WO2017213009A1

WO2017213009A1 - Film cutout method

Info

Publication number: WO2017213009A1
Application number: PCT/JP2017/020377
Authority: WO
Inventors: 宏太仲井; 直孝樋口; 勝則高田; 岩本　正樹; 雄基大瀬
Original assignee: 日東電工株式会社
Priority date: 2016-06-10
Filing date: 2017-06-01
Publication date: 2017-12-14
Also published as: JP2017219800A; TW201801841A; KR102328501B1; JP6754621B2; TWI757301B; CN109313303A; CN109313303B; KR20190015290A

Abstract

Provided is a method for cutting out a film using laser light while preventing film cracking. This film cutout method includes cutting out a film that includes polarizers using laser light irradiation and forming a cutout part of a prescribed shape in the film. The angle formed by a line A tangent to the cutout part at an initial cutting point by the laser light irradiation or a side B of the cutout part that includes the initial cutting point and the absorption axis for the polarizers is 0 - 85° or 95 - 180°.

Description

How to cut out film

The present invention relates to a film cutting method. More specifically, the present invention relates to a film cutting method using laser light.

Conventionally, polarizing plates are used in image display devices and the like, but in recent years, with the diversification of uses of image display devices, the shapes of polarizing plates used in the image display devices are also diversified. For example, in a vehicle-mounted image display device (for example, an image display device used for an instrument panel), a polarizing plate or the like that is cut into a predetermined shape and has a cut-out portion may be used.

Generally, laser light irradiation is known as one of means for cutting out a film. However, in a polarizing plate including a polarizer obtained through a stretching process, there is a problem that cracks are likely to occur from the starting point and the ending point of laser light irradiation.

JP 2005-326831 A

The present invention has been made to solve the above-described conventional problems, and a main object of the present invention is to provide a method of cutting out a film with a laser beam while preventing cracking of the film.

The film cutting method of the present invention includes cutting a film containing a polarizer by laser light irradiation, and forming a cut-out portion having a predetermined shape on the film, and tangent to the cut-out portion at a cutting start point by the laser light irradiation. The angle between A or the side B of the cutout including the start point and the absorption axis of the polarizer is 0 ° to 85 ° or 95 ° to 180 °.
In one embodiment, an angle formed between the tangent line A or the side B and the absorption axis of the polarizer is 0 ° to 60 ° or 120 ° to 180 °.
In one embodiment, the tangent A or side B and the absorption axis of the polarizer are parallel.

According to the present invention, the film can be cut out by laser light while preventing cracking of the film by setting the cut-out starting point by laser light irradiation to a specific position.

(A) And (b) is a figure explaining the cutting method of the film by one Embodiment of this invention. It is a figure explaining the cutting method of the film by another embodiment of this invention.

The film cutting method of the present invention includes cutting a film containing a polarizer by laser light irradiation and forming a cutout portion having a predetermined shape on the film.

The film containing a polarizer may be a polarizer alone or a film containing a polarizer (preferably one polarizer) and other layers. Examples of the other layers include a protective layer for protecting the polarizer and a layer composed of any appropriate optical film. In one embodiment, a polarizing plate is used as a film including a polarizer. The polarizing plate may include a polarizer and a protective layer disposed on at least one side of the polarizer. Moreover, you may use the laminated body of a polarizing plate, a surface protection film, and / or a separator as a film containing a polarizer. The surface protective film or the separator is detachably laminated on the polarizing plate via any appropriate pressure-sensitive adhesive. In this specification, the “surface protective film” is a film that temporarily protects the polarizing plate, and is different from the protective layer (layer that protects the polarizer) provided in the polarizing plate.

The polarizer is typically a swelling treatment, a stretching treatment, a dyeing treatment with a dichroic substance (eg, iodine, an organic dye, etc.), a crosslinking treatment, a washing treatment, It can be obtained by performing various treatments such as a drying treatment. Generally, a polarizer obtained through a stretching treatment has a characteristic that cracks are likely to occur, but according to the present invention, a film can be cut out while preventing cracks.

