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TW201801841A - Film cutout method - Google Patents

Film cutout method Download PDF

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Publication number
TW201801841A
TW201801841A TW106119003A TW106119003A TW201801841A TW 201801841 A TW201801841 A TW 201801841A TW 106119003 A TW106119003 A TW 106119003A TW 106119003 A TW106119003 A TW 106119003A TW 201801841 A TW201801841 A TW 201801841A
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Taiwan
Prior art keywords
film
cutting
polarizing element
laser light
absorption axis
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TW106119003A
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Chinese (zh)
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TWI757301B (en
Inventor
仲井宏太
樋口直孝
高田勝則
岩本正樹
大瀨雄基
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日東電工股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Polarising Elements (AREA)
  • Laser Beam Processing (AREA)

Abstract

Provided is a method for cutting out a film using laser light while preventing film cracking. This film cutout method includes cutting out a film that includes polarizers using laser light irradiation and forming a cutout part of a prescribed shape in the film. The angle formed by a line A tangent to the cutout part at an initial cutting point by the laser light irradiation or a side B of the cutout part that includes the initial cutting point and the absorption axis for the polarizers is 0-85 DEG or 95-180 DEG.

Description

薄膜之切割方法Cutting method of film

本發明係關於一種薄膜之切割方法。更詳細而言，本發明係關於一種使用雷射光之薄膜之切割方法。The invention relates to a method for cutting a film. More specifically, the present invention relates to a method for cutting a film using laser light.

先前以來，於圖像顯示裝置等中使用偏光板，但近年來，伴隨圖像顯示裝置之用途之多樣化，用於該圖像顯示裝置之偏光板之形狀亦多樣化。例如，於車載圖像顯示裝置(例如，用於儀錶面板之圖像顯示裝置)中，有時使用切割為特定形狀且具有切割部之偏光板等。 一般地，作為切割薄膜之方法之一，已知有雷射光照射。然而，於包含經過延伸步驟而獲得之偏光元件之偏光板中，有容易以雷射光照射之起點·終點為起點而產生裂紋之問題。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2005-326831號公報Polarizing plates have been used in image display devices and the like, but in recent years, with the diversification of the uses of image display devices, the shapes of polarizing plates used in the image display devices have also diversified. For example, in an in-vehicle image display device (for example, an image display device for an instrument panel), a polarizing plate or the like that is cut into a specific shape and has a cut portion is sometimes used. Generally, as one of methods for cutting a thin film, laser light irradiation is known. However, in a polarizing plate including a polarizing element obtained through an extension step, there is a problem that cracks easily occur from the starting point and the ending point of laser light irradiation. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2005-326831

[發明所欲解決之問題] 本發明係為了解決上述先前之課題而完成者，其主要目的在於提供一種防止薄膜之裂紋並且藉由雷射光對薄膜進行切割之方法。 [解決問題之技術手段] 本發明之薄膜之切割方法係包含藉由雷射光照射對包含偏光元件之薄膜進行切割而於該薄膜形成特定形狀之切割部的步驟，且該雷射光照射之切割開始點上之切割部之切線A、或包含該開始點之切割部之邊B與偏光元件之吸收軸所成之角為0°～85°或95°～180°。 於一實施形態中，上述切線A或邊B與偏光元件之吸收軸所成之角為0°～60°或120°～180°。 一實施形態中，上述切線A或邊B與偏光元件之吸收軸平行。 [發明之效果] 根據本發明，可藉由將雷射光照射之切割開始點設為特定之位置，而防止薄膜之裂紋並且藉由雷射光對薄膜進行切割。[Problems to be Solved by the Invention] The present invention has been made in order to solve the above-mentioned previous problems, and its main object is to provide a method for preventing cracking of a film and cutting the film by laser light. [Technical means to solve the problem] The cutting method of the film of the present invention includes the steps of cutting a film including a polarizing element by laser light irradiation to form a cutting portion of a specific shape on the film, and the laser light cutting starts The angle formed by the tangent line A of the cutting portion at the point or the edge B of the cutting portion including the starting point and the absorption axis of the polarizing element is 0 ° to 85 ° or 95 ° to 180 °. In one embodiment, an angle formed by the tangent line A or the side B and the absorption axis of the polarizing element is 0 ° to 60 ° or 120 ° to 180 °. In one embodiment, the tangent line A or the side B is parallel to the absorption axis of the polarizing element. [Effects of the Invention] According to the present invention, it is possible to prevent the film from being cracked and cut the film by the laser light by setting the cutting start point of the laser light irradiation to a specific position.

本發明之薄膜之切割方法包含藉由雷射光照射對包含偏光元件之薄膜進行切割而於該薄膜形成特定形狀之切割部的步驟。 包含偏光元件之薄膜可為偏光元件單體，亦可為包含偏光元件(較佳為1片偏光元件)與其他層之薄膜。作為其他層，可列舉保護偏光元件之保護層、由任意之適當之光學薄膜構成之層等。於一實施形態中，作為包含偏光元件之薄膜，使用偏光板。偏光板可具備偏光元件及配置於該偏光元件之至少一側之保護層。又，作為包含偏光元件之薄膜，亦可使用偏光板與表面保護薄膜及/或隔片之積層體。表面保護薄膜或隔片係經由任意之適當之黏著劑而可剝離地積層於偏光板。於本說明書中，所謂「表面保護薄膜」係指暫時保護偏光板之薄膜，係與偏光板所具備之保護層(保護偏光元件之層)不同者。 偏光元件代表性地可藉由對樹脂薄膜(例如聚乙烯醇系樹脂薄膜)實施膨潤處理、延伸處理、利用二色性物質(例如碘、有機染料等)進行之染色處理、交聯處理、洗淨處理、乾燥處理等各種處理而獲得。一般地，經過延伸處理而獲得之偏光元件具有容易產生裂紋之特性，但根據本發明，可防止裂紋並且對薄膜進行切割。 包含偏光元件之薄膜之厚度並無特別限制，可根據目的而採用適當之厚度，例如為20 μm～200 μm。又，偏光元件之厚度亦無特別限制，可根據目的而採用適當之厚度。偏光元件之厚度代表性地為1 μm～80 μm左右，較佳為3 μm～40 μm。 包含偏光元件之薄膜之尺寸並無特別限制，可根據目的而設為適當之尺寸。於一實施形態中，包含偏光元件之薄膜係包含與偏光元件之吸收軸平行之邊之長方形狀或正方形狀，與偏光元件之吸收軸平行之邊之長度為10 mm～400 mm，其他邊之長度為10 mm～500 mm。 圖1(a)及圖1(b)係說明本發明之一實施形態之薄膜之切割方法之圖。於圖1(a)中，表示開始藉由雷射光照射進行之切割之時間點、即對切割開始點11照射雷射光之時間點之包含偏光元件之薄膜100。於圖1(b)中，表示藉由雷射光照射進行之切割結束後之薄膜、即具有切割部10之薄膜110。於本實施形態中，首先，對切割開始點11照射雷射光，繼而，將該雷射光連續地照射至欲切割之部分之外廓12，藉此，對包含偏光元件之薄膜100進行切割，而於該薄膜形成大致圓形狀之切割部10。 於切割開始點11位於曲線上之情形(例如，圖1所示之實施形態之情形)時，雷射光照射之切割開始點11上之切割部之切線A與偏光元件之吸收軸X所成之角為0°～85°或95°～180°，較佳為0°～60°或120°～180°，更佳為0°～45°或135°～180°，特佳為0°～30°或150°～180°。最佳為切線A與吸收軸X平行。於本說明書中，所謂「平行」，包含實質上平行之情形，具體而言，包含2個方向所成之角為0°～5°之情形。又，於本說明書中，提及角度時，只要不特別明示，則該角度包含順時針方向及逆時針方向之兩個方向之角度。 於切割部之形狀為大致圓形狀之情形時，其直徑可根據薄膜之用途而設為任意之適當之長度。該直徑例如為2 mm～100 mm。根據本發明，亦能夠防止裂紋而切割出小徑之切割部。例如可於防止裂紋下形成直徑為2 mm～50 mm(較佳為2 mm～10 mm)之大致圓形狀切割部。 圖2係說明本發明之另一實施形態之薄膜之切割方法之圖。於圖2中，表示開始藉由雷射光照射進行之切割之時間點、即對切割開始點11'照射雷射光之時間點之包含偏光元件之薄膜。於本實施形態中，首先，對切割開始點11'照射雷射光，繼而，將該雷射光連續地照射至欲切割之部分之外廓12'，藉此，對包含偏光元件之薄膜進行切割，而於該薄膜形成大致長方形狀之切割部。如圖2中例示般，於切割開始點位於直線上之情形時所成，包含切割開始點11'之邊B與偏光元件之吸收軸X所成之角為0°～85°或95°～180°，較佳為0°～60°或120°～180°，更佳為0°～45°或135°～180°，特佳為0°～30°或150°～180°。