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WO2009054098A1 - 部品内蔵配線基板および部品内蔵配線基板の製造方法 - Google Patents

部品内蔵配線基板および部品内蔵配線基板の製造方法 Download PDF

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Publication number
WO2009054098A1
WO2009054098A1 PCT/JP2008/002810 JP2008002810W WO2009054098A1 WO 2009054098 A1 WO2009054098 A1 WO 2009054098A1 JP 2008002810 W JP2008002810 W JP 2008002810W WO 2009054098 A1 WO2009054098 A1 WO 2009054098A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
built
wiring board
electrodes
sealing resin
Prior art date
Application number
PCT/JP2008/002810
Other languages
English (en)
French (fr)
Inventor
Yoshiyuki Wada
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/680,979 priority Critical patent/US8418358B2/en
Priority to CN2008801133747A priority patent/CN101836520B/zh
Publication of WO2009054098A1 publication Critical patent/WO2009054098A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

　部品内蔵配線基板は、絶縁基板と、絶縁基板の上面上に設けられた配線パターンと、絶縁基板の上面上に設けられた複数の電極と、絶縁基板の上面上に設けられたソルダレジストと、複数の電極上にそれぞれ設けられた複数の半田部と、複数の半田部で複数の電極に接合された電子部品と、絶縁基板と電子部品との間に設けられた封止樹脂部と、電子部品と封止樹脂層を完全に覆う絶縁性を有する部品固定層と、部品固定層上に設けられた第２の配線パターンと、第１と第２の配線パターンを接続する層間配線部とを備える。ソルダレジストは複数の電極を囲む。封止樹脂部は、複数の半田部と複数の半田部とソルダレジストとを完全に覆う。部品固定部は絶縁性を有し、電子部品と封止樹脂層を完全に覆う。この部品内蔵配線基板は、簡便な工程で効率よく製造できる。
PCT/JP2008/002810 2007-10-25 2008-10-06 部品内蔵配線基板および部品内蔵配線基板の製造方法 WO2009054098A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/680,979 US8418358B2 (en) 2007-10-25 2008-10-06 Wiring board with built-in component and method for manufacturing wiring board with built-in component
CN2008801133747A CN101836520B (zh) 2007-10-25 2008-10-06 部件内置配线基板和部件内置配线基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-277318 2007-10-25
JP2007277318A JP4784586B2 (ja) 2007-10-25 2007-10-25 部品内蔵プリント配線基板および部品内蔵プリント配線基板の製造方法

Publications (1)

Publication Number Publication Date
WO2009054098A1 true WO2009054098A1 (ja) 2009-04-30

Family

ID=40579208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002810 WO2009054098A1 (ja) 2007-10-25 2008-10-06 部品内蔵配線基板および部品内蔵配線基板の製造方法

Country Status (5)

Country Link
US (1) US8418358B2 (ja)
JP (1) JP4784586B2 (ja)
CN (1) CN101836520B (ja)
TW (1) TW200922400A (ja)
WO (1) WO2009054098A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011160231A (ja) * 2010-02-01 2011-08-18 Mitsubishi Electric Corp 高周波伝送線路
JPWO2015064642A1 (ja) * 2013-10-30 2017-03-09 京セラ株式会社 配線基板およびこれを用いた実装構造体

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JP5197475B2 (ja) 2009-04-23 2013-05-15 パナソニック株式会社 放送受信装置及び番組ガイド作成方法
JP2010267895A (ja) * 2009-05-18 2010-11-25 Panasonic Corp 部品内蔵配線基板の製造方法
US8472207B2 (en) * 2011-01-14 2013-06-25 Harris Corporation Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
KR101875946B1 (ko) * 2011-11-29 2018-08-02 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
TWI557855B (zh) * 2011-12-30 2016-11-11 旭德科技股份有限公司 封裝載板及其製作方法
JP2013211519A (ja) 2012-02-29 2013-10-10 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
US8710681B2 (en) * 2012-05-31 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Isolation rings for blocking the interface between package components and the respective molding compound
US9711392B2 (en) * 2012-07-25 2017-07-18 Infineon Technologies Ag Field emission devices and methods of making thereof
JP5590097B2 (ja) * 2012-10-29 2014-09-17 大日本印刷株式会社 部品内蔵配線板
JP6151550B2 (ja) * 2013-04-25 2017-06-21 デクセリアルズ株式会社 保護素子
US9659891B2 (en) * 2013-09-09 2017-05-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device having a boundary structure, a package on package structure, and a method of making
JP6233524B2 (ja) * 2014-09-04 2017-11-22 株式会社村田製作所 部品内蔵基板
KR102194721B1 (ko) * 2014-09-16 2020-12-23 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR102340053B1 (ko) * 2015-06-18 2021-12-16 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
DE102015226135A1 (de) * 2015-12-21 2017-06-22 Robert Bosch Gmbh Verfahren zum Herstellen eines elektrischen Schaltungsmoduls und elektrisches Schaltungsmodul

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JP2007214535A (ja) * 2006-01-13 2007-08-23 Cmk Corp 半導体素子内蔵プリント配線板及びその製造方法

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Publication number Priority date Publication date Assignee Title
JP2006093493A (ja) * 2004-09-27 2006-04-06 Cmk Corp 部品内蔵型プリント配線板及びその製造方法
JP2007214535A (ja) * 2006-01-13 2007-08-23 Cmk Corp 半導体素子内蔵プリント配線板及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011160231A (ja) * 2010-02-01 2011-08-18 Mitsubishi Electric Corp 高周波伝送線路
JPWO2015064642A1 (ja) * 2013-10-30 2017-03-09 京セラ株式会社 配線基板およびこれを用いた実装構造体

Also Published As

Publication number Publication date
CN101836520A (zh) 2010-09-15
JP2009105302A (ja) 2009-05-14
US8418358B2 (en) 2013-04-16
TW200922400A (en) 2009-05-16
CN101836520B (zh) 2012-04-18
JP4784586B2 (ja) 2011-10-05
US20100206621A1 (en) 2010-08-19

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