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US20070182002A1 - Package structure of a microphone - Google Patents

Package structure of a microphone Download PDF

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Publication number
US20070182002A1
US20070182002A1 US11/391,607 US39160706A US2007182002A1 US 20070182002 A1 US20070182002 A1 US 20070182002A1 US 39160706 A US39160706 A US 39160706A US 2007182002 A1 US2007182002 A1 US 2007182002A1
Authority
US
United States
Prior art keywords
substrate
package structure
upper cap
microphone package
inclined plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/391,607
Other languages
English (en)
Inventor
Chin-Ching Huang
Jiung-Yue Tien
Hsi-Chen Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lingsen Precision Industries Ltd
Original Assignee
Lingsen Precision Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lingsen Precision Industries Ltd filed Critical Lingsen Precision Industries Ltd
Assigned to LINGSEN PRECISION INDUSTRIES, LTD reassignment LINGSEN PRECISION INDUSTRIES, LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, CHIN-CHING, YANG, HSI-CHEN, TIEN, JIUNG-YUE
Publication of US20070182002A1 publication Critical patent/US20070182002A1/en
Priority to US12/219,276 priority Critical patent/US7884467B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap

Definitions

  • Taiwan Application Serial Number b 95102675 filed Jan. 24, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.
  • the present invention relates generally to the package structure of microphone, and more particularly to the package structure of microphone with avoiding the short circuit caused by the overflowing of the conductive paste.
  • FIG. 1 illustrates a stereo assembly drawing of a related microphone package structure.
  • the package structure comprises the body 100 , the substrate 110 , sound processing unit 120 , bounding pad 130 , conductive line 140 and the upper cap 160 .
  • the substrate 110 includes the circuit board and the sound processing unit 120 is set on the circuit board with the conductive line 140 and the bounding pad 130 .
  • the substrate connection 111 is also prepared to connect to the connection 161 on the upper cap 160 , and the acoustic hole 162 is on the upper cap 160 .
  • FIG. 1 and FIG. 2 illustrate profiles of the package structure of the microphone.
  • the bounding pad 130 is on the same plate as the substrate connection 111 , moreover, these bounding pads 130 are separated by a short distance.
  • the upper cap 160 can be attached to the body 100 .
  • the conductive paste 150 may make two bounding pads 130 conductive when the upper cap 160 presses the conductive paste 150 . This unnecessary short circuit would disable the sound processing unit 120 . (In order to illustrate the relative position between the conductive paste 150 and the upper cap 160 , there are only two sides of the conductive paste 150 except for the front part, and so are the other profiles.)
  • the present invention provides a microphone package structure that prevents the short circuit caused by the conductive paste overflow.
  • the effectiveness of the electromagnetic shelter around the sound processing unit can be improved by smearing conductive paste on the substrate trench inside the microphone.
  • a microphone package structure with a trench is provided.
  • the substrate connection is attached with one trench formed in the lower part of the upper cap downward.
  • This trench could be a circular trench, a rectangular trench or a trench of another shape.
  • the trench shape depends on the shape of the substrate.
  • These trenches could also be plural trenches. For example, if the lower surface of the upper cap is divided into discrete sections, a trench could be formed in each of these discrete sections resulting in a plurality of trenches.
  • a package structure which can increase the effectiveness of the electromagnetic shelter of the microphone is provided.
  • a layer of conductive paste on the trench surface next to the substrate before the connection and between the substrate and upper cap, which forms the package structure of microphone.
  • the microphone package structure of the present invention could not only eliminate the disabilities of the electronic units using earlier technology, which commonly has conductive paste overflowing, but also provide a package structure for the electronic unit with a more effective electromagnetic shelter.
  • FIG. 1 illustrates a stereo assembly drawing of a related microphone package structure (the connective area of the substrate is at the same height as the bounding pad);
  • FIG. 2 illustrates a profile of the related microphone package structure (the connective area of the substrate is the same altitude as the bounding pad);