最佳為邊B與吸收軸X平行。於切割部之形狀為大致長方形狀之情形時，其短邊較佳為2 mm～100 mm，更佳為2 mm～50 mm，進而較佳為2 mm～30 mm，特佳為2 mm～10 mm。又，長邊較佳為5 mm～400 mm，更佳為5 mm～200 mm，進而較佳為5 mm～120 mm，特佳為5 mm～40 mm。 切割部之形狀並不限定於圖1及圖2所示之形狀。作為切割部之形狀，除大致圓形狀、大致長方形狀以外，例如可列舉大致正方形狀、大致橢圓形狀等。又，切割部之形狀亦可為將直線與曲線適當組合而成之形狀、由曲率不同之複數條曲線構成之形狀。於切割部之外廓具有頂點及/或直線與曲線之連結點之情形時，較佳為不將該頂點及該連結點設為切割開始點。 切割部之面積比率相對於包含偏光元件之薄膜(切割前之薄膜)之面積，例如為10%～50%。 於本發明中，藉由如上述般將切割開始點設為特定之位置，而可防止包含偏光元件之薄膜之裂紋並且藉由雷射光對該薄膜進行切割。於藉由雷射光形成特定形狀之切割部之情形時，以切割開始點為起點開始雷射光之照射，形成切割部之後，雷射光返回至切割開始點。即，雷射光照射之起點與終點成為相同部位。因此，於作為雷射光照射之起點及終點之切割開始點，切割部如圖1(b)所示，雖然微小但具有凸部(向具有切割部之薄膜側突出之凸部)。於本發明中，考慮藉由將切割開始點、即可能會成為裂紋之開端之上述凸部以偏光元件之吸收軸為基準而設為上述特定之位置，而防止薄膜之裂紋。利用本發明之方法切割後之薄膜對於嚴酷之溫度變化(例如，-40℃～85℃之熱循環)亦具有充分之耐久性，而不易產生裂紋。 上述雷射光較佳為包含200 nm～11000 nm之波長之光。 作為用於雷射光照射之雷射，可採用任意之適當之雷射。例如，可採用任意之適當之雷射。作為具體例，可列舉：CO2 雷射、準分子雷射等氣體雷射；YAG(Yttrium Aluminum Garnet，釔鋁石榴石)雷射等固體雷射；半導體雷射等。 雷射光之照射條件(輸出條件、移動速度、次數)可根據薄膜之材料、薄膜之厚度等而採用任意之適當之條件。 實施例 以下，藉由實施例對本發明進行具體說明，但本發明不受該等實施例限定。 [實施例1] 照射雷射光，自72 mm見方之偏光元件切割出圓形狀(直徑20 mm)之切割部。切割開始點上之切割部之切線與偏光元件之吸收軸所成之角設為0°。又，偏光元件之各邊與切割部之中心之距離設為30 mm。 再者，雷射光之照射條件如下所述。 波長：9.4 μm 脈衝寬度：8 μs 輸出：10 V 頻率：12.5 kHz 加工速度：400 mm/sec [實施例2] 將切割開始點上之切割部之切線與偏光元件之吸收軸所成之角設為30°，除此以外，以與實施例1相同之方式對偏光元件進行切割。 [實施例3] 將切割開始點上之切割部之切線與偏光元件之吸收軸所成之角設為45°，除此以外，以與實施例1相同之方式對偏光元件進行切割。 [實施例4] 將切割開始點上之切割部之切線與偏光元件之吸收軸所成之角設為60°，除此以外，以與實施例1相同之方式對偏光元件進行切割。 [比較例1] 將切割開始點上之切割部之切線與偏光元件之吸收軸所成之角設為90°，除此以外，以與實施例1相同之方式對偏光元件進行切割。 [評價] 將實施例及比較例中所獲得之具有切割部之偏光元件供於熱衝擊試驗。於熱衝擊試驗中，將於85℃之環境下放置30分鐘後於-40℃之環境下放置30分鐘設為1循環，目視確認200循環後及300循環後之偏光元件之外觀。 對5片樣品進行該熱衝擊試驗，求出裂紋之產生率(任一樣品均不存在裂紋之情形：0%、於5片樣品產生裂紋之情形：100%)。將結果示於表1。 [表1]

