[go: up one dir, main page]

WO2008155957A1 - 部品内蔵基板の製造方法および部品内蔵基板 - Google Patents

部品内蔵基板の製造方法および部品内蔵基板 Download PDF

Info

Publication number
WO2008155957A1
WO2008155957A1 PCT/JP2008/058698 JP2008058698W WO2008155957A1 WO 2008155957 A1 WO2008155957 A1 WO 2008155957A1 JP 2008058698 W JP2008058698 W JP 2008058698W WO 2008155957 A1 WO2008155957 A1 WO 2008155957A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
built
substrate
layer
interlayer connection
Prior art date
Application number
PCT/JP2008/058698
Other languages
English (en)
French (fr)
Inventor
Yusuke Yamakoshi
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to EP08752581A priority Critical patent/EP2066161A4/en
Priority to JP2008549296A priority patent/JPWO2008155957A1/ja
Publication of WO2008155957A1 publication Critical patent/WO2008155957A1/ja
Priority to US12/348,358 priority patent/US20090101400A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　部品内蔵基板において、口径が小さくストレート性の高い層間接続導体を形成し、層間接続導体間ピッチの狭小化および部品内蔵基板の小型化を達成することができる部品内蔵基板の製造方法および部品内蔵基板を提供する。 　部品内蔵基板４０において、第二層１１では、未硬化の状態で部品９を埋設し樹脂層１１を硬化させた後、第二層１１を上下方向に貫通する孔１２を形成し、前記孔１２に導電性ペーストを充填して第二の層間接続導体８を形成する。そして、複数のランド２ａを含む第一の面内導体２、第一層６および第二層１１を順次積層して圧着し、加熱することにより第一層６を硬化し、一体化した構造を形成する。
PCT/JP2008/058698 2007-06-19 2008-05-12 部品内蔵基板の製造方法および部品内蔵基板 WO2008155957A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08752581A EP2066161A4 (en) 2007-06-19 2008-05-12 METHOD FOR MANUFACTURING INCORPORATED COMPONENT SUBSTRATE AND THIS SUBSTRATE
JP2008549296A JPWO2008155957A1 (ja) 2007-06-19 2008-05-12 部品内蔵基板の製造方法および部品内蔵基板
US12/348,358 US20090101400A1 (en) 2007-06-19 2009-01-05 Method for manufacturing component-embedded substrate and component-embedded substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-161513 2007-06-19
JP2007161513 2007-06-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/348,358 Continuation US20090101400A1 (en) 2007-06-19 2009-01-05 Method for manufacturing component-embedded substrate and component-embedded substrate

Publications (1)

Publication Number Publication Date
WO2008155957A1 true WO2008155957A1 (ja) 2008-12-24

Family

ID=40156117

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058698 WO2008155957A1 (ja) 2007-06-19 2008-05-12 部品内蔵基板の製造方法および部品内蔵基板

Country Status (6)

Country Link
US (1) US20090101400A1 (ja)
EP (1) EP2066161A4 (ja)
JP (1) JPWO2008155957A1 (ja)
KR (1) KR20090010963A (ja)
CN (1) CN101543152A (ja)
WO (1) WO2008155957A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258847A (ja) * 2010-06-11 2011-12-22 Fujitsu Ltd 部品内蔵基板の製造方法及び部品内蔵基板
US9922932B2 (en) 2014-04-22 2018-03-20 Omron Corporation Resin structure having electronic component embedded therein, and method for manufacturing said structure