  • FIG. 3 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate is an outward inclined plane);
  • FIG. 4 illustrates a profile of a microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate is an outward inclined plane);
  • FIG. 5 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate downward forms a circular trench);
  • FIG. 6 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention (the lower connective area of the substrate forms a circular trench);
  • FIG. 7 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention (the connective area of the lower substrate forms a circular trench, and the bottom of the trench is an outward inclined plane);
  • FIG. 8 illustrates a top view of the microphone package structure of the preferred embodiment of the present invention (the connective area of the lower substrate forms four L-like trenches);
  • FIG. 9 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate downward forms four L-like trenches, and the bottom of the trench is an outward inclined plane);
  • FIG. 10 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate downward forms four L-like trenches);
  • FIG. 11 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention (the connective area of the lower substrate forms four L-like trenches);
  • FIG. 12 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention (the connective area of the substrate downward forms four L-like trenches, and the bottom of the trench is an outward inclined plane).
  • FIG. 3 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention.
  • a package structure comprises a main body 200 , a substrate 210 , a sound processing unit 220 , a bounding pad 230 , a wire 240 , and an upper cap 260 containing an acoustic hole 262 .
  • the connective area 211 of the substrate 210 connects with the connective area 261 of the upper cap (as the spotted area in the FIG. 3 ) and is constituted by an outward inclined plane. Moreover, the substrate 210 contains a circuit board with sound processing unit 220 , and the necessary electronic connection would be done through the wire 240 and the bounding pad 230 .
  • the shape of the connective area 211 of the substrate could be rectangular or circular and both the connective area 211 and 261 of the upper cap are interactive inclined planes. Besides, the substrate 210 and the upper cap 260 could be rectangles or non-rectangles.
  • FIG. 4 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention.
  • There is an angle between the connective area 211 of the rectangular substrate and the bounding pad 230 so it is not easy for the conductive paste 250 smeared on the connective area 211 of the substrate to be pressed to the located plane of the bounding pad 230 when the connective area 211 of the substrate and the connective area 261 of the upper cap connect. Consequently, the extra conductive paste 250 would be pressed to the outside of the substrate 210 .
  • FIG. 5 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention.
  • the package structure comprises the main body 200 , the substrate 210 , the sound processing unit 220 , the bounding pad 230 , the wire 240 , and an upper cap 270 containing an acoustic hole 272 .
  • the connective area of the substrate 210 connects to the connective area 271 of the upper cap (as the spotted area in the FIG. 5 ).
  • the upper surface of the connective area 210 of the substrate has a rectangular trench 212 formed in it.
  • the substrate 210 contains a circuit board with sound processing unit 220 , and the necessary electronic connection would be done through the wire 240 and the bounding pad 230 .
  • the shape of the trench 212 could be rectangular or circular.
  • the upper cap 270 could be a rectangle or some other shape.
  • FIG. 6 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention. Because of the separation height between the trench 212 and the bounding pad 230 is maintained, a bolt-connected structure would be connected between the four corners of the trench 212 and the upper cap 270 after the connection of the substrate 210 and the upper cap 270 . It could provide a secure, stable connection before the conductive paste 250 completely hardens.
  • FIG. 7 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention.
  • the bottom of the trench 212 in FIG. 6 would be transformed into an inclined plane outward from the substrate 210 ; therefore there would be a new trench 213 .
  • an upper cap 280 comprises an acoustic hole 281 , and the upper cap could be a rectangle or some other shape.
  • the trench 213 maintains altitude fixed separation difference from the bounding pad 230 , and the downward incline of the bottom could prevent short circuits caused by the conductive paste 250 which is pressed by the upper cap 280 on the bounding pad 230 . Also, the extra conductive paste 250 would be pressed to the outside of the substrate 210 .
  • the shape of the trench 213 could be rectangular or circular and the trench 213 is a concave inclined plane which is connected to each other with the connective area of the upper cap 280 .
  • FIG. 8 illustrates a top view of the microphone package structure of the preferred embodiment of the present invention.
  • a main body 300 comprises a substrate 310 , a sound processing unit 320 , a bounding pad 330 and a wire 340 .
  • the substrate 310 contains a circuit board with sound processing unit 320 , and the necessary electronic connection would be done through the wire 340 and the bounding pad 330 .
  • the trench forms an interval between the pairs and secured by a bolt structure that is more secure than the aforementioned mono-circular trench form (like the trench 212 and 213 ).
  • the substrate 310 could be rectangular or non-rectangle.
  • FIG. 9 illustrates a stereo assembly drawing of the microphone package structure of the preferred embodiment of the present invention.
  • These L-like trenches 312 in the Figure are formed by inclining the connective area of the substrate surface 310 downwards, and a protrusion between the pairs of the trenches 312 exists in order to form a bolt-connective structure of rectangular serration after the connection of the upper cap 360 and the main body 310 .
  • This provides better ability to connect than the circular trench 212 in FIG. 5 .
  • Both the connective area of the trench 312 and upper cap 360 are interactive inclined planes, and the upper cap 360 includes an acoustic hole 361 that could be rectangle or non-rectangle.
  • FIGS. 10 and 11 illustrate a stereo assembly drawing and a profile of the microphone package structure of the preferred embodiment of the present invention.
  • the L-like trench maintains a separation difference with the bounding pad 330 .
  • the separation distance between the bounding pad 330 and the trench 313 is enough to prevent the extra conductive past 350 from being pressed to the plane of the bounding pad 330 , which would make an unnecessary short circuit. Therefore, the separation difference provides a stronger bolt-connective structure than the trench 312 in the FIG. 9 .
  • the upper cap 370 includes an acoustic hole 371 that could be rectangle or non-rectangle.
  • FIG. 12 illustrates a profile of the microphone package structure of the preferred embodiment of the present invention.
  • the trenches of the substrate 310 are four L-like trenches, and they not only are concave but also have an inclined plane that matches the connective area of the upper cap 380 .
  • the upper cap 380 including an acoustic hole 381 could be rectangle or non-rectangle.
  • the inclined plane structure decreases the opportunity for the conductive paste 350 to be pressed by the upper cap 280 onto the sound processing unit 220 plane.
  • extra connective paste 350 would be pressed to the outside of the package structure, making it easy to erase.
  • the trench 314 excludes extra connective paste 350 , as the trench 312 in FIG. 9 , and also allows for a stronger bolt-connected structure than the botl-connected structure for the trench 313 in FIG. 10 .
  • a gap between the substrate and the connective paste is maintained so that the connective paste smeared on the surface of the trench will not easily be pressed onto the bounding pad by the upper cap and create a short circuit between the bounding pads.
  • the connective area of the upper cap and the substrate in the microphone package structure is the connective area of the upper cap and the substrate in the microphone package structure, and the connective area is smeared with the connective paste. Therefore, the increased effectiveness of a circular electromagnetic shelter could be established, and it could not only raise the durability of a microphone but also decrease the maintenance cost.
  • the structures of the lower part of the upper cap and the surface of the trench are designed as a combination of the inclined and flat plane. This design prevents the connective paste from overflowing to the outside of the package structure and prevent a short circuit being caused by the overflowing of the connective paste effectively; moreover, the bolt-connected structure of the substrate and upper cap would be more stable and stronger.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
US11/391,607 2006-01-24 2006-03-29 Package structure of a microphone Abandoned US20070182002A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/219,276 US7884467B2 (en) 2006-01-24 2008-07-18 Package structure of a microphone

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW095102675A TWI286040B (en) 2006-01-24 2006-01-24 Package structure of microphone
TW95102675 2006-01-24

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/219,276 Division US7884467B2 (en) 2006-01-24 2008-07-18 Package structure of a microphone

Publications (1)

Publication Number Publication Date
US20070182002A1 true US20070182002A1 (en) 2007-08-09

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ID=37056247

Family Applications (2)

Application Number Title Priority Date Filing Date
US11/391,607 Abandoned US20070182002A1 (en) 2006-01-24 2006-03-29 Package structure of a microphone
US12/219,276 Active 2027-05-08 US7884467B2 (en) 2006-01-24 2008-07-18 Package structure of a microphone

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/219,276 Active 2027-05-08 US7884467B2 (en) 2006-01-24 2008-07-18 Package structure of a microphone

Country Status (5)

Country Link
US (2) US20070182002A1 (zh)
JP (1) JP2007202104A (zh)
DE (1) DE102006037515A1 (zh)
GB (1) GB2434500B (zh)
TW (1) TWI286040B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12253391B2 (en) 2018-05-24 2025-03-18 The Research Foundation For The State University Of New York Multielectrode capacitive sensor without pull-in risk

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101660838B1 (ko) * 2009-04-01 2016-09-28 삼성전자주식회사 촬상장치 및 그 제어방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004325B2 (en) * 2001-05-08 2006-02-28 Nec Compound Semiconductor Devices, Ltd. Resin-molded package with cavity structure
US7061099B2 (en) * 2004-09-30 2006-06-13 Intel Corporation Microelectronic package having chamber sealed by material including one or more intermetallic compounds
US7193315B2 (en) * 2003-03-04 2007-03-20 Hynix Semiconductor Inc. Test vehicle grid array package

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Publication number Priority date Publication date Assignee Title
JPS60216699A (ja) * 1984-04-12 1985-10-30 Matsushita Electric Ind Co Ltd 超音波セラミツクマイクロホン
JPH06103958B2 (ja) 1987-03-16 1994-12-14 松下電器産業株式会社 マイクロホンユニツト
JPH02149199A (ja) * 1988-11-30 1990-06-07 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン
JP3162467B2 (ja) 1992-03-30 2001-04-25 ローム株式会社 圧電ブザー
JP3221130B2 (ja) 1993-02-08 2001-10-22 株式会社村田製作所 取付部材の基板に対する接合構造および電子部品
JP3497230B2 (ja) 1994-04-13 2004-02-16 松下電器産業株式会社 電話機のマイク取付装置
JPH09215080A (ja) 1996-02-01 1997-08-15 Kokusai Electric Co Ltd マイクおよびマイク取付構造
JP2001007588A (ja) 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
JP3574601B2 (ja) * 1999-12-13 2004-10-06 ホシデン株式会社 半導体エレクトレットコンデンサマイクロホン
JP3700559B2 (ja) 1999-12-16 2005-09-28 株式会社村田製作所 圧電音響部品およびその製造方法
JP4302857B2 (ja) 2000-05-16 2009-07-29 北陸電気工業株式会社 圧電発音器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004325B2 (en) * 2001-05-08 2006-02-28 Nec Compound Semiconductor Devices, Ltd. Resin-molded package with cavity structure
US7193315B2 (en) * 2003-03-04 2007-03-20 Hynix Semiconductor Inc. Test vehicle grid array package
US7061099B2 (en) * 2004-09-30 2006-06-13 Intel Corporation Microelectronic package having chamber sealed by material including one or more intermetallic compounds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12253391B2 (en) 2018-05-24 2025-03-18 The Research Foundation For The State University Of New York Multielectrode capacitive sensor without pull-in risk

Also Published As

Publication number Publication date
DE102006037515A1 (de) 2007-08-02
GB2434500A (en) 2007-07-25
TWI286040B (en) 2007-08-21
GB0616035D0 (en) 2006-09-20
GB2434500B (en) 2008-03-26
US7884467B2 (en) 2011-02-08
JP2007202104A (ja) 2007-08-09
US20080285784A1 (en) 2008-11-20
TW200729998A (en) 2007-08-01

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Legal Events

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AS Assignment

Owner name: LINGSEN PRECISION INDUSTRIES, LTD, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, CHIN-CHING;TIEN, JIUNG-YUE;YANG, HSI-CHEN;REEL/FRAME:017434/0772;SIGNING DATES FROM 20060302 TO 20060306

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION