments according to the present invention will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity, and the same elements are denoted by the same reference numerals, and thus the description thereof will be omitted.

To the problem that current notebook heat dissipation base form is thick and heavy, the radiating effect is poor, the utility model provides a new heat dissipation base for notebook computer, as shown in fig. 1-5, include:

the semiconductor refrigerating sheet 1 comprises a refrigerating surface 11 and a heating surface 12 which are oppositely arranged;

the lower surface of the heat conducting plate is in contact with the refrigerating surface 11 of the semiconductor refrigerating sheet, and the upper surface of the heat conducting plate is in contact with the bottom shell of the notebook computer;

the heat pipe 3 is arranged below the semiconductor chilling plate 1, and a part of the heat pipe 3 is in contact with the heating surface 12 of the semiconductor chilling plate;

the heat dissipation plate 4 is arranged below the heat pipe 3, the upper surface of the heat dissipation plate is in contact with a part of the heat pipe, and the heat dissipation plate 4 at least comprises a first heat dissipation plate and a second heat dissipation plate which are arranged at two ends of the heat pipe;

the radiator 5 at least comprises a first radiator arranged below the first heat dissipation plate and a second radiator arranged below the second heat dissipation plate;

and the fan 6 at least comprises a first fan arranged below the first heat dissipation plate and a second fan arranged below the second heat dissipation plate.

Illustratively, a semiconductor cooling chip 1, also called a semiconductor Cooler (TEC), is a cooling device. In principle, the semiconductor refrigerating sheet is a heat transfer tool, when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current to pass through, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold and hot end. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts of the two types are equal, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset. The temperature of the cold and hot ends will not change continuously.

For example, TEC is formed by arranging a plurality of N-type and P-type semiconductor particles, and NP is connected to a common conductor to form a complete circuit, usually copper, aluminum or other metal conductor, and finally sandwiched by two ceramic plates, which must be insulating and thermally conductive. The heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials of TEC, and the bismuth telluride elements are electrically connected in series and generate heat in parallel.

Illustratively, when current flows through a TEC, the heat generated by the current is transferred from one side of the TEC to the other, creating a "hot" side and a "cold" side on the TEC, which is the principle of heating and cooling of the TEC. The direction and magnitude of the current through the TEC determines whether the TEC cools or heats, and the rate of cooling or heating.

In one embodiment, the semiconductor chilling plate 1 comprises a chilling surface 11 and a heating surface 12 which are oppositely arranged, wherein the temperature of the chilling surface 11 ranges from 0 degrees to 10 degrees, and the temperature difference between the heating surface 12 and the chilling surface 11 ranges from 30 degrees to 40 degrees.

The semiconductor refrigeration piece is applied to the heat dissipation base to assist the notebook computer to dissipate heat, and the notebook computer cooling device has the following advantages:

(1) the heat dissipation efficiency is high;

(2) the refrigeration speed is fast: under the condition that the heat dissipation of the hot end is good and the cold end is idle, the refrigerating sheet can reach the maximum temperature difference in less than one minute after being electrified;

(3) no refrigerant is needed, and no pollution is caused;

(4) the continuous operation can be realized;

(5) the working process has no vibration and noise.

A heat conducting plate 2 is exemplarily disposed above the semiconductor chilling plate 1, and specifically, a lower surface of the heat conducting plate is in contact with a chilling surface 11 of the semiconductor chilling plate, as shown in fig. 1 to 5.

In order to rapidly diffuse the cold generated by the refrigerating surface 11 of the semiconductor refrigerating sheet, the heat conducting plate 2 is made of a heat conducting material easy to conduct.

Illustratively, the thermally conductive plate is made of a metal material, including but not limited to aluminum.

In one embodiment, the thermally conductive plate 2 is an aluminum plate or block.

In order to improve the heat (cold) conduction efficiency of the heat conduction plate, the contact area between the lower surface of the heat conduction plate and the refrigerating surface 11 of the semiconductor refrigerating sheet needs to be increased as much as possible.

Illustratively, the area of the lower surface of the heat conducting plate is larger than the area of the cooling surface 11 of the semiconductor cooling plate.

Further, the lower surface of the heat conducting plate completely covers the refrigerating surface 11 of the semiconductor refrigerating sheet.