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024348B2 (ja) * 2009-03-23 2012-09-12 株式会社デンソー 基板の表面に樹脂絶縁膜のパターンを形成する方法及び半導体装置
TWI405306B (zh) * 2009-07-23 2013-08-11 Advanced Semiconductor Eng 半導體封裝件、其製造方法及重佈晶片封膠體
CN102044417B (zh) * 2009-10-14 2014-06-18 株式会社电装 半导体设备以及在其基片上图案化树脂绝缘层的方法
US20110084372A1 (en) * 2009-10-14 2011-04-14 Advanced Semiconductor Engineering, Inc. Package carrier, semiconductor package, and process for fabricating same
US8378466B2 (en) * 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
TWI497679B (zh) * 2009-11-27 2015-08-21 Advanced Semiconductor Eng 半導體封裝件及其製造方法
TWI408785B (zh) * 2009-12-31 2013-09-11 Advanced Semiconductor Eng 半導體封裝結構
US8569894B2 (en) * 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US8372689B2 (en) * 2010-01-21 2013-02-12 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
US8320134B2 (en) * 2010-02-05 2012-11-27 Advanced Semiconductor Engineering, Inc. Embedded component substrate and manufacturing methods thereof
TWI419283B (zh) * 2010-02-10 2013-12-11 Advanced Semiconductor Eng 封裝結構
TWI411075B (zh) * 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
CN102201382B (zh) * 2010-03-26 2013-01-23 日月光半导体制造股份有限公司 半导体封装件及其制造方法
US8624374B2 (en) * 2010-04-02 2014-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
US8278746B2 (en) 2010-04-02 2012-10-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages including connecting elements
WO2012005236A1 (ja) * 2010-07-06 2012-01-12 株式会社フジクラ 積層配線基板及びその製造方法
WO2012015084A1 (en) * 2010-07-30 2012-02-02 Lg Innotek Co., Ltd. Printed circuit board and method of manufacturing the same
TWI451546B (zh) 2010-10-29 2014-09-01 Advanced Semiconductor Eng 堆疊式封裝結構、其封裝結構及封裝結構之製造方法
US8941222B2 (en) 2010-11-11 2015-01-27 Advanced Semiconductor Engineering Inc. Wafer level semiconductor package and manufacturing methods thereof
US9406658B2 (en) * 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US9171792B2 (en) 2011-02-28 2015-10-27 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having a side-by-side device arrangement and stacking functionality
US8487426B2 (en) 2011-03-15 2013-07-16 Advanced Semiconductor Engineering, Inc. Semiconductor package with embedded die and manufacturing methods thereof
KR101283747B1 (ko) * 2011-05-30 2013-07-08 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
US9064883B2 (en) * 2011-08-25 2015-06-23 Intel Mobile Communications GmbH Chip with encapsulated sides and exposed surface
FI20125725A7 (fi) * 2012-06-26 2013-12-27 Tellabs Oy Mekaanisella suojauksella varustettu piirikorttijärjestely
US8878360B2 (en) * 2012-07-13 2014-11-04 Intel Mobile Communications GmbH Stacked fan-out semiconductor chip
JP5285819B1 (ja) * 2012-11-07 2013-09-11 太陽誘電株式会社 電子回路モジュール
US9406552B2 (en) 2012-12-20 2016-08-02 Advanced Semiconductor Engineering, Inc. Semiconductor device having conductive via and manufacturing process
CN103874346B (zh) * 2014-03-26 2017-02-01 中国科学院微电子研究所 一种电路板的制作方法
JP2017130581A (ja) * 2016-01-21 2017-07-27 イビデン株式会社 プリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124380A (ja) * 2001-10-15 2003-04-25 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュールおよびその製造方法
JP2003142797A (ja) * 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd 電子部品実装済完成品の製造方法及び電子部品実装済完成品
JP2003188198A (ja) * 2001-12-20 2003-07-04 Matsushita Electric Ind Co Ltd 電子部品実装済み部品の製造方法及び製造装置
JP2005276981A (ja) * 2004-03-24 2005-10-06 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4635356A (en) * 1984-12-28 1987-01-13 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module
JP2817487B2 (ja) * 1991-12-09 1998-10-30 株式会社村田製作所 チップ型方向性結合器
US5879502A (en) * 1994-05-27 1999-03-09 Gustafson; Ake Method for making an electronic module and electronic module obtained according to the method
US6038133A (en) * 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
JP2001144432A (ja) * 1999-11-02 2001-05-25 Internatl Business Mach Corp <Ibm> 絶縁層上の導体層の製造方法およびビルドアップ回路基板の製造方法
JP4744689B2 (ja) * 2000-12-11 2011-08-10 パナソニック株式会社 粘性流体転写装置及び電子部品実装装置
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Ind Co Ltd Device built-in module and manufacturing method thereof
MXPA02005829A (es) * 2001-06-13 2004-12-13 Denso Corp Tablero de cableados impresos con dispositivo electrico incrustado y metodo para la manufactura de tablero de cableados impresos con dispositivo electrico incrustado.
JP4392157B2 (ja) * 2001-10-26 2009-12-24 パナソニック電工株式会社 配線板用シート材及びその製造方法、並びに多層板及びその製造方法
US7176055B2 (en) * 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
JP2003249763A (ja) * 2002-02-25 2003-09-05 Fujitsu Ltd 多層配線基板及びその製造方法
EP1357773A3 (en) * 2002-04-25 2005-11-30 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP4016340B2 (ja) * 2003-06-13 2007-12-05 ソニー株式会社 半導体装置及びその実装構造、並びにその製造方法
JP2005109307A (ja) * 2003-10-01 2005-04-21 Matsushita Electric Ind Co Ltd 回路部品内蔵基板およびその製造方法
US7258549B2 (en) * 2004-02-20 2007-08-21 Matsushita Electric Industrial Co., Ltd. Connection member and mount assembly and production method of the same
WO2006011320A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124380A (ja) * 2001-10-15 2003-04-25 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュールおよびその製造方法
JP2003142797A (ja) * 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd 電子部品実装済完成品の製造方法及び電子部品実装済完成品
JP2003188198A (ja) * 2001-12-20 2003-07-04 Matsushita Electric Ind Co Ltd 電子部品実装済み部品の製造方法及び製造装置
JP2005276981A (ja) * 2004-03-24 2005-10-06 Matsushita Electric Ind Co Ltd 回路部品内蔵モジュールの製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2066161A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258847A (ja) * 2010-06-11 2011-12-22 Fujitsu Ltd 部品内蔵基板の製造方法及び部品内蔵基板
US9922932B2 (en) 2014-04-22 2018-03-20 Omron Corporation Resin structure having electronic component embedded therein, and method for manufacturing said structure
TWI630686B (zh) * 2014-04-22 2018-07-21 歐姆龍股份有限公司 埋設電子零件的樹脂構造體及其製造方法

