WO2012063908A1 - 発光素子向け反射膜用組成物、発光素子、および発光素子の製造方法 - Google Patents
発光素子向け反射膜用組成物、発光素子、および発光素子の製造方法 Download PDFInfo
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- WO2012063908A1 WO2012063908A1 PCT/JP2011/075952 JP2011075952W WO2012063908A1 WO 2012063908 A1 WO2012063908 A1 WO 2012063908A1 JP 2011075952 W JP2011075952 W JP 2011075952W WO 2012063908 A1 WO2012063908 A1 WO 2012063908A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Definitions
- the present invention relates to a composition for a reflective film for a light emitting device, a light emitting device, and a method for producing the light emitting device. More specifically, the present invention relates to a composition for a reflective film for a light emitting device, which includes a conductive reflective film that efficiently reflects light emitted from a light emitting layer, a light emitting device, and a method for manufacturing the same.
- Patent document 1 is equipped with the board
- An LED light source having a titanium thin film on an Ag plating electrode film is disclosed.
- the Ag thin film and the titanium thin film are formed by a plating method or a vacuum film forming method.
- the plating method is expected to generate complicated processes and waste liquids, and the vacuum film forming method requires a large cost for maintaining and operating a large vacuum film forming apparatus. Since the LED light source is subject to thermal degradation and light degradation only with an Ag plating electrode film, a titanium thin film is required, and a combination of a plating method and a vacuum film forming method is required.
- Patent Document 2 discloses a method for manufacturing an LED device in which an LED element is mounted on a substrate, wire-bonded, and then a SiO 2 coating film is formed.
- this LED device manufacturing method also uses a silver plating film.
- the SiO 2 coating film is formed after the LED element is mounted, the LED element is contaminated when the SiO 2 coating solution is applied, and the yield may be reduced.
- the present invention improves the thin film formation method of the conductive reflective film that reflects the light emitted from the light emitting element and plays the role of an electrode, thereby suppressing deterioration of the conductive reflective film due to heat and environment, and It is an object of the present invention to provide a light-emitting element that can simplify a manufacturing process and can significantly improve running cost, and a manufacturing method thereof.
- the present invention relates to a light-emitting element that solves the above-described problems with the configuration described below, and a composition for a conductive reflective film included in the light-emitting element.
- 1st aspect of this invention is a composition for electroconductive reflective films for light emitting elements provided with a light emitting layer, the electroconductive reflective film which reflects the light emission from a light emitting layer, and a base material in this order
- the conductive reflective film composition is a composition for a conductive reflective film for a light-emitting device, characterized in that the conductive reflective film composition contains metal nanoparticles.
- a second aspect of the present invention is a composition for a conductive reflective film for a light-emitting element according to the first aspect, further comprising an additive.
- an overcoat composition for a conductive reflective film for a light emitting device comprising a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order.
- the overcoat composition is a conductive reflective film overcoat composition for a light-emitting device, which contains a light-transmitting binder.
- a light emitting device comprising a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order, wherein the conductive reflective film comprises metal nanoparticles. It is a light emitting element characterized by including a sintered compact.
- a light transmissive property is provided at a hole of the conductive reflective film and / or an interface between the conductive reflective film and the substrate.
- the transparent conductive material further includes a translucent binder between the light emitting layer and the conductive reflective film.
- a light-emitting element including a film is a light emitting element according to the sixth aspect, wherein the transparent conductive film further includes transparent conductive particles.
- An eighth aspect of the present invention is a light emitting device according to the sixth or seventh aspect, wherein the transparent conductive film is composed of two layers, and the transparent conductive film (transparent conductive layer) on the conductive reflective film side. ) Is higher than the refractive index of the transparent conductive film (transparent conductive film layer) on the light emitting layer side.
- a ninth aspect of the present invention is a light emitting element according to any one of the fourth to eighth aspects, wherein the light emitting element further includes an adhesion layer between the conductive reflective film and the base material. It is an element.
- a tenth aspect of the present invention is a light emitting element according to any one of the sixth to ninth aspects, wherein the conductive reflective film and the transparent conductive film are produced by a wet coating method.
- An eleventh aspect of the present invention is a light emitting element according to any one of the fourth to tenth aspects, wherein the conductive reflective film has a thickness of 0.05 to 1.0 ⁇ m. is there.
- a twelfth aspect of the present invention is a light emitting element according to any one of the fourth to eleventh aspects, wherein the conductive reflective film further contains an additive.
- a thirteenth aspect of the present invention is the light emitting device according to the twelfth aspect, wherein the additive comprises an organic polymer, a metal oxide, a metal hydroxide, an organometallic compound, and a silicone oil. It is a light emitting element containing at least 1 sort (s) chosen from.
- a fourteenth aspect of the present invention is the light emitting device according to the thirteenth aspect, wherein the organic polymer is at least one selected from the group consisting of polyvinylpyrrolidone, a polyvinylpyrrolidone copolymer, and water-soluble cellulose. It is a light emitting element which is a seed.
- a fifteenth aspect of the present invention is the light emitting device according to the thirteenth aspect, wherein the metal oxide is aluminum, silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper,
- the light-emitting element is an oxide or composite oxide containing at least one selected from the group consisting of zinc, molybdenum, tin, indium, and antimony.
- a sixteenth aspect of the present invention is the light emitting device according to the thirteenth aspect, wherein the metal hydroxide is aluminum, silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper , Zinc, molybdenum, tin, indium, and antimony, a light-emitting element that is a hydroxide containing at least one selected from the group consisting of antimony.
- the metal hydroxide is aluminum, silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper , Zinc, molybdenum, tin, indium, and antimony, a light-emitting element that is a hydroxide containing at least one selected from the group consisting of antimony.
- a seventeenth aspect of the present invention is the light emitting device according to the thirteenth aspect, wherein the organometallic compound is silicon, titanium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum, And a light emitting device which is a hydrolyzate of at least one metal soap, metal complex, metal alkoxide or metal alkoxide selected from the group consisting of tin and tin.
- a conductive reflective film is formed by applying a composition for a conductive reflective film containing metal nanoparticles and an additive on a substrate by a wet coating method, followed by baking or curing.
- a method for manufacturing a light-emitting element comprising forming and mounting a light-emitting layer on a conductive reflective film.
- a method for manufacturing a light emitting device according to the eighteenth aspect, wherein the conductive reflective film is further formed after the conductive reflective film is formed and before the light emitting layer is mounted. This is a method for manufacturing a light-emitting element in which a transparent conductive film is formed by applying an overcoat composition containing a light-transmitting binder on a film by a wet coating method and then baking or curing.
- the first aspect it is possible to easily obtain a conductive reflective film in which deterioration due to heat and environment generated from the light emitting layer is suppressed, even for a high-output light-emitting element. It is possible to easily manufacture a light-emitting element having a long lifetime.
- the fourth aspect even in a high-output light-emitting element, heat resistance and corrosion resistance can be increased, and deterioration of the conductive reflective film due to heat generated from the light-emitting layer and the environment is suppressed.
- a light-emitting element with a long lifetime can be provided.
- the conductive reflective film can be produced by a wet coating method, the production process can be simplified and produced at low cost.
- the additive is more heat resistant.
- a light-emitting element with high corrosion resistance can be provided. Further, according to the seventh aspect, it is possible to increase the light reflected by the conductive reflective film.
- a light emitting device having high heat resistance and corrosion resistance can be obtained simply and at low cost.
- the conductive reflective film is formed before mounting the light emitting layer, there is no possibility that the light emitting layer is contaminated by the composition for conductive reflective film.
- the conductive reflective film composition of the present invention comprises a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order.
- the conductive reflective film composition contains metal nanoparticles.
- the conductive reflective film composition forms a conductive reflective film by baking or curing.
- a light emitting element including a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order will be described later.
- the metal nanoparticles impart reflectivity and conductivity of the light emitted from the light emitting layer to the fired or cured composition for a conductive reflective film, that is, the conductive reflective film.
- the metal nanoparticles one or two or more mixed compositions or alloy compositions selected from the group consisting of silver, gold, platinum, palladium, ruthenium, nickel, copper, tin, indium, zinc, iron, chromium and manganese Silver and gold are preferable from the viewpoints of reflectivity and conductivity.
- the average particle diameter of the metal nanoparticles is preferably 10 to 50 nm.
- the average particle diameter is measured using a BET method by specific surface measurement using QUANTACHROME AUTOSORB-1.