The thickness of the film containing the polarizer is not particularly limited, and an appropriate thickness can be adopted depending on the purpose, and is, for example, 20 μm to 200 μm. The thickness of the polarizer is also not particularly limited, and an appropriate thickness can be adopted depending on the purpose. The thickness of the polarizer is typically about 1 μm to 80 μm, preferably 3 μm to 40 μm.

The size of the film including the polarizer is not particularly limited, and may be an appropriate size according to the purpose. In one embodiment, the film including the polarizer has a rectangular shape or a square shape including a side parallel to the absorption axis of the polarizer, and the length of the side parallel to the absorption axis of the polarizer is from 10 mm to 400 mm, and the length of the other side is 10 mm to 500 mm.

1 (a) and 1 (b) are diagrams illustrating a film cutting method according to an embodiment of the present invention. FIG. 1 (a) shows a film 100 including a polarizer at the time of starting cutting by laser light irradiation, that is, at the time of irradiating the cutting start point 11 with laser light. FIG. 1B shows a film after the cutting by laser light irradiation, that is, a film 110 having a cutout portion 10. In the present embodiment, first, the film 100 including the polarizer is obtained by irradiating the cutting start point 11 with a laser beam and then continuously irradiating the outer shell 12 of the portion to be cut out. Cut out, a substantially circular cutout 10 is formed in the film.

When the clipping start point 11 is on a curve (for example, in the case of the embodiment shown in FIG. 1), the angle formed by the tangent A of the clipping portion at the clipping start point 11 by laser light irradiation and the absorption axis X of the polarizer is 0 ° to 85 ° or 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, and particularly preferably Is 0 ° to 30 ° or 150 ° to 180 °. Most preferably, the tangent line A and the absorption axis X are parallel. In the present specification, “parallel” includes a case where they are substantially parallel, and specifically includes a case where an angle formed by two directions is 0 ° to 5 °. Further, when an angle is referred to in the present specification, the angle includes an angle in both a clockwise direction and a counterclockwise direction unless otherwise specified.

When the shape of the cutout portion is a substantially circular shape, the diameter can be set to any appropriate length depending on the use of the film. The diameter is, for example, 2 mm to 100 mm. According to the present invention, it is possible to prevent a crack and cut out a cutout portion having a small diameter. For example, a substantially circular cutout having a diameter of 2 mm to 50 mm (preferably 2 mm to 10 mm) can be formed while preventing cracks.

FIG. 2 is a diagram for explaining a film cutting method according to another embodiment of the present invention. FIG. 2 shows a film including a polarizer at the time of starting cutting by laser light irradiation, that is, at the time of irradiating laser light to the cutting start point 11 ′. In the present embodiment, a film including a polarizer is obtained by first irradiating the cut-out starting point 11 ′ with laser light and then continuously irradiating the outline 12 ′ of the portion to be cut out. And a substantially rectangular cut-out portion is formed on the film. As illustrated in FIG. 2, when the cutout start point is on a straight line, the angle formed between the side B including the cutout start point 11 ′ and the absorption axis X of the polarizer is 0 ° to 85 ° or 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, particularly preferably 0 ° to 30 ° or It is 150 ° to 180 °. Most preferably, the side B and the absorption axis X are parallel. When the shape of the cut-out portion is substantially rectangular, the short side is preferably 2 mm to 100 mm, more preferably 2 mm to 50 mm, still more preferably 2 mm to 30 mm, and particularly preferably 2 mm to 10 mm. is there. The long side is preferably 5 mm to 400 mm, more preferably 5 mm to 200 mm, still more preferably 5 mm to 120 mm, and particularly preferably 5 mm to 40 mm.

The shape of the cutout portion is not limited to the shape shown in FIGS. Examples of the shape of the cutout portion include a substantially square shape and a substantially elliptical shape in addition to a substantially circular shape and a substantially rectangular shape. Further, the shape of the cutout portion may be a shape formed by appropriately combining a straight line and a curve, or a shape composed of a plurality of curves having different curvatures. When the outline of the cutout portion has a vertex and / or a connection point between a straight line and a curve, it is preferable not to use the vertex and the connection point as a cutout start point.

The area ratio of the cutout portion is, for example, 10% to 50% with respect to the area of the film including the polarizer (the film before the cutout).

In the present invention, by setting the cut-out starting point to a specific position as described above, the film can be cut out by laser light while preventing cracking of the film containing the polarizer. In the case where a cutout portion having a predetermined shape is formed by laser light, laser light irradiation is started from the cutout start point, and after the cutout portion is formed, the laser light returns to the cutout start point. That is, the starting point and the ending point of laser light irradiation are the same part. Therefore, at the cutout start point which is the starting point and the end point of laser light irradiation, the cutout portion has a small but convex portion (a convex portion protruding to the film side having the cutout portion) as shown in FIG. It will be. In the present invention, it is considered that cracking of the film can be prevented by setting the cut-out starting point, that is, the convex portion that can be a trigger for the crack, to the specific position with reference to the absorption axis of the polarizer. The film cut out by the method of the present invention has sufficient durability against severe temperature changes (for example, a heat cycle of −40 ° C. to 85 ° C.), and does not easily crack.

The laser beam preferably includes light having a wavelength of 200 nm to 11000 nm.

Any appropriate laser can be adopted as the laser used for laser light irradiation. For example, any suitable laser can be employed. Specific examples include gas lasers such as CO ₂ laser and excimer laser; solid-state lasers such as YAG laser; semiconductor lasers and the like.

As the laser light irradiation conditions (output conditions, moving speed, number of times), any appropriate conditions can be adopted depending on the film material, the film thickness, and the like.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.

[Example 1]
Laser light was irradiated, and a circular cutout (diameter 20 mm) was cut out from a 72 mm square polarizer. The angle formed between the tangent line of the cutout at the cutout start point and the absorption axis of the polarizer was set to 0 °. The distance between each side of the polarizer and the center of the cutout was 30 mm.
The laser light irradiation conditions were as follows.
Wavelength: 9.4 μm
Pulse width: 8μs
Output: 10V
Frequency: 12.5kHz
Processing speed: 400mm / sec

[Example 2]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed between the tangent line of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 30 °.

[Example 3]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed between the tangent line of the cutout portion at the cutout start point and the absorption axis of the polarizer was set to 45 °.

[Example 4]
The polarizer was cut out in the same manner as in Example 1 except that the angle between the tangent line of the cutout starting point and the absorption axis of the polarizer was 60 °.

[Comparative Example 1]
The polarizer was cut out in the same manner as in Example 1 except that the angle formed by the tangent line of the cutout portion at the cutout start point and the absorption axis of the polarizer was 90 °.

[Evaluation]
Polarizers having cutout portions obtained in Examples and Comparative Examples were subjected to a heat shock test. In the heat shock test, one cycle is 30 minutes in an environment of 85 ° C and 30 minutes in an environment of -40 ° C, and the appearance of the polarizer after 200 cycles and 300 cycles is visually confirmed. did.
The heat shock test was performed on five samples, and the occurrence rate of cracks (0% when no sample was cracked: 0%, when cracks occurred on five samples: 100%) was obtained. The results are shown in Table 1.

The film cutting method of the present invention is suitably used when manufacturing an optical film such as a polarizer plate.

10 Cutout part 11, 11 'Cutout start point 100 Film

Claims

Cutting out a film containing a polarizer by laser light irradiation, and forming a cutout portion of a predetermined shape in the film;
The angle between the tangent line A of the cutout portion at the cutout start point by laser light irradiation or the side B of the cutout portion including the start point and the absorption axis of the polarizer is 0 ° to 85 ° or 95 ° to 180 °. is there,
How to cut out film.
The film cutting method according to claim 1, wherein an angle formed between the tangent line A or the side B and the absorption axis of the polarizer is 0 ° to 60 ° or 120 ° to 180 °.
The film cutting method according to claim 1 or 2, wherein the tangent line A or side B and the absorption axis of the polarizer are parallel to each other.