In one embodiment, as shown in fig. 1-5, the cooling surface 11 of the semiconductor chilling plate is completely attached to the lower surface of the heat conducting plate, so that the cooling energy generated by the cooling surface 11 of the semiconductor chilling plate is rapidly diffused throughout the heat conducting plate.

Further, the upper surface of the heat conducting plate is in contact with the bottom shell of the notebook computer.

Because the upper surface of the heat conducting plate is contacted with the bottom shell of the notebook computer, the notebook computer can be cooled. In order to improve the cooling efficiency of the notebook computer, the contact area between the upper surface of the heat conducting plate and the bottom shell of the notebook computer needs to be increased as much as possible.

In one embodiment, the upper surface of the heat conducting plate is completely attached to the bottom shell of the notebook computer, so that the notebook computer can be cooled quickly.

Exemplarily, a heat pipe 3 is disposed below the semiconductor chilling plate 1, and specifically, a portion of the heat pipe 3 is in contact with a heating surface 12 of the semiconductor chilling plate, as shown in fig. 1 to 5.

Illustratively, a heat pipe is a heat transfer element that relies on the phase change of its internal working fluid to effect heat transfer. The heat pipe is generally composed of a pipe shell, a wick and an end cover, wherein a proper amount of working liquid is filled after the pipe is pumped into negative pressure, and the wick capillary porous material tightly attached to the inner wall of the pipe is filled with the liquid and then sealed. One end of the tube is an evaporation section (heating section), the other end is a condensation section (cooling section), and a heat insulation section can be arranged between the two sections according to application requirements.

Illustratively, when one end of the heat pipe is heated, the liquid in the capillary wick evaporates and vaporizes, the vapor flows to the other end under a slight pressure difference to release heat and condense into liquid, and the liquid flows back to the evaporation section along the porous material under the action of capillary force. The circulation is not completed, and the heat is transferred from one end of the heat pipe to the other end. The heat pipe comprises the following main processes which are related to each other in the process of realizing the heat transfer: (1) heat is transferred to a liquid-vapor interface from a heat source through the wall of the heat pipe and a liquid absorption core filled with working liquid; (2) the liquid evaporates at the liquid-vapor interface in the evaporation zone; (3) the steam in the steam cavity flows from the evaporation section to the condensation section; (4) the steam condenses at the vapor-liquid interface in the condensing section; (5) heat is transferred from the vapor-liquid interface to the cold source through the liquid absorption core, the liquid and the pipe wall; (6) the condensed working fluid is returned to the evaporator end by capillary action in the wick.

In one embodiment, as shown in fig. 1-5, the intermediate portion (evaporator end) of the heat pipe 3 interfaces with the heating surface 12 of the semiconductor chilling plate. In order to improve the heat dissipation efficiency of the heat pipe, the contact area between the outer wall of the heat pipe and the heating surface 12 of the semiconductor chilling plate needs to be increased as much as possible.

The heat pipe is applied to the heat dissipation base to assist the notebook computer in heat dissipation, and the notebook computer has the following advantages:

(1) the heat dissipation efficiency is high;

(2) the heat transfer speed is high: the heat is rapidly led out by utilizing the phase change process of the medium and through convection conduction;

(3) the circulation speed is high: the medium circulates rapidly in the heat pipe, and the heat source is continuously led out;

(4) the working process has no vibration and noise.

Exemplarily, a heat dissipation plate 4 is disposed below the heat pipe 3, and specifically, an upper surface of the heat dissipation plate 4 is in contact with a portion of the heat pipe 3, as shown in fig. 1 to 5.

In one embodiment, the heat dissipation plate 4 is connected to both ends (condensation section) of the heat pipe 3. In order to improve the heat dissipation efficiency, the contact area between the outer wall of the heat pipe and the upper surface of the heat dissipation plate needs to be increased as much as possible.

In order to rapidly dissipate the heat conducted from the heating surface 12 of the semiconductor chilling plate by the heat pipe 3, the heat dissipation plate 4 is made of a heat-conductive material.

Illustratively, the heat dissipation plate is made of a metal material, including but not limited to copper.

In one embodiment, the heat dissipation plate is a copper plate.

Exemplarily, the heat dissipation plate 4 includes at least a first heat dissipation plate and a second heat dissipation plate disposed at both ends of the heat pipe.

In one embodiment, as shown in fig. 1 to 5, the first heat dissipation plate and the second heat dissipation plate are respectively located at two ends of the heat pipe 3, the first heat dissipation plate and the second heat dissipation plate do not overlap with the semiconductor chilling plate in the vertical direction, or the first heat dissipation plate and the second heat dissipation plate overlap with the semiconductor chilling plate only for a small part in the vertical direction (not exceeding 1/4 of the area of the heating surface 12 of the semiconductor chilling plate).

Further, the heat dissipation plate 4 further includes a third heat dissipation plate disposed below the semiconductor chilling plate.

In one embodiment, as shown in fig. 1 to 5, the third heat dissipation plate is located in the middle of the heat pipe 3 (below the semiconductor cooling plate), and the first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are not connected.

By providing the heat dissipation plates at both ends of the heat pipe, the heat dissipation area of the heating surface 12 of the semiconductor chilling plate is expanded, and specifically, by the combination of the heat pipe and the heat dissipation plates, the heat dissipation area of the semiconductor chilling plate is expanded in the horizontal direction from the heating surface 12 to the first heat dissipation plate area, the second heat dissipation plate area, and the space area below the semiconductor chilling plate (i.e., the third heat dissipation plate area). Compared with the heat dissipation device which is only arranged in the vertical direction of the semiconductor refrigeration sheet, the heat dissipation device expands the heat dissipation area in the horizontal direction, is beneficial to realizing the lightness and thinness of the heat dissipation base, and can improve the heat dissipation efficiency.

Exemplarily, a heat sink 5 is disposed below the heat dissipation plate 4.

Illustratively, the heat sink 5 includes a plurality of fins extending in a direction perpendicular to the extending direction of the heat radiating plate 4.

In one embodiment, the plurality of fins of the heat sink 5 extend downward.

In one embodiment, as shown in fig. 1-5, a first heat sink is disposed below the first heat sink, and a second heat sink is disposed below the second heat sink.

Exemplarily, a fan 6 is disposed below the heat dissipation plate 4.

Illustratively, the fan 6 is arranged in an upward blowing manner for blowing directly the lower surface of the heat radiating plate 4.

In one embodiment, as shown in fig. 1-5, a first fan is disposed below the first heat sink, and a second fan is disposed below the second heat sink.

The embodiment of the utility model provides an in the fan be used for assisting the local heat dissipation of heating panel 4, with only rely on the fan to blow to notebook bottom and carry out radiating base and compare, the utility model provides a fan can select for use small, the low fan of power, and need not to keep high-speed operation for a long time, has reduced the noise that the fan brought.

Illustratively, the heat sink 5 and the fan 6 are disposed on the same horizontal plane, i.e., the heat sink 5 and the fan 6 do not overlap in a vertical direction.

Through setting up radiator and fan on same horizontal plane, dispel the heat to the different regions of heating panel respectively, compare with arranging radiator and fan perpendicularly, expanded the ascending heat dissipation region of horizontal direction, be favorable to realizing the frivolousization of heat dissipation base, can improve the radiating efficiency simultaneously.

The present invention has been described in terms of the above embodiments, but it is to be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many more modifications and variations are possible in light of the teaching of the present invention and are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A heat dissipation base for a notebook computer, comprising:

2. The heat dissipating base of claim 1, wherein the heat sink and the fan are disposed on a same horizontal plane.

3. The heat dissipating base of claim 1, wherein the fan is arranged in an upward blowing manner for blowing straight on the lower surface of the heat dissipating plate.

4. The heat dissipation base of claim 1, wherein the heat dissipation plate further comprises a third heat dissipation plate disposed below the semiconductor chilling plate.

5. The heat dissipation base of claim 1, wherein an area of a lower surface of the thermally conductive plate is greater than an area of a cooling surface of the semiconductor chilling plate.

6. The heat dissipation base of claim 5, wherein the lower surface of the thermally conductive plate completely covers the cooling surface of the semiconductor chilling plate.

7. The heat dissipation base of claim 1, wherein the thermally conductive plate comprises an aluminum plate.

8. The heat dissipating base of claim 1, wherein the heat dissipating plate comprises a copper plate.

9. The heat dissipation base of claim 1, wherein the temperature of the cooling surface is in the range of 0 ° to 10 °, and the temperature difference between the heating surface and the cooling surface is in the range of 30 ° to 40 °.