- the shape of the metal nanoparticles is preferably spherical or plate-like from the viewpoints of dispersibility and reflectivity.
- the composition for conductive reflective film preferably contains an additive from the viewpoints of adhesion and reflectivity.
- an additive it is more preferable from a viewpoint of reflectivity and adhesiveness to contain at least one selected from the group consisting of organic polymers, metal oxides, metal hydroxides, organometallic compounds, and silicone oils.
- the organic polymer used as the additive is preferably at least one selected from the group consisting of polyvinylpyrrolidone, polyvinylpyrrolidone copolymer, and water-soluble cellulose from the viewpoint of reflectivity.
- the polyvinylpyrrolidone copolymer include a PVP-methacrylate copolymer, a PVP-styrene copolymer, and a PVP-vinyl acetate copolymer.
- the water-soluble cellulose include cellulose ethers such as hydroxypropylmethylcellulose, methylcellulose, and hydroxyethylmethylcellulose.
- the metal oxide used as an additive is at least selected from the group consisting of aluminum, silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum, tin, indium, and antimony
- An oxide or composite oxide containing one kind is preferable.
- Specific examples of the composite oxide include ITO, ATO, IZO, AZO and the like described above.
- the metal hydroxide used as an additive is selected from the group consisting of aluminum, silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum, tin, indium, and antimony.
- a hydroxide containing at least one kind is preferred.
- a metal soap containing at least one selected from the group consisting of silicon, titanium, zirconium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum, and tin Metal complexes, metal alkoxides or hydrolysates of metal alkoxides are preferred.
- the metal soap include chromium acetate, manganese formate, iron citrate, cobalt formate, nickel acetate, silver citrate, copper acetate, copper citrate, tin acetate, zinc acetate, zinc oxalate, and molybdenum acetate.
- Examples of the metal complex include an acetylacetone zinc complex, an acetylacetone chromium complex, and an acetylacetone nickel complex.
- Examples of the metal alkoxide include titanium isopropoxide, methyl silicate, isoanatopropyltrimethoxysilane, aminopropyltrimethoxysilane and the like.
- both straight silicone oil and modified silicone oil can be used.
- Modified silicone oils are those in which organic groups are introduced into part of the side chain of polysiloxane (side chain type), those in which organic groups are introduced into both ends of polysiloxane (both ends type), and both ends of polysiloxane One having an organic group introduced into one of them (one-end type), and one having a side chain of polysiloxane and an organic group introduced into both ends (both side-end type) can be used.
- the modified silicone oil includes a reactive silicone oil and a non-reactive silicone oil. Both types can be used as the additive of the present invention.
- Reactive silicone oil means amino modification, epoxy modification, carboxy modification, carbinol modification, mercapto modification, and heterogeneous functional group modification (epoxy group, amino group, polyether group). Indicates polyether modification, methylstyryl group modification, alkyl modification, higher fatty acid ester modification, fluorine modification, and hydrophilic special modification.
- the conductive reflective film composition includes a dispersion medium, and the dispersion medium is 1% by mass or more, preferably 2% by mass or more, and 2% by mass or more, based on 100% by mass of all the dispersion media. It is preferable to contain a solvent compatible with 3% by mass or more of water, for example, alcohols. For example, when the dispersion medium is composed of only water and alcohols, it contains 98% by mass of alcohol when it contains 2% by mass of water, and 98% by mass of water when it contains 2% by mass of alcohol.
- the dispersion medium that is, the protective molecule chemically modified on the surface of the metal nanoparticle contains one or both of a hydroxyl group (—OH) and a carbonyl group (—C ⁇ O).
- the water content is preferably in the range of 1% by mass or more with respect to 100% by mass of all the dispersion media. This is because when the water content is less than 2% by mass, it is difficult to sinter the film obtained by applying the composition for conductive reflective film by a wet coating method at a low temperature. Furthermore, it is because the electroconductivity and reflectivity of the conductive reflective film after firing are reduced.
- the composition for conductive reflective film is excellent in dispersion stability and can be used for low-temperature sintering of the coating film. There is an effective action.
- a carbonyl group (—C ⁇ O) is contained in a protective agent that chemically modifies metal nanoparticles such as silver nanoparticles, the composition for conductive reflective film is excellent in dispersion stability as described above, and is coated. There is also an effective action for low-temperature sintering of the film.
- the solvent compatible with water used for the dispersion medium alcohols are preferable.
- the alcohols it is particularly preferable to use one or more selected from the group consisting of methanol, ethanol, propanol, butanol, ethylene glycol, propylene glycol, diethylene glycol, glycerol, isobornyl hexanol and erythritol. preferable.
- a low resistance agent or a water-soluble cellulose derivative depending on the components used.
- the low resistance agent one or more selected from the group consisting of mineral salts and organic acid salts of cobalt, iron, indium, nickel, lead, tin, titanium and zinc are more preferable.
- a mixture of nickel acetate and ferric chloride, zinc naphthenate, a mixture of tin octylate and antimony chloride, a mixture of indium nitrate and lead acetate, a mixture of titanium acetyl acetate and cobalt octylate and the like can be mentioned.
- the resistance reducing agent is preferably 0.2 to 15 parts by mass with respect to 100 parts by mass of the composition for conductive reflective film.
- the water-soluble cellulose derivative is a non-ionizing surfactant, and has an extremely high ability to disperse metal nanoparticles even when added in a small amount compared to other surfactants, and is formed by the addition of a water-soluble cellulose derivative.
- the reflectance of the conductive reflective film is also improved.
- Examples of the water-soluble cellulose derivative include hydroxypropyl cellulose and hydroxypropyl methylcellulose.
- the water-soluble cellulose derivative is preferably 0.2 to 5 parts by mass with respect to 100 parts by mass of the transparent conductive film composition.
- composition for the conductive reflective film may further contain an antioxidant, a leveling agent, a thixotropic agent, a filler, a stress relaxation agent, other additives, etc., as long as the purpose of the present invention is not impaired. Can be blended.
- the metal nanoparticles are preferably from 75 parts by mass or more with respect to 100 parts by mass of the composition for conductive reflective film excluding the dispersion medium, from the viewpoint of reflectivity and conductivity, and 80 parts by mass or more. More preferred. Moreover, it is preferable from an adhesive viewpoint of an electroconductive reflective film as it is 95 mass parts or less, and it is more preferable in it being 80 mass parts or more.
- the content of the additive is preferably 0.1 to 25 parts by mass, more preferably 0.2 to 10 parts by mass with respect to 100 parts by mass of the composition for the conductive reflective film excluding the dispersion medium. preferable. If it is 0.1 part by mass or more, the base material and the adhesive force are good, and if it is 25 parts by mass or less, film unevenness during film formation hardly occurs.
- An overcoat composition for a conductive reflective film for a light emitting device of the present invention (hereinafter referred to as an overcoat composition) comprises a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a substrate.
- / or a translucent binder can be contained in the interface between the conductive reflective film and the substrate, and (2) the translucent binder is further provided between the light emitting layer and the conductive reflective film.
- a transparent conductive film containing can be formed.
- (2) by preparing two types of overcoat compositions, an overcoat composition for high refractive index and an overcoat composition for low refractive index, a transparent conductive film comprising two layers
- a transparent conductive film in which the refractive index of the transparent conductive film on the conductive reflective film side is higher than the refractive index of the transparent conductive film on the light emitting layer side.
- a light emitting element including a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order will be described later.
- the light-transmitting binder contains a polymer type binder and / or a non-polymer type binder that is cured by heating, curing after coating is easy, which is preferable from the viewpoint of adhesion.
- the polymer binder include acrylic resin, polycarbonate, polyester, alkyd resin, polyurethane, acrylic urethane, polystyrene, polyacetal, polyamide, polyvinyl alcohol, polyvinyl acetate, cellulose, and siloxane polymer.
- the polymer-type binder is composed of metal soaps, metal complexes, metal alkoxides and metal alkoxide hydrolysates of aluminum, silicon, titanium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum and tin. It is preferable to include at least one selected from the group.
- nonpolymer binder examples include metal soap, metal complex, metal alkoxide, hydrolyzate of metal alkoxide, alkoxysilane, halosilanes, 2-alkoxyethanol, ⁇ -diketone, and alkyl acetate.
- the metal contained in the metal soap, metal complex, or metal alkoxide is preferably aluminum, silicon, titanium, chromium, manganese, iron, cobalt, nickel, silver, copper, zinc, molybdenum, tin, indium, or antimony.
- Alkoxides of silicon and titanium for example, tetraethoxysilane, tetramethoxysilane, and butoxysilane are more preferable.
- halosilanes examples include trichlorosilane.
- an acid such as hydrochloric acid, nitric acid, phosphoric acid (H 3 PO 4 ), sulfuric acid, or an alkali such as aqueous ammonia or sodium hydroxide is used as a catalyst together with moisture for initiating the hydrolysis reaction.
- Nitric acid is more preferable from the viewpoint of easy volatilization and hardly remaining after heating and curing, no halogen remains, no P or the like having poor water resistance, and adhesion after curing.
- Transparent conductive particles are preferable because they improve the conductivity of the transparent conductive film and can suppress deterioration of the conductive reflective film due to heat and light.
- the transparent conductive particles are preferably oxide fine particles from the viewpoint of translucency, stability and weather resistance.
- transparent conductive oxide particles include ITO (Indium Tin Oxide), ATO (Antimony Tin Oxide) tin oxide powder, Al, Co, Fe, In, Sn, and Ti.
- TZO Tin Zinc Oxide
- the average particle diameter of the transparent conductive particles is preferably in the range of 10 to 100 nm in order to maintain stability in the dispersion medium, and more preferably in the range of 20 to 60 nm.
- the average particle diameter is measured by a BET method by specific surface measurement using QUANTACHROME AUTOSORB-1 or a dynamic light scattering method using LB-550 manufactured by Horiba. Unless otherwise specified, measurement is performed using the BET method based on the specific surface measurement by QUANTACHROME AUTOSORB-1.
- the shape of the transparent conductive particles is preferably spherical or acicular from the viewpoints of dispersibility and conductivity.
- a coupling agent to the translucent binder according to other components to be used. This is because the adhesion between the transparent conductive film and the transparent conductive film and the adhesion between the transparent conductive film and the sealing material film are improved, and the adhesion between the transparent conductive particles and the translucent binder is also improved.
- the coupling agent include a silane coupling agent, an aluminum coupling agent, and a titanium coupling agent.
- the content of the translucent binder is preferably 10 to 90 parts by mass and more preferably 30 to 80 parts by mass with respect to 100 parts by mass of the transparent conductive film excluding the dispersion medium. If it is 10 parts by mass or more, the conductive reflective film and the adhesive force are good, and if it is 90 parts by mass or less, film unevenness during film formation hardly occurs. Further, when metal alkoxide is used as a binder and nitric acid is used as a catalyst, the amount of nitric acid is 1 to 10 parts by mass with respect to 100 parts by mass of metal alkoxide. To preferred.
- the overcoat composition preferably contains a dispersion medium in order to improve film formation.
- a dispersion medium in order to improve film formation.
- the dispersion medium to be used it is the same as that of the composition for electroconductive reflective films.
- the transparent conductive particles are preferably 10 to 90 parts by mass, more preferably 20 to 70 parts by mass with respect to 100 parts by mass of the overcoat composition excluding the dispersion medium. If it is 10 parts by mass or more, the effect of returning the return light from the transparent conductive film to the conductive reflective film side can be expected. If it is 90 parts by mass or less, the strength of the transparent conductive film itself, and the transparent conductive film or sealing Maintain adhesive strength with the material.
- a coupling agent When a coupling agent is used, it is preferably 0.01 to 5 parts by weight, more preferably 0.1 to 2 parts by weight with respect to 100 parts by weight of the overcoat composition excluding the dispersion medium. preferable. If it is 0.01 mass part or more, the adhesive force improvement with an electroconductive reflective film or a sealing material and the remarkable improvement effect of particle dispersibility are seen, and when it exceeds 5 mass parts, film
- a low resistance agent or a water-soluble cellulose derivative to the overcoat composition according to the components used.
- the low resistance agent and the water-soluble cellulose derivative are also the same as the conductive reflective film composition.
- the overcoat composition may further contain an antioxidant, a leveling agent, a thixotropic agent, a filler, a stress relaxation agent, other additives, etc., as long as the object of the present invention is not impaired. Can do.
- Overcoat composition for high refractive index ⁇ Overcoat composition for high refractive index
- the overcoat composition for high refractive index includes the above-described translucent binder and transparent conductive particles, and further includes SiO 2 (refractive index: 1.54), TiO 2 (refractive index: 2.7), ZrO 2. It is preferable to contain at least one transparent particle selected from the group consisting of (refractive index: 2) and diamond (refractive index: 2.4).
- the transparent conductive particles have a refractive index of about 2 for any of zinc oxide containing at least one metal selected from the group consisting of ITO, ATO, and Al, Co, Fe, In, Sn, and Ti.
- the refractive index of the translucent binder is about 1.3 to 1.6.
- the transparent conductive particles are preferably 10 to 90 parts by mass and more preferably 20 to 70 parts by mass with respect to 100 parts by mass of the overcoat composition for high refractive index excluding the dispersion medium. If it is 10 parts by mass or more, the effect of returning the return light from the transparent conductive film to the transparent conductive film side can be expected. If it is 90 parts by mass or less, the strength of the transparent conductive film itself and the transparent conductive film composition are transparent. The adhesive force with the conductive film and the sealing material film is maintained.
- the transparent particles are preferably 10 to 50 parts by mass from the viewpoint of adjusting the refractive index with respect to 100 parts by mass of the transparent conductive film composition excluding the dispersion medium.
- the content of the translucent binder is preferably 10 to 90 parts by mass, more preferably 30 to 80 parts by mass with respect to 100 parts by mass of the transparent conductive film composition excluding the dispersion medium.
- the amount is 10 parts by mass or more, the adhesive strength with the transparent conductive film is good, and when the amount is 90 parts by mass or less, film unevenness during film formation hardly occurs.
- the overcoat composition for low refractive index includes the above-described translucent binder and transparent conductive particles, and further includes silsesquioxane particles (refractive index: 1.15 to 1.45), and magnesium fluoride particles ( It is preferable to include at least one low refractive transparent particle selected from the group consisting of refractive index: 1.18 to 1.38).
- the average particle size of the low refractive transparent particles is preferably 1 to 50 nm.
- the low refractive index overcoat composition contains 98 to 65 parts by mass of conductive oxide particles, preferably 95 to 70 parts by mass with respect to 100 parts by mass in total of the conductive oxide particles and the low refractive transparent particles. Including. This is because if the upper limit is exceeded, the adhesiveness is lowered, and if it is less than the lower limit, the conductivity is lowered.
- the content ratio of the light-transmitting binder is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass with respect to 100 parts by mass of the low refractive index overcoat composition excluding the dispersion medium. .
- the adhesive layer Before forming the conductive reflective film by wet-coating and baking the conductive reflective film composition on the base material, the adhesive layer is formed on the base material, thereby improving the adhesiveness to the base material. It is possible to form a conductive reflective film that is excellent and has excellent electrical bonding properties.
- the adhesion layer treatment is formed by applying the following composition for an adhesion layer on a substrate.
- the composition for the adhesion layer preferably contains at least one selected from the group consisting of metal oxides, resins, metal alkoxides, metal soaps, and coupling agents.
- Examples of the metal oxide include Ag 2 O, CuO, PdO, ZnO, NiO, MoO 2 , Cr 2 O 3 , MnO 2 , Al 2 O 3 , ZrO, TiO 2 , In 2 O 3 , and SiO 2.
- Examples of the resins include acrylic, vinyl acetate, epoxy, polyester, polyurethane, cellulose, polyvinyl pyrrolidone, modified resins thereof, and copolymers containing these as structural units.
- Examples of the metal alkoxide include tetraethoxysilane, tetrabutoxy titanium, titanium isopropoxide, zirconium butoxide and the like.
- Examples of the metal soap include calcium stearate, magnesium stearate, zinc stearate, tin 2-ethylhexanoate and the like.
- Examples of the coupling agent include 3-mercaptopropylmethyldimethoxysilane and triethanolamine titanate.
- the light emitting device of the present invention is a light emitting device comprising a light emitting layer, a conductive reflective film that reflects light emitted from the light emitting layer, and a base material in this order, and the conductive reflective film is sintered with metal nanoparticles. It includes the body.
- FIG. 1 shows a cross-sectional view of an example of a light-emitting element.
- the light emitting element 1 includes a conductive reflective film 10 and a light emitting layer 30 in this order on a base material (substrate) 20.
- the light emitting layer 30 is wired with the wire bonding 40 and then sealed with the sealing material 50.
- the periphery of the light emitting layer 30 is covered with a reflection frame 60.
- FIG. 2 is a cross-sectional view showing a preferred example of the light emitting element.
- the light emitting element 2 includes a conductive reflective film 11, a transparent conductive film 71, and a light emitting layer 31 in this order on a base material 21.
- the light emitting layer 31 is wired with wire bonding 41 and then sealed with a sealing material 51. Further, the periphery of the light emitting layer 31 is covered with a reflection frame 61.
- FIG. 2 shows a cross-sectional view of an example of a light emitting element.
- FIG. 3 is a cross-sectional view illustrating a more preferable example of the light-emitting element.
- the light emitting element 3 includes a conductive reflective film 12, a transparent conductive film 72, and a light emitting layer 32 in order on the base material 22.
- the light emitting layer 32 is wired with wire bonding 42 and then sealed with a sealing material 52. Further, the periphery of the light emitting layer 32 is covered with a reflection frame 62.
- the transparent conductive film 72 provided between the conductive reflective film 12 and the light emitting layer 31 is composed of two layers.
- a high refractive index transparent conductive film 721 is provided on the conductive reflective film 12 side, and a low refractive index transparent conductive film 722 is provided on the light emitting layer side. Prepare.
- the transparent conductive film 72 By making the transparent conductive film 72 a composite film having a two-layer structure, the reflected light from the conductive reflective film 12 can be increased.
- the transparent conductive film 72 is arranged from the conductive reflective film 12 side in the order of a high refractive index transparent conductive film, a low refractive index transparent conductive film, a high refractive index transparent conductive film, a low refractive index transparent conductive film,.
- the transparent conductive film 71 may be formed by laminating a plurality of composite films composed of two layers of a high refractive index transparent conductive film and a low refractive index transparent conductive film.
- the transparent conductive film 71 has an alternately laminated structure of a high refractive index transparent conductive film and a low refractive index transparent conductive film, and the layer closest to the light emitting layer is closest to the low refractive index transparent conductive film and the conductive reflective film.
- the layer becomes a high refractive index transparent conductive film.
- FIG. 4 is a cross-sectional view showing a preferred example of the light emitting element.
- the light emitting element 4 shown in FIG. 4 includes an adhesion layer 83 between the conductive reflective film 13 and the base material 23.
- the light-emitting element 4 includes an adhesion layer 83, a conductive reflective film 13, a transparent conductive film 73, and a light-emitting layer 33 in order on the base material 23.
- the light emitting layer 33 is sealed by the sealing material 53 after being wired by the wire bonding 43. Further, the periphery of the light emitting layer 33 is covered with a reflection frame 63.
- the adhesion layer 83 can improve the adhesion between the conductive reflective film 13 and the base material 23, and can improve the reliability of the light emitting element.
- the example shown in FIG. 4 is an example provided with the transparent conductive film 73, even if it is a case where the transparent conductive film 73 is not formed, it is preferable if the adhesion layer 83
- the conductive reflective film contains metal nanoparticles, and the conductive reflective film preferably contains an additive from the viewpoints of adhesion and reflectivity.
- the metal nanoparticles and additives are as described above.
- the thickness of the conductive reflective film is preferably from the viewpoint of reflectivity and conductivity, preferably 0.05 to 1.0 ⁇ m, and more preferably 0.1 to 0.5 ⁇ m.
- the wavelength is in the range of 380 to 780 nm.
- the reflection spectrum shows items having high reflectance on the long wavelength side and low on the short wavelength side. If the average diameter of the pores exceeds 100 nm, the inflection point at which the reflectance starts to decrease shifts to a longer wavelength side and a good reflectance cannot be obtained. Therefore, the average diameter is preferably 100 nm or less.
- the average pore depth exceeds 100 nm, the gradient (inclination) of the reflection spectrum increases, and good reflectance cannot be obtained. Therefore, the average pore depth is preferably 100 nm or less. If the number density of the pores exceeds 30 / ⁇ m 2 , the reflectance on the long wavelength side is lowered and a good reflectance cannot be obtained. Therefore, the number density of the pores is preferably 30 / ⁇ m 2 or less.
- the conductive reflective film has pores
- a translucent binder is present at the pores of the conductive reflective film and / or the interface between the conductive reflective film and the substrate
- the conductive reflective film Since heat resistance and corrosion resistance improve more and the adhesiveness of a conductive reflective film and a base material improves, it is preferable.
- the light-transmitting binder at the interface between the pores of the conductive reflective film and / or the conductive reflective film and the substrate is obtained by wet-coating the overcoat composition on the conductive reflective film having pores, It can be formed by firing.
- FIG. 5 shows a scanning electron micrograph of the cross section of the substrate on which the conductive reflective film and the like are formed.
- the conductive reflective film 110 is formed on the base material 120, and the light-transmitting binder 111 at the pores of the conductive reflective film and the light-transmitting binder at the interface between the conductive reflective film and the base material. 112 is observed.
- a transparent conductive film 170 is formed on the conductive reflective film 110.
- the translucent binder in the transparent conductive film is as described above, and preferably includes transparent conductive particles, a coupling agent, and the like.
- the transparent conductive film may further contain a filler, a stress relaxation agent, other additives, and the like as necessary, as long as the object of the present invention is not impaired.
- the thickness of the transparent conductive film is preferably 0.01 to 0.5 ⁇ m from the viewpoint of adhesion, and more preferably 0.02 to 0.1 ⁇ m. This is because if the thickness of the transparent conductive film is less than 0.01 ⁇ m or exceeds 0.5 ⁇ m, the adhesion effect cannot be obtained sufficiently.
- the transparent conductive film is composed of two layers, and the refractive index of the transparent conductive film on the conductive reflective film side (high refractive index transparent conductive film) is the refractive index of the transparent conductive film on the light emitting layer side (low refractive index transparent conductive film). If the ratio is higher than the above, the reflected light by the conductive reflective film is increased as described above.
- the adhesion layer improves the adhesion between the conductive reflective film and the substrate.
- the thickness of the adhesion layer is preferably 0.01 to 0.5 ⁇ m. This is because if the thickness of the adhesion layer is 0.01 ⁇ m or more, the adhesion force is sufficient, and if it is 0.5 ⁇ m or less, the change with time is small.
- the method for producing a light-emitting device of the present invention is obtained by applying a conductive reflective film composition containing metal nanoparticles and an additive on a substrate by a wet coating method, and then baking or curing the conductive reflective film. And a light emitting layer is mounted on the conductive reflective film.
- a conductive reflective film composition containing metal nanoparticles and an additive is applied onto a substrate by a wet coating method.
- the thickness after baking is preferably 0.05 to 1.0 ⁇ m, more preferably 0.1 to 0.5 ⁇ m.
- the coating film is dried at a temperature of 120 to 350 ° C., preferably 150 to 250 ° C. for 5 to 60 minutes, preferably 15 to 40 minutes. In this way, a conductive reflective film is formed.
- the substrate is not particularly limited as long as the light emitting layer can be mounted, and examples thereof include silicon, ceramics, polymer materials, Cu, and Al.
- composition for conductive reflective film desired components are mixed by a paint shaker, ball mill, sand mill, centrimill, three rolls, etc. by a conventional method to disperse a translucent binder, and optionally transparent conductive particles. Can be produced. Of course, it can also be produced by a normal stirring operation.
- a paint shaker ball mill, sand mill, centrimill, three rolls, etc.
- after mixing the component except a metal nanoparticle when it mixes with the dispersion medium containing the metal nanoparticle separately disperse
- the wet coating method is preferably a spray coating method, a dispenser coating method, a spin coating method, a knife coating method, a slit coating method, an inkjet coating method, a screen printing method, an offset printing method, or a die coating method.
- the present invention is not limited to this, and any method can be used.
- the spray coating method is a method in which the composition for conductive reflective film is made into a mist with compressed air and applied to the substrate, or the dispersion itself is pressurized and formed into a mist to apply to the substrate.
- the dispenser coating method is For example, the conductive reflective film composition is put into a syringe, and the dispersion is discharged from a fine nozzle at the tip of the syringe by pushing the piston of the syringe, and applied to the substrate.
- the spin coating method is a method in which a conductive reflective film composition is dropped onto a rotating substrate, and the dropped conductive reflective film composition is spread around the periphery of the substrate by its centrifugal force.
- a base material having a predetermined gap from the tip of the knife is provided so as to be movable in the horizontal direction, and the conductive reflective film composition is supplied onto the base material upstream of the knife, and the base material is This is a method of moving horizontally toward the downstream side.
- the slit coating method is a method in which the conductive reflective film composition is allowed to flow out of a narrow slit and is applied onto a substrate.
- the inkjet coating method is a method in which a conductive reflective film composition is applied to an ink cartridge of a commercially available inkjet printer. It is a method of filling and inkjet printing on a substrate.
- the screen printing method is a method in which a conductive reflective film composition is transferred to a substrate through a plate image formed thereon using wrinkles as a pattern indicating material.
- the offset printing method is for the conductive reflective film, in which the composition for the conductive reflective film attached to the plate is not directly attached to the substrate, but is transferred from the plate to the rubber sheet once and transferred again from the rubber sheet to the substrate. This is a printing method utilizing the water repellency of the composition.
- the die coating method is a method in which the composition for a conductive reflective film supplied into a die is distributed by a manifold and extruded onto a thin film from a slit, and the surface of a traveling substrate is applied.
- the die coating method includes a slot coat method, a slide coat method, and a curtain coat method.
- the substrate having the conductive reflective coating is preferably 5 to 60 at a temperature of 130 to 250 ° C., more preferably 180 to 220 ° C. in the air or an inert gas atmosphere such as nitrogen or argon.
- the baking is carried out for 1 minute, preferably 15 to 40 minutes.
- the binder reacts by hydrolysis or the like, it can be cured at a lower temperature.
- the reason why the firing temperature of the substrate having a coating film is preferably in the range of 130 to 250 ° C. is that if it is less than 130 ° C., the conductive reflective film has a problem of insufficient curing. On the other hand, if it exceeds 250 ° C., the production merit of the low temperature process cannot be utilized, that is, the manufacturing cost increases and the productivity decreases. Further, when the light emitting layer is an LED element, it is relatively weak against heat, and the light emission efficiency is lowered by the firing step.
- the reason why the firing time of the substrate having the coating film is preferably in the range of 5 to 60 minutes is that when the firing time is less than the lower limit, there is a problem that binder firing is not sufficient in the conductive reflective film. If the firing time exceeds the upper limit, the manufacturing cost will increase more than necessary, resulting in a decrease in productivity, and a problem that the light emission efficiency of the light emitting layer will decrease.
- the method of mounting the light emitting layer on the formed conductive reflective film is not particularly limited, and when the light emitting layer is an LED element, a known method such as die bonding may be used.
- the manufacturing method of the present invention can eliminate a vacuum process such as a vacuum deposition method and a sputtering method as much as possible by using a wet coating method, and therefore can manufacture a conductive reflective film at a lower cost.
- a light emitting device having high heat resistance and high corrosion resistance can be easily produced at low cost.
- the transparent conductive film composition containing a light-transmitting binder is further applied on the conductive reflective film by a wet coating method.
- the transparent conductive film is formed by baking or curing, the heat resistance and corrosion resistance of the light-emitting element can be further increased, which is preferable.
- the transparent conductive film is composed of two or more layers of a high refractive index transparent conductive film and a low refractive index transparent conductive film, the high refractive index transparent conductive film composition and the low refractive index are formed on the conductive reflective film. What is necessary is just to apply
- the production method, wet coating method, firing or curing method of the transparent conductive film composition is substantially the same as that of the conductive reflective film composition, but in the case of the transparent conductive film composition, after firing.
- the thickness is preferably 0.01 to 0.5 ⁇ m, more preferably 0.02 to 0.08 ⁇ m.
- the adhesion layer composition is applied onto the substrate before wet coating the conductive reflective film composition.
- the method for preparing the adhesive layer composition, the wet coating method, and the firing or curing method are substantially the same as those for the conductive reflective film composition, but in the case of the adhesive layer composition, the thickness after firing is the same. Is preferably 0.01 to 0.5 ⁇ m.
- a preferable manufacturing method can manufacture a transparent conductive film at a lower cost, and a light-emitting element with higher heat resistance and corrosion resistance can be manufactured easily and at low cost.
- composition for conductive reflective film was prepared.
- the production procedure is shown below.
- ⁇ Preparation of composition for conductive reflective film >> Silver nitrate was dissolved in deionized water to prepare an aqueous metal salt solution.
- sodium citrate was dissolved in deionized water to prepare a sodium citrate aqueous solution having a concentration of 26% by mass.
- granular ferrous sulfate is directly added and dissolved in a nitrogen gas stream maintained at 35 ° C., and citrate ions and ferrous ions are contained in a molar ratio of 3: 2.
- a reducing agent aqueous solution was prepared.
- a magnetic stirrer stirrer is placed in the reducing agent aqueous solution while maintaining the nitrogen gas flow at 35 ° C., and the reducing agent aqueous solution is stirred at a rotating speed of the stirrer: 100 rpm.
- An aqueous salt solution was added dropwise and mixed.
- the concentration of each solution is adjusted so that the amount of the metal salt aqueous solution added to the reducing agent aqueous solution is 1/10 or less of the amount of the reducing agent aqueous solution.
- the reaction temperature was kept at 40 ° C.
- the mixing ratio of the reducing agent aqueous solution and the metal salt aqueous solution is such that the molar ratio of citrate ions and ferrous ions in the reducing agent aqueous solution to the total valence of metal ions in the metal salt aqueous solution is 3
- the moles were doubled.
- the mixture is further stirred for 15 minutes to generate silver nanoparticles inside the mixture, and the silver nanoparticle dispersion in which the silver nanoparticles are dispersed Got.
- the pH of the silver nanoparticle dispersion was 5.5, and the stoichiometric amount of silver nanoparticles in the dispersion was 5 g / liter.
- the obtained silver nanoparticle dispersion was allowed to stand at room temperature, so that the silver nanoparticles in the dispersion were allowed to settle, and aggregates of the precipitated silver nanoparticles were separated by decantation.
- Deionized water was added to the separated silver nanoparticle aggregates to form a dispersion, and after desalting by ultrafiltration, the metal (silver) content was adjusted to 50% by mass by washing with methanol. . Thereafter, by using a centrifuge, the centrifugal force of the centrifuge is adjusted to separate relatively large silver particles having a particle size exceeding 100 nm, whereby silver nanoparticles having a primary particle size of 10 to 50 nm are separated. Was adjusted to contain 71% in number average.
- the silver nanoparticle dispersion liquid was obtained by adjusting the ratio of silver nanoparticles in the range of the primary particle size of 10 to 50 nm to 71% with respect to 100% of all silver nanoparticles on a number average.
- the obtained silver nanoparticles were chemically modified with a protective agent for sodium citrate.
- the metal nanoparticle which comprises the composition for electroconductive reflective films contains 75 mass% or more metal nanoparticles.
- a conductive reflective coating film is formed on a glass substrate by spin coating, and is baked at 200 ° C. for 20 minutes in a nitrogen atmosphere. A membrane was obtained.
- the film thickness was measured by cross-sectional observation with a scanning electron microscope (SEM, apparatus names: S-4300, SU-8000) manufactured by Hitachi High-Technologies. In other examples and comparative examples, the film thickness was measured in the same manner.
- Example 2 After producing a silver nanoparticle dispersion liquid in the same manner as in Example 1, the obtained metal nanoparticles were dispersed by adding and mixing 10 parts by mass with 90 parts by mass of a mixed solution containing water, ethanol and methanol. In addition, polyvinylpyrrolidone (PVP, molecular weight: 360,000) and tin acetate were added so as to have a ratio of metal nanoparticles: 96 parts by mass and PVP: 4 parts by mass to prepare a composition for a conductive reflective film. . In addition, the metal nanoparticle which comprises the composition for electroconductive reflective films contains 75 mass% or more metal nanoparticles. Next, in the same manner as in Example 1, a conductive reflective film having a thickness of 100 nm was obtained.
- PVP polyvinylpyrrolidone
- tin acetate tin acetate
- Example 3 First, an overcoat composition was prepared. The production procedure is shown below. ⁇ Preparation of overcoat composition >> First, the SiO 2 binder used as the binder is a 500 cm 3 glass four-necked flask, added with 140 g of tetraethoxysilane and 140 g of ethyl alcohol, and stirred with 1.7 g of 60% nitric acid. It was prepared by dissolving in 120 g of pure water and adding at once, and then reacting at 50 ° C. for 3 hours.