Also Published As

Publication number Publication date
EP2066161A4 (en) 2010-11-17
CN101543152A (zh) 2009-09-23
EP2066161A1 (en) 2009-06-03
US20090101400A1 (en) 2009-04-23
KR20090010963A (ko) 2009-01-30
JPWO2008155957A1 (ja) 2010-08-26

Similar Documents

Publication Publication Date Title
WO2008155957A1 (ja) 部品内蔵基板の製造方法および部品内蔵基板
EP1956878A3 (en) Method of manufacturing multilayer wiring board
TW200740334A (en) Multilayer printed wiring board and its manufacturing method
TW200731889A (en) Method of fabricating substrate with embedded component therein
WO2008143099A1 (ja) 積層配線基板及びその製造方法
RU2010144076A (ru) Узел соединителя и электрических дорожек
RU2013128431A (ru) Электронное устройство, способ его изготовления и печатная плата, содержащая электронное устройство
WO2009054098A1 (ja) 部品内蔵配線基板および部品内蔵配線基板の製造方法
TW200505304A (en) Multilayer circuit board and method for manufacturing the same
TW200621114A (en) Structure and method for embedded passive component assembly
JP2013247353A5 (ja)
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
US20120206890A1 (en) Method for integration of circuit components into the build-up layers of a printed wiring board
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
JP2013033894A5 (ja)
TW200701853A (en) Structure of circuit board and method for fabricating the same
WO2011056306A3 (en) Microelectronic package and method of manufacturing same
WO2007103949A3 (en) Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores
CN104756615A (zh) 印刷电路板
CN103929899A (zh) 一种电路板盲孔的制作方法
TW200618683A (en) Circuit board structure with embeded adjustable passive components and method for fabricating the same
TW201501600A (zh) 多層電路板及其製作方法
JP2008153580A5 (ja)
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
CN102427679B (zh) 具有嵌入式凸块互连结构的柔性印刷电路板及其制作方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880000433.X

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008549296

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: KR

WWE Wipo information: entry into national phase

Ref document number: 2008752581

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08752581

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE