CN111540715A - An IGBT controller self-cooling radiator - Google Patents
An IGBT controller self-cooling radiator Download PDFInfo
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- CN111540715A CN111540715A CN202010364001.XA CN202010364001A CN111540715A CN 111540715 A CN111540715 A CN 111540715A CN 202010364001 A CN202010364001 A CN 202010364001A CN 111540715 A CN111540715 A CN 111540715A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
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Abstract
本发明公开一种IGBT控制器自冷散热器,包括水冷板、冷凝器和水冷管道,所述冷凝器设置于所述水冷板的上方,所述水冷板内填充有冷却液,所述冷凝器的内部抽真空处理,所述冷凝器的上表面安装有若干第一散热片,所述水冷管道的两端分别连通所述水冷板和冷凝器。本设计结构简单科学,占用空间小,采用了冷凝器内部抽真空的方案,在水冷板上挤出铝翅片增加散热面积使之与空气进行自然对流,同时在冷凝器表面增加散热片,使用冷却风扇对散热片进行散热以达到对控制器进行冷却的效果,适于推广应用。
The invention discloses a self-cooling radiator for an IGBT controller, comprising a water-cooling plate, a condenser and a water-cooling pipe, the condenser is arranged above the water-cooling plate, the water-cooling plate is filled with cooling liquid, and the condenser The interior of the condenser is evacuated, a plurality of first cooling fins are installed on the upper surface of the condenser, and the two ends of the water-cooling pipe are respectively connected to the water-cooling plate and the condenser. The design is simple and scientific in structure, takes up little space, adopts the scheme of vacuuming inside the condenser, extrudes aluminum fins on the water-cooling plate to increase the heat dissipation area to allow natural convection with the air, and at the same time adds heat sinks on the surface of the condenser, using The cooling fan dissipates heat on the heat sink to achieve the effect of cooling the controller, which is suitable for popularization and application.
Description
技术领域technical field
本发明涉及散热器结构领域,具体为一种IGBT控制器自冷散热器。The invention relates to the field of radiator structures, in particular to a self-cooling radiator for an IGBT controller.
背景技术Background technique
电机控制器绝缘栅双极型晶体管(Insulated Gate Bipolar Transistor,IGBT)散热性能以及成为影响电机乃至电动汽车安全性、可靠性及动力性的重要因素。由于现在电机控制器的集成化越来越小,所以热流密度越来越大。所以对电机控制器的冷却至关重要,影响其使用效果及寿命。目前,市面上的控制器散热器多采用自然冷却,风冷以及水冷,自然冷却采用散热器紧贴着控制器的方案,散热器与控制器之间涂抹一层高导热硅脂,减少接触热阻,控制器把热量传递到散热器,散热器通过热传导作用把散热器基板温度传递到翅片,翅片与空气进行自然对流带走热量。液冷散热器,通过水冷板把控制器的热传导到冷却液,通过水泵或者冷水机组对冷却液进行冷却,以达到冷却液循环使用的效果。但是自然冷却散热效率低,所带走热量少;水冷散热器由于需要外接循环水泵或者冷水机组,虽然散热效果较好,但增加了耗电量,安装难度,维护难度等,同时集成度不高,占地大。The heat dissipation performance of the insulated gate bipolar transistor (IGBT) of the motor controller has become an important factor affecting the safety, reliability and power of the motor and even the electric vehicle. Since the integration of motor controllers is getting smaller and smaller, the heat flux density is getting bigger and bigger. Therefore, the cooling of the motor controller is very important, which affects its use effect and life. At present, most of the controller radiators on the market use natural cooling, air cooling and water cooling. The natural cooling adopts the scheme that the radiator is close to the controller, and a layer of high thermal conductivity silicone grease is applied between the radiator and the controller to reduce contact heat. The controller transfers the heat to the radiator, the radiator transfers the temperature of the radiator substrate to the fins through thermal conduction, and the fins and the air carry out natural convection to take away the heat. The liquid-cooled radiator conducts the heat of the controller to the cooling liquid through the water-cooling plate, and cools the cooling liquid through the water pump or the chiller, so as to achieve the effect of circulating the cooling liquid. However, the heat dissipation efficiency of natural cooling is low, and the heat taken away is small; the water-cooled radiator needs an external circulating water pump or a chiller, although the heat dissipation effect is good, but it increases the power consumption, installation difficulty, maintenance difficulty, etc., and the integration degree is not high. , occupies a large area.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于克服现有技术提及的问题,现提供一种IGBT控制器自冷散热器。The purpose of the present invention is to overcome the problems mentioned in the prior art, and now provides a self-cooling radiator for an IGBT controller.