- the SiO 2 binder used as the binder is a 500 cm 3 glass four-necked flask, added with 140 g of tetraethoxysilane and 140 g of ethyl alcohol, and stirred with 1.7 g of 60% nitric acid. It was prepared by dissolving in 120 g of pure water and adding at once, and then reacting at 50 ° C. for 3 hours.
- ITO powder (average particle size: 25 nm): 100 parts by mass, SiO 2 binder: 30 parts by mass, IPA: 72.3 parts by mass, the total is 60 g, put into a 100 cm 3 glass bottle, diameter: 0.3 mm zirconia beads (Microhaika, Showa Shell Sekiyu KK): Using 100 g, the composition for overcoat was prepared by dispersing for 6 hours with a paint shaker.
- a transparent conductive coating film was formed by spin coating the overcoat composition on a 200 nm thick conductive reflective film, except that the composition shown in Table 3 was used. Then, by baking at 160 ° C. for 30 minutes, a transparent conductive film having a thickness of 10 nm was obtained.
- Example 4 A SiO 2 binder was used as the overcoat composition, and a transparent conductive film having a thickness of 100 nm was obtained in the same manner as in Example 3.
- Examples 5 to 23 A conductive reflective film was produced in the same manner as in Example 2 and a transparent conductive film in the same manner as in Example 3 except that the compositions and film thicknesses described in Tables 1 and 2 were used.
- Example 24 The copper nanoparticle dispersion liquid was produced similarly to the said silver nanoparticle. Silver nanoparticles and copper particles were mixed at a mass ratio of 92: 4 to obtain a metal nanoparticle dispersion.
- the metal nanoparticle which comprises the composition for electroconductive reflective films contains the metal nanoparticle (silver nanoparticle + copper nanoparticle) of 75 mass% or more.
- a conductive reflective coating film was formed on a glass substrate by spin coating, and baked at 200 ° C. for 20 minutes in a nitrogen atmosphere to obtain a thickness of 100 nm. A conductive reflective film was obtained.
- Examples 25 to 31 A conductive reflective film was produced in the same manner as in Example 24 and a transparent conductive film was produced in the same manner as in Example 3 except that the composition and film thickness described in Table 2 were used.
- cuprous nitrate is used as a raw material for Cu
- iron sulfate is used as Fe
- chloroauric acid is used as a raw material for Au
- manganese sulfate is used as a raw material for Mn
- tin chloride is used as a raw material for Sn
- indium nitrate was used.
- Comparative Example 2 A silver thin film having a thickness of 100 nm was formed on a glass substrate by sputtering, and a titanium thin film having a thickness of 30 nm was further formed by sputtering.
- Example 32 A titanium thin film with a thickness of 30 nm was formed on the conductive reflective film of Example 5 by sputtering.
- Example 33 The adhesion layer composition was applied onto a glass substrate by spin coating and baked at 120 ° C. for 30 minutes in a nitrogen atmosphere to form an adhesion layer having a thickness of 50 nm.
- a conductive reflective film having a thickness of 100 nm was formed on the adhesion layer in the same manner as in Example 4 except that the composition and film thickness described in Table 2 were used, and the overcoat composition was formed on the conductive reflective film. This was applied to form a transparent conductive film having a thickness of 50 nm.
- a silane coupling agent (3-mercaptopropylmethyldimethoxysilane) was used for the adhesive layer composition.
- Example 34 A reflective film was formed in the same manner as in Example 33 except that the thickness of the adhesion layer was 300 nm and the transparent conductive film was not formed.
- Example 35 First, an adhesion layer is formed on a glass substrate, and then a silver nanoparticle-containing reflective film composition is applied onto the adhesion layer by spin coating and baked at 200 ° C. for 20 minutes in a nitrogen atmosphere. A reflective film was obtained. Further, an overcoat composition for low refractive index in which SiO 2 binder: 60 parts by mass and silsesquioxane having an average particle diameter of 10 nm: 40 parts by mass were applied by spin coating, and was applied at 160 ° C. in a nitrogen atmosphere. By baking for 20 minutes, a low refractive index transparent conductive film having a thickness of 30 nm and a refractive index of 1.20 was obtained.
- an overcoat composition for high refractive index in which SiO 2 binder: 70 parts by mass and TiO 2 having an average particle diameter of 20 nm: 30 parts by mass were mixed by spin coating, and at 160 ° C. in a nitrogen atmosphere.
- the silsesquioxane-containing low-refractive index overcoat composition (described as silsesquioxane in Table 3) is silsesquioxane spherical particles: 5 g, SiO 2 binder: 10 g, ethanol: 85 g.
- the sample was placed in a 100 cm 3 glass bottle and dispersed by using a paint shaker for 6 hours using 100 g of zirconia beads having a diameter of 0.3 mm (Microhaika, Showa Shell Sekiyu KK).
- Example 36 A reflective film and a low refractive index transparent conductive film were formed in the same manner as in Example 35 except that the composition and film thickness shown in Table 3 were used.
- Example 1 the initial reflectance after heat treatment was high, and the reflectance after the sulfidation test was about 30%.
- Comparative Example 1 produced by the sputtering method had a high initial reflectance, but the deterioration after the heat treatment was large, and the reflectance after the sulfidation test was greatly reduced to 14%.
- the reflectivity after the initial stage, after the heat treatment, and after the sulfidation test is very high, and the heat resistance and corrosion resistance are very high. It was found that few light emitting elements can be manufactured.
- Comparative Example 2 produced by the sputtering method had a low reflectance of 65% after the sulfidation test.
- Example 32 in which a Ti thin film was formed on the film of Example 5 by the spotter method was inferior in all of the initial, after heat treatment, and after the sulfidation test as compared with Example 5 in which the conductive reflective film was the same. .
- the reflectance was high also in Examples 33 and 34 in which the adhesion layer was formed.
- the light-emitting element of the present invention can increase heat resistance and corrosion resistance even if it is a high-power light-emitting element by providing a conductive reflective film containing metal nanoparticles between the substrate and the light-emitting layer. Deterioration of the conductive reflective film due to heat generated from the light emitting layer and the environment can be suppressed. Since this conductive reflective film can be produced by a wet coating method, the manufacturing process can be simplified and the cost can be reduced. In addition, by providing a transparent conductive film containing a translucent binder between the light-emitting layer and the conductive reflective film, the heat resistance and light resistance are further increased, and the adhesion between the substrate and the light-emitting layer is further improved. It can be improved and is very useful.
- the conductive reflective film of the light emitting element is formed using the composition of the present invention, even when the output of the light emitting element is high, the deterioration of the conductive reflective film due to heat and environment generated from the light emitting layer is suppressed, and the light emitting element Can extend the lifetime of In the present invention, a light-emitting element having high heat resistance and corrosion resistance can be manufactured at a low cost by a simple process.