Figure TW201801841AD00001
[產業上之可利用性] 本發明之薄膜之切割方法於製造偏光元件板等光學薄膜時可較佳地使用。The cutting method of the thin film of the present invention includes the step of cutting a thin film including a polarizing element by laser light irradiation to form a cut portion having a specific shape on the thin film. The film including a polarizing element may be a single polarizing element, or a film including a polarizing element (preferably a polarizing element) and other layers. Examples of the other layers include a protective layer for protecting a polarizing element, a layer made of any appropriate optical film, and the like. In one embodiment, a polarizing plate is used as a film including a polarizing element. The polarizing plate may include a polarizing element and a protective layer disposed on at least one side of the polarizing element. Moreover, as a film including a polarizing element, a laminated body of a polarizing plate and a surface protective film and / or a separator may be used. The surface protective film or the separator is laminated on the polarizing plate releasably through any appropriate adhesive. In this specification, the "surface protection film" refers to a film that temporarily protects a polarizing plate, and is different from a protective layer (a layer that protects a polarizing element) provided in a polarizing plate. The polarizing element is typically made of a resin film (for example, a polyvinyl alcohol-based resin film) by a swelling treatment, an extension treatment, a dyeing treatment using a dichroic substance (such as iodine, an organic dye, etc.), a crosslinking treatment, and a washing It is obtained by various processes, such as a net process and a drying process. Generally, a polarizing element obtained by the stretching treatment has a characteristic of easily causing cracks, but according to the present invention, cracks can be prevented and the film can be cut. The thickness of the film including the polarizing element is not particularly limited, and an appropriate thickness can be adopted according to the purpose, for example, 20 μm to 200 μm. In addition, the thickness of the polarizing element is not particularly limited, and an appropriate thickness can be adopted according to the purpose. The thickness of the polarizing element is typically about 1 μm to 80 μm, and preferably 3 μm to 40 μm. The size of the film including the polarizing element is not particularly limited, and it can be set to an appropriate size according to the purpose. In one embodiment, the film including the polarizing element is rectangular or square including a side parallel to the absorption axis of the polarizing element, and the length of the side parallel to the absorption axis of the polarizing element is 10 mm to 400 mm. The length is from 10 mm to 500 mm. 1 (a) and 1 (b) are diagrams illustrating a method for cutting a film according to an embodiment of the present invention. In FIG. 1 (a), a film 100 including a polarizing element is shown at a time point when cutting by laser light irradiation is started, that is, a time point at which laser light is irradiated to the cutting start point 11. In FIG. 1 (b), the film after the cutting by laser light irradiation is completed, that is, the film 110 having the cutting portion 10 is shown. In this embodiment, first, the cutting start point 11 is irradiated with laser light, and then the laser light is continuously irradiated to the outer contour 12 of the portion to be cut, thereby cutting the film 100 including the polarizing element, and A substantially circular cutting portion 10 is formed on the film. In the case where the cutting start point 11 is located on a curve (for example, in the case of the embodiment shown in FIG. 1), the tangent line A of the cutting portion at the cutting start point 11 irradiated with laser light and the absorption axis X of the polarizing element are formed. The angle is 0 ° to 85 ° or 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, and particularly preferably 0 ° to 30 ° or 150 ° ～ 180 °. Preferably, the tangent line A is parallel to the absorption axis X. In this specification, the term "parallel" includes a case where it is substantially parallel, and specifically includes a case where an angle formed by two directions is 0 ° to 5 °. In addition, in this specification, when referring to an angle, unless otherwise specified, the angle includes an angle in both of a clockwise direction and a counterclockwise direction. When the shape of the cutting portion is a substantially circular shape, the diameter can be set to any appropriate length according to the application of the film. The diameter is, for example, 2 mm to 100 mm. According to the present invention, it is also possible to prevent a crack and cut a small-diameter cutting portion. For example, a substantially circular cutting portion having a diameter of 2 mm to 50 mm (preferably 2 mm to 10 mm) can be formed under a crack prevention. FIG. 2 is a diagram illustrating a method for cutting a film according to another embodiment of the present invention. In FIG. 2, the time point when the cutting by laser light irradiation is started, that is, the time point when the laser light is irradiated to the cutting start point 11 ′ is a film including a polarizing element. In this embodiment, first, laser light is irradiated to the cutting start point 11 ', and then the laser light is continuously irradiated to the outer contour 12' of the portion to be cut, thereby cutting the film including the polarizing element. A substantially rectangular cutting portion is formed on the film. As illustrated in FIG. 2, when the cutting start point is located on a straight line, the angle formed by the side B including the cutting start point 11 ′ and the absorption axis X of the polarizing element is 0 ° to 85 ° or 95 ° to 180 °, preferably 0 ° to 60 ° or 120 ° to 180 °, more preferably 0 ° to 45 ° or 135 ° to 180 °, and particularly preferably 0 ° to 30 ° or 150 ° to 180 °. Most preferably, the side B is parallel to the absorption axis X. When the shape of the cutting portion is substantially rectangular, the short side is preferably 2 mm to 100 mm, more preferably 2 mm to 50 mm, even more preferably 2 mm to 30 mm, and particularly preferably 2 mm to 10 mm. The long side is preferably 5 mm to 400 mm, more preferably 5 mm to 200 mm, still more preferably 5 mm to 120 mm, and particularly preferably 5 mm to 40 mm. The shape of the cutting portion is not limited to the shape shown in FIGS. 1 and 2. Examples of the shape of the cutting portion include a substantially circular shape and a substantially rectangular shape, and examples thereof include a substantially square shape and a substantially elliptical shape. The shape of the cutting portion may be a shape obtained by appropriately combining a straight line and a curve, and a shape composed of a plurality of curves having different curvatures. When the outline of the cutting portion has a vertex and / or a connection point between a straight line and a curve, it is preferable not to set the vertex and the connection point as a cutting start point. The area ratio of the cut portion is, for example, 10% to 50% with respect to the area of the thin film (film before cutting) including the polarizing element. In the present invention, by setting the cutting start point to a specific position as described above, it is possible to prevent cracking of a film including a polarizing element and cut the film by laser light. In the case where a cutting part having a specific shape is formed by laser light, irradiation of laser light is started with the cutting start point as a starting point, and after forming the cutting part, the laser light returns to the cutting start point. That is, the starting point and the ending point of laser light irradiation are the same. Therefore, as shown in FIG. 1 (b), the cutting portion is the starting point and end point of laser light irradiation, and the cutting portion is small but has a convex portion (a convex portion protruding toward the film side having the cutting portion). In the present invention, it is considered to prevent the crack of the film by setting the above-mentioned convex portion, which is the beginning of the cutting, that is, the beginning of the crack, to the absorption axis of the polarizer as a reference to prevent the film from cracking. The film cut by the method of the present invention also has sufficient durability against severe temperature changes (for example, a thermal cycle of -40 ° C to 85 ° C), and is not prone to cracks. The laser light is preferably light having a wavelength of 200 nm to 11000 nm. As the laser for laser light irradiation, any appropriate laser can be adopted. For example, any appropriate laser can be used. Specific examples include gas lasers such as CO 2 lasers and excimer lasers; solid lasers such as YAG (Yttrium Aluminum Garnet) lasers; semiconductor lasers. Irradiation conditions (output conditions, movement speed, and number of times) of laser light may be any appropriate conditions depending on the material of the film, the thickness of the film, and the like. Examples Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by these examples. [Example 1] A laser beam was irradiated, and a circular-shaped (20 mm diameter) cutting portion was cut from a 72 mm square polarizing element. The angle formed by the tangent of the cutting portion at the cutting start point and the absorption axis of the polarizing element is set to 0 °. The distance between each side of the polarizing element and the center of the cutting portion was set to 30 mm. The irradiation conditions of the laser light are as follows. Wavelength: 9.4 μm Pulse width: 8 μs Output: 10 V Frequency: 12.5 kHz Processing speed: 400 mm / sec [Example 2] Set the angle formed by the tangent of the cutting part at the cutting start point and the absorption axis of the polarizer The polarizing element was cut in the same manner as in Example 1 except that it was 30 °. [Example 3] The polarizing element was cut in the same manner as in Example 1 except that the angle formed by the tangent of the cutting portion at the cutting start point and the absorption axis of the polarizing element was set to 45 °. [Example 4] The polarizing element was cut in the same manner as in Example 1 except that the angle formed by the tangent of the cutting portion at the cutting start point and the absorption axis of the polarizing element was set to 60 °. [Comparative Example 1] A polarizing element was cut in the same manner as in Example 1 except that the angle formed by the tangent of the cutting portion at the cutting start point and the absorption axis of the polarizing element was set to 90 °. [Evaluation] The polarizing element having a cutting portion obtained in the examples and comparative examples was subjected to a thermal shock test. In the thermal shock test, the cycle was left for 30 minutes in an environment of 85 ° C and 30 minutes in an environment of -40 ° C. The cycle was set as one cycle, and the appearance of the polarizer after 200 cycles and 300 cycles was visually confirmed. This thermal shock test was performed on five samples to determine the occurrence rate of cracks (in the case where no cracks existed in any of the samples: 0%, and in the case where cracks occurred in five samples: 100%). The results are shown in Table 1. [Table 1]
Figure TW201801841AD00001
 [Industrial Applicability] The cutting method of the film of the present invention can be preferably used when manufacturing optical films such as polarizing element plates.

10‧‧‧切割部
11、11'‧‧‧切割開始點
12‧‧‧外廓
12'‧‧‧外廓
100‧‧‧薄膜
110‧‧‧薄膜
A‧‧‧切線
B‧‧‧邊
X‧‧‧吸收軸10‧‧‧ Cutting Department
11, 11'‧‧‧ Cutting start point
12‧‧‧ outline
12'‧‧‧Outline
100‧‧‧ film
110‧‧‧ film
A‧‧‧ Tangent
B‧‧‧ side
X‧‧‧ Absorption axis

圖1(a)及(b)係說明本發明之一實施形態之薄膜之切割方法之圖。 圖2係說明本發明之另一實施形態之薄膜之切割方法之圖。1 (a) and 1 (b) are diagrams illustrating a method for cutting a film according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a method for cutting a film according to another embodiment of the present invention.

10‧‧‧切割部 10‧‧‧ Cutting Department

11‧‧‧切割開始點 11‧‧‧ Cutting start point

12‧‧‧外廓 12‧‧‧ outline

100‧‧‧薄膜 100‧‧‧ film

110‧‧‧薄膜 110‧‧‧ film

A‧‧‧切線 A‧‧‧ Tangent

X‧‧‧吸收軸 X‧‧‧ Absorption axis

Claims (3)

一種薄膜之切割方法，其包含藉由雷射光照射對包含偏光元件之薄膜進行切割而於該薄膜形成特定形狀之切割部的步驟，且 雷射光照射之切割開始點上之切割部之切線A、或包含該開始點之切割部之邊B與偏光元件之吸收軸所成之角為0°～85°或95°～180°。A method for cutting a thin film, comprising the steps of cutting a thin film including a polarizing element by laser light irradiation to form a cut portion of a specific shape on the thin film, and a tangent line A, Or, the angle formed by the side B of the cutting portion including the starting point and the absorption axis of the polarizing element is 0 ° to 85 ° or 95 ° to 180 °. 如請求項1之薄膜之切割方法，其中上述切線A或邊B與偏光元件之吸收軸所成之角為0°～60°或120°～180°。For example, the cutting method of the film of claim 1, wherein the angle formed by the tangent line A or the side B and the absorption axis of the polarizing element is 0 ° to 60 ° or 120 ° to 180 °. 如請求項1或2之薄膜之切割方法，其中上述切線A或邊B與偏光元件之吸收軸平行。If the cutting method of the film of item 1 or 2 is requested, wherein the tangent line A or the side B is parallel to the absorption axis of the polarizing element.
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JP4732790B2 (en) * 2005-04-28 2011-07-27 日本合成化学工業株式会社 Production method of polyvinyl alcohol film, polyvinyl alcohol film and polarizing film, polarizing plate
JP2007319888A (en) * 2006-05-31 2007-12-13 Sharp Corp Laser beam fusion-cutting method of brittle member to be worked
JP4808106B2 (en) * 2006-08-23 2011-11-02 日東電工株式会社 Cutting method of optical film
CN101755226A (en) * 2007-07-06 2010-06-23 日东电工株式会社 polarization plate
JP5558026B2 (en) * 2008-05-07 2014-07-23 日東電工株式会社 Polarizing plate and manufacturing method thereof
JP2010017990A (en) * 2008-07-14 2010-01-28 Seiko Epson Corp Substrate dividing method
US8584490B2 (en) * 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
JP5824218B2 (en) * 2011-02-24 2015-11-25 伊藤光学工業株式会社 Anti-glare optical element
CN104854645B (en) * 2012-12-18 2017-05-24 住友化学株式会社 Manufacturing method for optical display device and manufacturing system for optical display device
JP2014182274A (en) * 2013-03-19 2014-09-29 Fujifilm Corp Polarizing plate, liquid crystal display device, and method for manufacturing liquid crystal display device
JP2014191051A (en) * 2013-03-26 2014-10-06 Nitto Denko Corp Laser processing method of polarizer
JP6127707B2 (en) * 2013-05-16 2017-05-17 住友化学株式会社 Optical display device production system and production method
JP6227279B2 (en) * 2013-05-17 2017-11-08 住友化学株式会社 Manufacturing apparatus and manufacturing method of optical member bonded body
JP2015108663A (en) * 2013-12-03 2015-06-11 住友化学株式会社 Apparatus for manufacturing optical member laminate
KR20160015160A (en) * 2014-07-30 2016-02-12 스미또모 가가꾸 가부시키가이샤 Anti-glare film
US20160033699A1 (en) * 2014-08-04 2016-02-04 Nitto Denko Corporation Polarizing plate
KR101817388B1 (en) * 2014-09-30 2018-01-10 주식회사 엘지화학 Cutting method for the polarizing plate, polarizing plate cut usuing the same

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