本发明解决其技术问题所采用的技术方案是:一种IGBT控制器自冷散热器,包括水冷板、冷凝器和水冷管道,所述冷凝器设置于所述水冷板的上方,所述水冷板内填充有冷却液,所述冷凝器的内部抽真空处理,所述冷凝器的上表面安装有若干第一散热片,所述水冷管道的两端分别连通所述水冷板和冷凝器。由于内部抽真空的冷凝器连通了水冷板的冷却流道,降低了冷却液(水)的沸点,使冷却液更容易气化以带走更多热量到冷凝器,通过冷凝器的散热片散热带走热量,冷却液(水)在冷凝器散热液化后回流至水冷板处形成循环。The technical solution adopted by the present invention to solve the technical problem is as follows: an IGBT controller self-cooling radiator, comprising a water-cooling plate, a condenser and a water-cooling pipe, wherein the condenser is arranged above the water-cooling plate, and the water-cooling plate is arranged above the water-cooling plate. The inside is filled with cooling liquid, the inside of the condenser is evacuated, a number of first fins are installed on the upper surface of the condenser, and the two ends of the water-cooling pipe are respectively connected to the water-cooling plate and the condenser. Because the condenser evacuated inside is connected to the cooling channel of the water-cooled plate, the boiling point of the cooling liquid (water) is lowered, and the cooling liquid is easier to vaporize to take more heat to the condenser, and dissipate heat through the cooling fins of the condenser The heat is taken away, and the cooling liquid (water) flows back to the water-cooling plate to form a circulation after the condenser is dissipated and liquefied.
进一步的,所述冷凝器的上表面形成有若干散热柱,每一所述第一散热片上均设有配合所述散热柱的安装孔,所述第一散热片由上至下间隔安装于所述散热柱上。其中,所述第一散热片呈波浪形,增加与空气的接触面积;所述第一散热片与所述散热柱采用过盈配合,并且所述第一散热片与所述散热柱连接处涂抹有导热硅脂,减少接触热阻增加导热。Further, a plurality of heat dissipation columns are formed on the upper surface of the condenser, each of the first heat dissipation fins is provided with mounting holes for matching the heat dissipation columns, and the first heat dissipation fins are installed at intervals from top to bottom. on the cooling column. Wherein, the first heat sink is in a wave shape to increase the contact area with the air; the first heat sink and the heat dissipation column adopt an interference fit, and the connection between the first heat sink and the heat dissipation column is painted There is thermal grease to reduce contact thermal resistance and increase thermal conductivity.
进一步的,还包括有冷却风扇,所述冷却风扇通过螺栓安装在所述冷凝器上,并对所述第一散热片鼓风冷却。Further, a cooling fan is also included, and the cooling fan is mounted on the condenser through bolts and blows air to cool the first radiating fins.
进一步的,所述水冷板由水冷板壳体和水冷板底板组成,所述水冷板壳体上设有连接igbt控制器的连接孔,所述水冷板壳体和水冷板底板采用搅拌摩擦焊焊接,所述水冷板底板上设有第二散热片,所述水冷板底板与第二散热片采用挤铝成型工艺一体挤出,较少了焊接次数,减少了焊接热阻;所述冷凝器的底部采用钎焊焊接于所述第二散热片上。Further, the water-cooled plate is composed of a water-cooled plate shell and a water-cooled plate bottom plate, the water-cooled plate shell is provided with a connection hole for connecting the igbt controller, and the water-cooled plate shell and the water-cooled plate bottom plate are welded by friction stir welding. , the bottom plate of the water-cooled plate is provided with a second heat sink, and the bottom plate of the water-cooled plate and the second heat sink are extruded integrally by an aluminum extrusion molding process, which reduces the number of welding times and reduces the welding thermal resistance; The bottom is welded on the second heat sink by brazing.
进一步的,所述冷凝器由冷凝器壳体和冷凝器顶板组成,所述冷凝器壳体和冷凝器顶板采用搅拌摩擦焊焊接,所述散热柱采用钎焊焊接于所述冷凝器顶板上。Further, the condenser is composed of a condenser shell and a condenser top plate, the condenser shell and the condenser top plate are welded by friction stir welding, and the heat dissipation column is welded on the condenser top plate by brazing.
本发明的有益效果是:本设计结构简单科学,采用了冷凝器内部抽真空的方案,在水冷板上挤出铝翅片增加散热面积使之与空气进行自然对流,同时在冷凝器表面增加散热片,使用冷却风扇对散热片进行散热以达到对控制器进行冷却的效果;同时,把散热片,水冷板,冷凝器集成在一起,减小了占用空间。The beneficial effects of the invention are as follows: the design structure is simple and scientific, adopts the scheme of vacuuming inside the condenser, extrudes aluminum fins on the water-cooling plate to increase the heat dissipation area to make it conduct natural convection with the air, and at the same time increases heat dissipation on the surface of the condenser The cooling fan is used to dissipate heat from the heat sink to achieve the effect of cooling the controller; at the same time, the heat sink, the water cooling plate and the condenser are integrated to reduce the occupied space.
附图说明Description of drawings
图1为本发明的结构分解图;Fig. 1 is the structure exploded view of the present invention;
图2为本发明的结构立体图;Fig. 2 is the structural perspective view of the present invention;
图3为本发明的第一散热片与散热柱结构连接示意图。FIG. 3 is a schematic diagram of the structural connection between the first heat sink and the heat sink of the present invention.
具体实施方式Detailed ways
下面结合附图对本发明进行进一步的说明。The present invention will be further described below with reference to the accompanying drawings.
如图1至图3所示,一种IGBT控制器自冷散热器,包括水冷板、冷凝器和水冷管道1,所述水冷板由水冷板壳体9和水冷板底板7组成,所述水冷板壳体9上设有连接igbt控制器8的连接孔,igbt控制器8与水冷板壳体9使用螺栓连接,;两者之间接触处涂抹高导热系数硅脂减少热阻,所述水冷板壳体9和水冷板底板7采用搅拌摩擦焊焊接;所述冷凝器由冷凝器壳体6和冷凝器顶板3组成,所述冷凝器壳体6和冷凝器顶板3采用搅拌摩擦焊焊接;所述冷凝器设置于所述水冷板的上方,所述水冷板内填充有冷却液,所述冷凝器的内部抽真空处理,所述冷凝器顶板3的上表面安装有若干散热柱2,所述散热柱2采用钎焊焊接于所述冷凝器顶板3上,所述散热柱2上安装有若干第一散热片4,每一所述第一散热片4上均设有配合所述散热柱2的安装孔,所述第一散热片4由上至下间隔安装于所述散热柱2上。所述水冷管道1的两端分别连通所述水冷板和冷凝器,所述冷凝器上安装有对所述第一散热片4鼓风冷却的冷却风扇5。其中,所述第一散热片4呈波浪形,所述第一散热片4与所述散热柱2采用过盈配合,并且所述第一散热片4与所述散热柱2连接处涂抹有导热硅脂,减少接触热阻增加导热。所述水冷板底板7上设有第二散热片,所述水冷板底板7与第二散热片采用挤铝成型工艺一体挤出,较少了焊接次数,减少了焊接热阻;所述冷凝器壳体6的底部采用钎焊焊接于所述第二散热片上。As shown in Figures 1 to 3, an IGBT controller self-cooling radiator includes a water-cooled plate, a condenser and a water-cooled
由于内部抽真空的冷凝器连通了水冷板的冷却流道,降低了冷却液(水)的沸点,当冷却液为水时,水在1000pa时沸点为6.9696℃,在2000pa时沸点为17.495℃,在101325pa时沸点为100℃,当对流道内部抽真空时,水的沸点会降低,真空度越高,沸点越低,在控制器发热时,水吸热,发生相变反应从而带走热量,该热量为工作液体的蒸发潜热,水蒸汽会通过水冷管道进入冷凝器,冷凝器的冷却风扇以及第一散热片会使水蒸气温度降低瞬间冷凝为水回流入水冷板,从而形成循环对控制器达到冷却效果,因此,在内部流道,只有水冷板内部充满液态水,在水气化时通过水冷管道进入冷凝器中。同时在水冷板底板与冷凝器壳体之间的第二散热片也会带走一部分热量,该第二散热片的翅片在宽度方面应该保证足够的支持强度以及工艺加工难度,建议翅片高度/厚度≤8,翅片检具/翅片高度>0.28时散热效果最佳。对于顶部散热翅片,强制空气对流换热系数对于其中,V为散热片附近流速,L为沿着流体运动方向,当L越小,对流换热系数越大,所以此处风扇固定在散热翅片长边处会产生更大的对流换热系数。Since the condenser evacuated inside is connected to the cooling channel of the water-cooled plate, the boiling point of the cooling liquid (water) is lowered. When the cooling liquid is water, the boiling point of water is 6.9696°C at 1000pa, and 17.495°C at 2000pa. At 101325pa, the boiling point is 100°C. When the inside of the flow channel is evacuated, the boiling point of water will decrease. The higher the vacuum degree, the lower the boiling point. When the controller heats up, the water absorbs heat and undergoes a phase change reaction to take away heat. This heat is the latent heat of evaporation of the working liquid. The water vapor will enter the condenser through the water cooling pipe. The cooling fan of the condenser and the first heat sink will reduce the temperature of the water vapor and instantly condense it into water and return to the water cooling plate, thus forming a cycle for the controller. To achieve the cooling effect, therefore, in the internal flow channel, only the inside of the water-cooled plate is filled with liquid water, which enters the condenser through the water-cooled pipe when the water is vaporized. At the same time, the second heat sink between the bottom plate of the water-cooling plate and the condenser shell will also take away a part of the heat. The fins of the second heat sink should ensure sufficient support strength and processing difficulty in terms of width. It is recommended that the height of the fins be / Thickness ≤ 8, fin gauge / fin height > 0.28 when the heat dissipation effect is the best. For top fins, the forced air convection heat transfer coefficient is Among them, V is the flow velocity near the heat sink, and L is the direction of fluid movement. When L is smaller, the convective heat transfer coefficient is larger, so here the fan is fixed at the long side of the heat dissipation fin, which will produce a larger convection heat transfer coefficient. .
以上所述者,仅为本发明的较佳实施例而已,当不能以此限定本发明实施的范围,即大凡依本发明申请专利范围及发明说明内容所作的简单的等效变化与修饰,皆仍属本发明专利涵盖的范围内。The above are only preferred embodiments of the present invention, and should not limit the scope of implementation of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the description of the invention are all It still falls within the scope covered by the patent of the present invention.
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CN114430649A (en) * | 2022-01-15 | 2022-05-03 | 坎德拉(深圳)新能源科技有限公司 | Heat dissipation device of motor controller and motor controller of flywheel energy storage system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201518567U (en) * | 2009-08-26 | 2010-06-30 | 富准精密工业(深圳)有限公司 | Radiating die set |
CN103062728A (en) * | 2011-10-19 | 2013-04-24 | 杨同彦 | Large-power light-emitting diode (LED) heat dissipation mechanism |
US20140293541A1 (en) * | 2013-03-26 | 2014-10-02 | Ge Energy Power Conversion Technology Ltd | Heat pipe heat sink for high power density |
CN106486433A (en) * | 2016-12-30 | 2017-03-08 | 株洲时代金属制造有限公司 | Igbt radiator |
-
2020
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201518567U (en) * | 2009-08-26 | 2010-06-30 | 富准精密工业(深圳)有限公司 | Radiating die set |
CN103062728A (en) * | 2011-10-19 | 2013-04-24 | 杨同彦 | Large-power light-emitting diode (LED) heat dissipation mechanism |
US20140293541A1 (en) * | 2013-03-26 | 2014-10-02 | Ge Energy Power Conversion Technology Ltd | Heat pipe heat sink for high power density |
CN106486433A (en) * | 2016-12-30 | 2017-03-08 | 株洲时代金属制造有限公司 | Igbt radiator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114430649A (en) * | 2022-01-15 | 2022-05-03 | 坎德拉(深圳)新能源科技有限公司 | Heat dissipation device of motor controller and motor controller of flywheel energy storage system |
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