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Abstract
Description
本発明の第1の態様は、発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用組成物であって、導電性反射膜組成物が、金属ナノ粒子を含むことを特徴とする、発光素子向け導電性反射膜用組成物である。
本発明の第2の態様は、上記第1の態様にかかる発光素子向け導電性反射膜用組成物であって、さらに、添加物を含む、発光素子向け導電性反射膜用組成物である。
本発明の第3の態様は、発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用オーバーコート用組成物であって、オーバーコート用組成物が、透光性バインダーを含む、発光素子向け導電性反射膜用オーバーコート組成物である。
本発明の第5の態様は、上記第4の態様にかかる発光素子であって、前記導電性反射膜の空孔および/または前記導電性反射膜と前記基材との界面に、透光性バインダーが存在する発光素子である。
本発明の第6の態様は、上記第4または第5いずれかの態様にかかる発光素子であって、発光層と、導電性反射膜との間に、さらに、透光性バインダーを含む透明導電膜を備える発光素子である。
本発明の第7の態様は、上記第6の態様にかかる発光素子であって、前記透明導電膜が、さらに、透明導電性粒子を含む、発光素子である。
本発明の第8の態様は、上記第6または第7の態様にかかる発光素子であって、前記透明導電膜が2層からなり、前記導電性反射膜側の透明導電膜(透明導電膜層)の屈折率が、前記発光層側の透明導電膜(透明導電膜層)の屈折率より高い、発光素子である。
本発明の第9の態様は、上記第4から第8いずれかの態様にかかる発光素子であって、前記導電性反射膜と、前記基材との間に、さらに、密着層を備える、発光素子である。
本発明の第11の態様は、上記第4から第10いずれかの態様にかかる発光素子であって、前記導電性反射膜の厚さが、0.05~1.0μmである、発光素子である。
本発明の第12の態様は、上記第4から第11いずれかの態様にかかる発光素子であって、前記導電性反射膜が、さらに、添加物を含む光素子である。
本発明の第13の態様は、上記第12の態様にかかる発光素子であって、前記添加物が、有機高分子、金属酸化物、金属水酸化物、有機金属化合物、およびシリコーンオイルからなる群より選ばれる少なくとも1種を含む、発光素子である。
本発明の第14の態様は、上記第13の態様にかかる発光素子であって、前記有機高分子が、ポリビニルピロリドン、ポリビニルピロリドンの共重合体、および水溶性セルロースからなる群より選ばれる少なくとも1種である、発光素子である。
本発明の第16の態様は、上記第13の態様にかかる発光素子であって、前記金属水酸化物が、アルミニウム、シリコン、チタン、ジルコニウム、クロム、マンガン、鉄、コバルト、ニッケル、銀、銅、亜鉛、モリブデン、錫、インジウム、およびアンチモンからなる群より選ばれる少なくとも1種を含む水酸化物である、発光素子である。
本発明の第17の態様は、上記第13の態様にかかる発光素子であって、前記有機金属化合物が、シリコン、チタン、クロム、マンガン、鉄、コバルト、ニッケル、銀、銅、亜鉛、モリブデン、および錫からなる群より選ばれる少なくとも1種の金属石鹸、金属錯体、金属アルコキシドまたは金属アルコキシドの加水分解物である、発光素子である。
本発明の第18の態様は、基材上に、金属ナノ粒子と添加物を含む導電性反射膜用組成物を、湿式塗工法により塗布した後、焼成または硬化することにより導電性反射膜を形成し、導電性反射膜上に発光層を搭載することを特徴とする、発光素子の製造方法である。
本発明の第19の態様は、上記第18の態様にかかる発光素子の製造方法であって、前記導電性反射膜を形成した後、前記発光層を搭載する前に、さらに、前記導電性反射膜上に、透光性バインダーを含むオーバーコート組成物を、湿式塗工法により塗布した後、焼成または硬化することにより透明導電膜を形成する、発光素子の製造方法である。
本発明の導電性反射膜用組成物は、発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用組成物(以下、導電性反射膜用組成物という)であって、導電性反射膜組成物が、金属ナノ粒子を含むことを特徴とする。導電性反射膜用組成物は、焼成または硬化することにより、導電性反射膜を形成する。発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子については、後述する。
本発明の発光素子向け導電性反射膜用オーバーコート組成物(以下、オーバーコート組成物という)は、発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用オーバーコート用組成物であって、オーバーコート用組成物が、透光性バインダーを含む。オーバーコート組成物は、(1)導電性反射膜上に湿式塗工されるとき、導電性反射膜に空孔がある場合には、導電性反射膜に浸透し、導電性反射膜の空孔および/または導電性反射膜と基材との界面に、透光性バインダーを含有させることができ、また、(2)発光層と、導電性反射膜との間に、さらに、透光性バインダーを含む透明導電膜を形成することができる。さらに、(2)の場合には、オーバーコート組成物を、高屈折率用オーバーコート組成物と、低屈折率用オーバーコート組成物の2種類を作製することにより、2層からなる透明導電膜であって、導電性反射膜側の透明導電膜の屈折率が、発光層側の透明導電膜の屈折率より高い透明導電膜を製造することが可能となる。発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子については、後述する。
高屈折率用オーバーコート組成物には、上述のオーバーコート組成物を使用することができるが、以下、より高屈折率のオーバーコート組成物の製造方法を説明する。
低屈折率用オーバーコート組成物は、上記の透光性バインダー、透明導電性粒子を含み、さらに、シルセスキオキサン粒子(屈折率:1.15~1.45)、およびフッ化マグネシウム粒子(屈折率:1.18~1.38)からなる群より選ばれる少なくとも1種の低屈折透明粒子を含むと好ましい。低屈折透明粒子の平均粒径は、1~50nmが好ましい。
導電性反射膜用組成物を、基材上に湿式塗工、焼成して導電性反射膜を形成する前に、基材に対して密着層を形成することで、基材との密着性に優れ、かつ電気的接合性に優れた導電性反射膜を形成することができる。密着層処理は、以下のような密着層用組成物を基材上に塗布することにより形成される。密着層用組成物は、金属酸化物、樹脂類、金属アルコキシド、金属石鹸およびカップリング剤からなる群より選択される少なくとも1種を含むと好ましい。金属酸化物としては、Ag2O、CuO、PdO、ZnO、NiO、MoO2、Cr2O3、MnO2、Al2O3、ZrO、TiO2、In2O3、SiO2等が挙げられる。樹脂類としてはアクリル、酢酸ビニル、エポキシ、ポリエステル、ポリウレタン、セルロース、ポリビニルピロリドン、これらの変性樹脂、これらを構造単位として含むコポリマー等が挙げられる。金属アルコキシドとしてはテトラエトキシシラン、テトラブトキシチタン、チタンイソプロポキシド、ジルコニウムブトキシド等が挙げられる。金属石鹸としては、ステアリン酸カルシウム、ステアリン酸マグネシウム、ステアリン酸亜鉛、2-エチルヘキサン酸錫等が挙げられる。カップリング剤としては3-メルカプトプロピルメチルジメトキシシラン、トリエタノールアミンチタネート等が挙げられる。
本発明の発光素子は、発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子であって、導電性反射膜が、金属ナノ粒子焼結体を含むことを特徴とする。
導電性反射膜は、金属ナノ粒子を含み、また、導電性反射膜は、密着性、反射性、の観点から、好ましくは添加物を含む。金属ナノ粒子、添加物は、上述のとおりである。
透明導電膜が、発光層と、導電性反射膜との間に形成されると、導電性反射膜の熱と光による劣化を抑制することができ、好ましい。透明導電膜中の透光性バインダーは、上述のとおりであり、好ましくは、透明導電性粒子、カップリング剤等を含む。
密着層は、導電性反射膜と基材の間の密着性を向上させる。密着層の厚さは、0.01~0.5μmであると好ましい。密着層の厚さが、0.01μm以上であれば、密着力が十分であり、0.5μm以下であれば、経時変化が少ないためである。
本発明の発光素子の製造方法は、基材上に、金属ナノ粒子と添加剤を含む導電性反射膜用組成物を、湿式塗工法により塗布した後、焼成または硬化することにより導電性反射膜を形成し、導電性反射膜上に発光層を搭載することを特徴とする。
まず、導電性反射膜用組成物を作製した。以下に、作製手順を示す。
《導電性反射膜用組成物の作製》
硝酸銀を脱イオン水に溶解して、金属塩水溶液を調製した。また、クエン酸ナトリウムを脱イオン水に溶解して、濃度が26質量%のクエン酸ナトリウム水溶液を調製した。このクエン酸ナトリウム水溶液に、35℃に保持された窒素ガス気流中で、粒状の硫酸第1鉄を直接加えて溶解させ、クエン酸イオンと第1鉄イオンを3:2のモル比で含有する還元剤水溶液を調製した。
実施例1と同様に銀ナノ粒子分散液を作製後、得られた金属ナノ粒子:10質量部を水、エタノール及びメタノールを含む混合溶液90質量部に添加混合することにより分散させ、この分散液に、ポリビニルピロリドン(PVP、分子量:360,000)、酢酸錫を、金属ナノ粒子:96質量部、PVP:4質量部の割合となるように加えて、導電性反射膜用組成物を作製した。なお、導電性反射膜用組成物を構成する金属ナノ粒子は、75質量%以上の金属ナノ粒子を含有している。次に、実施例1と同様にして、厚さ:100nmの導電性反射膜を得た。
まず、オーバーコート用組成物を作製した。以下に、作製手順を示す。
《オーバーコート用組成物の作製》
まず、バインダーとして用いるSiO2結合剤は、500cm3のガラス製の4ッ口フラスコを用い、140gのテトラエトキシシランと、140gのエチルアルコールを加え、撹拌しながら1.7gの60%硝酸を、120gの純水に溶解して一度に加え、その後、50℃で3時間反応させることにより製造した。
SiO2結合剤を、オーバーコート用組成物として使用し、実施例3と同様にして、厚さ:100nmの透明導電膜を得た。
表1、表2に記載した組成、膜厚になるようにしたこと以外は、導電性反射膜を実施例2と同様に、透明導電膜を実施例3と同様にして、作製した。
上記銀ナノ粒子と同様に、銅ナノ粒子分散液を作製した。銀ナノ粒子と銅粒子が、質量比で、92:4となるように混合し、金属ナノ粒子分散液を得た。
表2に記載した組成、膜厚になるようにしたこと以外は、導電性反射膜を実施例24と同様に、透明導電膜を実施例3と同様にして、作製した。ここで、Cuの原料としては硝酸第一銅を、Feとしては硫酸鉄を、Auの原料としては塩化金酸を、Mnの原料としては硫酸マンガンを、Snの原料としては塩化錫を、Inの原料としては硝酸インジウムを使用した。
ガラス基板に、真空成膜法のスパッタ法により、厚さ:100nmの銀薄膜を形成した。
ガラス基板に、スパッタ法により、厚さ:100nmの銀薄膜を形成し、さらにスパッタ法により、厚さ:30nmのチタン薄膜を形成した。
実施例5の導電性反射膜上に、スパッタ法により、厚さ:30nmのチタン薄膜を形成した。
ガラス基板上に密着層組成物をスピンコーティングにより塗布し、窒素雰囲気中、120℃で30分焼成することで、厚さ50nmの密着層を形成した。表2に記載した組成、膜厚にしたこと以外は実施例4と同様にして、密着層上に、厚さ100nmの導電性反射膜を形成し、導電性反射膜上にオーバーコート組成物を塗布し、厚さ50nmの透明導電膜を形成した。ここで、密着層用組成物には、シランカップリング剤(3-メルカプトプロピルメチルジメトキシシラン)を使用した。
密着層の膜厚を300nmにし、透明導電膜を形成しなかったこと以外は、実施例33と同様にして、反射膜を形成した。
まず、ガラス基板上に、密着層を形成し、次に、密着層上に、銀ナノ粒子含有反射膜組成物をスピンコーティングにより塗布し、窒素雰囲気中、200℃で20分焼成することにより、反射膜を得た。さらに、SiO2結合剤:60質量部と平均粒径:10nmのシルセスキオキサン:40質量部を混合した低屈折率用オーバーコート組成物をスピンコーティングにより塗布し、窒素雰囲気中、160℃で20分焼成することにより、厚さ:30nm、屈折率1.20の低屈折率透明導電膜を得た。同様にして、SiO2結合剤:70質量部と平均粒径:20nmのTiO2:30質量部を混合した高屈折率用オーバーコート組成物をスピンコーティングにより塗布し、窒素雰囲気中、160℃で20分焼成し、厚さ:30nm、屈折率1.45の高屈折率透明導電膜を形成した。ここで、シルセスキオキサン含有低屈折率用オーバーコート組成物(表3に、シルセスキオキサンと記載)は、シルセスキオキサン球状粒子:5g、SiO2結合剤:10g、エタノール:85gを、100cm3のガラス瓶中に入れ、直径:0.3mmのジルコニアビーズ(ミクロハイカ、昭和シェル石油製):100gを用いて、ペイントシェーカーで6時間分散することにより作製した。
表3に示す組成、膜厚にしたこと以外は、実施例35と同様にして、反射膜、低屈折率透明導電膜を形成した。
実施例1~36、比較例1~2の反射率の評価は、紫外可視分光光度計と積分球の組み合わせにより、波長450nmにおける導電性反射膜の拡散反射率を測定した。また、熱処理試験を、200℃、1000時間で、耐食性試験としての硫化試験を、硫化水素:10ppm、温度:25℃、相対湿度:75%RH、504時間行い、それぞれの試験後の反射率を測定した。表1、表2、表3に、これらの結果を示す。
密着性評価については、テープテスト(JIS K-5600)に準ずる方法で、反射率測定後の実施例2、33、34について、膜に対してテープを密着させ、剥がした際に、成膜した膜がはがれたり、めくれあがったりする状態の程度により、優・可・不可の3段階で評価した。テープ側に膜形成物が張り付かず、接着テープのみがはがれた場合を優とし、接着テープの剥がれと基材となる光電変換層2が露出した状態が混在した場合を可とし、接着テープの引き剥がしにより基材となる光電変換層2表面の全面が露出した場合を不可とした。実施例2は可、実施例33、34は優であった。
Claims (19)
- 発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用組成物であって、導電性反射膜組成物が、金属ナノ粒子を含むことを特徴とする、発光素子向け導電性反射膜用組成物。
- さらに、添加物を含む、請求項1記載の発光素子向け導電性反射膜用組成物。
- 発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子向け導電性反射膜用オーバーコート用組成物であって、オーバーコート用組成物が、透光性バインダーを含む、発光素子向け導電性反射膜用オーバーコート組成物。
- 発光層と、発光層からの発光を反射する導電性反射膜と、基材とを、この順に備える発光素子であって、導電性反射膜が、金属ナノ粒子焼結体を含むことを特徴とする、発光素子。
- 前記導電性反射膜の空孔および/または前記導電性反射膜と前記基材との界面に、透光性バインダーが存在する、請求項4記載の発光素子。
- 前記発光層と、前記導電性反射膜との間に、さらに、透光性バインダーを含む透明導電膜を備える、請求項4または5記載の発光素子。
- 前記透明導電膜が、さらに、透明導電性粒子を含む、請求項6記載の発光素子。
- 前記透明導電膜が2層からなり、前記導電性反射膜側の透明導電膜の屈折率が、前記発光層側の透明導電膜の屈折率より高い、請求項6または7記載の発光素子。
- 前記導電性反射膜と、前記基材との間に、さらに、密着層を備える、請求項4~8のいずれか1項記載の発光素子。
- 前記導電性反射膜および前記透明導電膜が、湿式塗工法で製造される、請求項6~9のいずれか1項記載の記載の発光素子。
- 前記導電性反射膜の厚さが、0.05~1.0μmである、請求項4~10のいずれか1項記載の発光素子。
- 前記導電性反射膜が、さらに、添加物を含む、請求項4~11のいずれか1項に記載の発光素子。
- 前記添加物が、有機高分子、金属酸化物、金属水酸化物、有機金属化合物、およびシリコーンオイルからなる群より選ばれる少なくとも1種を含む、請求項12記載の発光素子。
- 前記有機高分子が、ポリビニルピロリドン、ポリビニルピロリドンの共重合体、および水溶性セルロースからなる群より選ばれる少なくとも1種である、請求項13記載の発光素子。
- 前記金属酸化物が、アルミニウム、シリコン、チタン、クロム、マンガン、鉄、コバルト、ニッケル、銀、銅、亜鉛、モリブデン、錫、インジウム、およびアンチモンからなる群より選ばれる少なくとも1種を含む酸化物または複合酸化物である、請求項13記載の発光素子。
- 前記金属水酸化物が、アルミニウム、シリコン、ジルコニウム、チタン、クロム、マンガン、鉄、コバルト、ニッケル、銀、銅、亜鉛、モリブデン、錫、インジウム、およびアンチモンからなる群より選ばれる少なくとも1種を含む水酸化物である、請求項13記載の発光素子。
- 前記有機金属化合物が、シリコン、チタン、ジルコニウム、クロム、マンガン、鉄、コバルト、ニッケル、銀、銅、亜鉛、モリブデン、および錫からなる群より選ばれる少なくとも1種の金属石鹸、金属錯体、金属アルコキシドまたは金属アルコキシドの加水分解物である、請求項13記載の発光素子。
- 基材上に、金属ナノ粒子と添加物を含む導電性反射膜用組成物を、湿式塗工法により塗布した後、焼成または硬化することにより導電性反射膜を形成し、導電性反射膜上に発光層を搭載することを特徴とする、発光素子の製造方法。
- 前記導電性反射膜を形成した後、前記発光層を搭載する前に、さらに、前記導電性反射膜上に、透光性バインダーを含むオーバーコート組成物を、湿式塗工法により塗布した後、焼成または硬化することにより透明導電膜を搭載する、請求項18記載の発光素子の製造方法。
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Also Published As
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US9647185B2 (en) | 2017-05-09 |
US20130234191A1 (en) | 2013-09-12 |
TW201234665A (en) | 2012-08-16 |
KR101836551B1 (ko) | 2018-03-08 |
TWI580075B (zh) | 2017-04-21 |
CN103180980B (zh) | 2017-04-26 |
JP5998481B2 (ja) | 2016-09-28 |
KR20130121844A (ko) | 2013-11-06 |
JPWO2012063908A1 (ja) | 2014-05-12 |
CN103180980A (zh) | 2013-06-26 |
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